Semiconductor module
TW202643034APending Publication Date: 2026-10-16SHINDENGEN ELECTRIC MANUFACTURING CO LTD
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Patent Information
- Application Number
- TW115109173
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-04-03
- Filing Date
- 2026-03-12
- Publication Date
- 2026-10-16
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Abstract
This invention provides a semiconductor module that reduces the area occupied by the circuitry mounted on it. The semiconductor module includes a first semiconductor element and a second semiconductor element, each having a source electrode and a gate electrode on one side and a drain electrode on the other side, wherein the second semiconductor element is configured in a flip-over state relative to the first semiconductor element. The semiconductor module also includes electrode terminals respectively connected to the electrodes of the first and second semiconductor elements, wherein a source terminal connected to the source electrode of one semiconductor element and a drain terminal connected to the drain electrode of the other semiconductor element are arranged adjacent to each other.
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