Communication jack having a dielectric film between plug interface contacts

Abstract

Embodiments of this invention relate to the design of network sockets that can be used for cable connections. In one embodiment, the invention is an RJ45 socket that utilizes a thin dielectric film between two layers of PIC (plug interface contact) to provide crosstalk compensation through their geometry. Compensation is achieved via capacitor plates that hold the thin dielectric film. This allows for adjacent PIC layers and, if necessary, higher coupling, allowing for greater compensation near the plug / socket contact point. This allows the effect of moving compensation to be applied closer to the plug / socket contact point, which in turn reduces the amount of compensation required further along the data path.

Description

[Technical Field] The embodiments of the present invention are generally related to the field of network communications, and more specifically, to the design of network sockets that can be used for cable connections. [Previous Technology] As is known to those skilled in the art, network connection components such as RJ45 plugs and sockets generate and eliminate predetermined amounts of crosstalk. It is also known that, in order to more effectively eliminate crosstalk in an RJ45 socket, the compensation circuit must be moved as close as possible to the plug / socket mating interface. One way to achieve this is by using a flexible printed circuit board (PCB) connected to the socket's PIC (plug interface contact) at a location relatively close to the plug / socket mating interface. An example of this configuration is provided in U.S. Patent Application Publication No. 2008 / 0045090, where Figures 15A to 15G illustrate exemplary sockets using a flexible PCB with crosstalk compensation circuitry. While effective, this method is expensive due to the high cost of flexible PCBs. Another method of moving the crosstalk circuit closer to the plug / receptacle interface involves implementing crossover in some of the contact traces of the receptacle. An example of this configuration can be seen in U.S. Patent Application Publication No. 2014 / 0073195, where the crossover in the PIC is implemented near the spindle of the skid plate. While these crossovers allow compensation to begin relatively early after the plug / receptacle interface, it is difficult to obtain sufficient coupling, resulting in a larger portion of the compensation signal being generated further away from the plug / receptacle interface to achieve a net compensation signal. Given the above, there is still a need to improve socket design to provide adequate crosstalk cancellation while maintaining relatively economical manufacturing. [Summary of the Invention] Therefore, at least some embodiments of the present invention lead to improved socket designs that provide adequate crosstalk cancellation while remaining relatively economical. In one embodiment, the present invention is an RJ45 socket that utilizes a thin dielectric film between two PIC layers to provide crosstalk compensation via its geometry. Compensation is achieved by capacitor plates clamping the thin dielectric film. This allows for closer proximity of the PIC layers and, as needed, higher coupling, allowing for greater compensation near the plug / socket contact point. This allows the effect of motion compensation to be applied closer to the plug / socket contact point, which in turn reduces the amount of further compensation and / or crosstalk required along the data path. In another embodiment, the present invention is a communication socket for mating with a communication plug. The communication socket includes: a housing having an opening for receiving the communication plug; a skid plate at least partially positioned inside the housing, a first end of the skid plate being proximate to the opening and having a spindle, and a second end being distal to the opening; a first PIC, each of the first plurality of PICs having a first portion extending along one side of the skid plate and a second portion formed around the spindle; a second plurality of PICs, each of the second plurality of PICs having a first portion extending along that side of the skid plate and a second portion formed around the spindle; and a dielectric film positioned between at least some of the first portions of the first plurality of PICs and at least some of the first portions of the second plurality of PICs, the dielectric film being further positioned between at least some of the second portions of the first plurality of PICs and at least some of the second portions of the second plurality of PICs. In another embodiment, the present invention is a communication socket for mating with a communication plug. The communication socket includes: a housing having an opening for receiving the communication plug, the housing further having a plurality of pressure-resistant ribs; a skid plate at least partially positioned inside the housing, a first end of the skid plate being adjacent to the opening and having a spindle, and a second end being distal to the opening; a first plurality of PICs, each of the first plurality of PICs having a first portion extending along one side of the skid plate and a second portion formed around the spindle; a second plurality of PICs, each of the second plurality of PICs having a first portion extending along that side of the skid plate and a second portion formed around the spindle; and a dielectric film positioned between at least some of the first portions of the first plurality of PICs and at least some of the first portions of the second plurality of PICs, wherein the pressure-resistant ribs press against at least some of the first plurality of PICs against the dielectric film. In yet another embodiment, the present invention is a communication socket for mating with a communication plug. The communication socket includes: a housing having an opening for receiving the communication plug; a skid plate at least partially positioned inside the housing, a first end of the skid plate being proximate to the opening and having a spindle, and a second end being distal to the opening; a first plurality of PICs, each of the first plurality of PICs having a first portion extending along one side of the skid plate and a second portion formed around the spindle; and a second plurality of PICs, each of the second plurality of PICs having a first portion extending along that side of the skid plate and a second portion formed around the spindle. The two parts; and a dielectric film positioned between at least some of the first parts of the first plurality of PICs and at least some of the first parts of the second plurality of PICs, wherein at least one of the first plurality of PICs is capacitively coupled to at least one of the second plurality of PICs via a first capacitor plate positioned on the at least one of the first plurality of PICs and a second capacitor plate positioned on the at least one of the second plurality of PICs, and wherein the first capacitor plate overlaps and extends over the second capacitor plate. These and other features, aspects and advantages of the invention will be better understood by referring to the following figures, descriptions and any claims that may be followed. [Simplified Explanation of the Diagram] Figure 1 is a top isometric view of a communication system according to one embodiment of the present invention. Figure 2 is a bottom-view isometric view of a socket according to one embodiment of the present invention. Figure 3 is an exploded bottom isometric view of a socket according to one embodiment of the present invention. Figure 4 is a top isometric view of a skid plate assembly according to one embodiment of the present invention before disassembly. Figure 5 is an exploded top isometric view of the skid plate assembly shown in Figure 4. Figure 6 is a partially transparent front view of the skid assembly shown in Figure 4. Figure 7A is a partially transparent top view of the skid plate assembly in Figure 4. Figure 7B is a detailed view derived from Figure 7A. Figure 8 is a bottom-view isometric view of the front and rear of the outer casing according to one embodiment of the present invention. Figure 9 shows an isometric cross-sectional view of the front shell of Figure 8, obtained around section line 9-9. Figure 10 shows an isometric cross-sectional view of the outer casing according to one embodiment of the present invention. Figure 11 shows an isometric cross-sectional view of the outer casing according to one embodiment of the present invention. Figure 12 is a cross-sectional view of the communication system in Figure 1 taken around section line 12-12.

Implementation Method

Claims

1. A communication socket for mating with a communication plug, the communication socket comprising: The housing has an opening for receiving the communication plug; A skid plate, at least partially positioned inside the housing, has a first end near the opening and having a spindle, and a second end distal to the opening; a first plurality of PICs (plug interface contacts), each of the first plurality of PICs having a first portion extending along one side of the skid plate and a second portion formed around the spindle; a second plurality of PICs, each of the second plurality of PICs having a first portion extending along that side of the skid plate and a second portion formed around the spindle; and a dielectric film positioned within the first plurality of PICs. The dielectric film is further positioned between at least some of the first portions of the PIC and at least some of the first portions of the second plurality of PICs; wherein the first plurality of PICs and the second plurality of PICs are mirror images of each other in their respective first portions, and wherein at least one of the first plurality of PICs and at least one of the second plurality of PICs intersect in their respective second portions.

2. As in the communication socket of claim 1, wherein, The mandrel includes a first mandrel and a second mandrel, the first mandrel having a larger radius than the second mandrel, wherein the second portion of each of the first plurality of PICs is formed around the first mandrel, and wherein the second portion of each of the second plurality of PICs is formed around the second mandrel.

3. As in the communication socket described in claim 1, wherein, The housing includes a plurality of pressure-resistant ribs that press at least some of the first plurality of PICs against the dielectric film.

4. For example, the communication socket described in claim 3, wherein, The pressure-resistant rib further presses the dielectric film against at least some of the second plurality of PICs.

5. As in the communication socket described in claim 1, wherein, At least some of the first portions of the first plurality of PICs include a first capacitor plate, wherein at least some of the first portions of the second plurality of PICs include a second capacitor plate, and wherein each of the first capacitor plates is separated from one of the second capacitor plates by about 0.002 inches.

6. As in the communication socket described in claim 1, wherein, At least one of the first plurality of PICs is capacitively coupled to at least one of the second plurality of PICs via a first capacitor plate positioned on the at least one of the first plurality of PICs and a second capacitor plate positioned on the at least one of the second plurality of PICs, wherein the first capacitor plate overlaps and extends over the second capacitor plate.

7. For example, the communication socket described in claim 6, wherein, The first capacitor plate extends over the second capacitor plate by a distance of at least 0.001 inches.

8. Such as the communication socket in claim 7, wherein, This distance extends along each side of the second plate.

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