Seal member for use in semiconductor production apparatus

TWD202038SActive Publication Date: 2020-01-11VALQUA LTD
View PDF 8 Cites 0 Cited by

Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Designs
Current Assignee / Owner
Filing Date
2019-04-02
Publication Date
2020-01-11

Smart Images

  • Figure TWG2TB001511923_001
    Figure TWG2TB001511923_001
  • Figure TWG2TB001511923_002
    Figure TWG2TB001511923_002
  • Figure TWG2TB001511923_003
    Figure TWG2TB001511923_003
Patent Text Reader

Abstract

【Item Uses】 This article is a sealing material for semiconductor manufacturing equipment, suitable for use in semiconductor equipment such as CVD or dry etching equipment. As shown in the reference figure illustrating the use of this article, the sealing material for semiconductor manufacturing equipment is inserted into the groove of a first component of the semiconductor manufacturing equipment to seal between the first component and the second component. 【Design Description】 This design is a derivative design of patent application No. 108301849. The rear view is the same as the front view, so it is omitted. The left side view is the same as the right side view, so it is omitted. The AA section view is a cross-sectional view at line AA in the top view. The BB enlarged cross-sectional view is a magnified view of the BB line portion in the AA cross-sectional view.
Need to check novelty before this filing date? Find Prior Art

Citation Information

Patent Citations

  • sealing parts

    TWD127505S

  • sealing ring

    TWD149670S

  • Composite sealing material

    TWD163769S

  • Part of the wafer edge sealing ring

    TWD164826S

  • TWD164827