Electronic package and manufacturing method thereof
Patent Information
- Application Number
- TW114112852
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-04-02
- Publication Date
- 2026-10-16
- Estimated Expiration
- 2045-04-01
Smart Images
Figure TWG2TA001080030_001 
Figure TWG2TA001080030_002 
Figure TWG2TA001080030_003
Abstract
Claims
1. An electronic package, comprising: Electronic components; An electronic connector is disposed on the electronic component and has a first light guide element; A photonic chip is disposed on the electronic component, with the first light guide correspondingly located on the side of the photonic chip; and a transmission component is connected to the electronic connector, wherein the electronic connector is disposed only on a portion of the lower surface of the electronic component, and both the electronic connector and the first light guide are located between the portion of the lower surface of the electronic component and the side of the photonic chip.
2. The electronic package as described in claim 1 further includes a carrier structure for mounting the photonic chip.
3. The electronic package as described in claim 1 or 2, wherein, This electronic component is an integrated circuit chip.
4. The electronic package as described in claim 1 or 2, wherein, The first light guide component is a reflector.
5. The electronic package as described in claim 1 or 2, wherein, The transmission component is located on the side of the photonic chip.
6. The electronic package as described in claim 1 or 2, wherein, The transmission component is a fiber optic array element.
7. The electronic package as described in claim 1 or 2, wherein, The transmission component has a set of ribbon cables.
8. The electronic package as described in claim 7, wherein, The cable system is made of optical fiber.
9. The electronic package as described in claim 1 or 2, wherein, The transmission component has a second light guide configured in correspondence with the first light guide.
10. The electronic package as described in claim 9, wherein, The second light guide is a reflector.
11. A method for manufacturing an electronic package, comprising: Provide a wafer-level substrate containing a plurality of electronic components; An electronic connector with a first light guide is provided on each of the electronic components; A photonic chip is disposed on each of the electronic components, and the first light guide is positioned on the side of the photonic chip to form a plurality of packaging modules; the substrate is subjected to a dicing process to separate the packaging modules; and a transmission component is connected to the electronic connector, wherein the electronic connector is disposed only on a portion of the lower surface of the electronic component, and both the electronic connector and the first light guide are located between the portion of the lower surface of the electronic component and the side of the photonic chip.
12. The method for manufacturing an electronic package as described in claim 11, wherein, This electronic component is an integrated circuit chip.
13. The method for manufacturing an electronic package as described in claim 11, wherein, The first light guide component is a reflector.
14. The method for manufacturing an electronic package as described in claim 11, wherein, The transmission component is located on the side of the photonic chip.
15. The method for manufacturing an electronic package as described in claim 11, wherein, The transmission component is a fiber optic array element.
16. The method for manufacturing an electronic package as described in claim 11, wherein, The transmission component has a set of ribbon cables.
17. The method of manufacturing an electronic package as described in claim 16, wherein, The cable system is made of optical fiber.
18. The method for manufacturing an electronic package as described in claim 11, wherein, The transmission component has a second light guide configured in correspondence with the first light guide.
19. A method for manufacturing an electronic package as described in claim 18, wherein, The second light guide is a reflector.
20. The method of manufacturing an electronic package as described in claim 18 further includes mounting the photonic chip, which includes the electronic component, the electronic connector and the transmission assembly, onto a carrier structure.