Interconnect module

TWD246395SActive Publication Date: 2026-09-01SAMTEC INC
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Patent Information

Application Number
TW113305140
Authority / Receiving Office
TW · TW
Patent Type
Designs
Current Assignee / Owner
Priority Date
2023-06-29
Filing Date
2023-08-07
Publication Date
2026-09-01
Estimated Expiration
2038-08-06

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Abstract

【Item Uses】 The interconnect module of this invention can be used for general purposes in a variety of applications. 【Design Description】 From an overall perspective, the interconnect module of this creation not only completely breaks away from the traditional design of existing products, but also has a refined and unique overall shape, with novel and distinctive visual effects and creativity. The dotted lines in the diagram represent the parts for which this design is not claimed; the area enclosed by a single chain line in the diagram defines the scope for which this design is to be claimed, and that single chain line itself represents the parts for which this design is not claimed; the semi-transparent fills in the diagram represent the parts for which this design is not claimed. The scope of the design patent is as shown in the drawings.
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Citation Information

Patent Citations

  • Connector

    TWD218587S