Semiconductor module

TW202643034APending Publication Date: 2026-10-16SHINDENGEN ELECTRIC MANUFACTURING CO LTD
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Patent Information

Application Number
TW115109173
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-04-03
Filing Date
2026-03-12
Publication Date
2026-10-16

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Abstract

This invention provides a semiconductor module that reduces the area occupied by the circuitry mounted on it. The semiconductor module includes a first semiconductor element and a second semiconductor element, each having a source electrode and a gate electrode on one side and a drain electrode on the other side, wherein the second semiconductor element is configured in a flip-over state relative to the first semiconductor element. The semiconductor module also includes electrode terminals respectively connected to the electrodes of the first and second semiconductor elements, wherein a source terminal connected to the source electrode of one semiconductor element and a drain terminal connected to the drain electrode of the other semiconductor element are arranged adjacent to each other.
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