Semiconductor package and method for fabricating the same and package substrate for the semiconductor package

Abstract

Semiconductor packages with embedded ceramic cores and methods of forming the same are provided. A semiconductor package includes a semiconductor chip and a package substrate bonded to the semiconductor chip. The package substrate includes a resin core comprising a fiber-reinforced resin material extending across at least a first region of the package substrate. The package substrate includes a ceramic core disposed beneath the semiconductor chip in a second region of the package substrate. The ceramic core comprises a redistribution structure electrically coupled to the semiconductor chip and extending through the ceramic core to provide electrical connections within the package substrate.

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