Methods for forming semiconductor device packages and process chamber

Abstract

Embodiments discussed herein relate to methods of forming underfill structures in various semiconductor packages. In some embodiments, the underfill structures may be applied to a device package with reduced air bubbles. In some embodiments, an oscillation may be performed after application and prior to curing of the underfill material to remove air bubbles in the underfill material. In some embodiments, the oscillation process comprises applying an oscillating pressure. In some embodiments, the oscillation process comprises applying an acoustic oscillation. In some embodiments, the acoustic oscillation is performed in combination with the pressure oscillation.

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