Cleaning methods for process chambers

Abstract

This invention discloses a method for cleaning a process chamber. It includes: providing a dummy wafer placed in a reaction chamber, with an adhesive layer pre-deposited on the surface of the dummy wafer; a loosening treatment step: introducing a first processing gas to loosen particulate impurities within the reaction chamber, causing at least some to detach; an adhesion treatment step: adhering the detached particulate impurities to the adhesive layer; and removing the dummy wafer with the adhered particulate impurities from the reaction chamber. This invention accelerates the removal efficiency of particulate impurities within the reaction chamber by using a first processing gas to promote the loosening and detachment of particulate impurities attached to the inner wall of the reaction chamber and by enhancing the adhesion treatment of the detached particulate impurities; furthermore, by introducing a second processing gas, it makes stubborn particulate impurities remaining after multiple cleanings more compact, reducing the risk of them peeling off.

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