Inspection apparatus and method for side electrodes of wafer stacking devices

Abstract

This invention provides an inspection apparatus capable of inspecting the side electrodes of a wafer stacking device. The inspection apparatus of this invention is an inspection apparatus for the side electrodes of a wafer stacking device; and the aforementioned wafer stacking device includes a first surface to a fourth surface, and has side electrodes on the aforementioned first surface and edge marks at designated positions relative to the aforementioned side electrodes; the aforementioned inspection apparatus includes: a quantitative phase microscope and an inspection unit; the aforementioned inspection unit is equipped with an optical information acquisition unit for acquiring optical information measured by the aforementioned quantitative phase microscope; the aforementioned optical information includes the following information based on reflected light from the first surface exposing the aforementioned side electrodes or reflected light from the surface exposing the aforementioned edge marks: first information, which includes information about the aforementioned side electrodes or the aforementioned edge marks in a direction along the aforementioned first surface or the surface exposing the aforementioned edge marks; and second information, which includes information about the aforementioned side electrodes or the aforementioned edge marks in a direction intersecting the aforementioned first surface or the surface exposing the aforementioned edge marks.

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