Adhesive tape for manufacturing semiconductor device

Abstract

【Item Uses】 The adhesive tape requested in this design for manufacturing semiconductor devices is used in semiconductor manufacturing processes. 【Design Description】 The dotted lines shown in the diagram represent the parts that are not recommended for design in this case. The area enclosed by the chain line shown in the diagram defines the scope of the claims made in this case. The chain line itself is the part of the design that is not claimed in this case. The substrate, bonding layer, and PET separator of the adhesive tape used in this design for manufacturing semiconductor components are all transparent components.

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