Substrate, transfer method, manufacturing method of light-emitting diode panel and manufacturing method of component

Abstract

This invention provides a receiver substrate that improves the success rate of picking up transfer objects when using a mold for transfer, a method for manufacturing the receiver substrate, a transfer method using the receiver substrate, and a method for manufacturing an LED panel. A receiver substrate is configured with a plurality of transfer objects to be transferred to other substrates using a mold. The receiver substrate has a plurality of partitions configured with a group of transfer objects that are simultaneously transferred in a single transfer operation using the mold. Outside each partition are non-displacement areas where no transfer objects are disposed, and each of the plurality of partitions is surrounded by the non-displacement areas.

Images