Memory module
TWD246982SActive Publication Date: 2026-10-01AGITECHNOLOGYCO LTD
Patent Information
- Application Number
- TW115300478
- Authority / Receiving Office
- TW · TW
- Patent Type
- Designs
- Current Assignee / Owner
- Filing Date
- 2026-01-30
- Publication Date
- 2026-10-01
- Estimated Expiration
- 2041-01-29
Smart Images

Figure TWG2TB001914613_001 
Figure TWG2TB001914613_002 
Figure TWG2TB001914613_003
Abstract
【Item Uses】 The item in this design is a memory module installed in a computer host. 【Design Description】 The distinctive feature of this design is its overall appearance, which is a geometric and linear combination of a top light guide and a heat sink. The surface of the heat sink has multiple sets of symmetrically arranged diagonal lines that extend from the central area to both sides, forming a radial arrangement. The overall visual presentation resembles a diamond-shaped totem structure, giving the appearance a three-dimensional and technological feel. The top light guide system adopts an irregular polyhedral shape with sharp edges and corners. Its surface is composed of multiple intersecting planes, forming a three-dimensional appearance with a geometric cut. It echoes the diagonal lines of the heat sink below, which is different from the appearance of traditional heat sink modules with smooth or single shapes. The dotted lines shown in the diagram (the exposed parts of the AGI trademark and circuit board) are the parts that this case does not advocate designing.
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Citation Information
Patent Citations
Memory module
TWD169231S
Electronic device heat sink
TWD224451S
Portion of heat sink for memory module
TWD225439S
