Methods for determining rotational speed, substrate processing methods, semiconductor device manufacturing methods, programs, and substrate processing equipment.

Abstract

This invention provides a technique for improving the in-plane uniformity of processing a rotating substrate. The invention relates to a method for determining the rotational speed of a substrate used in substrate processing, the substrate processing comprising the step of supplying a processing gas to a rotating substrate intermittently at regular intervals for a predetermined number of times K over a predetermined period T from the outer edge of the substrate toward the in-plane direction; the method for determining the rotational speed of the substrate comprises: (a) calculating an evaluation value E corresponding to each of the predetermined period T and the processing gas supply interval I, the predetermined number of times K, and each of a plurality of candidate values ​​N; and (b) determining, from the plurality of candidate values ​​N, the rotational speed of the substrate used in the substrate processing based on the evaluation value E calculated for each of the plurality of candidate values ​​N.

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