Door opening mechanism and semiconductor process equipment

TW202642960APending Publication Date: 2026-10-16BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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Patent Information

Application Number
TW115110745
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-04-01
Filing Date
2026-03-20
Publication Date
2026-10-16

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Abstract

This application provides a door opening mechanism and a semiconductor process equipment. The door opening mechanism is disposed on the sidewall of a Loading Area of the semiconductor process equipment, with the sidewall provided with a transfer port corresponding to a pod opening. The door opening mechanism includes an isolation assembly configured to be disposed on the sidewall and form, with the sidewall, a first chamber communicating with the transfer port, the first chamber having an opening portion; a detection device; and a blocking member movably disposed within the first chamber. The blocking member is movably disposed between a first position and a second position. The blocking member is configured to block the transfer port and open the opening portion when in the first position, and to open the transfer port and seal the opening portion when in the second position. The door opening mechanism can detect gas concentrations inside the pod and within the Loading Area respectively through the detection device.
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