Cold plate and manifold integration for high reliability

TW202643003APending Publication Date: 2026-10-16AMERICAN CO ADIA SEMICON BONDING TECH CO LTD
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Patent Information

Application Number
TW114149594
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-08-04
Filing Date
2025-12-17
Publication Date
2026-10-16

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Abstract

A device package comprising an integrated cooling assembly. The device package comprises a semiconductor device attached to a substrate and a cold plate attached to the semiconductor device. The cold plate’s footprint is larger than the footprint of the semiconductor device so one or more portions of the cold plate extends past the edges of the semiconductor device’s footprint. One or more standoffs are disposed adjacent to the semiconductor device to support the one or more portions of the cold plate that extend past the edges of the semiconductor device’s footprint.
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