Wafer cleaning fluid discharge structure
TW202642987APending Publication Date: 2026-10-16ACM RES (SHANGHAI) INC
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- TW114127822
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-31
- Filing Date
- 2025-07-22
- Publication Date
- 2026-10-16
Smart Images

Figure TWG2TA001080475_001 
Figure TWG2TA001080475_002 
Figure TWG2TA001080475_003
Abstract
This application provides a wafer cleaning fluid discharge structure, belonging to the field of semiconductor manufacturing. The wafer cleaning fluid discharge structure is disposed in a wafer cleaning chamber. The discharge structure includes: multiple annular guide shields, each annular guide shield including a shield body and an annular snap-fit member extending vertically from the lower end of the shield body. Adjacent annular guide shields are connected by the annular snap-fit member and form a guide channel for discharging cleaning fluid; a lifter for driving each annular guide shield to move up and down; wherein, each annular guide shield has a limiting part on the annular snap-fit member, the limiting part being used to limit the adjacent annular guide shields.
Need to check novelty before this filing date? Find Prior Art
