Mold for resin molding

Abstract

【Item Uses】 The resin molding mold requested in this design is a mold for resin molding equipment, which is used to encapsulate substrates on which semiconductor wafers or the like have been fixed with resin. As shown in the reference figure, the pusher and support claw of the workpiece fixture are configured to span the film pusher, so that the film pusher is configured more inward than the conventional structure, that is, closer to the cavity of the opposite lower mold, thereby reducing the size of the demolding film. 【Design Description】 The dotted lines shown in the diagram represent the parts that are not recommended for design in this case. The area enclosed by the chain line shown in the diagram defines the scope of the claims made in this case. The chain line itself is the part of the design that is not claimed in this case. Referring to the enlarged view of section AB and the reference view of the claim section of section CC, the parts of the design claimed in this case are indicated in red.

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