Substrate processing method and substrate processing apparatus

TW202642989APending Publication Date: 2026-10-16SCREEN HOLDINGS CO LTD
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Patent Information

Application Number
TW115108492
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-17
Filing Date
2026-03-09
Publication Date
2026-10-16

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Abstract

In the substrate processing apparatus of the present invention, a liquid film of the processing liquid containing a sublimable substance and a solvent is formed by supplying a processing liquid containing a sublimable substance to the main surface of a patterned substrate. A cured film containing the sublimable substance is formed on the main surface by evaporating the solvent from the liquid film. The cured film is removed from the main surface by sublimation. In the information processing apparatus, a processor executes a program to capture an image of the liquid film formed on the main surface using a camera that receives light in a wavelength region different from the visible region during solvent evaporation, thereby obtaining an image showing the distribution of the sublimable substance in the liquid film. The collapse rate of the pattern in the case of sublimation of the cured film is predicted based on the image. If the collapse rate is above a threshold, it is determined that processing using the prediction result will be performed before sublimation of the cured film.
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