Cooling device for electronic component heat sink

TWD181167SActive Publication Date: 2017-02-01NIPPON LIGHT METAL CO LTD
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Designs
Current Assignee / Owner
Filing Date
2016-05-31
Publication Date
2017-02-01

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    Figure TWG2TB001325026_003
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Abstract

【Item Uses】 【Design Description】 The bottom view and the top view are symmetrical, so they are omitted.
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Description

The bottom view and the top view are symmetrical, so they are omitted.