Adhesive tape for manufacturing semiconductor device

Abstract

【Article use】;The article is a tape used in the process of manufacturing semiconductor devices, for example, used for cutting semiconductor wafers and wafer keying of the semiconductor wafers obtained after cutting. When used, the release film is peeled off, and the semiconductor wafer is pasted on the bonding layer. The article does not have a product name display area near the bonding layer that cannot be used due to the presence of foreign matter. The product name display area is applied to the surface of the substrate. Therefore, when the article is used, the sensor of the pressing device can detect the bonding layer with foreign matter by not reading the product name display area, so the bonding layer can be excluded. 【Design description】; The dashed line part disclosed in the drawing is not the part of the design claimed in the present application. The one-dot chain line in the drawing is the boundary between the part of the design claimed in the present application and the part not claimed. The one-dot chain line itself is a virtual imaginary line that does not actually exist and is not the part of the design claimed in the present application. The two-dot chain line in the drawing is used to represent the omitted length of the design. The two-dot chain line itself is not the part of the design claimed in the present application.