Substrate structure of electronic device and manufacturing method of electronic device

TW202643000APending Publication Date: 2026-10-16INNOLUX CORP
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Patent Information

Application Number
TW115101209
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-04-01
Filing Date
2026-01-13
Publication Date
2026-10-16

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    Figure TWG2TA001080931_003
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Abstract

μm. The conductive element is disposed in at least one of the plurality of through-holes. In a cross-sectional view of the substrate structure, the conductive element has a bridge, a first portion, a second portion, and a third portion sequentially disposed along a normal direction of the substrate. The bridge is adjacent to a sidewall of at least one of the plurality of through-holes, the first portion is adjacent to a sidewall of the bridge, and the first portion has an average grain size less than or equal to
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