Pickup device and pickup method

Abstract

This disclosure enables the alignment of a lifting unit and a semiconductor wafer using a simple method. The pickup device includes: an expansion ring (11) for holding a wafer (32) to which a semiconductor wafer (31) is attached; a drive unit (16) for driving the expansion ring in a circumferential direction; a lifting unit (20) for lifting the semiconductor wafer (31); a camera (14); and a control unit (40). The control unit (40) captures an image of the lifting unit (20) through the camera (14), detects a first offset angle of the lifting unit (20) relative to the camera about the rotation axis (11C) of the expansion ring (11), and adjusts the position of the expansion ring (11) by the drive unit (16) based on the detected first offset angle, thereby aligning the angular position of the lifting unit (20) with that of the semiconductor wafer (31) about the rotation axis (11C) of the expansion ring (11). This disclosure also provides a pickup method.

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