Inspection substrate for substrate processing apparatus

TWD245530SActive Publication Date: 2026-07-11TOKYO ELECTRON LTD
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Patent Information

Application Number
TW114303269
Authority / Receiving Office
TW · TW
Patent Type
Designs
Current Assignee / Owner
Priority Date
2025-01-27
Filing Date
2025-07-16
Publication Date
2026-07-11
Estimated Expiration
2040-07-15

Smart Images

  • Figure IMG-2_DRAW_114303269-A0305-14-0001-1
    Figure IMG-2_DRAW_114303269-A0305-14-0001-1
  • Figure IMG-2_DRAW_114303269-A0305-14-0002-2
    Figure IMG-2_DRAW_114303269-A0305-14-0002-2
  • Figure IMG-2_DRAW_114303269-A0305-14-0003-3
    Figure IMG-2_DRAW_114303269-A0305-14-0003-3
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Abstract

[Purpose of the Article]: This article is an inspection substrate used in substrate processing apparatuses such as coating and developing devices to check the appropriateness of the relative positional relationship between the substrate to be processed (e.g., a semiconductor wafer) and various substrate processing apparatus components (e.g., processing cups, processing liquid supply nozzles) located nearby. When using this article for inspection, it is transported into the substrate processing apparatus, and a position sensor equipped with a camera checks the distance between the article and the various processing apparatus components located nearby. Additionally, a contact sensor can check whether the article makes contact (interference) with the aforementioned components and transmits the detected information wirelessly. [Design Notes]: The dotted lines shown in the drawings represent the portion not claimed in this design. The single-point chain line shown in the drawings merely indicates the boundary between the portion for which a design patent is sought and the portion not claimed; this single-point chain line itself represents the portion not claimed in this design.
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