Semiconductor device and manufacturing method thereof

TW202643008APending Publication Date: 2026-10-16INNOLUX CORP
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Patent Information

Application Number
TW114149811
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-31
Filing Date
2025-12-18
Publication Date
2026-10-16

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Abstract

A method of manufacturing a semiconductor device includes the following steps. A first semiconductor assembly and a second semiconductor assembly are provided. A first bonding process is performed to align the second semiconductor assembly on the first semiconductor assembly. A second bonding process is performed to bond the second semiconductor assembly onto the first semiconductor assembly, wherein a first temperature of the first bonding process is lower than a second temperature of the second bonding process.
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