Semiconductor die bonder

TWD246551SActive Publication Date: 2026-09-01FASFORD TECH
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Patent Information

Application Number
TW115301215
Authority / Receiving Office
TW · TW
Patent Type
Designs
Current Assignee / Owner
Priority Date
2025-09-19
Filing Date
2026-03-12
Publication Date
2026-09-01
Estimated Expiration
2041-03-11

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Abstract

【Item Uses】 The item described herein relates to a semiconductor manufacturing die bonding machine, which is used to pick up semiconductor devices from a wafer and transfer them to a lead frame or substrate for mounting. 【Design Description】 The semiconductor manufacturing die bonding machine of this design has a manufacturing space inside, which can be used to transfer and install semiconductor components onto lead frames or substrates. The semiconductor manufacturing die bonding machine of this design is equipped with a display for showing the manufacturing conditions or manufacturing status of semiconductor manufacturing. The dotted lines shown in the diagram represent the parts that are not recommended for design in this case.
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Citation Information

Patent Citations

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