Adhesive tape for manufacturing semiconductor device

TWD245892SActive Publication Date: 2026-08-01RESONAC CORP
View PDF 3 Cites 0 Cited by

Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Designs
Current Assignee / Owner
RESONAC CORP
Filing Date
2025-10-09
Publication Date
2026-08-01

Smart Images

  • Figure TWG2TB001904286_001
    Figure TWG2TB001904286_001
  • Figure TWG2TB001904286_002
    Figure TWG2TB001904286_002
  • Figure TWG2TB001904286_003
    Figure TWG2TB001904286_003
Patent Text Reader

Abstract

【Item Uses】 The adhesive tape requested in this design for manufacturing semiconductor devices is used in semiconductor manufacturing processes. 【Design Description】 The rear view is a perspective that ordinary consumers would not notice when purchasing or using the product, so it is omitted. The dotted lines shown in the diagram represent the parts that are not recommended for design in this case. The area enclosed by the chain line shown in the diagram defines the scope of the claims made in this case. The chain line itself is the part of the design that is not claimed in this case.
Need to check novelty before this filing date? Find Prior Art