Adhesive tape for manufacturing semiconductor device
TWD247397SActive Publication Date: 2026-10-21RESONAC CORP
Patent Information
- Application Number
- TW115300900D05
- Authority / Receiving Office
- TW · TW
- Patent Type
- Designs
- Current Assignee / Owner
- Priority Date
- 2025-08-27
- Filing Date
- 2026-02-25
- Publication Date
- 2026-10-21
- Estimated Expiration
- 2041-02-24
Smart Images

Figure TWG2TB001918013_001 
Figure TWG2TB001918013_002 
Figure TWG2TB001918013_003
Abstract
【Item Uses】 This case requests an adhesive tape with visual effects for use in manufacturing semiconductor components. 【Design Description】 In the front view, this design can extend continuously in the left and right directions. In this case, the base material, adhesive layer, and PET release membrane are all transparent. The dotted lines and colored areas shown in the diagram are the parts that this design does not advocate. The area enclosed by the chain line shown in the diagram defines the scope of the claims made in this case. The chain line itself is the part of the design that is not claimed in this case.
Need to check novelty before this filing date? Find Prior Art
Citation Information
Patent Citations
Tape for packaging electronic devices
TWD203973S
