Semiconductor device and method of making using a die and pillar first approach

Abstract

A semiconductor device has a semiconductor die and a conductive pillar disposed adjacent to the semiconductor die. An encapsulant is deposited over the semiconductor die and conductive pillar. A first conductive layer is formed directly on the encapsulant, conductive pillar, and semiconductor die. A second conductive layer is formed directly on the encapsulant, conductive pillar, and semiconductor die opposite the first conductive layer.

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