Adhesive tape for manufacturing semiconductor device
TWD245892SActive Publication Date: 2026-08-01RESONAC CORP
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Designs
- Current Assignee / Owner
- RESONAC CORP
- Filing Date
- 2025-10-09
- Publication Date
- 2026-08-01
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Figure TWG2TB001904286_001 
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Abstract
【Item Uses】 The adhesive tape requested in this design for manufacturing semiconductor devices is used in semiconductor manufacturing processes. 【Design Description】 The rear view is a perspective that ordinary consumers would not notice when purchasing or using the product, so it is omitted. The dotted lines shown in the diagram represent the parts that are not recommended for design in this case. The area enclosed by the chain line shown in the diagram defines the scope of the claims made in this case. The chain line itself is the part of the design that is not claimed in this case.
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