Display device

Abstract

This invention relates to a display device. According to one embodiment, the display device includes: a substrate including a display area containing a plurality of pixels and a non-display area located near the display area; a first dam disposed on the substrate of the non-display area; a second dam disposed on the substrate of the non-display area and between the first dam and the display area; and a touch sensor layer including a touch conductive layer disposed between the first dam and the second dam, and a touch organic layer disposed on the touch conductive layer, wherein the touch organic layer terminates inside the first dam, and the first dam and the second dam comprise the same material.

Description

Technical Field

[0001] This invention relates to a display device and a method for manufacturing the display device. Prior Technology

[0002] With the development of the information society, the demand for display devices for displaying images is constantly increasing, and various types of display devices are being used, such as liquid crystal display (LCD) devices and organic light emitting diode (OLED) display devices.

[0003] The display device may include a display panel and a touch sensor layer, and the touch sensor layer may be attached to the display panel as a separate layer from the display panel, or it may be directly disposed on the display panel.

[0004] Recently, efforts have been made to reduce the number of masks when manufacturing display devices that include display panels and touch sensor layers. Summary of the Invention

[0005] The present invention relates to providing a display device manufactured using fewer masks.

[0006] The purpose of this invention is not limited to the purpose described above, and other technical purposes can be inferred from the embodiments below.

[0007] A display device for achieving a purpose according to one embodiment includes: a substrate including a display area containing a plurality of pixels and a non-display area located near the display area; a first dam disposed on the substrate in the non-display area; a second dam disposed on the substrate in the non-display area and disposed between the first dam and the display area; and a touch sensor layer including a touch conductive layer disposed between the first dam and the second dam and a touch organic layer disposed on the touch conductive layer, wherein the touch organic layer terminates inside the first dam, and the first dam and the second dam contain the same material.

[0008] According to another embodiment, a display device for achieving a purpose includes: a display area comprising a plurality of pixels; and a non-display area located near the display area, wherein the non-display area includes a first dam component surrounding the display area, and a second dam component surrounding the display area and disposed between the first dam component and the display area, and wherein the first dam component includes a main dam portion having a first separation distance from the second dam component, and a protruding dam portion having a second separation distance from the second dam component.

[0009] According to an embodiment, by omitting one of the multiple touch organic layers of a conventional touch sensor layer, the number of masks can be reduced and the manufacturing of the display device can be simplified.

[0010] Simultaneously, one of the plurality of touch organic layers includes a dam to prevent another organic layer from overflowing onto the pad member. According to an embodiment, since one of the plurality of touch organic layers is omitted, at least one of the organic layers of the display panel can be used to form the dam. In other words, by using at least one of the organic layers of the display panel to form a dam to simplify the stacking structure of the display device and prevent another organic layer from overflowing onto the pad member, it is possible to prevent another touch organic layer from overflowing onto the pad member.

[0011] According to the embodiments, process optimization can be achieved by reducing the number of masks and simplifying the manufacturing process when manufacturing display devices.

[0012] However, the effects achievable by this invention are not limited to those described above, and those skilled in the art will be able to clearly understand from the following description other effects not mentioned. Simple Explanation of the Diagram

[0013] Figure 1 is a schematic cross-sectional view of a display device according to one embodiment. Figure 2 is a plan view of the display device according to Figure 1. Figure 3 is a cross-sectional view showing the bent state of the display device according to Figure 1. Figure 4 is a more detailed plan view of the display device according to Figure 2. Figure 5 is an enlarged plan view of region A in Figure 4. Figure 6 is a cross-sectional view along line I-I' in Figure 2. Figures 7 and 8 are cross-sectional views of each operation of the process in a method of manufacturing a display device according to one embodiment. Figure 9 is a cross-sectional view of a display device according to another embodiment. Figure 10 is a cross-sectional view of a display device according to yet another embodiment. Implementation

[0014] In the following description, embodiments will be referenced to the accompanying drawings. In this invention, when a first component (or region, layer, portion, etc.) is described as "on", "connected to", or "coupled to" a second component, it means that the first component can be directly connected / coupled to the second component or that a third component can be disposed between the first component and the second component.

[0015] The same reference numerals indicate the same components. Additionally, in the drawings, the thickness, scale, and dimensions of components are exaggerated for the purpose of effectively describing the technical content. The term "and / or" includes all or one combination that can be defined by the associated configuration.

[0016] Terms such as "first" and "second" may be used to describe various components, but such components are not limited by these terms. These terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the embodiments, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component. Unless the context clearly specifies otherwise, singular expressions include plural expressions.

[0017] Terms such as "below," "on the lower side," "above," and "on the upper side" are used to describe the relationships between the components illustrated in the diagram. These terms are relative concepts and are described relative to the direction marked in the diagram.

[0018] It should be understood that terms such as "comprising," "including," or "having" are intended to specify the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in this invention, and do not preclude the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0019] Figure 1 is a schematic cross-sectional view of a display device according to one embodiment.

[0020] Referring to FIG1, a display device 1 according to one embodiment may include: a display panel 100; and a touch sensor layer 200 formed on the display panel 100. The display panel 100 may include: a substrate component SUB; a circuit element layer CEL formed on the substrate component SUB; an organic element layer EL formed on the circuit element layer CEL; and a thin film encapsulation layer TFE formed on the organic element layer EL, and the touch sensor layer 200 formed on the thin film encapsulation layer TFE. In one embodiment, the display panel 100 may be an organic light-emitting display panel including the organic element layer EL. However, the display panel 100 is not limited thereto and may be a liquid crystal display panel or an inorganic light-emitting display panel. Hereinafter, examples in which the display panel 100 is an organic light-emitting display panel will be primarily described.

[0021] Display device 1 may include: a display area DA; and a non-display area NDA located near the display area DA. The display area DA may contain a plurality of pixels to generate an image. The non-display area NDA may not generate an image. The non-display area NDA may not contain pixels, but is not limited thereto.

[0022] The display device 1 may further include: a sensing area SA; and a non-sensing area NSA located near the sensing area SA. The sensing area SA and the non-sensing area NSA may correspond to the display area DA and the non-display area NDA, respectively, and may have the same area, but are not limited thereto. The sensing area SA may be an area in which touch electrodes TE and RE, to be described in FIG. 4 below, are disposed, and touch lines TL connected to the touch electrodes TE and RE, touchpad TPAD connected to the touch lines TL, etc., may be disposed in the non-sensing area NSA.

[0023] The following describes the substrate component SUB, the circuit element layer CEL, the organic component layer EL, the thin film encapsulation layer TFE, and the touch sensor layer 200.

[0024] Figure 2 is a plan view of the display device according to Figure 1.

[0025] Referring to Figure 2, the planar shape of the display area DA can be rectangular. However, the invention is not limited to this, and the planar shape of the display area DA can be square, circular, elliptical, or other polygonal shapes. For example, the display area DA can be a rectangular shape with rounded corners, but is not limited to this, and can also be a rectangular shape with pointed corners.

[0026] In this embodiment, the first direction DR1 and the second direction DR2 are different directions and intersect each other, for example, perpendicular directions in a plan view. The third direction DR3 (see FIG. 3) is a direction that intersects the plane containing the first direction DR1 and the second direction DR2, for example, a direction perpendicular to both the first direction DR1 and the second direction DR2. In FIG. 2, generally speaking, the first direction DR1 may be the same as the extension direction of the short side of the display panel 100, the second direction DR2 may be the same as the extension direction of the long side of the display panel 100, and the third direction DR3 may be the same as the stacking direction of the substrate component SUB, the circuit element layer CEL, the organic component layer EL, the thin film encapsulation layer TFE, and the touch sensor layer 200 in FIG. 1. However, the directions described in this embodiment should be understood as indicating relative directions, and the embodiment is not limited to the directions described.

[0027] The display area DA may include a short side extending in the first direction DR1 and a long side extending in the second direction DR2. The non-display area NDA may surround the display area DA. The non-display area NDA may be located on one side and the other side of the display area DA in the first direction DR1, and on one side and the other side of the display area DA in the second direction DR2.

[0028] The non-display area NDA, located on the other side of the display area DA in the second direction DR2, may extend further from the central portion of the display area DA on the other side of the second direction DR2 toward the other side of the second direction DR2. The width of the non-display area NDA extending further from the central portion of the display area DA on the other side of the second direction DR2 in the first direction DR1 may be smaller than the width of the non-display area NDA in the first direction DR1 adjacent to the display area DA on the other side of the second direction DR2.

[0029] Display device 1 may include: a main area MR; a sub-area SR; and a curved area BR located between the main area MR and the sub-area SR. The main area MR is formed by a display area DA and a non-display area NDA surrounding the display area DA on all four surfaces. The curved area BR and the sub-area SR may be formed by a portion extending from the central portion of the display area DA on the other side of the second direction DR2 towards the other side of the second direction DR2. The curved area BR may be disposed between the sub-area SR and the main area MR. The sub-area SR may include: a first pad area PA1; and a second pad area PA2 located at the end of the sub-area SR on the other side of the second direction DR2. Display device 1 may further include: a data driver 300; and a printed circuit board 500. The data driver 300 may be disposed in the first pad area PA1, and the printed circuit board 500 may be attached to the second pad area PA2. A plurality of pads connected to the data driver 300 and the printed circuit board 500 may be disposed in each of the first pad area PA1 and the second pad area PA2. The data driver 300 may be formed, for example, in the form of a driver chip (IC), but is not limited thereto. In one embodiment, an example is described in which the data driver 300 is disposed in a chip-on-plastic type directly mounted on the display panel 100, but the invention is not limited thereto and is disposed in a glass flip-chip type or a thin-film flip-chip type.

[0030] As described above in Figure 1, the display area DA may contain a plurality of pixels PX. Each of the plurality of pixels PX may be connected to a scan line SL and a data line DL. In addition to the scan line SL and the data line DL, the pixel PX may also contain high-voltage power lines, low-voltage power lines or various lines in the field, and capacitors.

[0031] According to one embodiment, the display device 1 may further include: a first dam component DP1; and a second dam component DP2. The first dam component DP1 and the second dam component DP2 may each surround a display area DA. The first dam component DP1 and the second dam component DP2 may each have a closed-loop shape completely surrounding the display area DA. The second dam component DP2 may be disposed between the first dam component DP1 and the display area DA. The second dam component DP2 may be disposed between the display area DA and the curved area BR to be described below.

[0032] The first dam component DP1 and the second dam component DP2 can each be located in a non-display area NDA. For example, the second dam component DP2 can be located in a non-display area NDA adjacent to the display area DA and within the main area MR. The first dam component DP1 can be located outside the second dam component DP2 to surround it. The first dam component DP1 can include: a main dam portion DP1a; a protruding dam portion DP1b; and a connecting dam portion DP1c. Generally, the main dam portion DP1a can be located on one side and the other side of the display area DA in the first direction DR1, and is located in a non-display area NDA adjacent to one side of the display area DA in the second direction DR2. The main dam portion DP1a can also be located around the other side of the non-display area NDA adjacent to the display area DA in the second direction DR2. The main dam section DP1a can be integrally formed. This main dam section DP1a is disposed in a non-display area NDA adjacent to the display area DA on one and the other sides in the first direction DR1 and on one side in the second direction DR2, and is disposed around the non-display area NDA adjacent to the other side in the second direction DR2 of the display area DA. The main dam section DP1a can be disposed in the main area MR.

[0033] The protruding dam portion DP1b can be located in the curved zone BR and may not be located in the main zone MR. In other words, the main dam portion DP1a and the second dam component DP2 can be located with a first separation distance d1, and the protruding dam portion DP1b and the second dam component DP2 can be located with a second separation distance d2 greater than the first separation distance d1. The main dam portion DP1a and the protruding dam portion DP1b can be connected by a connecting dam portion DP1c. The connecting dam portion DP1c can be located throughout the curved zone BR and the main zone MR, but is not limited thereto. In other words, when the protruding dam portion DP1b is located in the curved zone BR adjacent to the boundary between the curved zone BR and the main zone MR, the connecting dam portion DP1c may be located only in the main zone MR.

[0034] In some embodiments, the protruding dam portion DP1b can be located in the main area MR.

[0035] In some embodiments, the second separation distance d2 may be equal to the first separation distance d1.

[0036] Figure 3 is a cross-sectional view showing the bent state of the display device according to Figure 1.

[0037] Referring to FIG3, the curved region BR of the display panel 100 of the display device 1 according to one embodiment can be bent in the thickness direction (or the third direction DR3). Therefore, the main region MR and the sub-region SR can overlap each other in the thickness direction. The display panel 100 can be bent such that the lower surface of the main region MR and the upper surface of the sub-region SR face each other. The printed circuit board 500 can be attached to the end of the sub-region SR.

[0038] Figure 4 is a more detailed plan view of the display device according to Figure 2. Figure 5 is an enlarged plan view of region A of Figure 4. Figure 4 is a plan view of the display device 1 according to Figure 2 and specifically shows the touch sensor layer 200 (see Figure 1), and the touch line TL and touchpad TPAD connected to the touch sensor layer 200.

[0039] Referring to Figures 4 and 5, the touch sensor layer 200 may include: a plurality of touch electrodes TE and RE for detecting user touch using a capacitive method; and a touch line TL connecting the plurality of touch electrodes TE and RE to a touchpad TPAD. For example, the touch sensor layer 200 may use a self-capacitance method or a mutual capacitance method to sense user touch.

[0040] Multiple touch electrodes TE and RE can be set in the sensing area SA.

[0041] A plurality of touch electrodes TE and RE can generate mutual capacitance or self-capacitance to detect touch from objects or people. The plurality of touch electrodes TE and RE may include: a plurality of driving electrodes 240_T; and a plurality of detection electrodes 240_R.

[0042] A plurality of driving electrodes 240_T can be arranged on the first direction DR1 and the second direction DR2. The plurality of driving electrodes 240_T can be spaced apart from each other on the first direction DR1 and the second direction DR2. Driving electrodes 240_T that are adjacent to each other on the second direction DR2 can be electrically connected through bridging electrodes 220_B.

[0043] A plurality of detection electrodes 240_R may extend in a first direction DR1 and may be spaced apart from each other in a second direction DR2. The plurality of detection electrodes 240_R may be arranged in the first direction DR1 and the second direction DR2, and the detection electrodes 240_R adjacent to each other in the first direction DR1 may be electrically connected to the connecting member 240_B.

[0044] A plurality of driving electrodes 240_T and a plurality of detection electrodes 240_R can each be connected to a plurality of touchpads TPAD via touch lines TL.

[0045] The bridging electrode 220_B can be disposed on a different layer than the plurality of driving electrodes 240_T and the plurality of detection electrodes 240_R. Detection electrodes 240_R adjacent to each other in the first direction DR1 can be electrically connected through connecting members 240_B formed on the same layer as the plurality of driving electrodes 240_T or the plurality of detection electrodes 240_R, and driving electrodes 240_T adjacent to each other in the second direction DR2 can be electrically connected through the bridging electrode 220_B formed on a different layer than the plurality of driving electrodes 240_T or the plurality of detection electrodes 240_R. Therefore, even when the bridging electrode 220_B overlaps with the plurality of detection electrodes 240_R in the thickness direction DR3, the plurality of driving electrodes 240_T and the plurality of detection electrodes 240_R can be insulated from each other. Mutual capacitance can be generated between the driving electrodes 240_T and the detection electrodes 240_R.

[0046] Figure 6 is a cross-sectional view along line I-I' in Figure 2.

[0047] Referring to FIG6, the display device 1 may include: a substrate component SUB; a circuit element layer CEL formed on the substrate component SUB; an organic element layer EL formed on the circuit element layer CEL; a thin film encapsulation layer TFE formed on the organic element layer EL; and a touch sensor layer 200 formed on the thin film encapsulation layer TFE.

[0048] The substrate component SUB may include a base substrate 101. The base substrate 101 may support layers disposed thereon. The base substrate 101 may be disposed over the entire display area DA and the non-display area NDA. The base substrate 101 may be made of an insulating material such as a polymer resin. Examples of polymer materials may include polyether ether (PES), polyacrylate (PA), polyarylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyallylate, polyimide (PI), polycarbonate (PC), cellulose triacetate (CAT), cellulose acetate propionate (CAP), or combinations thereof. The base substrate 101 may be a flexible substrate capable of bending, folding, rolling, etc. Examples of materials forming a flexible substrate may be polyimide (PI), but are not limited thereto. The base substrate 101 may also be a rigid substrate made of glass, quartz, etc.

[0049] The circuit element layer CEL can be formed on the substrate component SUB. The circuit element layer CEL may include: a semiconductor layer 105; a gate insulating layer 111 formed on the semiconductor layer 105; a gate conductive layer including a gate electrode 121 located on the gate insulating layer 111; a first interlayer insulating layer 112 formed on the gate conductive layer; a first source-drain conductive layer 130 including a source electrode 131, a drain electrode 133, and a first touchpad portion TPAD1 of the touchpad TPAD; a second interlayer insulating layer 141 formed on the first source-drain conductive layer 130; a second source-drain conductive layer 150 including a connection electrode 151 formed on the second interlayer insulating layer 141, a second touchpad portion TPAD2 of the touchpad TPAD, and a bent bridging electrode CL; and a first organic layer 160 including a planarization layer 161 formed on the second source-drain conductive layer 150 and a second lower dam DAM21. The thin-film transistor TR in the circuit element layer CEL includes: a semiconductor layer 105; a gate electrode 121; a source electrode 131; and a drain electrode 133.

[0050] The organic element layer EL may include: an organic light-emitting diode (OLED) including an anode (ANO), an organic layer (OL), and a cathode (CAT) formed on a first organic layer 160; and a second organic layer 170 including a dam layer 171, a second upper dam (DAM22), and a first dam (DAM1).

[0051] The thin-film encapsulation layer TFE may include: a first encapsulation inorganic layer 181 formed on the organic element layer EL; an encapsulation organic layer 182 formed on the first encapsulation inorganic layer 181; and a second encapsulation inorganic layer 183 formed on the encapsulation organic layer 182.

[0052] The touch sensor layer 200 may include: a touch buffer layer 210 formed on a thin film encapsulation layer TFE; a first touch conductive layer 220 including a bridging electrode 220_B formed on the touch buffer layer 210 and a first touch line portion TL1 of the touch line TL; a touch insulating layer 230 formed on the first touch conductive layer 220; a second touch conductive layer 240 including a driving electrode 240_T and a detection electrode 240_R (not shown in Figures 6 to 10) formed on the touch insulating layer 230, a second touch line portion TL2 of the touch line TL, and a third touch panel portion TPAD3 of the touch panel TPAD; and a touch organic layer 250 formed on the second touch conductive layer 240.

[0053] A buffer layer can be disposed on the substrate 101. The buffer layer can prevent the diffusion of impurity ions and prevent the penetration of moisture or external air.

[0054] Unlike what is shown, the buffer layer can comprise multiple layers. In other words, the buffer layer can be provided as a layer formed by alternating stacking of silicon nitride (SiNx) and silicon oxide (SiOx) at least once.

[0055] Semiconductor layer 105 can be disposed on buffer layer and in display area DA. Semiconductor layer 105 can contain polycrystalline silicon. Semiconductor layer 105 can contain channel region, source region and drain region. Polycrystalline silicon can be formed by crystallizing amorphous silicon. Examples of crystallization methods may include, but are not limited to, rapid thermal annealing (RTA), solid phase crystallization (SPC), excimer laser annealing (ELA), metal-induced crystallization (MIC), metal-induced lateral crystallization (MILC), and sequential crystallization (SLS).

[0056] Gate insulating layer 111 can be formed on semiconductor layer 105. Gate insulating layer 111 can be disposed substantially over the entire display area DA and non-display area NDA. Gate insulating layer 111 can be a gate insulating film with gate insulating function. Gate insulating layer 111 can contain silicon compounds, metal oxides, etc. For example, gate insulating layer 111 can contain silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, tantalum oxide, hafnium oxide, zirconium oxide, titanium oxide, etc. These materials can be used alone or in combination. Although the figure shows gate insulating layer 111 formed from a single film, in some cases, gate insulating layer 111 can be a multilayer film formed from stacked films made of different materials.

[0057] The gate conductive layer can be disposed on the gate insulating layer 111.

[0058] In one embodiment, the gate conductive layer may include a gate electrode 121. Additionally, the gate conductive layer may further include scan signal lines for transmitting scan signals to the gate electrode 121. The gate electrode 121 may be disposed to overlap with a channel region of the semiconductor layer 105.

[0059] The gate conductive layer may comprise one or more of the following: molybdenum (Mo), aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta), tungsten (W), and copper (Cu). Furthermore, although the diagram only shows the case where the gate conductive layer is a single layer, in some cases, the gate conductive layer may be formed as a multilayer layer. In this case, the multilayer film of the gate conductive layer may be formed as a stacked film made of different metals among the metals mentioned above.

[0060] The first interlayer insulating layer 112 can be disposed on the gate conductive layer. The first interlayer insulating layer 112 can be disposed on the entire display area DA and the non-display area NDA.

[0061] The first interlayer insulating layer 112 can insulate the gate conductive layer and the first source-drain conductive layer 130. The first interlayer insulating layer 112 can be an interlayer insulating film.

[0062] The first interlayer insulation layer 112 may comprise: inorganic insulating materials, such as silicon oxide, silicon nitride, silicon oxynitride, hafnium oxide, aluminum oxide, titanium oxide, tantalum oxide, or zinc oxide; or organic insulating materials, such as polyacrylate resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, unsaturated polyester resin, polyphenylene ether resin, polyphenylene sulfide resin, or benzocyclobutene (BCB). Although an example in the drawings is shown where the first interlayer insulation layer 112 is a single layer, the invention is not limited thereto and may be a multilayer layer formed by stacked layers containing different materials.

[0063] A first source-drain conductive layer 130 may be disposed on a first interlayer insulating layer 112. The first source-drain conductive layer 130 may include: a source electrode 131; a drain electrode 133; and a first touch panel portion TPAD1. The source electrode 131 may be connected to the source region of the semiconductor layer 105, and the drain electrode 133 may be connected to the drain region of the semiconductor layer 105. The first touch panel portion TPAD1 may be disposed in a second pad region PA2. The first source-drain conductive layer 130 may contain aluminum (Al), copper (Cu), titanium (Ti), etc., and may be formed as a multilayer or a single layer. In one embodiment, the first source-drain conductive layer 130 may have a Ti / Al / Ti multilayer structure, but is not limited thereto. The source electrode 131, drain electrode 133, and the first touch panel portion TPAD1 contain the same material and can be formed in the same process.

[0064] The second interlayer insulating layer 141 can be disposed on the first source-drain conductive layer 130. The second interlayer insulating layer 141 can be disposed in the display area DA and the non-display area NDA. In the non-display area NDA, the second interlayer insulating layer 141 can be disposed in the curved area BR and can also be disposed in the portion of the main area MR and sub-area SR adjacent to the curved area BR. The second interlayer insulating layer 141 can contain organic materials, such as polyacrylate resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, unsaturated polyester resin, polyphenylene ether resin, polyphenylene sulfide resin, or benzocyclobutene (BCB).

[0065] The second source-drain conductive layer 150 can be disposed on the second interlayer insulating layer 141. The second source-drain conductive layer 150 may include: a connecting electrode 151 connected to the drain electrode 133; a second touchpad portion TPAD2 disposed on and directly disposed on the first touchpad portion TPAD1; and a bent bridging electrode CL connected to the touch line TL around the bend region BR and passing through the bend region BR. The second source-drain conductive layer 150 may contain aluminum (Al), copper (Cu), titanium (Ti), etc., and may be formed as a multilayer or a single layer. In one embodiment, the second source-drain conductive layer 150 may have a Ti / Al / Ti multilayer structure, but is not limited thereto. The connecting electrode 151, the second touchpad portion TPAD2, and the bent bridging electrode CL may contain the same material and may be formed in the same process.

[0066] The first organic layer 160 may be disposed on the second source-drain conductive layer 150. The first organic layer 160 may include: a planarization layer 161; and a second lower dam DAM21.

[0067] The first organic layer 160 may contain organic materials such as polyacrylate resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, unsaturated polyester resin, polyphenylene ether resin, polyphenylene sulfide resin, or benzocyclobutene (BCB). The planarization layer 161 and the second lower dam DAM21 may contain the same materials and may be formed in the same process.

[0068] The planarization layer 161 can be disposed in the display area DA, the curved area BR, and the sub-area SR. In the display area DA, the planarization layer 161 can be disposed on the connecting electrode 151 and the second interlayer insulating layer 141. In the curved area BR, the planarization layer 161 can be disposed on the curved bridging electrode CL and the second interlayer insulating layer 141. In the sub-area SR, the planarization layer 161 can be disposed on the first interlayer insulating layer 112.

[0069] The second lower dam DAM21 can be combined with the second upper dam DAM22 to form the second dam DAM2.

[0070] The anode (ANO) can be disposed on the planarization layer 161 in the display area DA. The anode (ANO) can pass through the planarization layer 161 and can be electrically connected to the connection electrode 151. The connection electrode 151 can electrically connect the anode (ANO) to the drain electrode 133.

[0071] The second organic layer 170 can be disposed on the anode ANO. The second organic layer 170 can include: a dam layer 171; a second upper dam DAM22; and a first dam DAM1.

[0072] The second organic layer 170 may contain organic materials such as polyacrylate resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, unsaturated polyester resin, polyphenylene ether resin, polyphenylene sulfide resin, or benzocyclobutene (BCB). The dam layer 171, the second upper dam DAM22, and the first dam DAM1 may contain the same materials and may be formed in the same process.

[0073] The dam layer 171 can be disposed in the display area DA and can expose a portion of the upper surface of the anode ANO. The dam layer 171 can define the emission area by exposing the central portion of the upper surface of the anode ANO. In the display area DA, the area in which the dam layer 171 is disposed can be defined as a non-emission area.

[0074] The second upper dam DAM22 can be disposed on the second lower dam DAM21. The second upper dam DAM22 can overlap with the second lower dam DAM21 in the thickness direction. The width of the second upper dam DAM22 can be greater than the width of the second lower dam DAM21, and the second upper dam DAM22 can cover the side surface of the second lower dam DAM21.

[0075] The second dam DAM2 may include: a second lower dam DAM21; and a second upper dam DAM22, and one or more second dams DAM2 may be provided. An example in which two second dams DAM2 are provided is shown in Figure 6. Two or more second dams DAM2 may be spaced apart from each other. One or more second dams DAM2 may be provided in the second dam component DP2. The second dams DAM2 prevent the encapsulating organic layer 182 of the thin-film encapsulation layer TFE, to be described below, from overflowing into the bend region BR. For example, the encapsulating organic layer 182 may terminate at the outer second dam DAM2 of the two second dams DAM2. Therefore, the encapsulating organic layer 182 does not extend into the bend region BR and may not overlap with the component located in the bend region BR at all. The encapsulating organic layer 182 may not overlap with the first dam DAM1.

[0076] The first dam DAM1 can be disposed in the bending region BR. The first dam DAM1 can be disposed in the first dam component DP1. One or more first dams DAM1 can be provided. An example in which two first dams DAM1 are provided is shown in Figure 6. Two or more first dams DAM1 can be disposed in the first dam component DP1. The first dam DAM1 prevents the touch organic layer 250, to be described below, from overflowing into the sub-region SR. For example, the touch organic layer 250 can terminate at the first dam DAM1 located on the outside of the two first dams DAM1. Therefore, the touch organic layer 250 does not extend into the sub-region SR and can not overlap with the components located in the sub-region SR at all. The first dam DAM1 can be disposed on the second interlayer insulating layer 141 and the planarization layer 161. The first dam DAM1 can be disposed to overlap with the second interlayer insulating layer 141 and the planarization layer 161.

[0077] In some embodiments, spacers may be further disposed on the second organic layer 170. The spacers may comprise at least one of the illustrated materials of the second organic layer 170. In some embodiments, at least one of the first dam DAM1 and the second dam DAM2 may be formed to further comprise spacers. For example, the first dam DAM1 may have a structure in which spacers are stacked on the first dam DAM1 of FIG. 6, while the second dam DAM2 may have a structure in which a second lower dam DAM21, a second upper dam DAM22, and spacers are stacked.

[0078] For example, the first dam DAM1 and the second dam DAM2 can have various stacking structures. In some embodiments, the first dam DAM1 can have a structure in which the first dam DAM1 of FIG6 and a planarization layer 161 disposed below it are stacked. In this case, the planarization layer 161 can be patterned like the first dam DAM1, and the patterned planarization layer 161 can be stacked with the first dam DAM1 of FIG6 to form the first dam.

[0079] In some embodiments, the second dam DAM2 does not include the second lower dam DAM21 and may be formed only as the second upper dam DAM22.

[0080] In some embodiments, the second dam DAM2 does not include the second upper dam DAM22 and may be formed only as the second lower dam DAM21.

[0081] The upper surface of the first dam DAM1 may have a first surface height H1 from the substrate 101, while the upper surface of the second dam DAM2 may have a second surface height H2 from the substrate 101. The first surface height H1 may be greater than the second surface height H2. The first surface height H1 may be greater than the thickness of the first dam DAM1 than the second surface height H2, but is not limited thereto.

[0082] The organic layer OL can be disposed on the upper surface of the anode ANO and in the opening of the dam 171. Although an example in which the organic layer OL is disposed only in the opening of the dam 171 is depicted in the figures, the invention is not limited thereto and can be disposed to extend from the opening of the dam 171 to the upper surface of the dam 171.

[0083] Organic layers (OLs) may include: an organic light-emitting layer; a hole injection / transport layer; and an electron injection / transport layer.

[0084] The cathode CAT is disposed on the organic layer OL and the diaphragm layer 171. The cathode CAT can be a common electrode disposed on a plurality of pixels PX in the display area DA. The organic layer OL, the anode ANO, and the cathode CAT can form an organic light-emitting diode (OLED).

[0085] A thin-film encapsulation layer (TFE) is disposed on the cathode (CAT). The TFE can cover an organic light-emitting diode (OLED). The TFE can be a stacked film formed by alternating inorganic and organic films. For example, the TFE can include a first encapsulating inorganic layer 181, an encapsulating organic layer 182, and a second encapsulating inorganic layer 183 stacked sequentially. The encapsulating inorganic layers 181 and 183 can contain inorganic materials. The encapsulating organic layer 182 can contain organic materials. The encapsulating organic layer 182 can pass through the second dam (DAM2) without overflowing into the bending region (BR), and can terminate inside the second dam (DAM2). In the second dam component (DP2), the second encapsulating inorganic layer 183 can be in direct contact with the first encapsulating inorganic layer 181. For example, since the encapsulating organic layer 182 terminates inside the second dam (DAM2), the encapsulating organic layer 182 may not be disposed on the second dam (DAM2). On the second dam (DAM2), the second encapsulating inorganic layer 183 can be in direct contact with the first encapsulating inorganic layer 181.

[0086] The encapsulated inorganic layers 181 and 183 can be disposed in both the display area DA and the non-display area NDA. The encapsulated inorganic layers 181 and 183 can be disposed in the bending area BR and the sub-area SR, but not in the second pad area PA2, and can expose the second touchpad portion TPAD2.

[0087] The touch sensor layer 200 can be disposed on the thin-film encapsulation layer TFE. The touch buffer layer 210 can be disposed on the second encapsulation inorganic layer 183.

[0088] The touch sensor layer 200 can be disposed on the second encapsulated inorganic layer 183.

[0089] The touch buffer layer 210 can prevent chemical solutions (developers, etchants, etc.) used in the manufacturing process of the electrodes 240_T and 240_R disposed on the touch buffer layer 210 or external moisture from penetrating the organic light-emitting diode OLED containing the organic layer. Therefore, the touch buffer layer 210 can prevent damage to the organic light-emitting diode OLED, which is susceptible to chemical solutions or moisture. The touch buffer layer 210 can contain inorganic or organic materials. The touch buffer layer 210 can extend from the display area DA to the curved area BR and the sub-area SR, and can expose the second touch panel portion TPAD2 in the second pad area PA2.

[0090] A first touch conductive layer 220 may be disposed on the touch buffer layer 210. The first touch conductive layer 220 may include: a bridging electrode 220_B; and a first touch line portion TL1. The bridging electrode 220_B may be disposed in the sensing area SA (or display area DA) to electrically connect adjacent driving electrodes 240_T. The bridging electrode 220_B may be insulated from the connecting component 240_B, and a touch insulating layer 230 may be inserted between the bridging electrode and the connecting component.

[0091] In Figure 6, although an example is shown in which the bridging electrode 220_B is electrically connected to the driving electrodes 240_T that are adjacent to each other, the present invention is not limited thereto, and the bridging electrode 220_B may be electrically connected to the detection electrodes 240_R that are adjacent to each other, while the connecting member 240_B may be electrically connected to the driving electrodes 240_T that are adjacent to each other.

[0092] The first touch line portion TL1 can be disposed in the display area DA and the non-display area NDA. The first touch line portion TL1 can be electrically connected to the detection electrode 240_R or the driving electrode 240_T. The first touch line portion TL1 can pass through the second dam component DP2 and extend to the bending area BR. The first touch line portion TL1 can form a touch line TL together with the second touch line portion TL2 and be used to electrically connect the electrodes 240_T and 240_R to the touch panel TPAD.

[0093] A touch insulating layer 230 may be disposed on the first touch conductive layer 220. The touch insulating layer 230 may contain inorganic materials. The touch insulating layer 230 may extend from the display area DA to the curved area BR and the sub-area SR, and expose the second touch panel portion TPAD2 in the second pad area PA2.

[0094] The second touch conductive layer 240 can be disposed on the touch insulating layer 230. The second touch conductive layer 240 may include: a driving electrode 240_T; a detection electrode 240_R (not shown in Figures 6 to 10); a second touch line portion TL2; and a third touch panel portion TPAD3.

[0095] The second touch line portion TL2 may include: a 2-1 touch line portion TL2a; and a 2-2 touch line portion TL2b. The 2-1 touch line portion TL2a may overlap with the first touch line portion TL1 in the thickness direction. The 2-1 touch line portion TL2a may be disposed in the portion of the main region MR and the curved region BR. The 2-1 touch line portion TL2a may be electrically connected to the first touch line portion TL1 through a third contact hole CT3 passing through the touch insulating layer 230 in the thickness direction. The 2-1 touch line portion TL2a may be electrically connected to the first touch line portion TL1 through the third contact hole CT3 passing through the touch insulating layer 230 in the thickness direction, thereby reducing the resistance of the touch line TL. The third contact hole CT3 may be located on the second dam component DP2, but is not limited thereto. The 2-1 touch line portion TL2a may be electrically connected to the bent bridging electrode CL in the curved region BR. 2-1 The touch line portion TL2a can be electrically connected to the bent bridging electrode CL through a first contact hole CT1 passing through the touch insulating layer 230, the touch buffer layer 210, the second encapsulation inorganic layer 183, the first encapsulation inorganic layer 181, and the planarization layer 161. The first contact hole CT1 can be located in the bent region BR, but is not limited thereto. The first contact hole CT1 can be located between the second dam DAM2 and the first dam DAM1. 2-2 The touch line portion TL2b can be located in the bent region BR and a portion of the sub-region SR. 2-2 The touch line portion TL2b can be electrically connected to the bent bridging electrode CL in the bent region BR. 2-2 The touch line portion TL2b can be electrically connected to the bent bridging electrode CL through a second contact hole CT2 passing through the touch insulating layer 230, the touch buffer layer 210, the second encapsulation inorganic layer 183, the first encapsulation inorganic layer 181, and the planarization layer 161. The second contact hole CT2 can be located in the bent region BR, but is not limited thereto. The second contact hole CT2 can be located between the first dam DAM1 and the touchpad TPAD.

[0096] According to one embodiment, a touch line TL may include: a first touch line portion TL1; a second touch line portion TL2; and a bent bridging electrode CL. Compared with the first touch line portion TL1 and the second touch line portion TL2 in the bent region BR, the touch line TL may include a bent bridging electrode CL made of a flexible material, thereby preventing the touch line TL from disconnecting or cracking due to bending.

[0097] 2-2 The touch line portion TL2b can be connected to the third touch panel portion TPAD3 in the second pad area PA2. The third touch panel portion TPAD3 can overlap with the second touch panel portion TPAD2 in the thickness direction and can be directly disposed on the second touch panel portion TPAD2. The third touch panel portion TPAD3 can be disposed on both the upper surface and the side surface of the second touch panel portion TPAD2. The third touch panel portion TPAD3 can directly contact the outer portion of the upper surface of the first touch panel portion TPAD1 exposed by the second touch panel portion TPAD2, but is not limited thereto.

[0098] The touch organic layer 250 can be disposed on the second touch conductive layer 240. The touch organic layer 250 can be formed on the second touch conductive layer 240 using an inkjet method. In the process of forming the touch organic layer 250 on the second touch conductive layer 240 using an inkjet method, the touch organic layer 250 may overflow into the sub-region SR, and in order to prevent the overflow of the sub-region, a second dam DAM2 and other dams may be required. Conventionally, a separate organic layer is used between the touch organic layer 250 and the second touch conductive layer 240 to form a dam for preventing the overflow of the touch organic layer 250 in the first dam component DP1. However, in this case, the process of the display device 1 is complicated because the process of forming a separate organic layer and the process of using a separate organic layer as a mask to form the dam are added. However, according to one embodiment of the display device 1, since the first dam DAM1 is formed together with the second upper dam DAM22 in the process of forming the second dam DAM2 without forming a separate organic layer, the process of forming a separate organic layer and the process of using a separate organic layer as a mask to form the dam can be omitted. Therefore, the number of masks can be reduced and the manufacturing of the display device 1 can be simplified. The touch organic layer 250 can be disposed in the main area MR and the curved area BR and can terminate inside the first dam DAM1.

[0099] In the following text, a method for manufacturing the display device 1 will be described. When describing the method for manufacturing the display device according to FIG. 7 and FIG. 8, FIG. 6 will be used in conjunction with the description. When describing the method for manufacturing the display device based on FIG. 7 and FIG. 8, the overlapping description of the components of the display device 1 described in FIG. 6 may be omitted, and the operation of manufacturing the components of the described display device 1 may be performed in the stacking order of the display devices 1.

[0100] Figures 7 and 8 are cross-sectional views of each operation of the process in a method of manufacturing a display device according to one embodiment.

[0101] Referring to Figures 6 to 8, firstly, as shown in Figure 7, a first organic layer 160 is formed on the second source-drain conductive layer 150. The first organic layer 160 may include: a planarization layer 161; and a second lower dam DAM21.

[0102] The first organic layer 160 may contain organic materials such as polyacrylate resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, unsaturated polyester resin, polyphenylene ether resin, polyphenylene sulfide resin, or benzocyclobutene (BCB). The planarization layer 161 and the second lower dam DAM21 may contain the same materials and may be formed in the same process.

[0103] The planarization layer 161 can be disposed in the display area DA, the curved area BR, and the sub-area SR. In the display area DA, the planarization layer 161 can be disposed on the connecting electrode 151 and the second interlayer insulating layer 141. In the curved area BR, the planarization layer 161 can be disposed on the curved bridging electrode CL and the second interlayer insulating layer 141. In the sub-area SR, the planarization layer 161 can be disposed on the first interlayer insulating layer 112.

[0104] The second lower dam DAM21 can be combined with the second upper dam DAM22 to form the second dam DAM2.

[0105] As shown in Figure 8, after the first organic layer 160 is formed, the second organic layer 170 is formed.

[0106] The second organic layer 170 may contain organic materials such as polyacrylate resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, unsaturated polyester resin, polyphenylene ether resin, polyphenylene sulfide resin, or benzocyclobutene (BCB). The dam layer 171, the second upper dam DAM22, and the first dam DAM1 may contain the same materials and may be formed in the same process.

[0107] The dam layer 171 can be disposed in the display area DA and can expose a portion of the upper surface of the anode ANO. The dam layer 171 can define the emission area by exposing the central portion of the upper surface of the anode ANO. In the display area DA, the area in which the dam layer 171 is disposed can be defined as a non-emission area.

[0108] The second upper dam DAM22 can be disposed on the second lower dam DAM21. The second upper dam DAM22 can overlap with the second lower dam DAM21 in the thickness direction. The width of the second upper dam DAM22 can be greater than the width of the second lower dam DAM21, and the second upper dam DAM22 can cover the side surface of the second lower dam DAM21.

[0109] The second dam DAM2 may include: a second lower dam DAM21; and a second upper dam DAM22, and one or more second dams DAM2 may be provided. An example in which two second dams DAM2 are provided is shown in Figure 6. Two or more second dams DAM2 may be spaced apart from each other. Two or more second dams DAM2 may be disposed within the second dam component DP2. The second dams DAM2 prevent the encapsulating organic layer 182 of the thin-film encapsulation layer TFE from overflowing into the bending region BR. For example, the encapsulating organic layer 182 may terminate at the outer second dam DAM2 among the two second dams DAM2. Therefore, the encapsulating organic layer 182 does not extend into the bending region BR and may not overlap with the component located in the bending region BR at all.

[0110] The first dam DAM1 can be disposed in the curved area BR. The first dam DAM1 can be disposed in the first dam component DP1. One or more first dams DAM1 can be provided. An example in which two first dams DAM1 are provided is shown in Figure 6. One or more first dams DAM1 can be disposed in the first dam component DP1. The first dam DAM1 prevents the touch organic layer 250 from overflowing into the sub-area SR. For example, the touch organic layer 250 can terminate at the outer first dam DAM1 of the two first dams DAM1. Therefore, the touch organic layer 250 does not extend into the sub-area SR and can not overlap with the components located in the sub-area SR at all.

[0111] Other embodiments of the display device will be described below. In the embodiments described below, overlapping descriptions of the components of the display device 1 already described in FIG6 may be omitted.

[0112] Figure 9 is a cross-sectional view of a display device according to another embodiment.

[0113] Referring to FIG9, the touch line TL_1 of the display device 2 according to this embodiment differs from that of the display device 1 according to FIG6 in that the touch line TL_1 does not include the first touch line portion TL1.

[0114] More specifically, the touch line TL_1 may include: a second touch line portion TL2; and a bent bridging electrode CL. The first touch conductive layer 220_1 may not include the first touch line portion TL1 of FIG6.

[0115] Since the remaining description is as described above in Figure 6, its detailed explanation will be omitted.

[0116] Figure 10 is a cross-sectional view of a display device according to yet another embodiment.

[0117] Referring to FIG10, the display device 3 according to this embodiment differs from the display device 1 according to FIG6 in that: the second touch conductive layer 240_1 does not include the second touch line portion TL2 and the third touch panel portion TPAD3, and the first touch conductive layer 220_2 includes the first touch line portion TL1_1 and the third touch panel portion TPAD3_1.

[0118] More specifically, according to FIG. 6, the upper surface of the second touch line portion TL2 of the display device 1 is in direct contact with the touch organic layer 250. In other words, when moisture penetrates the touch organic layer 250 into the second touch line portion TL2, corrosion may occur. However, according to this embodiment, by omitting the second touch line portion TL2, forming a touch line TL2 that passes through the first touch line portion TL1_1 and the bent bridging electrode CL, and arranging the touch insulating layer 230 between the first touch line portion TL1_1 and the touch organic layer 250, the moisture penetrating into the touch line TL_2 can be minimized.

[0119] Since the remaining description is as shown in Figure 6 above, its detailed description will be omitted.

[0120] Although embodiments have been described above with reference to the accompanying drawings, those skilled in the art will understand that the technical configurations described above can be implemented in other specific forms without altering their technical spirit or essential characteristics. Therefore, it should be understood that the embodiments described above are illustrative and not limiting in all aspects. Furthermore, the scope of the invention is explained by the claims described below, rather than by specific embodiments. Additionally, the meaning and scope of the claims, as well as all changes or modifications derived from equivalent concepts, should be interpreted as being included within the scope of this invention.

[0121] This application claims priority to Korean Patent Application No. 10-2023-0112495, filed on August 28, 2023, the entire contents of which are incorporated herein by reference for all purposes.

[0122] 1,2,3: Display device 100: Display panel 101: Substrate 105: Semiconductor layer 111: Gate insulation layer 112: First interlayer insulation layer 121: Gate electrode 130: First source-drain conductive layer 131: Source electrode 133: Drain electrode 141: Second interlayer insulation layer 150: Second source-drain conductive layer 151: Connecting Electrodes 160: First organic layer 161: Planarization layer 170: Second organic layer 171: Embankment 181: First Encapsulation Inorganic Layer / Encapsulation Inorganic Layer 182: Encapsulation organic layer 183: Second Encapsulation Inorganic Layer / Encapsulation Inorganic Layer 200: Touch sensor layer 210: Touch buffer layer 220: First Touch Conductive Layer 220_1: First Touch Conductive Layer 220_2: First Touch Conductive Layer 220_B: Bridging electrode 230: Touch insulation layer 240: Second Touch Conductive Layer 240_1: Second Touch Conductive Layer 240_B: Connecting component 240_R: Detection Electrode / Electrode 240_T: Driving electrode / electrode 250: Touch-sensitive organic layer 300: Data Drive 500: Printed Circuit Board A: Area ANO: Anode BR: Bending area CAT: Cathode CEL: Circuit Component Layer CL: Bridging electrode CT1: First contact hole CT2: Second contact hole CT3: Third contact hole d1: First separation distance d2: Second separation distance DA: Display area DAM1: First Dam DAM2: Second Dam DAM21: Second Lower Dam DAM22: Second Dam DL: Data Line DP1: First Dam Component DP1a: Main Dam Section DP1b: Protruding dam section DP1c: Connecting dam section DP2: Second Dam Component DR1: First Direction DR2: Second Direction DR3: Third direction / thickness direction EL: Organic Component Layer H1: First surface height H2: Second surface height MR: Main Region NDA: Non-display area NSA: Non-sensing area OL: Organic layer OLED: Organic Light Emitting Diode PA1: First Pad Area PA2: Second Pad Area PX: pixel RE,TE: Touch electrode SA: Sensing Area SL: Scan line SR: Sub-region SUB: Substrate Components TFE: Thin film encapsulation layer TL, TL_1, TL_2: Touch lines TL1, TL1_1: First touch line section TL2: Second touch line section TL2a:2-1 Touch Line Section TL2b:2-2 Touch Line Section TPAD: Touchpad TPAD1: First touchpad section TPAD2: Second Touchpad Section TPAD3: Third Touchpad Section TPAD3_1: Third Touchpad Section TR: Thin Film Transistor

Claims

1. A display device, comprising: A substrate includes a display area containing a plurality of pixels and a non-display area located in the vicinity of the display area; A first dam is disposed on the substrate of the non-display area; a second dam is disposed on the substrate of the non-display area and between the first dam and the display area; and a touch sensor layer comprising: a touch conductive layer disposed between the first dam and the second dam; and a touch organic layer located on the touch conductive layer, wherein the touch organic layer terminates within the first dam by the structure of the first dam, and the first dam and the second dam comprise the same material.

2. The display device as claimed in claim 1, wherein, The height of the first dam from a first surface of the substrate is greater than the height of the second dam from a second surface of the substrate.

3. The display device as claimed in claim 1, further comprising a thin-film encapsulation layer located between the first dam and the touch sensor layer, wherein, The thin-film encapsulation layer includes: a first encapsulation inorganic layer; an encapsulation organic layer disposed on the first encapsulation inorganic layer; and a second encapsulation inorganic layer disposed on the encapsulation organic layer.

4. The display device as claimed in claim 3, wherein, The encapsulated organic layer terminates inside the second dam.

5. The display device as claimed in claim 4, wherein, The encapsulated organic layer does not overlap with the first dam.

6. The display device as claimed in claim 1, wherein, The non-display area includes a curved area, wherein the display device is curved in a thickness direction, the first dam is disposed in the curved area, and the second dam is disposed between the curved area and the display area.

7. The display device as claimed in claim 1, further comprising an organic element layer disposed on the substrate of the display area, wherein, The organic element layer includes: an anode; a diaphragm layer exposing a portion of an upper surface of the anode; an organic layer disposed on the exposed upper surface of the anode; and a cathode disposed on the organic layer.

8. The display device as claimed in claim 7, wherein, The first dam and the second dam are formed in the same layer as the levee layer.

9. The display device as claimed in claim 1, wherein, Set up two or more first dams.

10. The display device as claimed in claim 7, wherein, The first dam is set on a second interlayer insulation layer between the dam layer and the base plate.

11. The display device as claimed in claim 7, wherein, The first dam is set on a planarization layer between the dam layer and the base plate.

12. The display device as claimed in claim 10, further comprising a planarization layer located between the second interlayer insulating layer and the dam layer, wherein, The first dam is set on the second interlayer insulation layer and the planarization layer.

13. The display device as claimed in claim 1, wherein, The touch organic layer overlaps with the touch conductive layer.

14. A display device, comprising: A display area contains a plurality of pixels; and a non-display area located near the display area, wherein the non-display area includes: a first dam component surrounding the display area; and a second dam component surrounding the display area and disposed between the first dam component and the display area, wherein the first dam component includes: a main dam portion having a first separation distance from the second dam component; and a protruding dam portion having a second separation distance from the second dam component, and wherein a touch organic layer terminates within the first dam component by means of the structure of the first dam component.

15. The display device as claimed in claim 14, wherein, The first dam component and the second dam component each comprise a closed-loop shape.

16. The display device as claimed in claim 14, wherein, The first dam component further includes a connecting dam section that connects the main dam section to the projecting dam section.

17. The display device as claimed in claim 15, wherein, The non-display area further includes a curved area, wherein the display device is curved in a thickness direction, and the protruding dam portion is disposed in the curved area.

18. The display device as claimed in claim 14, wherein, The second separation distance is greater than the first separation distance.

19. The display device as claimed in claim 14, further comprising a touch-conductive layer, wherein, The touch organic layer overlaps with the touch conductive layer.

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