Stacked electronic structure

Abstract

A stacked electronic structure, comprising: a substrate, wherein a plurality of electronic devices are disposed on the substrate, wherein a molding body encapsulates the plurality of electronic devices, wherein the plurality of electronic devices comprises a first active device, wherein a first electrode of a first active device is on a top surface of the first active device and a second electrode of the first active device is on a bottom surface of the first active device; and a magnetic device, comprising a magnetic body disposed over the molding body and a first inductor disposed in the magnetic body, wherein the second electrode of the first active device is electrically connected to the substrate, and the first inductor is electrically connected to the first electrode of the first active device.

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