Multi-press, multi-temperature control workpress module and semiconductor package component testing device equipped with the same

The multi-point pressure and temperature control module addresses the limitations of traditional testing equipment by providing simultaneous and independent control for multiple wafers in advanced semiconductor packages, ensuring complete contact and uniform temperature distribution.

TWI931828BActive Publication Date: 2026-07-11KING YUAN ELECTRONICS
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Patent Information

Application Number
TW113134120
Authority / Receiving Office
TW · TW
Patent Type
Patents
Current Assignee / Owner
Filing Date
2024-09-09
Publication Date
2026-07-11
Estimated Expiration
2044-09-08

AI Technical Summary

Technical Problem

Traditional semiconductor package component testing equipment using a single pressure probe and temperature controller is inadequate for advanced packaging technologies like 2.5D and 3D packaging, failing to ensure complete contact with multiple chips and uniform temperature control, leading to thermal crosstalk and reliability issues.

Method used

A multi-point pressure application and multi-point temperature control downpressure module with multiple pressure blocks, generating units, temperature regulating units, and a controller, allowing simultaneous application of varied pressures and temperatures to individual wafers or regions on semiconductor packages.

Benefits of technology

Ensures complete contact and independent temperature control for each wafer, preventing thermal crosstalk and improving testing accuracy and reliability for advanced packaging technologies.

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Abstract

This invention discloses a multi-point pressure application and multi-point temperature control downpressure module and a semiconductor package component testing apparatus equipped with the downpressure module. It can simultaneously apply multiple downpressures of the same or different magnitudes to multiple wafers on a semiconductor package component, and simultaneously produce the same or different temperature control effects on these wafers. Specifically, multiple downpressure generating units drive multiple pressing blocks to apply downpressure to the wafers on the semiconductor package component; and the temperature regulating units on each pressing block heat or cool the wafers respectively.
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