Semiconductor device and methods of forming the same
TW202642984APending Publication Date: 2026-10-16NAN YA TECH
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Patent Information
- Application Number
- TW114123418
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-31
- Filing Date
- 2025-06-20
- Publication Date
- 2026-10-16
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Abstract
A method for forming a semiconductor device, comprising forming a dielectric layer over a substrate; forming a conductive layer over the dielectric layer; forming a photoresist layer over the conductive layer, wherein the photoresist layer includes a magnetic material; performing an exposure process to the photoresist layer to form an exposed region and an unexposed region in the photoresist layer; applying a directional magnetic field to the photoresist layer; performing a post-exposure baking process to the photoresist layer; performing a developing process to remove portions of the photoresist layer; and transferring a pattern of remaining portions of the photoresist layer to the conductive layer and the dielectric layer.
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