Primers with improved reflective and thermally insulative properties for microcapsule imaging system

The primer layer with white microparticles and hollow particles in microcapsule imaging systems addresses inefficiencies in dye release and adhesion, enhancing color density and energy efficiency, and the back coating prevents light leakage, improving overall image quality and reducing energy consumption.

TWI931504BActive Publication Date: 2026-07-11POLAROID IP BV
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Patent Information

Application Number
TW111120911
Authority / Receiving Office
TW · TW
Patent Type
Patents
Current Assignee / Owner
Filing Date
2022-06-06
Publication Date
2026-07-11
Estimated Expiration
2042-06-05

AI Technical Summary

Technical Problem

Existing microcapsule imaging systems face issues such as inefficient dye release, poor color density, slow color development rates, light leakage through substrates, and adhesion problems with primer coatings, leading to compromised image quality and increased energy consumption.

Method used

A primer layer comprising polymer binder, white microparticles, and polymer hollow particles is applied between the substrate and microcapsule layer, enhancing adhesion, image resolution, and energy efficiency, while a back coating with reflective and opaque components prevents light leakage.

Benefits of technology

Improves color density, development rate, and energy efficiency, reduces adhesion issues, and maintains image quality without additional processing steps or materials, while maintaining substrate adhesion.

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Abstract

A primer layer with improved reflectivity and thermal insulation properties is provided for microencapsulated thermal imaging films. The primer layer comprises approximately 3% to approximately 60% by weight of polymer binder, white microparticles, a primer substrate, and hollow microparticles relative to the total weight of the primer layer. This primer layer improves, among other things, the reflectivity, color rendering, color density, and thermal insulation of the microencapsulated imaging film. A black back coating applied to the substrate on the side opposite to the primer layer further enhances the Dmax and E;10 of the microencapsulated imaging film and prevents premature exposure of the microencapsulated imaging film in the stacking medium.
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