Connectors and relevant panel , tray and substrate

Abstract

A cable connector system may include: a board connector attached to a die package; a cable connector attached to the board connector; and an 1RU board I / O connector attached to the cable connector.

Description

[Technical Field] This invention relates to connector systems. More specifically, this invention relates to connector systems that allow cable connectors to be connected to a substrate in a stacked configuration. This application claims the benefits of U.S. Patent Application No. 62 / 704,025, filed October 9, 2018; U.S. Patent Application No. 62 / 704,052, filed January 28, 2019; U.S. Patent Application No. 62 / 813,102, filed March 3, 2019; U.S. Patent Application No. 62 / 840,731, filed April 30, 2019; and PCT Application No. PCT / US2019 / 041356, filed July 11, 2019, all of which are incorporated herein by reference in their entirety for all purposes as fully set forth herein. [Previous Technology] Known cable connector systems may include various signal pairs or optical cables that electrically or optically connect application-specific integrated circuits (ASICs) and boards. A problem with using known cable connector systems is providing high density and high terabyte throughput between the ASIC and the front panel of the rack-mount equipment enclosing the ASIC. [Summary of the Invention] To overcome the aforementioned problems, preferred embodiments of the present invention provide a cable connector system that allows cable connectors to be connected to board connectors in a stacked or nested configuration while simultaneously reducing the footprint and stacking height required by the board connectors. For example, embodiments of the present invention can be used for groups of connectors positioned on one or two opposing surfaces of a die package substrate or on one or two opposing sides of a second substrate, the second substrate including a die package and attached to a body substrate. Embodiments of the present invention can be used to transmit at least 50 terabytes of data with -40 dB or better frequency domain crosstalk on standard 70 mm x 70 mm die packages, 75 mm x 75 mm die packages, 85 mm x 85 mm die packages, 120 mm x 120 mm die packages, 150 mm x 150 mm die packages, or other sizes of die packages. Embodiments of the present invention may have a height measured from the mounting surface of the substrate to the top surface of any of the connectors described herein from about 1.5 mm to about 7 mm. The board connector may include a housing. The housing may include a first board connector mating interface surface, a first slot defined by the first board connector mating interface surface, a second slot vertically stacked above the first slot, and a first housing wall partially defining both the first and second slots. A first leadframe assembly may be disposed in the first slot. The first leadframe assembly may include a first signal conductor defining a first mating end and a second signal conductor defining a second mating end. A second leadframe assembly may be disposed in the second slot. The second leadframe assembly may include a third signal conductor defining a third mating end and a fourth signal conductor defining a fourth mating end. The first and second mating ends may each be disposed closer to the first board connector mating interface surface than the third and fourth mating ends. The first housing wall may extend above the first, second, third, and fourth mating ends. The first groove may be defined by the first housing wall, a first wall, and a pair of third walls on either side. The first wall and the third wall on either side may be evenly spaced from a longitudinal centerline located between the first wall and the third wall on either side. The longitudinal centerline may also be parallel to both the first wall and the third wall on either side. The second groove may be defined by a first housing wall, a first wall, and a third wall portion on the opposite side, and the first wall and the third wall on the opposite side may be unevenly spaced from the longitudinal centerline. Alternatively, the second groove may be defined by a first housing wall, a first wall, and a third wall portion on the opposite side, and the first wall and the third wall on the opposite side may be evenly spaced from the longitudinal centerline. The housing may include a third slot vertically stacked above the second slot, a second housing wall partially defining both the second and third slots, and a third lead frame assembly disposed in the third slot. The third lead frame assembly may include a fifth signal conductor having a fifth mating end and a sixth signal conductor having a sixth mating end. The fifth and sixth mating ends may each be disposed further away from the mating interface surface of the first board connector than the first, second, third, and fourth mating ends. The third groove may be defined by the second shell wall, the first wall, and a portion of the third wall on the opposite side, with the first wall and the third wall on the opposite side being unevenly spaced from the longitudinal centerline. Alternatively, the second groove may be defined by the second shell wall, the first wall, and a portion of the third wall on the opposite side, with the first wall and the third wall on the opposite side being evenly spaced from the longitudinal centerline. The board connector housing may further include a fourth slot vertically stacked above the third slot, a third housing wall partially defining both the third and fourth slots, and a fourth lead frame assembly disposed in the fourth slot. The fourth lead frame assembly may include a seventh signal conductor having a seventh mating end and an eighth signal conductor having an eighth mating end. The seventh and eighth mating ends may each be disposed further away from the first board connector mating interface surface than the first, second, third, fourth, fifth, and sixth mating ends. The fourth groove may be defined by the third shell wall, the first wall, and a portion of the third wall on the opposite side, wherein the first wall and the third wall on the opposite side are unevenly spaced from the longitudinal centerline. Alternatively, the fourth groove may be defined by the third shell wall, the first wall, and a portion of the third wall on the opposite side, wherein the first wall and the third wall on the opposite side are evenly spaced from the longitudinal centerline. The first and second slots may each have the same width. The first and second slots may each have the same depth. The first and second slots may each have different depths. The first and second slots may each accommodate the same cable connector. The first, second, third, and fourth signal conductors may each be socket conductors. The housing is configured to protrude beyond the edge of the mounting base. The housing may have a height of approximately 1.7mm to approximately 4mm, approximately 4mm to approximately 7mm, approximately 5mm to approximately 8mm, or approximately 1.7mm to approximately 7mm. The first, second, and third slots may each have the same width. The second and third slots may each have the same width. The first, second, and third slots may each have the same depth. The second and third slots may each have the same depth. The first, second, third, and fourth slots may each have the same width. The third and fourth slots may each have the same width. The first, second, third, and fourth slots may each have the same depth. The third and fourth slots may each have the same depth. The cable connector may include a cable connector shield. The cable connector shield may include a single sheet of conductive material having shield arms and holes. The shield arms may bend backward and extend into the holes. The cable connector may mate with a mating connector. The shield arms may be configured to form an electrical connection with the mating connector shield. The cable connector may include an insert comprising a cable connector signal conductor. A cable may be connected to the cable connector signal conductor. The cable connector height may be approximately 1 mm. An electrical connector may be provided with different signal pairs and a unified connector shield. The connector shield may include a first connector shield surface, a second connector shield surface opposite the first connector shield surface, a hole, and a shield arm. The shield arm is rearwardly bendable above the first connector shield surface and through the hole, the first connector shield surface, and the second connector shield surface, such that the shield arm is configured to contact a mating connector shield of a mating connector when the electrical connector mates with the mating connector. The electrical connector may be a cable connector. A board may be provided. The board may define a 1RU area and at least 257 different 56 GHz signal pairs disposed in the 1RU area, or at least 289 different 56 GHz signal pairs may be disposed in the 1RU area, or at least 300 different 56 GHz signal pairs may be disposed in the 1RU area, or at least 400 different 56 GHz signal pairs may be disposed in the 1RU area, or at least 500 different 56 GHz signal pairs may be disposed in the 1RU area. A tray may be provided. This tray may include a first airflow area and a second airflow area. The first airflow area and the second airflow area may be arranged parallel to each other, may be arranged adjacent to each other, and may each be served by an individual fan. A back-to-back transceiver may be placed in the first airflow area. A die may be placed in the second airflow area. A mating electrical right-angle connector can have a mating stack height greater than zero but less than approximately 5 mm. A substrate may be provided. The substrate may include a first linear pad array extending along a first pad centerline and including a first end pad and a second end pad at opposite ends of the first linear pad array. A second linear pad array extending along a second pad centerline and including a third end pad and a fourth end pad at opposite ends of the second linear pad array. A possible first solder tab pad on the substrate may have a first solder tab centerline. A possible second solder tab pad on the substrate may have a second solder tab centerline. The first pad centerline may be arranged parallel to the second pad centerline. The first linear pad array may be offset from the second linear pad array by more than one column spacing. The first end pad and the third end pad may each be on the same side of the substrate, and the second end pad and the fourth end pad may each be on the same side of the substrate opposite to the first end pad and the third end pad. The center lines of the first and second weld tabs can be arranged parallel to each other and perpendicular to the center lines of the first and second pads, respectively. A first pad distance from the center of the second end pad to the center line of the second weld tab can be less than a second pad distance from the center of the third end pad to the center line of the first weld tab. A third pad distance in the first linear pad array between the first end pad and the center line of the first weld tab can be greater than the first pad distance. The center lines of the first and second pads do not intersect with the first or second weld tab pads. Referring to the accompanying drawings, the above and other features, elements, characteristics, steps, and advantages of the present invention will become more apparent from the following detailed description of embodiments of the invention. [Simplified Explanation of the Diagram] Figure 1 is a perspective top view of the cable connector system. Figure 2 is a side view of the cable connector system shown in Figure 1. Figure 3 is a perspective bottom view of the cable connector system shown in Figure 1. Figure 4 is a perspective top view of the board connector shown in Figure 1. Figure 5 is a perspective front view of the board connector shown in Figure 1. Figure 6 is a perspective front view of the first shell shown in Figure 1. Figure 7 is a perspective rear view of the first shell shown in Figure 1. Figure 8 is a perspective top view of the second shell shown in Figure 1. Figure 9 is a perspective side view of the conductors of the mating lead frame assembly shown in Figure 1 without any plastic or overmolding. Figure 10 is a perspective front view of the lead frame assembly. Figure 11 is a perspective top view of the first leader frame assembly shown in Figure 10. Figure 12 is a perspective front view of the board connector including the lead frame assembly shown in Figure 10. Figure 13 is a front view of the first shell shown in Figure 12. Figure 14 is a perspective rear view of a cable connector system with a protruding plate connector. Figure 15 is a perspective rear view of a 1x2 cable connector system. Figure 16 is a perspective rear view of a 1x2 cable connector system with a protruding plate connector. Figure 17 is a perspective front view of a cable connector. Figure 18 is a perspective top view of the cable connector shown in Figure 17. Figure 19 is a cross-sectional side view of the cable connector system shown in Figure 1. Figure 20 is a top perspective view of the cable connector shield and insert. Figure 21 is a perspective top view of the cable connector shield before bending. Figure 22 is a top perspective view of a cable connector shield manufactured by progressive molding. Figure 23 is a top perspective view of a cable connector shield manufactured by progressive molding. Figure 24 is a top perspective view of a cable connector shield manufactured by progressive molding. Figure 25 is a top perspective view of a cable connector shield manufactured by progressive molding. Figure 26 is a top view of the area occupied by the first substrate. Figure 27 is a top view of the area occupied by the second substrate. Figure 28 is a top view of the die package mounted on the main substrate. Figure 29 is a bottom view of a die package filled with a cable connector system. Figure 30 is a perspective side view of the board I / O connector. Figure 31 is a perspective side view of the external cable connector. Figure 32 is a front view of the 1RU plate. Figure 33 is a perspective top view of the tray. Figure 34 is a side view of two stacked onboard transceivers. Figure 35 is a perspective top view of the tray shown in Figure 33, in which components have been removed for clarity.

Implementation Method

Claims

1. A board connector comprising: a housing including: A first board connector mating interface surface; a first slot defined by the first board connector mating interface surface; a second slot vertically stacked above the first slot; and a first housing wall partially defining both the first slot and the second slot; a first lead frame assembly disposed in the first slot, the first lead frame assembly including a first signal conductor having a first mating end and a second signal conductor having a second mating end; a second lead frame assembly disposed in the second slot, the second lead frame assembly including a third signal conductor having a third mating end and a fourth signal conductor having a fourth mating end; wherein the first mating end and the second mating end are disposed closer to the first board connector mating interface surface than the third mating end and the fourth mating end; and the first housing wall extends above the first mating end, the second mating end, the third mating end, and the fourth mating end.

2. The board connector as claimed in claim 1, wherein the first slot is defined by the first housing wall, a first wall and a pair of third walls on both sides, and the first wall and the third wall on both sides are uniformly spaced from a longitudinal centerline located between the first wall and the third wall on both sides and parallel to both the first wall and the third wall on both sides.

3. The board connector as claimed in claim 2, wherein the second slot is defined by the first housing wall, the first wall and the third wall portion on the opposite side, and the first wall and the third wall portion on the opposite side are unevenly spaced from the longitudinal centerline.

4. The board connector as claimed in claim 2, wherein the second slot is defined by the first housing wall, the first wall and the third wall portion on the opposite side, and the first wall and the third wall portion on the opposite side are evenly spaced from the longitudinal centerline.

5. The board connector as claimed in claim 1, wherein the housing further comprises: A third slot, which is vertically stacked above the second slot, a second housing wall, which partially defines both the second and third slots, and a third lead frame assembly disposed in the third slot. The third lead frame assembly includes a fifth signal conductor having a fifth mating end and a sixth signal conductor having a sixth mating end, wherein the fifth mating end and the sixth mating end are each disposed further away from the mating interface surface of the first board connector than the first mating end, the second mating end, the third mating end and the fourth mating end.

6. The board connector as claimed in claim 5, wherein the third slot is defined by the second housing wall, a first wall and a pair of side third walls, and the first wall and the side third walls are unevenly spaced from a longitudinal centerline.

7. The board connector as claimed in claim 5, wherein the second slot is defined by the second housing wall, a first wall and a pair of third walls on opposite sides, and the first wall and the third walls on opposite sides are evenly spaced from a longitudinal centerline.

8. The board connector as claimed in claim 5, wherein the housing further comprises: A fourth slot, which is vertically stacked above the third slot; a third housing wall, which partially defines both the third and fourth slots; and a fourth lead frame assembly disposed in the fourth slot. The fourth lead frame assembly includes a seventh signal conductor having a seventh mating end and an eighth signal conductor having an eighth mating end, wherein the seventh and eighth mating ends are each disposed further away from the mating interface surface of the first board connector than the first, second, third, fourth, fifth, and sixth mating ends.

9. The board connector as claimed in claim 8, wherein the fourth slot is defined by the third housing wall, a first wall and a pair of side third wall portions, and the first wall and the side third wall are unevenly spaced from a longitudinal centerline.

10. The board connector as claimed in claim 8, wherein the fourth slot is defined by the third housing wall, a first wall and a pair of side third wall portions, and the first wall and the side third wall are evenly spaced from a longitudinal centerline.

11. A board connector as described in any one of claims 1 to 10, wherein the first slot and the second slot each have the same width.

12. The board connector as described in any one of claims 1 to 10, wherein the first slot and the second slot each have the same depth.

13. The board connector as described in any one of claims 1 to 10, wherein the first slot and the second slot each have different depths.

14. The board connector as described in any one of claims 1 to 10, wherein the first slot and the second slot each receive an identical cable connector.

15. The board connector as described in any one of claims 1 to 10, wherein the first signal conductor, the second signal conductor, the third signal conductor and the fourth signal conductor are each a socket conductor.

16. A board connector as described in any one of claims 1 to 10, wherein the housing is configured to protrude beyond the edge of a mounting base plate.

17. A board connector as described in any one of claims 1 to 4, wherein the housing has a height of approximately 1.7 mm to approximately 4 mm.

18. A board connector as described in any one of claims 5 to 7, wherein the housing has a height of approximately 4 mm to approximately 7 mm.

19. The board connector as described in any one of claims 5 to 7, wherein the first slot, the second slot, and the third slot each have the same width.

20. A board connector as described in any one of claims 5 to 7, wherein the second slot and the third slot each have the same width.

21. The board connector as described in any one of claims 5 to 7, wherein the first slot, the second slot, and the third slot each have the same depth.

22. The board connector as described in any one of claims 5 to 7, wherein the second slot and the third slot each have the same depth.

23. A board connector as described in any one of claims 8 to 10, wherein the housing has a height of approximately 5 mm to approximately 8 mm.

24. A board connector as described in any one of claims 8 to 10, wherein the first slot, the second slot, the third slot, and the fourth slot each have the same width.

25. A board connector as described in any one of claims 8 to 10, wherein the third slot and the fourth slot each have the same width.

26. The board connector as described in any one of claims 8 to 10, wherein the first slot, the second slot, the third slot, and the fourth slot each have the same depth.

27. A board connector as described in any one of claims 8 to 10, wherein the third slot and the fourth slot each have the same depth.

28. A cable connector mating with a board connector as described in any one of claims 1 to 27, the cable connector including a cable connector shielding having a shielding arm and an aperture, wherein the shielding arm is bent rearward and extends into the aperture.

29. The cable connector as claimed in claim 28, wherein when the cable connector is mated with a mating connector, the shield arm is configured to form an electrical connection with a mating connector shield.

30. The cable connector as claimed in claim 28 or 29, further comprising an insert including a cable connector signal conductor.

31. The cable connector as described in claim 30, further comprising a cable connected to the signal conductor of the cable connector.

32. The cable connector as described in claim 31, wherein the height of the cable connector is approximately 1 mm.

33. An electrical connector mating with a board connector as claimed in any one of claims 1 to 8, the electrical connector comprising different signal pairs and a unified connector shield, wherein the connector shield includes a first connector shield surface, a second connector shield surface opposite to the first connector shield surface, a hole, and a shield arm; and the shield arm is rearwardly bent on the first connector shield surface and passes through the hole, the first connector shield surface, and the second connector shield surface, such that the shield arm is configured to contact one of the mating connector shields of the mating connector when the electrical connector is mated with a mating connector.

34. The electrical connector as described in claim 33, wherein the electrical connector is a cable connector.

35. A board assembly for assembling a board connector as described in any one of claims 1 to 8, the board assembly comprising: a 1RU region; and at least two hundred and fifty-seven different 56 GHz signal pairs disposed in the 1RU region.

36. The board as described in claim 35, wherein at least two hundred and eighty-nine different 56 GHz signal pairs are disposed in the 1RU area.

37. The board as described in claim 35, wherein at least three hundred different 56 GHz signal pairs are disposed in the 1RU area.

38. The board as described in claim 35, wherein at least four hundred different 56 GHz signal pairs are located in the 1RU area.

39. The board as described in claim 35, wherein at least five hundred different 56 GHz signal pairs are disposed in the 1RU area.

40. A tray for carrying a plate as described in claim 35, the tray comprising: a first airflow region; and a second airflow region, wherein the first airflow region and the second airflow region are parallel to each other, arranged adjacent to each other, and are served by individual fans.

41. The tray as claimed in claim 40, further comprising a back-to-back transceiver disposed in the first airflow region.

42. The tray as described in claim 40, further comprising a grain disposed in the second airflow region.

43. A mating electrical right-angle connector comprising a board connector as described in claim 1 and an electrical connector as described in claim 33, wherein the mating electrical right-angle connector has a mating stack height greater than zero but less than approximately 5 mm.

44. A substrate for mounting a board connector as claimed in any one of claims 1 to 8, the substrate comprising: a first linear pad array extending along a first pad centerline and including a first end pad and a second end pad at opposite ends of the first linear pad array; a second linear pad array extending along a second pad centerline and including a third end pad and a fourth end pad at opposite ends of the second linear pad array; a first solder tab pad having a first solder tab centerline; and a second solder tab pad having a second solder tab centerline, wherein the first pad centerline is parallel to the second pad centerline. The first linear pad array is offset from the second linear pad array by more than one column spacing. The first end pad and the third end pad are on the same side of the substrate, and the second end pad and the fourth end pad are on the same side of the substrate opposite to the first end pad and the third end pad. The center lines of the first weld tab and the second weld tab are each parallel to each other and perpendicular to the center lines of the first pad and the second pad, respectively. The distance from the center of the second end pad to the center line of the second weld tab is less than the distance from the center of the third end pad to the center line of the first weld tab.

45. The substrate as claimed in claim 44, wherein a third pad distance between the first end pad in the first linear pad array and the centerline of the first weld tab is greater than the first pad distance.

46. ​​The substrate as described in claim 44 or 45, wherein the center line of the first pad and the center line of the second pad do not intersect with the first solder tab pad or the second solder tab pad.

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