Mounting devices and methods for electronic components
TW202642961APending Publication Date: 2026-10-16SHIBAURA MECHATRONICS CORP
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Patent Information
- Application Number
- TW115112330
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-31
- Filing Date
- 2026-03-30
- Publication Date
- 2026-10-16
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Abstract
The present invention addresses the application of an electronic component mounting apparatus and method that improves the replacement efficiency of a support substrate. One embodiment of the electronic component mounting apparatus is an apparatus for mounting multiple electronic components onto a support substrate, comprising multiple platforms capable of holding at least one of the support substrates and movable vertically offset from each other along the same path in a first direction, which is horizontal.
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