Adhesive tape for manufacturing semiconductor device

TWD247397SActive Publication Date: 2026-10-21RESONAC CORP
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Patent Information

Application Number
TW115300900D05
Authority / Receiving Office
TW · TW
Patent Type
Designs
Current Assignee / Owner
Priority Date
2025-08-27
Filing Date
2026-02-25
Publication Date
2026-10-21
Estimated Expiration
2041-02-24

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Abstract

【Item Uses】 This case requests an adhesive tape with visual effects for use in manufacturing semiconductor components. 【Design Description】 In the front view, this design can extend continuously in the left and right directions. In this case, the base material, adhesive layer, and PET release membrane are all transparent. The dotted lines and colored areas shown in the diagram are the parts that this design does not advocate. The area enclosed by the chain line shown in the diagram defines the scope of the claims made in this case. The chain line itself is the part of the design that is not claimed in this case.
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Citation Information

Patent Citations

  • Tape for packaging electronic devices

    TWD203973S