Modular interconnection device and a method for forming the same

Abstract

This application provides a modular interconnect device and a method for forming the same. The modular interconnect device includes: a first interconnect layer having a first insulating layer and a first plurality of prefabricated conductive pillars extending perpendicularly through the first insulating layer; and a second interconnect layer formed on the first interconnect layer, the second interconnect layer having a second insulating layer and a second plurality of prefabricated conductive pillars extending through the second interconnect layer, wherein the second interconnect layer further includes at least one electronic element formed within the second insulating layer and electrically connected to a first subset of the first plurality of prefabricated conductive pillars, and wherein the second plurality of prefabricated conductive pillars are perpendicularly aligned with and electrically connected to a second subset of the first plurality of prefabricated conductive pillars.

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