Electronic devices and methods of manufacturing electronic devices

Abstract

In one example, an electronic device includes a substrate comprising a lower conductor, the lower conductor including a lower conductor lower side, which includes a perimeter. An electronic component is coupled to the substrate. An encapsulant covers a portion of the substrate and the electronic component, wherein the lower conductor lower side is exposed from the encapsulant. The electronic device includes one or more of a groove at the perimeter of the lower conductor lower side and extending inward from the lower conductor lower side with the encapsulant within the groove, or a protrusion in the encapsulant that extends to overlap the perimeter with the protrusion including a lower side that lies within a different horizontal plane than the lower conductor lower side. Other examples and related methods are also disclosed herein.

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