Chip on film package structure

Abstract

A chip on film package structure includes a flexible circuit substrate and a chip. The flexible circuit substrate includes a flexible base and a patterned metal layer. A chip mounting area of the flexible base has a first long side and a second long side opposite to each other. The patterned metal layer is disposed on the flexible base and includes a plurality of inner leads. The inner leads are located in the chip mounting area and adjacently arranged along the first long side and the second long side. The chip is disposed on the flexible circuit substrate and located in the chip mounting area. The chip includes a plurality of first bumps and a plurality of second bumps. Each of the first bumps is correspondingly connected to one of the inner leads. Each of the second bumps is correspondingly connected to at least two of the inner leads.

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