Probes for integrated circuit testing

Abstract

【Purpose of the Item】; This design is a probe for testing integrated circuits, mainly used to establish electrical contact between the electrodes (pads, balls, pins) on integrated circuit (IC) chips or packages and the test equipment. 【Design Description】; Please refer to the views shown. This design is a 'probe for testing integrated circuits'. Its creative feature is that, viewed from a three-dimensional perspective, it presents a majestic and towering visual aesthetic, resembling a mountain range with layers stacked upon each other, and concave on both sides at the top, giving a visually exhilarating feeling of reaching the summit, fully demonstrating the aesthetic beauty rich in the creator's unique design concept. Viewed from the left and right sides, in addition to resembling mountains, it also looks like a staircase reaching into the clouds, with different heights of the tiers interlocking to form a unique visual aesthetic. Furthermore... Similarly, the left and right side views feature a subtle indentation at the bottom of the probe, adding a touch of dynamism to the overall seriousness with a streamlined recess. In summary, this design has a rich sense of layering, and through the combination of various geometric and three-dimensional elements, it presents a novel and unique product that embodies the creator's ingenious design concept, showcasing the creativity of this project. It has met the requirements for a design patent application, and therefore, a design patent application is filed in accordance with the law. We respectfully request that the Bureau grant us the patent, for which we would be most grateful.

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