Electronic package and manufacturing method thereof

Abstract

An electronic package and its manufacturing method are disclosed, which mainly involves forming a groove in a carrier structure and placing a circuit structure in the groove to electrically connect the carrier structure and the circuit structure with chips of different specifications as first electronic components and second electronic components respectively, thereby meeting the needs of multiple functions.

Description

Technical Field

[0001] This invention relates to a semiconductor device, and more particularly to an electronic package and its manufacturing method. Prior Technology

[0002] With the booming development of the electronics industry, wireless communication technology is now widely used in various consumer electronic products to receive or send various wireless signals. In order to meet the appearance design requirements of consumer electronic products, the manufacturing and design of wireless communication modules are developed to meet the requirements of lightness, thinness, shortness and smallness. Among them, the patch antenna is widely used in the wireless communication modules of electronic products such as cell phones because of its small size, light weight and easy manufacturing.

[0003] Figure 1 is a perspective view of a conventional wireless communication module 1. As shown in Figure 1, the wireless communication module 1 includes: a substrate 10, a plurality of electronic components 11 disposed on the substrate 10, an antenna structure 12, and a package material 13. The substrate 10 is a circuit board and is rectangular. The electronic components 11 are radio frequency chips and / or millimeter-wave chips, etc., which are disposed on the substrate 10 and electrically connected to the substrate 10. The antenna structure 12 is planar and has an antenna body 120 and a conductor 121. The antenna body 120 is electrically connected to the electronic components 11 through the conductor 121. The package material 13 covers the electronic components 11 and part of the conductor 121.

[0004] If a millimeter-wave chip used for 5G mmWave signals is used as an electronic component 11, it usually needs to be placed on a substrate 10 made of a dielectric layer with a low dielectric constant / dielectric loss factor (low DK / Df) to reduce signal / energy loss. Other radio frequency chips, however, have no restrictions on the dielectric material required for the substrate 10.

[0005] On the other hand, if an RF chip is used as an electronic component 11, it needs to be placed on a fine-line substrate 10 so that the electrical contacts of the RF chip can be fully wired to the other side of the substrate 10. However, millimeter-wave chips do not need to use a fine-line substrate 10.

[0006] However, in conventional wireless communication modules 1, when using chips of different specifications (RF chips and millimeter-wave chips) as electronic components 11, different specifications of substrates 10 need to be considered. Therefore, it is not possible to configure electronic components 11 of different specifications on existing single-specification substrates 10, that is, it is not possible to configure RF chips and millimeter-wave chips at the same time, thus failing to meet the requirements of multi-functionality.

[0007] Furthermore, if millimeter-wave chips and radio frequency chips for 5G mmWave signals are to be configured simultaneously, special substrates 10 that meet the specifications of fine lines and low DK / Df dielectric layers must be specially manufactured, which will significantly increase the manufacturing cost and make it difficult to reduce the overall cost of the end product.

[0008] Therefore, how to overcome the various problems of the aforementioned conventional technologies has become an urgent issue that needs to be addressed. Summary of the Invention

[0009] In view of the various deficiencies of the prior art, the present invention provides an electronic package comprising: a carrier structure having a wiring layer, defining a first side and a second side opposite to each other, and forming at least one groove connecting the first side and the second side; a wiring structure disposed in the groove and having a wiring layer; a first electronic component disposed on the wiring structure corresponding to the first side and electrically connected to the wiring layer; a second electronic component disposed on the first side of the carrier structure and electrically connected to the wiring layer; a conductive structure bridging the carrier structure and the wiring structure and electrically connecting the wiring layer and the wiring layer; and a packaging layer covering the first electronic component.

[0010] The present invention further provides a method for manufacturing an electronic package, comprising: providing a carrier structure having a wiring layer, defining a first side and a second side opposite to each other, and forming at least one groove connecting the first side and the second side; placing at least one wiring structure having a wiring layer in the groove; disposing a first electronic component on the wiring structure corresponding to the first side, and electrically connecting the first electronic component to the wiring layer; disposing a second electronic component on the first side of the carrier structure, and electrically connecting the second electronic component to the wiring layer; bridging the carrier structure and the wiring structure by a conductive structure, thereby electrically connecting the wiring layer and the wiring layer by the conductive structure; and encapsulating the first electronic component by an encapsulation layer.

[0011] In the aforementioned electronic package and its manufacturing method, the packaging layer extends into the groove to cover the circuit structure.

[0012] In the aforementioned electronic package and its manufacturing method, the packaging layer covers the conductive structure.

[0013] In the aforementioned electronic package and its manufacturing method, a plurality of grooves are formed on the carrier structure, and the circuit structure is respectively disposed in each groove, so that a plurality of first electronic components and a plurality of conductive structures are disposed on the first side of the carrier structure. For example, a plurality of encapsulation layers are formed on the first side of the carrier structure to respectively cover each of the first electronic components. Alternatively, the encapsulation layer covers a plurality of the first electronic components.

[0014] In the aforementioned electronic package and its manufacturing method, the packaging layer covers the second electronic component.

[0015] In the aforementioned electronic package and its manufacturing method, the packaging layer extends to the side of the supporting structure.

[0016] In the aforementioned electronic package and its manufacturing method, the conductive structure is disposed on the first or second side of the supporting structure.

[0017] In the aforementioned electronic package and its manufacturing method, the conductive structure is an interposer, bonding wire, active component, passive component, or a combination thereof.

[0018] As can be seen from the above, in the electronic package and manufacturing method of the present invention, the circuit structure is placed in the groove of the carrier structure to form substrate areas of different specifications. Therefore, compared with the prior art, the electronic package of the present invention can arrange the first electronic component and the second electronic component on the required substrate area according to their specifications. When the electronic package needs to use chips of different specifications, chips of different specifications can be arranged as the first electronic component and the second electronic component on the circuit structure and the carrier structure at the same time, thus satisfying the needs of multiple functions.

[0019] Furthermore, the circuit structure and the supporting structure can be manufactured using existing technology and equipment, so there is no need to add new processes and materials or purchase new special-specification machines. Therefore, compared with the prior art, the electronic package of the present invention will not incur additional cost expenditures during manufacturing, which helps to reduce the manufacturing cost of the electronic package and thus effectively reduce the overall cost of the end product. Simple Explanation of the Diagram

[0020] Figure 1 is a three-dimensional schematic diagram of a conventional wireless communication module.

[0021] Figures 2A to 2D are cross-sectional schematic diagrams illustrating the manufacturing process of the electronic package of the present invention.

[0022] Figure 2E is a top view of Figure 2D.

[0023] Figures 3A, 4A, 5A, 6A, 7A, 8A and 9A are cross-sectional schematic diagrams of various forms of the electronic package of the present invention.

[0024] Figures 3B, 4B, 5B, 6B, 7B, 8B, and 9B are top views of Figures 3A, 4A, 5A, 6A, 7A, 8A, and 9A, respectively. Implementation

[0025] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0026] It should be understood that the structures, proportions, sizes, etc., illustrated in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the conditions under which the present invention can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportional relationships, or adjustments to the size, without affecting the effects and objectives that the present invention can produce, should still fall within the scope of the technical content disclosed herein. Furthermore, the terms such as "above," "first," "second," and "a" used in this specification are only for clarity of description and are not intended to limit the scope of the present invention. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of the present invention.

[0027] Figures 2A to 2D are cross-sectional schematic diagrams illustrating the manufacturing process of the electronic package 2 of the present invention.

[0028] As shown in Figure 2A, a support structure 20 is provided on a support member 9. The support structure 20 defines a first side 20a and a second side 20b that are opposite to each other. The support structure 20 has at least one groove 200 that connects the first side 20a and the second side 20b, so that at least one circuit structure 29 is placed in the groove 200, and the support structure 20 and the circuit structure 29 serve as a substrate module 2a.

[0029] In this embodiment, the carrier structure 20 is, for example, a substrate with a core layer, a coreless substrate, or other wiring structures. It consists of at least one wiring layer 201 bonded to the insulating material 202, such as a redistribution layer (RDL). For example, the insulating material 202 is a dielectric material such as polybenzoxazole (PBO), polyimide (PI), prepreg (PP), or others.

[0030] Furthermore, the circuit structure 29 includes at least one insulating layer 290 and a circuit layer 291 bonded to the insulating layer 290, such as a redistribution layer (RDL). For example, the insulating layer 290 is a dielectric material such as polybenzoxazole (PBO), polyimide (PI), prepreg (PP), or others.

[0031] It should be understood that the carrier structure 20 may also be other carrier chip substrates, such as boards with metal wiring, and is not limited to the above.

[0032] As shown in Figure 2B, at least one (e.g., two) first electronic components 21 are provided on the circuit structure 29 corresponding to the first side 20a, and at least one second electronic component 22 and at least one third electronic component 23 are provided on the first side 20a of the carrier structure 20, and at least one (e.g., four) conductive structure 24 is provided to bridge the circuit structure 29 and the first side 20a of the carrier structure 20.

[0033] In this embodiment, the first electronic component 21 is an active component, a passive component, or a combination thereof. The active component is, for example, a semiconductor wafer, while the passive component is, for example, a resistor, a capacitor, and an inductor. For example, the first electronic component 21 is a semiconductor wafer, such as a radio frequency wafer or a millimeter-wave wafer, which has a plurality of electrode pads 210 to electrically connect the circuit layer 291 via a plurality of conductive bumps 211 using a flip-chip method.

[0034] Furthermore, the second electronic component 22 and the third electronic component 23 are active components, passive components, or combinations thereof. The active component is, for example, a semiconductor chip, while the passive component is, for example, a resistor, capacitor, and inductor. For example, the second electronic component 22 and the third electronic component 23 can be semiconductor chips such as radio frequency chips or millimeter-wave chips, which are electrically connected to the wiring layer 201 by a plurality of conductive bumps 221, 231 using a flip-chip method, and the conductive bumps 221, 231 are covered with adhesive 28.

[0035] Furthermore, the conductive structure 24 is a through silicon interposer (TSI), which electrically connects the wiring layer 201 and the circuit layer 291 through a plurality of conductive bumps 241. The aforementioned interposer material can be a through silicon interposer (TSI) or an organic circuit board.

[0036] It should be understood that the electrical connection of the first electronic component 21, the second electronic component 22, and the third electronic component 23, and even the conductive structure 24 to the substrate module 2a can be varied, such as by wire bonding, and is not limited to the above.

[0037] As shown in Figure 2C, a plurality of encapsulation layers 25 are formed on the carrier structure 20 and the circuit structure 29, so that each encapsulation layer 25 covers each of the first electronic components 21 and its adjacent conductive structure 24, and fills the groove 200 to cover the circuit structure 29.

[0038] In this embodiment, the encapsulation layer 25 is an insulating material, such as polyimide (PI), dry film, or an encapsulating compound such as epoxy resin. For example, the encapsulation layer 25 can be formed by liquid compounding, injection, lamination, or compression molding.

[0039] As shown in Figures 2D and 2E, the carrier 9 is removed, and a cutting process is performed along the cutting path S shown in Figure 2C to obtain the required electronic package 2.

[0040] In another embodiment, as shown in FIG3A and FIG3B, the electronic package 3 may have a package layer 35 covering only the first electronic component 21 without covering the conductive structure 24 and the circuit structure 29.

[0041] In other embodiments, the electronic package 4 shown in Figures 4A and 4B may also cover all the first electronic components 21, all conductive structures 24 and the circuit structure 29 with only a single packaging layer 45.

[0042] Furthermore, as shown in Figures 5A and 5B, the electronic package 5, the package layer 55 can cover the first electronic component 21, the second electronic component 22, the third electronic component 23 and the conductive structure 24 disposed on the carrier structure 20 and the circuit structure 29.

[0043] Furthermore, as shown in Figures 6A and 6B, the electronic package 6 has a package layer 65 that is not only formed on the carrier structure 20 and the circuit structure 29, but can also extend to the side 20c of the carrier structure 20 to cover the carrier structure 20.

[0044] Furthermore, as shown in Figures 7A and 7B, the conductive structure 74 of the electronic package 7 can be disposed on the second side 20b of the carrier structure 20 as required, so that the conductive structure 74 is located on a different side from the first electronic component 21, the second electronic component 22, and the third electronic component 23.

[0045] Alternatively, as shown in Figures 8A and 8B, the conductive structure 84 of the electronic package 8 can be the same as the structure of the first electronic component 21, the second electronic component 22 and the third electronic component 23, and can be a bridge die composed of active components, passive components or combinations thereof.

[0046] Furthermore, as shown in Figures 9A and 9B, the conductive structure 94 of the electronic package 9 can be a bonding wire for wire bonding.

[0047] It should be understood that there are many types and configurations of the conductive structures 24, 74, 84, and 94, which mainly provide electrical conduction between the wiring layer 201 and the line layer 291.

[0048] Therefore, in the manufacturing method of the electronic package of the present invention, the circuit structure 29 is placed in the groove 200 of the carrier structure 20, so that the substrate module 2a can be designed with different specifications of substrate area according to requirements. For example, the circuit layer 291 of the circuit structure 29 meets the requirements of fine circuits, and the insulating material 202 of the carrier structure 20 meets the requirements of low DK / Df dielectric layer specifications (or, the wiring layer 201 of the carrier structure 20 meets the requirements of fine circuits, and the insulating layer 290 of the circuit structure 29 meets the requirements of low DK / Df dielectric layer specifications). (DK / Df dielectric layer specifications required), therefore, compared with the prior art, the electronic package 2-9 of the present invention can arrange the first electronic component 21 (RF chip or millimeter-wave chip) and the second electronic component 22 (RF chip or millimeter-wave chip) on the required substrate area according to their specifications. When the electronic package 2-9 needs to use chips of different specifications (such as RF chips and millimeter-wave chips), the RF chip and the millimeter-wave chip can be arranged on the circuit structure 29 and the carrier structure 20 respectively, thus meeting the requirements of multiple functions.

[0049] Furthermore, the substrate module 2a can be manufactured using existing technology and equipment without the need for new processes, new materials, or the purchase of new special-specification equipment. Therefore, the manufacturing method of this invention will not generate a large amount of additional cost expenditure, which helps to reduce the manufacturing cost of the electronic package 2 to 9, thereby effectively reducing the overall cost of the end product.

[0050] The present invention also provides an electronic package 2-9, which includes: a carrier structure 20 having a wiring layer 201, at least one circuit structure 29, at least one first electronic component 21, at least one second electronic component 22, at least one conductive structure 24, 74, 84, 94 and at least one packaging layer 25, 35, 45, 55, 65.

[0051] The load-bearing structure 20 is defined with a first side 20a and a second side 20b opposite to each other, and at least one groove 200 is formed connecting the first side 20a and the second side 20b.

[0052] The circuit structure 29 is disposed in the groove 200 and has a circuit layer 291.

[0053] The first electronic component 21 is disposed on the circuit structure 29 corresponding to the first side 20a and electrically connected to the circuit layer 291.

[0054] The second electronic component 22 is disposed on the first side 20a of the support structure 20 and electrically connected to the wiring layer 201.

[0055] The conductive structures 24, 74, 84, and 94 are connected across the bearing structure 20 and the circuit structure 29 and electrically connected between the wiring layer 201 and the circuit layer 291.

[0056] The encapsulation layers 25, 35, 45, 55, and 65 are used to cover the first electronic component 21.

[0057] In one embodiment, the encapsulation layers 25, 45, 55, 65 extend into the groove 200 to cover the circuit structure 29.

[0058] In one embodiment, the encapsulation layer 25, 45, 55, 65 covers the conductive structure 24, 84, 94.

[0059] In one embodiment, a plurality of grooves 200 are formed on the carrier structure 20, and the circuit structure 29 is respectively disposed in each groove 200, so that a plurality of first electronic components 21 and a plurality of conductive structures 24, 84, 94 are disposed on the first side 20a of the carrier structure 20. For example, a plurality of encapsulation layers 25, 35 are formed on the first side 20a of the carrier structure 20 to respectively cover each of the first electronic components 21. Alternatively, the encapsulation layers 45, 55, 65 cover the plurality of first electronic components 21.

[0060] In one embodiment, the encapsulation layers 55 and 65 cover the second electronic component 22.

[0061] In one embodiment, the encapsulation layer 65 extends to the side 20c of the support structure 20.

[0062] In one embodiment, the conductive structures 24 and 74 are disposed on the first side 20a or the second side 20b of the supporting structure 20.

[0063] In one embodiment, the conductive structure 24, 74, 84, 94 is an interposer, a bonding wire, an active element, a passive element, or a combination thereof.

[0064] In summary, the electronic package and its manufacturing method of the present invention form substrate areas of different specifications by placing the circuit structure in the groove of the carrier structure. Therefore, the electronic package of the present invention can arrange the first electronic component and the second electronic component on the required substrate area according to their specifications. When the electronic package needs to use electronic components (chips) of different specifications, it can simultaneously arrange electronic components of different specifications on the circuit structure and the carrier structure, thereby meeting the needs of multiple functions.

[0065] Furthermore, the circuit structure and the supporting structure can be manufactured using existing technology and equipment, without the need for new processes, new materials, or the purchase of new special-specification equipment. Therefore, the electronic package of the present invention will not incur additional cost expenditures during manufacturing, which helps to reduce the manufacturing cost of the electronic package and thus effectively reduces the overall cost of the end product.

[0066] The above embodiments are illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be as set forth in the following patent claims.

[0067]

[0068] 1: Wireless communication module

[0069] 10:Substrate

[0070] 11: Electronic components

[0071] 12: Antenna Structure

[0072] 120: Antenna body

[0073] 121: Conductor

[0074] 13: Packaging Material

[0075] 2,3,4,5,6,7,8,9: Electronic packages

[0076] 2a: Substrate Module

[0077] 20: Load-bearing structure

[0078] 20a: First side

[0079] 20b: Second side

[0080] 20c: Side view

[0081] 200: Groove

[0082] 201: Wiring Layer

[0083] 202: Insulating materials

[0084] 21: First electronic component

[0085] 210: Electrode pad

[0086] 211,221,231,241: Conductive bumps

[0087] 22: Second electronic component

[0088] 23: Third electronic component

[0089] 24, 74, 84, 94: Conductive structure

[0090] 25, 35, 45, 55, 65: Encapsulation layer

[0091] 28: Base rubber

[0092] 29: Circuit Structure

[0093] 290: Insulation layer

[0094] 291: Line Layer

[0095] 9: Load-bearing components

[0096] S: Cutting path

Claims

1. An electronic package, comprising: The support structure has a wiring layer and defines a first side and a second side opposite to each other, and forms at least one groove connecting the first side and the second side; A circuit structure is disposed in the groove and has a circuit layer; a first electronic component is disposed on the circuit structure corresponding to the first side and electrically connected to the circuit layer; a second electronic component is disposed on the first side of the carrier structure and electrically connected to the wiring layer; a conductive structure is connected to the carrier structure and the circuit structure and electrically connected to the wiring layer; and an encapsulation layer is used to cover the first electronic component. The carrier structure has a plurality of grooves formed therein, with the circuit structure disposed in each groove, such that a plurality of the first electronic components are disposed on the first side of the carrier structure, and a plurality of the conductive structures are disposed on either the first or second side of the carrier structure.

2. The electronic package as described in claim 1, wherein, The encapsulation layer extends into the recess to cover the circuit structure.

3. The electronic package as described in claim 1, wherein, The encapsulation layer covers the conductive structure.

4. The electronic package as described in claim 1, wherein, The first electronic component or the second electronic component is a radio frequency chip or a millimeter-wave chip.

5. The electronic package as described in claim 1, wherein, A plurality of the encapsulation layers are formed on the first side of the carrier structure to respectively encapsulate each of the first electronic components.

6. The electronic package as described in claim 1, wherein, The encapsulation layer covers the plurality of the first electronic components.

7. The electronic package as described in claim 1, wherein, The encapsulation layer covers the second electronic component.

8. An electronic package comprising: The support structure has a wiring layer and defines a first side and a second side opposite to each other, and forms at least one groove connecting the first side and the second side; A circuit structure is disposed in the groove and has a circuit layer; a first electronic component is disposed on the circuit structure corresponding to the first side and electrically connected to the circuit layer; a second electronic component is disposed on the first side of the carrier structure and electrically connected to the wiring layer; a conductive structure is connected to the carrier structure and the circuit structure and electrically connected to the wiring layer; and an encapsulation layer is used to cover the first electronic component, wherein the encapsulation layer extends to the side of the carrier structure.

9. The electronic package as described in claim 8, wherein, The conductive structure is located on the first or second side of the supporting structure.

10. The electronic package as described in claim 1 or 8, wherein, The conductive structure can be an interposer, a bonding wire, an active component, a passive component, or a combination thereof.

11. A method for manufacturing an electronic package, comprising: A carrier structure having a wiring layer is provided, defining a first side and a second side opposite to each other, and forming at least one groove connecting the first side and the second side; at least one circuit structure having a wiring layer is placed in the groove; a first electronic component is disposed on the circuit structure corresponding to the first side, and the first electronic component is electrically connected to the circuit layer; a second electronic component is disposed on the first side of the carrier structure, and the second electronic component is electrically connected to the wiring layer; a conductive structure is used to bridge the carrier structure and the circuit structure, so that the conductive structure electrically connects the wiring layer and the circuit layer; and the first electronic component is encapsulated by an encapsulation layer, wherein a plurality of grooves are formed on the carrier structure, and the circuit structure is disposed in each of the grooves, such that a plurality of the first electronic components are disposed on the first side of the carrier structure, and a plurality of the conductive structures are disposed on the first side or the second side of the carrier structure.

12. A method for manufacturing an electronic package as described in claim 11, wherein, The encapsulation layer extends into the recess to cover the circuit structure.

13. A method for manufacturing an electronic package as described in claim 11, wherein, The encapsulation layer covers the conductive structure.

14. A method for manufacturing an electronic package as described in claim 11, wherein, The first electronic component or the second electronic component is a radio frequency chip or a millimeter-wave chip.

15. A method for manufacturing an electronic package as described in claim 11, wherein, A plurality of the encapsulation layers are formed on the first side of the carrier structure to respectively encapsulate each of the first electronic components.

16. A method for manufacturing an electronic package as described in claim 11, wherein, The encapsulation layer covers the plurality of the first electronic components.

17. A method for manufacturing an electronic package as described in claim 11, wherein, The encapsulation layer covers the second electronic component.

18. A method for manufacturing an electronic package, comprising: A carrier structure having a wiring layer is provided, defining a first side and a second side opposite to each other, and forming at least one groove connecting the first side and the second side; at least one wiring structure having a wiring layer is placed in the groove; a first electronic component is disposed on the wiring structure corresponding to the first side, and the first electronic component is electrically connected to the wiring layer; a second electronic component is disposed on the first side of the carrier structure, and the second electronic component is electrically connected to the wiring layer; a conductive structure is used to bridge the carrier structure and the wiring structure, so that the conductive structure electrically connects the wiring layer and the wiring layer; and the first electronic component is covered by an encapsulation layer, wherein the encapsulation layer extends to the side of the carrier structure.

19. A method for manufacturing an electronic package as described in claim 18, wherein, The conductive structure is located on the first or second side of the supporting structure.

20. A method for manufacturing an electronic package as described in claim 11 or 18, wherein, The conductive structure can be an interposer, a bonding wire, an active component, a passive component, or a combination thereof.

Images