System for a chemical and / or electrolytic surface treatment of a substrate, modular distribution body for a chemical and / or electrolytic surface treatment of a substrate, and manufacturing method for at least two distribution body elements

Abstract

This invention relates to a system of at least two distribution elements for chemical and / or electrical surface treatment of a substrate, a modular distribution including the system, and a method for manufacturing the at least two distribution elements. In the system of at least two distribution elements, each distribution element has a plate shape and includes an injection port for distributing a process fluid from inside the distribution element to the substrate to be treated, and an outlet for distributing the process fluid and a current through the distribution element. Each distribution element has a connection region configured to connect to a connection region of another distribution element to form a modular distribution including at least two distribution elements.

Description

Technical Field

[0001] The present invention relates to a system for at least two distribution elements for chemical and / or electrical surface treatment of a substrate, a modular distribution including the system, and a method for manufacturing the at least two distribution elements. Prior Technology

[0002] The size of a substrate used to produce a printed circuit board (PCB) panel has increased significantly with advancements in scaling technology to improve manufacturing efficiency and meet the demand for larger panels. The length of a single side of the panel has exceeded 1800 mm, and in some cases even exceeds 3000 mm. Consequently, the requirements for electroplating technology have become increasingly complex, particularly regarding uniform plating thickness (uniformity) and faster plating speeds.

[0003] Optimal processing results can now be achieved using a high-speed electroplating technology called the HSP system. In this system, one or two HSP plates are immersed together with one or two substrates in a tank containing an electrolyte and one or more anodes. Within the tank, the electrolyte and a current distribution are guided through the HSP plates toward the surface of a substrate. To achieve a uniform plating thickness and avoid plating difficulties at the edges of the panel, the active surface (current-permeable area) of the HSP plate must match the size of the substrate to be plated. Therefore, as the substrate size increases, the size of the HSP plate must also increase, which is technically very challenging and time-consuming. Summary of the Invention

[0004] Therefore, there may be a need for an improved system for distributing an electrolyte and / or a current distribution, which is beneficial for electroplating one of a large-size substrate.

[0005] This problem is solved by the subject matter of the independent technical solution of the present invention, wherein further embodiments are incorporated in the appended technical solutions. It should be noted that the present invention described below is applicable to a system of at least two distribution elements for a chemical and / or electrical surface treatment of a substrate, including a modular distribution of such a system, and a method for manufacturing at least two distribution elements.

[0006] According to the present invention, a system of at least two distribution elements for chemical and / or electrical surface treatment of a substrate is provided. In this system of at least two distribution elements, each distribution element has a plate shape and includes an injection port for distributing a process fluid from inside the distribution element to the substrate to be treated, and an exhaust port for distributing the process fluid and a current through the distribution element. Each distribution element has a connection region configured to connect to a connection region of another distribution element to form a modular distribution comprising at least two distribution elements.

[0007] The system according to the invention allows for flexible application of the distributor depending on the size of one of the substrates to be processed. In other words, the number and / or configuration of the distributor elements can be variably selected relative to the size and / or shape of the substrate. Conventionally, the nozzles and / or discharge ports of a distributor (particularly for an HSP (High-Speed ​​Plating) system) are manufactured by a milling process, wherein each opening is drilled individually to form holes for the distribution of a process fluid and / or a current. However, due to the increase in substrate size, the milling process takes significantly longer as the size of the distributor increases, which can lead to instability and errors in the milling process.

[0008] By combining several distribution elements that are relatively small compared to a target distribution, this large distribution can be easily provided, and process errors can be greatly reduced or even eliminated. Furthermore, the substrate size is no longer limited to the size of the distribution. Accordingly, the delivery time of the HSP system from a production site to a customer can be significantly reduced, and this delivery time is no longer dependent on milling time. Therefore, even for very large panels, the HSP system can become economically attractive.

[0009] Furthermore, the system according to the invention can provide a uniform outflow of the process fluid, the electrolyte, and / or the current distribution from the distributor to the substrate. Specifically, a sufficient fluid pressure must be maintained within the distributor from one edge to one center. To achieve this, as the size of the distributor increases, the thickness of the distributor must increase. However, a thicker distributor can lead to a significant increase in the milling time of each hole of the injection and discharge ports, and thus a significant increase in the milling time of the entire distributor. In contrast, a system comprising several distributor elements interconnected to form a larger distributor is not limited to the machining capability of a single milling machine. Therefore, the distributor can have a precise configuration of the holes on the distributor, wherein a uniform outflow rate and / or a sufficient fluid pressure can be ensured.

[0010] This system can be configured to perform a chemical surface treatment and / or an electrolytic surface treatment. Wet processing, such as the chemical and / or electrolytic surface treatments, allows for high chemical selectivity, which can be achieved using various process liquids (such as acids, alkalis, oxidants, etc.) or simple or complex mixtures thereof. Furthermore, wet processing allows for inherent simplicity, scalability in handling various types of substrates of various sizes, and low operating costs.

[0011] The chemical and / or electrolytic surface treatment of the substrate can be any material deposition, zinc plating, chemical or electrochemical etching, anodizing, metal separation processes, or the like. The substrate may include a conductor plate, a semiconductor substrate, a thin film substrate, a substantially plate-shaped metal or metallized workpiece, or the like. At least one substrate may be held by a substrate holder and immersed in an electrochemical deposition tank containing a process fluid for a current distribution and / or an electrolyte. If the current distributed through the discharge port is zero, the system can be used to perform a chemical surface treatment using the process fluid supplied through the discharge port and / or the injection port.

[0012] The plate-shaped distributor element can be configured to face the substrate. In other words, the plate-shaped distributor element can be arranged parallel to the surface of a substrate to be electroplated. The distributor element may include a distribution surface or an active surface through which a plurality of holes are formed. The plurality of holes can serve as nozzles for distributing the process fluid from inside the distributor element to the substrate to accelerate an electroplating speed and / or as outlets for distributing the process fluid and / or the current through the distributor element from one side of the distributor element to an opposite side. The outlets and nozzles can be configured in a pattern to achieve optimal electroplating uniformity.

[0013] An exhaust port may have a diameter greater than that of an injection port. An exhaust port may be surrounded by at least two injection ports, preferably a plurality of injection ports, or a plurality of injection ports preferably arranged in a circle around the exhaust port. Some or all of the exhaust ports may each be surrounded by injection ports.

[0014] The discharge ports may be formed from one side of the distribution element to the opposite side, extending through the entire distribution element. In contrast, the injection ports may extend only from the interior of one of the distribution elements to a surface of the distribution element facing the substrate. In other words, the injection ports may substantially extend only through the entire extension or a portion of the thickness of the distribution element, preferably through half of the distribution element. This can be applied to a single discharge port, some, or all of the injection ports. Accordingly, the discharge ports may be formed independently of the injection ports in the distribution element.

[0015] Through these discharge ports, the process fluid and / or the current can flow in opposite directions relative to each other. The "used process fluid" can return from the substrate, which serves as the cathode, to the anode. The current can flow from the anode to the substrate, which serves as the cathode.

[0016] Separating the current density distribution from the process fluid through separate openings provides further flexibility and simplicity in the processing of the substrate surface. Accordingly, the flow rate of the process fluid and the current density distribution can be controlled individually and independently. For example, the flow rate of the current density distribution can be reduced while the flow rate of the process fluid is kept constant, which will prevent hydrogen bubbles from adhering to the substrate during the chemical and / or electrolytic surface treatment of the substrate. Similarly, the flow rate of the process fluid can be changed (increased or decreased) while the flow rate of the current density distribution remains constant.

[0017] The distributor element can be made of conductive polymer, conductive ceramic, or metallic materials. Alternatively, it can be made of non-conductive polymer, non-conductive ceramic, or non-conductive plastic materials.

[0018] The distribution element may include a connection region configured parallel or perpendicular to the distribution surface. The connection region may also surround the distribution surface of the distribution element. The connection region allows the distribution element to engage with another distribution element to extend the distribution surface. In other words, at least two, preferably several, distribution elements may be connected to each other via the connection region to form a modular distribution. One of the extension directions of the distribution elements may not be limited to a specific direction. In other words, two or more distribution elements may be connected to each other in any direction based on the shape and / or size of one of the substrates to be processed.

[0019] Therefore, the size of the module can vary depending on the number of the distributed elements to be assembled. Preferably, the distributed elements can be connected adjacent to each other, such that the connected distributed elements together form a large distribution surface. This large distribution surface can be used, for example, for a substrate having a length of more than 1800 mm or even more than 3000 mm. Accordingly, a large distribution surface can be achieved by assembling a number of distributed elements. Since each distributed element can be manufactured within the reliable machining capabilities of the milling machine, it allows for a reliable fluid pressure and / or a uniform flow of the electrolyte and / or a current distribution to be provided across the entire distribution surface of the distributed elements.

[0020] In one example, the connection region of one distribution element is configured to be releasably connected to the connection region of another distribution element. In other words, the distribution elements connected to each other via the connection region can be separated and reassembled in a different shape and / or size. Accordingly, flexible use of one of the distribution elements according to the shape and / or size of the substrate can be achieved.

[0021] In one example, the connection area of ​​one distribution element is configured to be mechanically connected to the connection area of ​​another distribution element. This connection area ensures a strong and reliable engagement between one distribution element and an adjacent distribution element. Therefore, the connection areas of these distribution elements can be connected to each other by, for example, welding, form fitting, clips, and / or hooks. Alternatively or additionally, the connection areas of adjacent distribution elements can also be chemically bonded to each other. Alternatively or additionally, the connection areas of adjacent distribution elements can be in magnetic contact with each other.

[0022] The distribution elements may be substantially square or rectangular, with connecting areas disposed at one edge and / or edge of the distribution element. The distribution elements may also have a jigsaw puzzle shape, having an integrated protrusion and / or recess as connecting areas that connect to each other in the form of a jigsaw puzzle.

[0023] In one example, the density of openings in the distribution elements is at least about 50 / dm², preferably at least about 100 / dm², more preferably at least about 500 / dm², and even more preferably at least about 950 / dm². A milling machine for forming holes for injection ports and / or discharge ports on the distribution elements can be used for distribution elements with a single machinable size, rather than a single distribution of a large size. Accordingly, the milling machine can be used reliably without overloading due to milling the holes.

[0024] Typically, by increasing the size of one of the distribution elements to be milled, the thickness of that distribution element also needs to be increased to maintain a uniform outflow rate of the electrolyte and / or the current. However, due to the thickness of the distribution and the individual processes involved in forming the holes, this can increase the milling time of the large distribution. Subsequently, the milling machine can become unstable and process accuracy can be reduced. In contrast, by providing distribution elements that can be assembled to form a large distribution, the milling machine can form holes in the individual distribution elements within a machinable range. Accordingly, a dense arrangement of the injection and / or discharge ports on the individual distribution elements is also feasible, which can improve the plating uniformity of the substrate.

[0025] However, such distribution elements with nozzles and / or discharge ports can also be manufactured using an alternative process (such as 3D printing technology), which can form a dense arrangement of such openings.

[0026] According to the present invention, a modular distribution for chemical and / or electrolytic surface treatment of a substrate is also provided. The modular distribution includes a system of at least two distribution elements as described above. Each distribution element has at least one connection region, and the connection region of one distribution element is connected to the connection region of another distribution element.

[0027] Multiple individual distribution elements can be modularly assembled like a jigsaw puzzle, enabling the manufacture of modular distributions of any desired shape and / or size. Accordingly, these pre-manufactured distribution elements can be interconnected based on a customer's requirements. Because these distribution elements have a size smaller than that of the modular distribution, the shape and / or size of the individual distribution element are not limited to a single target shape and / or size of the modular distribution.

[0028] In one example, the connection region of one distribution element is chemically bonded to the connection region of another distribution element. In other words, the contact surfaces and / or edges of each distribution element with an adjacent distribution element can be directly and / or chemically bonded by an adhesive.

[0029] In one example, the connection region of one distribution element is welded to the connection region of another distribution element. These distribution elements can also be mechanically connected to each other, for example, by clips, hooks, etc. However, any other mechanical or physical bonding of these distribution elements (such as by applying pressure and / or temperature or by applying a magnetic force between the connection regions) is also possible. In one example, the connection region of one distribution element and the connection region of another distribution element can also be connected by a combination of chemical, mechanical, and / or physical bonding.

[0030] In one example, the total length of one side of the modular distribution is a multiple of the length of one side of one of the distribution elements. Since the target modular distribution may include a multiple of a distribution element, the total side length of the modular distribution may correspond to the sum of the side lengths of each distribution element.

[0031] In one example, the total length of one side of the modular distribution is at least about 1000 mm, preferably at least about 1800 mm, and more preferably at least about 3000 mm. Accordingly, the modular distribution can be applied to a substrate having a large size for uniform electroplating of the substrate.

[0032] The modular distribution can be further expanded by connecting additional distribution elements to an existing modular distribution. Therefore, an active surface, in other words, the distribution surface for the process fluid and / or the current, can also be expanded.

[0033] According to the present invention, a method for manufacturing at least two distributed body elements is provided. The method includes, but is not necessarily in this order: - Provides at least two plate-shaped distribution elements, wherein each distribution element includes an injection port for distributing a process fluid from inside the distribution element to the substrate to be processed and an exhaust port for distributing the process fluid and a current through the distribution element. - A connection area is configured at each distribution element, and the connection area of ​​one distribution element is configured to connect to the connection area of ​​another distribution element.

[0034] Therefore, flexible application of the distribution body can be facilitated depending on the size of one of the substrates to be processed. In other words, the number and / or arrangement of the distribution body elements can be variably selected relative to the size and / or shape of the substrate. By combining several distribution body elements, a large distribution body can be easily provided. Furthermore, uniform outflow of the electrolyte and / or the current can be achieved, which is necessary for guiding a flow from the distribution body to the substrate system.

[0035] In one example, the manufacturing method further includes connecting the connection region of one distribution element to the connection region of another distribution element to form a modular distribution comprising at least two distribution elements. Accordingly, a plurality of individual distribution elements can be modularly assembled like a jigsaw puzzle, enabling the manufacture of modular distributions of any desired shape and / or size. Accordingly, these pre-manufacturable distribution elements can be connected to each other according to a customer's requirements.

[0036] In one example, the provision of these distribution elements includes 3D printing. This 3D printing facilitates the manufacturing of these distribution elements. Specifically, the distribution elements manufactured by this 3D printing may have a wall thickness greater than that of distribution elements manufactured by conventional methods, because the outlets and / or jets can also be manufactured by 3D printing rather than by using a milling machine. Even if the substrate may have a side length exceeding 3000 mm, these thicker distribution elements can provide uniform flow and / or current distribution of the process fluid across the entire active surface. Therefore, excellent plating quality can be ensured for large-size substrates.

[0037] In one example, the 3D printing includes the generation of the discharge ports. Accordingly, significant manufacturing time can be saved compared to conventional milling methods used to form holes. Advantageously, compared to conventional milling methods, the 3D printing method allows the generation of distribution elements having a narrower space between the discharge ports. Furthermore, residual material between the discharge ports can be stabilized by the 3D printing, which is typically a limiting factor in the manufacturing of such distribution elements.

[0038] In one example, the provision of these distribution elements includes drilling a hole for one of the nozzles. Generally, these nozzles can be individually configured according to a customer's requirements. Therefore, in some cases, the preparatory work for forming one of the nozzles on the distribution elements can be counterproductive. Accordingly, these nozzles can be provided separately after the distribution elements, including the discharge port manufactured by the 3D printing.

[0039] In one example, the provision of these distribution elements includes injection molding and preferred cutting. Injection molding can be a very cost-effective manufacturing method in which each shape and size of a distribution or distribution element can be manufactured and cut to the size and shape required by the customer. Furthermore, the technical limitations of hole spacing and distribution thickness in conventional methods can be overcome by injection molding.

[0040] In one example, the manufacturing method further includes mounting the interconnected modular distribution into a frame that at least partially surrounds the interconnected modular distribution. For use in a substrate electroplating system, the modular distribution can be securely held by the frame, which can at least partially surround the entire modular distribution and / or individual distribution elements. However, it is important that the frame is configured such that the outflow of the electrolyte and / or the current of the modular distribution is not affected by the frame.

[0041] In one instance, the frame may also include only a single distribution element. This distribution element can be releasably attached to the frame.

[0042] In one example, the frame includes a flow rectification zone and / or a fluid supply line. Accordingly, the frame can provide the electrolyte, process fluid, and / or current to the modular distribution, and the frame can also enable these to flow in reverse. The frame may further include specific features for electroplating the substrate.

[0043] It should be noted that the above embodiments can be combined with each other, regardless of the specific state involved. Accordingly, the method can be combined with structural features, and similarly, the system can be combined with the features described above regarding the method.

[0044] These and other aspects of the present invention will be understood with reference to the embodiments described below. Simple Explanation of the Diagram

[0045] The following description will use the accompanying drawings to illustrate exemplary embodiments of the invention.

[0046] Figure 1 schematically and illustratively shows one embodiment of a distribution element according to the present invention.

[0047] Figure 2 schematically and illustratively shows one embodiment of a configuration of an exhaust port and an injection port according to the present invention.

[0048] Figure 3 schematically and illustratively illustrates one embodiment of a modular distribution according to the present invention.

[0049] Figure 4 schematically and illustratively illustrates one embodiment of a modular distribution according to the present invention.

[0050] Figure 5 schematically and illustratively illustrates one embodiment of a modular distribution according to the present invention.

[0051] Figure 6 schematically and illustratively illustrates an embodiment of an assembly of a modular distribution according to the present invention. Implementation

[0052] Figure 1 illustrates a single distribution element 1 for a chemical and / or electrolytic surface treatment of a substrate 32 (see Figure 3). The distribution element 1 is formed as a plate. The distribution element 1 can be manufactured by 3D printing or injection molding (such as cutting).

[0053] The distribution element 1 includes an injection port 3 for distributing a process fluid from inside the distribution element 1 to the substrate 32 to be processed, and an exhaust port 4 for distributing the process fluid and a current through the distribution element 1. The exhaust port 4 and / or the injection port 3 can be configured in a pattern to achieve optimal electroplating uniformity. The exhaust port 4 and / or the injection port 3 can also be configured in a high density in the distribution element 1. For example, the density of the openings in the distribution element 1 is at least about 50 / dm2, preferably at least about 100 / dm2, more preferably at least about 500 / dm2, and even more preferably at least about 950 / dm2.

[0054] The discharge port 4 has a diameter larger than that of the injection port 3 (see Figure 2). Each discharge port 4 is surrounded by a plurality of injection ports 3. As shown in Figure 3, the discharge port 4 extends through the distribution element 1 from the side of the distribution element 1 facing an anode 31 to the active surface 11 of the distribution element 1 facing the substrate and / or a cathode 32. In contrast, the injection ports 3 extend from the interior of the distribution element 1 to the active surface 11 of the distribution element 1 facing the substrate 32.

[0055] The discharge port 4 and / or the injection port 3 can be manufactured by 3D printing or injection molding. However, the discharge port 4 can be initially manufactured by 3D printing or injection molding and the injection port 3 can be formed by drilling based on a customer's requirements.

[0056] Each distribution element 1 includes at least one active surface 11 through which process fluids and / or currents can pass, and preferably several connection regions 2. The connection regions 2 of the distribution element 1 are configured to connect to a connection region 2 of another distribution element 1. Preferably, the connection regions 2 are releasably attached to the connection regions 2 of adjacent distribution elements 1 to facilitate the assembly of a modular distribution 10. The connection regions 2 of the distribution elements 1 can be mechanically connected and / or chemically bonded to each other, for example by welding, adhesion, magnetism, clips, hooks, etc.

[0057] Figures 4 and 5 respectively illustrate a modular distribution body 10 comprising a plurality of distribution elements 1 in square and rectangular shapes. Each distribution element 1 is connected to adjacent distribution elements 1 according to a desired size and shape. Therefore, the modular distribution body 10 formed by combining distribution elements 1 via their equal connection regions 2 can be used in a large-size distribution body without any pressure drop across the entire active surface 11. Accordingly, the total side length of the modular distribution body 10 is the sum of the side lengths of each distribution element. For example, the total side length of the modular distribution body 10 is at least about 1000 mm, preferably at least about 1800 mm, and more preferably at least about 3000 mm.

[0058] To use the modular distributor 10 in a high-speed electroplating system, the modular distributor 10 can be joined in a frame 5, as shown in FIG6. The frame 5 includes an opening 51 through which the active surface 11 of the modular distributor 10 can pass. The frame 5 at least partially surrounds the entire modular distributor 10 and / or individual distributor elements 1. However, it is important that the frame 5 is configured such that the outflow of electrolyte and / or the current distribution of the modular distributor 10 is not affected by the frame 5. Furthermore, only one distributor element 1 may be disposed at the opening 51 of the frame 5. Therefore, each frame 5 may include an opening 51 of a different size depending on the number of distributor elements 1.

[0059] The frame 5 can be immersed in a tank containing process fluid. The active surface 11 of the modular distribution 10 faces the substrate 32 to be electroplated or an electrode, preferably an anode 31. The frame 5 may further include a flow rectification zone 6 and / or a fluid supply line 7 to provide process fluid and / or current through the modular distribution 10 in a first direction and in one of the opposite directions to the first direction.

[0060] It should be noted that embodiments of the present invention are described with reference to different objects. Specifically, some embodiments are described with reference to method type claims, while other embodiments are described with reference to apparatus type claims. However, those skilled in the art will understand from the foregoing and following description that, unless otherwise stated, any combination of features relating to features of different objects, except for any combination of features belonging to one type of object, is also considered to be disclosed together with this application. However, all features can be combined together to provide more synergistic effects than the simple sum of such features.

[0061] Although the invention has been illustrated and described in detail in the accompanying drawings and description, such illustrations and descriptions are to be considered illustrative or exemplary rather than restrictive. The invention is not limited to the disclosed embodiments. Other variations to the disclosed embodiments will be understood and implemented by those skilled in the art upon practice of the invention, by studying the drawings, the summary of the invention, and the claims.

[0062] In the claims, the word "comprising" does not exclude other elements or steps, and the indefinite articles "a" or "an" do not exclude plural. A single processor or other unit may perform the functions of several items described in the claims. The fact that specific measures are referenced in mutually different subsidiary claims does not indicate that a combination of such measures cannot be used advantageously. Any reference signs in the claims should not be construed as limiting the scope.

[0063] 1: Distribution element 2: Connecting Area 3: Injection nozzle 4: Emission outlet 5: Framework 6: Flow rectification area 7: Fluid supply line 10: Modular Distribution System 11: Active Surface 31: Anode 32: Substrate / Cathode 51: Opening

Claims

1. A system of at least two distribution elements (1) for a chemical and / or electrolytic surface treatment of a substrate (32), wherein each distribution element (1) has a plate shape, and each distribution element (1) comprises: (a) a plurality of nozzles (3) for distributing a process fluid from inside the distribution element (1) to the substrate (32) to be processed, wherein the nozzles (3) extend from inside one of the distribution elements (1) to a surface of the distribution element (1) facing the substrate (32); and (b) a plurality of discharge ports (4) for discharging the process fluid and a current through the distribution element, wherein the process fluid is configured to return from the substrate as a cathode to an anode, while the current is configured to flow from the anode to the substrate as a cathode, wherein the discharge ports (4) extend through the distribution element (1) from one side to the opposite side of the distribution element (1); and wherein each distribution element (1) has a connection region (2) configured to connect to a connection region (2) of another distribution element (1) to form a modular distribution comprising at least two distribution elements (1).

2. In the system of request item 1, the connection area (2) of one of the distribution elements (1) is configured to be releasably connected to the connection area (2) of another distribution element.

3. In the system of request item 1 or 2, the connection area (2) of one of the distribution elements (1) is configured to be mechanically connected to the connection area (2) of another distribution element.

4. The system of claim 1 or 2, wherein the density of one of the openings (3, 4) in the distribution element (1) is at least about 50 / dm2, preferably at least about 100 / dm2, more preferably at least about 500 / dm2, and even more preferably at least about 950 / dm2.

5. A modular distribution (10) for chemical and / or electrolytic surface treatment of a substrate (32), comprising a system of at least two distribution elements (1) as claimed in any one of claims 1 to 4, wherein each distribution element (1) has at least one connection region, and the connection region (2) of one distribution element (1) is connected to the connection region (2) of the other distribution element (1).

6. The modular distribution (10) of claim 5, wherein the connection region (2) of one distribution element (1) is chemically bonded to the connection region (2) of another distribution element (1).

7. As in claim 5, in a modular distribution body (10), the connection area (2) of one distribution body element (1) is soldered to the connection area (2) of another distribution body element (1).

8. A modular distribution body (10) of any one of claims 5 to 7, wherein the total length of one side of the modular distribution body (10) is a multiple of the length of one side of one of the distribution body elements (1).

9. A modular distribution body (10) as requested in any of items 5 to 7, wherein the total length of one side of the modular distribution body (10) is at least about 1000 mm.

10. A method for manufacturing at least two distributed body elements (1), comprising: At least two plate-shaped distribution elements (1) are provided, wherein each distribution element (1) includes: (a) a plurality of nozzles (3) for distributing a process fluid from inside the distribution element (1) to a substrate (32) to be processed, wherein the nozzles (3) extend from inside one of the distribution elements (1) to a surface of the distribution element (1) facing the substrate (32); and (b) Multiple discharge ports (4) for discharging the process fluid and a current through the distribution element, wherein the process fluid is configured to return from the substrate, which is the cathode, to an anode, while the current is configured to flow from the anode to the substrate, which is the cathode, wherein the discharge ports (4) extend through the distribution element (1) from one side to the opposite side of the distribution element (1); and a connection region (2) is disposed at each distribution element, wherein the connection region (2) of one distribution element (1) is configured to connect to the connection region (2) of another distribution element.

11. The manufacturing method of claim 10, further comprising: Connecting the connection region (2) of one distribution element (1) to the connection region (2) of another distribution element (1) to form a modular distribution (10) comprising at least two distribution elements (1).

12. The manufacturing method of claim 10 or 11, wherein the provision of the distributed body element (1) includes 3D printing.

13. The manufacturing method of claim 12, wherein the 3D printing includes the generation of one of the discharge ports (4).

14. The manufacturing method of claim 10 or 11, wherein the provision of the distribution element (1) includes drilling one of the injection ports (3).

15. A method of manufacturing as claimed in any of claims 10 and 11, wherein the provision of the distributed body element (1) includes injection molding, and preferably includes cutting.

16. The manufacturing method of claim 11, further comprising: A connected modular distribution (10) is installed into a frame (5) that at least partially surrounds the connected modular distribution (10).

17. The manufacturing method of claim 16, wherein the frame (5) includes a flow rectification zone (6) and / or a fluid supply line (7).

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