Component coupling device
The component coupling device addresses misalignment and adhesive application challenges in semiconductor manufacturing by providing precise alignment and adhesive application, enhancing fiber optic array coupling efficiency and reducing costs.
Patent Information
- Application Number
- TW113150073
- Authority / Receiving Office
- TW · TW
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2024-12-20
- Publication Date
- 2026-07-11
- Estimated Expiration
- 2044-12-19
AI Technical Summary
Current semiconductor manufacturing processes face challenges in efficiently coupling fiber optic array elements to integrated circuits due to the complexity and inaccuracies in adhesive application, leading to misalignment and incomplete bonding, which affects the transmission efficiency and increases setup costs.
A component coupling device with a machine base, first and second stage devices, an adhesive application station, and a holding mechanism that ensures precise alignment and application of adhesive to fiber array components, allowing for multi-axial movement and adjustment to ensure proper bonding with integrated circuits.
The solution enhances the efficiency of fiber optic array coupling by ensuring consistent adhesive application and alignment, reducing misalignment issues and improving transmission efficiency while simplifying the mechanism and reducing setup costs.
Smart Images

Figure IMG-2_DRAW_113150073-A0101-14-0001-1 
Figure IMG-2_DRAW_113150073-A0101-14-0001-2 
Figure IMG-2_DRAW_113150073-A0101-14-0002-3
Abstract
Description
Technical Field
[0001] This invention relates to a component coupling device, and more particularly to a component coupling device for coupling fiber array components to integrated circuit components. Prior Technology
[0002] In semiconductor manufacturing processes, silicon photonics (SiPh) technology has become a key focus of industry development in order to produce chips with higher transmission efficiency and lower power consumption. In SiPh technology, whether it's pluggable transceiver optics (PTO), on-board optics (OBO), co-packaged optics (CPO), or optical I / O, all require coupling fiber optic array units (FAUs) onto integrated circuits (ICs). Currently, semiconductor manufacturing processes have evolved to 2.5D or 3D packaging, and the structures of integrated circuits and fiber optic array units have also changed accordingly. For example, integrated circuits now incorporate photonic integrated circuits (PICs). The integrated circuit (IC) of the fiber optic array element includes an optical coupler, a socket, and an optical fiber connecting the optical coupler and the socket. The photonic integrated circuit of the integrated circuit element is coupled by the optical coupler of the fiber optic array element and communicates with the outside world through the optical fiber and the socket of the fiber optic array element.
[0003] When coupling the fiber optic array element to the integrated circuit element, adhesive is typically used to attach the fiber optic array element to the integrated circuit element. A multi-axis movable adhesive valve moves above the integrated circuit element and applies adhesive to the position where the integrated circuit element is to be coupled with the fiber optic array element. Then, a multi-axis movable holding mechanism holds the fiber optic array element and places it on the adhesive. Because the adhesive valve and the holding mechanism need to move to the integrated circuit element separately, it not only increases the complexity and setup cost of the mechanism, but the actual position of the adhesive application may also deviate from the position where the integrated circuit element is to be coupled with the fiber optic array element. This results in the adhesive not being present between the fiber optic array element and the integrated circuit element, leading to a situation where the fiber optic array element cannot be fixed to the integrated circuit element by the adhesive. Further improvements are needed. Summary of the Invention
[0004] Therefore, the object of the present invention is to provide a component coupling device that can improve upon at least one disadvantage of the prior art.
[0005] According to the component coupling device of the present invention, a machine base is provided with: a first stage device, which is provided with a first stage capable of supporting an integrated circuit component; a second stage device, which is provided with a second stage capable of supporting an optical fiber array component; an adhesive application station, which is provided with a first adhesive valve for applying a first adhesive material to the optical fiber array component; and a component coupling device, which is provided with a holding mechanism for holding the optical fiber array component; the holding mechanism can be driven to move the optical fiber array component sequentially between the second stage, the adhesive application station and the first stage.
[0006] In the component coupling device of this invention, the fiber array component is held by the holding mechanism and driven by the holding mechanism to the adhesive application station, so that the adhesive application station can apply the first adhesive to the fiber array component. Compared with the prior art, it can not only save the mechanism for driving the adhesive valve to move to the integrated circuit component, but also ensure that the first adhesive exists between the fiber array component and the integrated circuit component. Simple Explanation of the Diagram
[0007] Figure 1 is an incomplete exploded three-dimensional view illustrating the fiber optic array elements and some integrated circuit elements in the embodiments of the present invention. Figure 2 is a partial cross-sectional view illustrating that the fiber array element will be coupled to the integrated circuit element. Figure 3 is a three-dimensional view illustrating the fiber optic array element. Figure 4 is a three-dimensional view illustrating the fiber array element from a different perspective than that in Figure 3. Figure 5 is a partial cross-sectional view illustrating the optical signal transmitted between the fiber array element and the integrated circuit element. Figure 6 is a schematic diagram illustrating that the component coupling device in this embodiment of the invention is provided on the machine base with a measurement unit, a component coupling device, a control unit, a first platform device, a second platform device, a testing station, a first track device, a second track device, a component transfer device, and an adhesive application station. Figure 7 is a schematic diagram illustrating the configuration of the component coupling device, the first platform device, the second platform device, the testing station, the first track device, the second track device, the component transfer device, and the adhesive application station on the machine platform. Figure 8 is a perspective view illustrating the component coupling device in an embodiment of the present invention. Figure 9 is an exploded perspective view illustrating the third direct-acting component, the second drive mechanism, the holding mechanism, and the inspection mechanism of the element coupling device. Figure 10 is an exploded perspective view illustrating the first rotating component, the second rotating component, and the third rotating component of the second drive mechanism. Figure 11 is a perspective view illustrating that the first moving seat of the first rotating component swings along the first base in a left and right arc-shaped path with the first axis as the axis. Figure 12 is a perspective view illustrating that the second moving seat of the second rotating component swings along the second base in an upper and lower arc-shaped path with the second axis as the axis. Figure 13 is a perspective view illustrating that the third moving seat of the third rotating component swings along the third base in a forward and backward arc-shaped path with the third axis as the axis. Figure 14 is a partial side view illustrating the various connecting surfaces of the second drive mechanism. Figure 15 is an incomplete three-dimensional view illustrating that the first axis, the second axis, and the third axis intersect each other. Figure 16 is an exploded three-dimensional view illustrating the retaining mechanism and its curing components. Figure 17 is a partial side view illustrating the retaining mechanism and its airway. Figure 18 is a partial side view illustrating the retaining element of the retaining mechanism. Figure 19 is an incomplete three-dimensional view illustrating the retainer from an inverted perspective. Figure 20 is a perspective view illustrating the drive components of the retaining mechanism. Figure 21 is a perspective view illustrating the docking components of the retaining mechanism. Figure 22 is a schematic diagram illustrating that the docking component can be driven to selectively dock with the fiber array element. Figure 23 is a schematic diagram illustrating ultraviolet light shining on the fiber array element. Figure 24 is a schematic diagram illustrating how the holding mechanism moves the fiber optic array element to the detection station. Figure 25 is a schematic diagram illustrating how the holding mechanism moves the fiber array element to the coating station. Implementation
[0008] Please refer to Figure 1. This embodiment of the invention is applicable to the process of coupling a fiber array element W1 to an integrated circuit element W2.
[0009] Please refer to Figures 2, 3, and 4. The fiber array element W1 includes an optical coupler W11, a socket W12, and an optical fiber W13 connecting the optical coupler W11 and the socket W12. The optocoupler W11 is made of a light-transmitting material and has a prism W111 on a first side W112 away from the socket W12. The socket portion W12 allows the optical fiber portion W13 to pass through and be exposed on a second side W121 of the socket portion W12 away from the optical coupler portion W11. The socket portion W12 has a wider first base portion W122, a narrower second base portion W123, and two guide holes W124 passing through the first base portion W122 and the second base portion W123. The second side surface W121 is inclined outward from top to bottom. The optical fiber section W13 is composed of a plurality of optical fibers W131 and is flexible.
[0010] Please refer to Figures 1 and 2. The integrated circuit element W2 includes a carrier board W21, a cover W22 disposed on the carrier board W21, and a photonic integrated circuit W23 disposed on the carrier board W21 (in this embodiment of the invention, a plurality of photonic integrated circuits W23 are disposed on the carrier board W21). The carrier board W21 is roughly rectangular, and the photonic integrated circuit W23 can be arranged on one side of the carrier board W21; The cover W22 has a first cover portion W221, a second cover portion W222 with a height slightly lower than the first cover portion W221, and a cutout section W223 located between the first cover portion W221 and the second cover portion W222, which can expose the photonic integrated circuit W23; the cutout section W223 can be provided according to the design requirements of the photonic integrated circuit W23, for example, at each of the four near-side edges of the corresponding rectangular carrier board W21; Each of the photonic integrated circuits W23 is provided with a lens array W231; the lens array W231 is composed of a matrix of multiple lenses W2311.
[0011] Please refer to Figures 2 and 5. When the fiber optic array element W1 is coupled to the integrated circuit element W2, the optical coupler W11 of the fiber optic array element W1 is attached to the photonic integrated circuit W23, and the socket W12 is attached to the second cover W222 of the cover W22. The fiber optic array element W1 uses the prism W111 to correspond to the lens array W231, so that an optical signal W3 can be transmitted between the prism W111 of the fiber optic array element W1 and the lens array W231 of the photonic integrated circuit W23. The optical signal W3 is supplied to the fiber optic array element W1 by a measurement unit 1 (Figure 6). The measurement unit 1 (Figure 6) can measure the signal transmitted from the fiber optic array element W1 to the integrated circuit element W2 and then back to the fiber optic array element W1. The intensity value of the optical signal W3; specifically, when the optical signal W3 is transmitted from the fiber array element W1 to the integrated circuit element W2, it can be reflected by the prism W111 and then enter the lens W2311 of the lens array W231 forward and downward; the optical coupler W11 and the photonic integrated circuit W23 can be bonded and fixed by a first adhesive F1, and the socket W12 and the cover W22 can be bonded and fixed by a second adhesive F2. The shrinkage rate of the first adhesive F1 after curing is smaller than that of the second adhesive F2 after curing, and the strength of the second adhesive F2 after curing is greater than that of the first adhesive F1 after curing; in this embodiment of the invention, the first adhesive F1 is a UV-curable adhesive, and the second adhesive F2 is a thermosetting adhesive. In other embodiments of the present invention, the cover W22 may only have the first cover portion W221, and the socket portion W12 is attached to the carrier plate W21.
[0012] Please refer to Figures 6 and 7. The embodiments of the present invention can be performed using the component coupling device 11 shown in the figures. This component coupling device 11 is suitable for coupling the fiber array component W1 to the integrated circuit component W2. The component coupling device 11 is provided on a machine T with: a measurement unit 1, a component coupling device 2, a control unit 3, a first platform device 4, a second platform device 5, a testing station 6, a first track device 7, a second track device 8, a component transfer device 9, and an adhesive application station 10. In order to increase work efficiency, the component coupling device 11 is provided with two component coupling devices 2 facing each other, but it is not limited thereto. The component coupling device 11 may also be provided with only one component coupling device 2.
[0013] Please refer to Figures 7 and 8. The element coupling device 2 is suitable for holding and moving the fiber array element W1 and coupling the fiber array element W1 to the integrated circuit element W2. The element coupling device 2 is provided with: A first drive mechanism A is mounted on the machine base T; A second drive mechanism B is mounted on the first drive mechanism A and can be driven by the first drive mechanism A to perform multi-axial linear movement; A holding mechanism C is disposed on the second driving mechanism B and can be driven by the second driving mechanism B to perform multi-axial rotational movement; the holding mechanism C can hold the fiber array element W1 and drive the fiber array element W1 to perform multi-axial linear or rotational movement under the drive of the first driving mechanism A and the second driving mechanism B; An inspection mechanism D is provided on the first drive mechanism A and can be driven by the first drive mechanism A to make multi-axial linear movements, and can inspect the integrated circuit element W2 (Figure 1).
[0014] Please refer to Figure 8. In the following description of the embodiment of the present invention, the horizontal direction is defined as a first direction d1, the horizontal direction and orthogonal to the first direction d1 is defined as a second direction d2, and the vertical direction and orthogonal to the first direction d1 and the second direction d2 are defined as a third direction d3.
[0015] Please refer to Figures 8 and 9. The first drive mechanism A includes: a first direct drive component A1 disposed on the machine base T, a second direct drive component A2 disposed on the first direct drive component A1, and a third direct drive component A3 disposed on the second direct drive component A2. The first direct-acting component A1 is provided with two first rail seats A11 spaced apart on the machine base T and two first slides A12 respectively provided on the two first rail seats A11; the first rail seats A11 extend along the first direction d1 and the first slides A12 can move along the first direction d1 on the first rail seats A11; The second linear motion component A2 is provided with a second rail A21 spanning the two first slides A12 and a second slide A22 disposed on the second rail A21; the second rail A21 extends along the second direction d2, and the second slide A22 is movable on the second rail A21 along the second direction d2; The third linear motion component A3 is provided with a third rail seat A31 disposed on the second slide seat A22 and a third slide seat A32 disposed on the third rail seat A31; the third rail seat A31 extends along the third direction d3, and the third slide seat A32 is movable on the third rail seat A31 along the third direction d3; The first drive mechanism A can drive the second drive mechanism B, which in turn drives the holding mechanism C, to move the fiber array element W1 in a straight line with three degrees of freedom: the first direction d1, the second direction d2, and the third direction d3. In this embodiment of the invention, the first rail seat A11 and the second rail seat A21 are driven by a linear motor, but this is not a limitation; a combination of a rotary motor and a screw can also be used. In this embodiment of the invention, the third rail seat A31 is driven by a combination of a rotary motor and a screw, but this is not a limitation; a linear motor can also be used.
[0016] Please refer to Figure 9. The inspection mechanism D is provided with a first image-capturing component D1 and a first distance sensor D2. The first image-capturing component D1 is provided with an image sensor D11, a lens D12, and a light source D13. Please refer to Figure 1 in conjunction with the first image-capturing component D1, which can capture an image of the photonic integrated circuit W23 and / or the lens array W231 above the integrated circuit element W2 to obtain the orientation of the photonic integrated circuit W23 and / or the lens array W231. The first distance sensor D2 can be, for example, an optical reflective sensor, which can sense the distance to different positions on the upper surface of the photonic integrated circuit W23 to obtain the flatness of the upper surface of the photonic integrated circuit W23.
[0017] Please refer to Figures 9 and 10. The second drive mechanism B includes: a first rotating component B1 disposed on the third slide A32, a second rotating component B2 disposed on the first rotating component B1, and a third rotating component B3 disposed on the second rotating component B2.
[0018] Please refer to Figures 10 and 11. The first rotating assembly B1 includes a first base B11 disposed on the third slide A32 (Figure 7), a first movable seat B12 disposed on the first base B11, a first driver B13 capable of driving the first movable seat B12 to move, and a first connecting member B14 disposed on the first movable seat B12. The first base B11 has an arcuate concave surface facing the first movable seat B12, and the first movable seat B12 has an arcuate convex surface facing the first base B11. 12 can be driven by the first driver B13 to move in an arc along the first base B11 and to move the first connector B14 in a left and right arc path. The first trajectory R1 formed by the arc path of the first moving seat B12 is centered on a first axis L1 parallel to the third direction d3 (the radius from the first trajectory R1 to the first axis L1 in Figure 9 is r1). In this embodiment of the invention, the first base B11 and the first moving seat B12 are connected by a cross bearing to make relative movement between them.
[0019] Please refer to Figures 10 and 12. The second rotating assembly B2 includes a second base B21 disposed on the first connector B14 (Figure 9), a second movable seat B22 disposed on the second base B21, a second driver B23 capable of driving the second movable seat B22 to move, and a second connector B24 disposed on the second movable seat B22. The second base B21 has an arcuate concave surface facing the second movable seat B22, and the second movable seat B22 has an arcuate convex surface facing the second base B21. Driven by the second driver B23, the second movable seat B22 moves in an arc along the second base B21 and is linked to the second connector B24 to swing in an upper and lower arc path. The second trajectory R2 formed by the swing of the arc path of the second movable seat B22 is centered on a second axis L2 parallel to the first direction d1 (the radius from the second trajectory R2 to the second axis L2 in Figure 10 is r2). In this embodiment of the invention, the second base B21 and the second movable seat B22 are connected by a cross bearing to enable relative movement between them.
[0020] Please refer to Figures 10 and 13. The third rotating assembly B3 includes a third base B31 disposed on the second connector B24 (Figure 10), a third movable seat B32 disposed on the third base B31, a third driver B33 capable of driving the third movable seat B32 to move, and a third connector B34 disposed on the third movable seat B32. The third base B31 has an arcuate concave surface facing the third movable seat B32, and the third movable seat B32 has an arcuate convex surface facing the third base B31. B32 can be driven by the third driver B33 to move in an arc along the third base B31 and drive the third connector B34 to swing in a forward and backward arc path. The third trajectory R3 formed by the swing of the arc path of the third moving seat B32 is centered on a third axis L3 parallel to the second direction d2 (the radius from the third trajectory R3 to the third axis L3 in Figure 11 is r3). In this embodiment of the invention, the third base B31 and the third moving seat B32 are connected by a cross bearing to enable relative movement between them.
[0021] Please refer to Figures 10 and 14. The first connector B14 has a vertical first connecting surface B141 and a horizontal second connecting surface B142; the second connector B24 has a horizontal third connecting surface B241 and an inclined fourth connecting surface B242; the third connector B34 has an inclined fifth connecting surface B341 and a vertical sixth connecting surface B342; the first connecting surface B141 is approximately parallel to the sixth connecting surface B342; the fourth connecting surface B242 is approximately parallel to the fifth connecting surface B341. The first connector B14 is disposed on the first movable seat B12 of the first rotating assembly B1 with the first connecting surface B141; The second rotating component B2 is located below the first connector B14, and the second base B21 is located on the second connecting surface B142 of the first connector B14; the second connector B24 is located on the second movable seat B22 with the third connecting surface B241. The third rotating component B3 is disposed on the inclined fourth connecting surface B242 of the second connector B24 with the third base B31; the third connector B34 is disposed on the third movable seat B32 with the inclined fifth connecting surface B341. The retaining mechanism C (Figure 9) is located on the sixth connecting surface B342.
[0022] Please refer to Figure 15. The first axis L1, the second axis L2, and the third axis L3 intersect (orthogonalize) each other at a pivot point Lp. The second drive mechanism B can drive the holding mechanism C to rotate the fiber array element W1 around the pivot point Lp as the rotation center, with the first axis L1, the second axis L2, and the third axis L3 as the axes. The preset position of the pivot point Lp is that when the fiber array element W1 is held by the holding mechanism C, it is preset to correspond to the lower part of the optical coupler W11 and the front part of the prism W111. Please refer to Figure 5. When the fiber array element W1 is coupled to the integrated circuit element W2, the lower part of the optical coupler W11 and the front part of the prism W111 are also approximately located on the upper surface of the photonic integrated circuit W23 and correspond to the lens array W231.
[0023] Please refer to Figures 16 and 17. The holding mechanism C includes: a bracket C1, a holding member C2 disposed on the bracket C1 and capable of holding the fiber array element W1, a docking member C3 disposed on the bracket C1 and connected to the measurement unit 1, a driving component C4 disposed on the bracket C1 and capable of driving the docking member C3 to move along the first direction d1, and a curing component C5 disposed on the bracket C1 and capable of curing adhesive. The bracket C1 has an air passage C12 communicating with an air nozzle C11, and the air nozzle C11 is connected to a negative pressure source (not shown). The holding member C2 and the docking member C3 are disposed on the bracket C1 and can move synchronously. The docking member C3 can move relative to the holding member C2 to selectively dock with or not dock with the fiber array element W1, so that the holding mechanism C can not only hold the fiber array element W1 but also facilitate the measurement unit 1 to measure the fiber array element W1.
[0024] Please refer to Figures 17, 18, and 19. The retaining member C2 has a first retaining portion C21 and a second retaining portion C22 spaced apart from the first retaining portion C21 in the first direction d1. The first retaining portion C21 can hold the optical coupler portion W11 of the fiber array element W1, and the second retaining portion C22 can hold the socket portion W12 of the fiber array element W1. The way in which the retaining member C2 holds both ends of the fiber array element W1 makes the fiber array element W1 securely held on the retaining member C2, thereby reducing the possibility of the fiber array element W1 falling off the retaining mechanism C. The first holding portion C21 has a first holding surface C211 and a first negative pressure hole C212 communicating with the first holding surface C211. The optical coupler portion W11 of the fiber array element W1 can be adsorbed and held on the first holding surface C211 through the first negative pressure hole C212. The second holding portion C22 has a second holding surface C221 and a second negative pressure hole C222 communicating with the second holding surface C221. The socket portion W12 of the fiber array element W1 can be adsorbed and held on the second holding surface C221 through the second negative pressure hole C222. The first negative pressure hole C212 and the second negative pressure hole C222 communicate with the air passage C12. The retaining member C2 is provided with a first limiting part C23 and a second limiting part C24. The first limiting part C23 is located on the side of the second retaining part C22 close to the first retaining part C21, and the second limiting part C24 is located on the side of the second retaining part C22 away from the first retaining part C21. The first limiting part C23 is provided with a first clearance area C231 through which the optical fiber part W13 of the optical fiber array element W1 passes, and the second limiting part C24 is provided with a second clearance area C241 through which the second seat part W123 of the socket part W12 of the optical fiber array element W1 passes. When the fiber array element W1 is held by the retainer C2, the wider first seat W122 of the socket W12 will be positioned between the first limiting part C23 and the second limiting part C24, thereby restricting the movement of the fiber array element W1 on the retainer C2 in the first direction d1.
[0025] Please refer to Figures 17, 20, 21, and 22. The docking component C3 is indirectly mounted on the bracket C1 via the driving assembly C4. The driving assembly C4 includes a driving component C41, a movable component C42 driven by the driving component C41, and a mounting base C43 disposed on the movable component C42. The docking component C3 is disposed on the mounting base C43 and can be driven by the driving component C41 to reciprocate relative to the retaining component C2 along the first direction d1, selectively docking with or not docking with the fiber array element W1. The docking component C3 includes a light transmission section C31, a light transmission section C32 connecting the light transmission section C31 and the measurement unit 1, and a guide section C33 that can be selectively inserted into the fiber array element W1. The light transmission section C31 and the guide section C33 are disposed on a docking surface C34 of the docking component C3 facing the retainer C2. The docking surface C34 is inclined from bottom to top towards the retainer C2, and the inclination of the docking surface C34 corresponds to the second side surface W121 of the fiber array element W1. Specifically, the docking surface C34 and the second side surface W121 are parallel to each other. The guide portion C33 is provided with two guide pins C331 spaced apart on both sides of the optical transmission portion C31. The guide pins C331 can be inserted into the guide hole W124 (Fig. 3) of the fiber array element W1. When the docking member C3 docks with the fiber array element W1, the guide pins C331 are inserted into the guide hole W124 and the docking surface C34 is against the second side surface W121, so that the optical transmission portion C31 is exposed in the fiber portion W13 of the socket portion W12, so that the measurement unit 1 can supply the optical signal W3 (Fig. 5) to the fiber array element W1.
[0026] Please refer to Figures 16, 18, and 23. The curing component C5 is provided with two first light sources C51. The two first light sources C51 are respectively disposed on both sides of the retainer C2 in the second direction d2 with a distance between them. The first light sources C51 can be tilted to irradiate ultraviolet light C511 towards the first retaining part C21 of the retainer C2. In other embodiments of the present invention, the curing component C5 is further provided with a second light source (not shown), which can irradiate laser light at an angle toward the second holding portion C22 of the holding member C2.
[0027] Please refer to Figure 7. The first platform device 4 and the second platform device 5 are arranged side by side at a distance in the second direction d2, and are located within the range where the component coupling device 2 can perform operations. The first platform device 4 includes a first platform 41 capable of supporting the integrated circuit element W2, a first rotating seat 42 capable of driving the first platform 41 to rotate horizontally, and a first platform rail 43 capable of driving the first rotating seat 42 and the first platform 41 to move along the first direction d1; The second platform device 5 is provided with a second platform 51 that can carry the fiber array element W1, and a second platform rail 52 that can drive the second platform 51 to move along the first direction d1.
[0028] Please refer to Figures 7 and 24. The testing station 6 is located between the first stage device 4 and the second stage device 5 and within the range where the component coupling device 2 can perform operations. The testing station 6 can inspect or measure the fiber array component W1. The detection station 6 is equipped with a second image-capturing component 61, a second distance sensor 62, and an optical integrator 63; The second imaging component 61 can capture images of the optical coupler W11 and / or the prism W111 below the fiber array element W1 held in the holding mechanism C to obtain the orientation of the optical coupler W11 and / or the prism W111; the second distance sensor 62 can sense the distance to different positions on the lower surface of the optical coupler W11 to obtain the flatness of the lower surface of the optical coupler W11; the structure of the second imaging component 61 and the second distance sensor 62 can be, for example, the first imaging component D1 (FIG. 9) and the first distance sensor D2 (FIG. 9); The optical integrator 63 can measure the intensity value of the optical signal W3 below the fiber array element W1 held in the holding mechanism C; the optical integrator 63 can be, for example, an optical integrating sphere; specifically, the optical integrator 63 measures the optical signal W3 transmitted from the fiber array element W1, while the optical signal W3 transmitted from the fiber array element W1 to the integrated circuit element W2 (FIG. 5) and then back to the fiber array element W1 is measured by the measurement unit 1 (FIG. 17).
[0029] Please refer to Figure 7. The first track device 7 and the second track device 8 are arranged side by side at a distance from each other in the second direction d2. The first track device 7 is provided with a first track 71, which can transport a first tray S1 along the first direction d1. The first tray S1 carries the integrated circuit element W2. The first track 71 can be, for example, a combination of a track frame and a conveyor belt. The second track device 8 is provided with a second track 81, which can transport a second tray S2 along the first direction d1. The second tray S2 carries the fiber optic array element W1. The second track 81 can be, for example, a combination of a track frame and a conveyor belt. The component transfer device 9 is provided with a gantry frame 91 spanning above the first track device 7 and the second track device 8, a first pick-and-place mechanism 92 provided on the gantry frame 91, and a second pick-and-place mechanism 93 provided on the gantry frame 91; the first pick-and-place mechanism 92 and the second pick-and-place mechanism 93 can move along the second direction d2 on the gantry frame 91; the first pick-and-place mechanism 92 can move between the first material tray S1 and the first platform 41, and the second pick-and-place mechanism 93 can move between the second material tray S2 and the second platform 51; the first pick-and-place mechanism 92 and the second pick-and-place mechanism 93 can be, for example, a combination of suction cups or suction nozzles.
[0030] Please refer to Figures 7 and 25. The adhesive application station 10 is located on the side of the second platform device 5 away from the testing station 6 and within the range where the component coupling device 2 can perform its operations. The adhesive application station 10 is equipped with a first adhesive valve 101 for applying the first adhesive material F1 and a second adhesive valve 102 for applying the second adhesive material F2. The first adhesive valve 101 is equipped with a first adhesive nozzle 1011 that can dispense adhesive upwards, and the second adhesive valve 102 is equipped with a second adhesive nozzle 1021 that can dispense adhesive upwards. In this embodiment of the invention, the first adhesive valve 101 and the second adhesive valve 102 can be, for example, a syringe pump, but are not limited thereto, and can also be, for example, a screw adhesive valve, a piezoelectric adhesive valve, a spray adhesive valve, etc.
[0031] In the implementation of the component coupling device of this invention, the first tray S1 carries at least one integrated circuit element W2 (one in this embodiment) and is fed into the first track 71 from one end of the first track device 7; the second tray S2 carries at least one fiber array element W1 (a plurality of in this embodiment) and is fed into the second track 81 from one end of the second track device 8. The first track 71 and the second track 81 respectively transport the first tray S1 and the second tray S2 to below the gantry 91, and the first platform 41 and the second platform 51 are respectively driven to below the gantry 91 by the first platform rail seat 43 and the second platform rail seat 52; The first pick-and-place mechanism 92 of the component transfer device 9 picks up the integrated circuit component W2 from the first tray S1 and places it onto the first stage 41, and the second pick-and-place mechanism 93 picks up the fiber array component W1 from the second tray S2 and places it onto the second stage 51; After the first platform 41 and the second platform 51 respectively carry the integrated circuit element W2 and the fiber array element W1, the first platform 41 and the second platform 51 are driven by the first platform rail 43 and the second platform rail 52 respectively to the area below the second direct-acting component A2 of the first drive mechanism A; The first driving mechanism A drives the inspection mechanism D to move laterally above the first stage 41. After the inspection mechanism D obtains the orientation of the photonic integrated circuit W23 and / or the lens array W231 and the flatness of the upper surface of the photonic integrated circuit W23, the control unit 3 records it. After obtaining the orientation of the photonic integrated circuit W23 and / or the lens array W231 and the flatness of the upper surface of the photonic integrated circuit W23, the first driving mechanism A drives the second driving mechanism B, which in turn drives the holding mechanism C, to move laterally above the second stage 51. The first driving mechanism A then drives the second driving mechanism B, which in turn drives the holding mechanism C, to move downwards so that the holding member C2 contacts the fiber array element W1 on the second stage 51. Simultaneously, the negative pressure source activates, causing the first holding portion C21 and the second holding portion C22 of the holding member C2 to respectively attract the optical coupler portion W11 and the socket portion W12 of the fiber array element W1. Then, the driving assembly C4 drives the docking member C3 to approach the fiber array element W1 and dock with it, so that the measurement unit 1 can supply the optical signal W3 to the fiber array element W1. After the docking member C3 docks with the fiber array element W1, the first driving mechanism A drives the second driving mechanism B, which in turn drives the holding mechanism C, to move upwards. This causes the holding member C2 to adhere to and hold the fiber array element W1, moving it away from the second stage 51. The first driving mechanism A then drives the second driving mechanism B, which in turn drives the holding mechanism C, to move the fiber array element W1 laterally to the detection station 6 for detection and measurement of the intensity value of the optical signal W3. At the detection station 6, the orientation of the optical coupler W11 and / or the prism W111, the flatness of the lower surface of the optical coupler W11, and the measured intensity value of the optical signal W3 are obtained. The intensity value of signal W3 is then recorded by the control unit 3; wherein, the control unit 3 can compare the deviation between the orientation of the optical coupler W11 and / or the prism W111 and the orientation of the photonic integrated circuit W23 and / or the lens array W231, and control the first rotating component B1 of the second driving mechanism B to swing left and right in an arc-shaped path with the first axis L1 as the axis, so as to adjust the posture of the fiber array element W1 held by the holding mechanism C so that the orientation of the optical coupler W11 and / or the prism W111 can be aligned with the orientation of the photonic integrated circuit W23 and / or the lens array W231. The control unit 3 can compare the deviation between the flatness of the lower surface of the optical coupler W11 and the flatness of the upper surface of the photonic integrated circuit W23, and control the second rotating component B2 of the second drive mechanism B to swing up and down in an arc-shaped path around the second axis L2, and control the third rotating component B3 to swing forward and backward in an arc-shaped path around the third axis L3, so as to adjust the posture of the fiber array element W1 held by the holding mechanism C so that the lower surface of the optical coupler W11 can be parallel to the upper surface of the photonic integrated circuit W23; and the ..., so that the lower surface of the optical coupler W11 can be parallel to the upper surface of the photonic integrated circuit W23; and the control unit 3 can compare the deviation between the flatness of the lower surface of the optical coupler W11 and the flatness of the upper surface of the photonic integrated circuit W23, and control the second rotating component B2 of the second drive mechanism B The intensity value of the optical signal W3 measured by the detection station 6 is recorded by unit 3 for calibration purposes. This is because optical loss occurs during the transmission of the optical signal W3. For example, if the measurement unit 1 supplies the optical signal W3 with an intensity value of 100 units to the fiber array element W1, but the optical integrator 63 actually measures the intensity value of the optical signal W3 transmitted from the fiber array element W1 as 90 units, the control unit 3 will record the intensity value of the optical signal W3 measured by the detection station 6 as 90 units and use it for subsequent readjustment of the attitude (orientation or level) of the fiber array element W1. After the second driving mechanism B drives the holding mechanism C to adjust the posture of the fiber array element W1, the first driving mechanism A drives the second driving mechanism B to move laterally to the adhesive coating station 10 for adhesive coating. The holding mechanism C can hold the fiber array element W1 to move relative to the first adhesive valve 101 and the second adhesive valve 102 along the second direction d2, so that the first adhesive valve 101 and the second adhesive valve 102 respectively apply a layer of the first adhesive F1 and a layer of the second adhesive F2 to the lower surface of the optical coupler part W11 and the lower surface of the socket part W12. After the fiber array element W1 is coated with adhesive, the first driving mechanism A drives the second driving mechanism B, which in turn drives the holding mechanism C, to move laterally above the first stage 41. Because the second driving mechanism B has previously driven the holding mechanism C to adjust the orientation of the optical coupler W11 and / or the prism W111 to align with the orientation of the photonic integrated circuit W23 and / or the lens array W231, and the lower surface of the optical coupler W11 has been adjusted to be parallel to the upper surface of the photonic integrated circuit W23, after the holding mechanism C moves above the first stage 41, the first driving mechanism A can directly drive the second driving mechanism B, which in turn drives the holding mechanism C, to move laterally above the first stage 41. The driving mechanism A drives the second driving mechanism B, which in turn drives the holding mechanism C to move downwards. This causes the lower surfaces of the optical coupler W11 and the socket W12 to be bonded to the upper surfaces of the photonic integrated circuit W23 and the second cover W222 of the cover W22 via the first adhesive material F1 and the second adhesive material F2, respectively. This allows the optical signal W3 to be transmitted between the fiber array element W1 and the integrated circuit element W2 via the prism W111 and the lens array W231. At this time, the holding mechanism C continues to hold the fiber array element W1 with the holding member C2. After the fiber array element W1 is attached to the integrated circuit element W2, because the first adhesive F1 and the second adhesive F2 have not yet cured and the first adhesive F1 and the second adhesive F2 have a certain height, the fiber array element W1 can float on the first adhesive F1 and the second adhesive F2 and can still be adjusted in attitude by the holding mechanism C. At this time, the measuring unit 1 can measure whether the intensity value of the optical signal W3 falls within a preset range. When the intensity value of the optical signal W3 has not fallen within the preset range, the control unit 3 controls the second driving mechanism B to drive the holding mechanism C to move the fiber array element W1 along the axis as needed. The optical fiber array element W1 is rotated around point Lp as the center of rotation, with the first axis L1, the second axis L2, and the third axis L3 as axes of three degrees of freedom. While the optical fiber array element W1 is attached to the integrated circuit element W2, the orientation of the optical fiber array element W1 is adjusted slightly until the intensity value of the optical signal W3 measured by the measurement unit 1 falls within a preset range. At this point, the second drive mechanism B is controlled to stop operating. When the intensity value of the optical signal W3 falls within the preset range, it indicates that the optical signal W3 transmitted between the optical fiber array element W1 and the integrated circuit element W2 has better transmission efficiency. The preset range is related to... The intensity value of the optical signal W3 recorded by the detection station 6 and the control unit 3 is positively correlated. For example, if the intensity value of the optical signal W3 is recorded as 90 units, considering that optical loss will occur during the transmission of the optical signal W3 between the fiber array element W1 and the integrated circuit element W2, the preset range can be preset between 80 and 90 units. If the intensity value of the optical signal W3 measured by the measurement unit 1 is 75 units, the control unit 3 controls the second drive mechanism B to continuously drive the holding mechanism C to adjust the attitude of the fiber array element W1 until the intensity value of the optical signal W3 measured by the measurement unit 1 is 75 units. The intensity value falls between 80 and 90 units; wherein, the operating order of the first rotating component B1, the second rotating component B2, and the third rotating component B3 of the second driving mechanism B is that the third rotating component B3 takes priority, followed by the second rotating component B2, and finally the first rotating component B1. If the third rotating component B3 drives the holding mechanism C to rotate the fiber array element W1 around the third axis L3, and the intensity value of the optical signal W3 measured by the measuring unit 1 has fallen within the preset range, then the first rotating component B1 and the second rotating component B2 do not need to operate anymore.After the second drive mechanism B drives the holding mechanism C to slightly adjust the attitude of the fiber array element W1, if the intensity value of the optical signal W3 still cannot fall within the preset range, the control unit 3 can, as needed, control the first drive mechanism A to drive the second drive mechanism B in conjunction with the holding mechanism C to drive the fiber array element W1 to move linearly along the three degrees of freedom of the first direction d1, the second direction d2, and the third direction d3, and continue to control the second drive mechanism B to drive the holding mechanism C to drive the fiber array element W1 to rotate around the first axis L1, the second axis L2, and the third axis L3 as axes. While the fiber array element W1 is attached to the integrated circuit element W2, the attitude of the fiber array element W1 is adjusted more significantly until the intensity value of the optical signal W3 measured by the measurement unit 1 falls within the preset range, at which point the first drive mechanism A and the second drive mechanism B are controlled to stop operating. After the intensity value of the optical signal W3 falls within the preset range, the curing component C5 uses ultraviolet light C511 and laser light to cure the first adhesive material F1 and the second adhesive material F2 respectively. Because the optocoupler W11 is made of a light-transmitting material, the ultraviolet light C511 can penetrate the optocoupler W11 and cure the first adhesive material F1 between the optocoupler W11 and the photonic integrated circuit W23. Furthermore, because the laser light can generate heat, the second adhesive material F2 between the socket W12 and the second cover W222 of the cover W22 can be heated and cured. After the first adhesive material F1 and the second adhesive material F2 have cured, the driving component C4 drives the docking part C3 away from the fiber array element W1, thereby disengaging from the fiber array element W1. After the docking component C3 is disconnected from the fiber array element W1, the negative pressure source is turned off and the retaining component C2 is moved away from the fiber array element W1, thus completing the process of coupling the fiber array element W1 to the integrated circuit element W2; The first driving mechanism A and the second driving mechanism B of the component coupling device 2 can drive the holding mechanism C to repeat the above actions in sequence to couple a preset number of fiber array elements W1 to the integrated circuit element W2. When the photonic integrated circuit W23 is arranged on all four proximal sides of the carrier plate W21 of the integrated circuit element W2, the two component coupling devices 2 can respectively perform the operation of coupling the fiber array elements W1 to the integrated circuit element W2 on two opposite proximal sides of the four proximal sides of the integrated circuit element W2. After the coupling operation is completed on the two opposite proximal sides, the first rotating seat 42 drives the first stage 41 to rotate 90 degrees. Then, the two component coupling devices 2 continue to perform coupling operations on the other two near sides of the integrated circuit element W2. After the integrated circuit element W2 has been coupled with a preset number of fiber array elements W1, the first platform 41 is driven back to the bottom of the gantry 91 by the first platform rail 43, and the first pick-and-place mechanism 92 picks up the integrated circuit element W2 that has completed the coupling operation and returns it to the first tray S1. Then, the first track 71 is sent out from the other end of the first track device 7. After there are no more fiber array elements W1 on the second tray S2, the second tray S2 will be sent out from the other end of the second track device 8 to the second track 81.
[0032] In the component coupling device of this invention, the fiber array element W1 is held by the holding mechanism C and driven by the holding mechanism C to the adhesive application station 10, so that the adhesive application station 10 can apply the first adhesive material F1 to the fiber array element W1. Compared with the prior art, it can not only save the mechanism for driving the adhesive valve to move to the integrated circuit element W2, but also ensure that the first adhesive material F1 exists between the fiber array element W1 and the integrated circuit element W2.
[0033] However, the above description is merely an embodiment of the present invention and should not be construed as limiting the scope of the present invention. Any simple equivalent changes and modifications made in accordance with the scope of the patent application and the contents of the patent specification shall still fall within the scope of the patent of the present invention.
[0034] 1: Measurement Unit 2: Component coupling device 3: Control Unit 4: First platform device 41: First Platform 42: First Rotary Seat 43: First platform rail 5: Second platform device 51: Second Platform 52: Second platform rail 6: Testing Station 61: Second imaging component 62: Second distance sensor 63: Optical Integrator 7: First Track Device 71: First Track 8: Second orbital device 81: Second Track 9: Component transfer device 91: Gantry 92: First pick-up and drop-off mechanism 93: Second pick-up and drop-off mechanism 10: Glue Coating Station 101: First Glue Valve 1011: First Nozzle 102: Second glue valve 1021: Second nozzle 11: Component Coupling Device A: First drive mechanism A1: First direct-acting component A11: First Track A12: First slide A2: Second direct-drive component A21: Second Track A22: Second slide A3: Third Direct-Motion Component A31: Third Track A32: Third slide B: Second drive mechanism B1: First Rotating Component B11: First Foundation B12: First Moving Seat B13: First Driver B14: First Connector B141: First connecting surface B142: Second connecting surface B2: Second Rotation Component B21: Second Base B22: Second movable seat B23: Second Driver B24: Second connector B241: Third connecting surface B242: Fourth connecting surface B3: Third Rotation Component B31: Third Base B32: Third movable seat B33: Third Driver B34: Third connector B341: Fifth Connecting Surface B342: Sixth Connecting Surface C: Maintaining mechanism C1: Bracket C11: Valve C12: airway C2: Retaining component C21: First Holding Section C211: First retaining surface C212: First negative pressure hole C22: Second Holding Section C221: Second retaining surface C222: Second negative pressure hole C23: First limiting part C231: First Yield Zone C24: Second limiting part C241: Second yielding zone C3: Connecting parts C31: Optical Communication Department C32: Optical Transmission Section C33: Guiding Unit C331: Sales Guide C34: Dating surface C4: Driver Components C41: Driver C42: Moving parts C43: Mounting bracket C5: Curing Components C51: First Light Source C511: Ultraviolet light D: Inspection Agency D1: First imaging component D11: Image Capturer D12: Lens D13: Light Source D2: First distance sensor F1: First Adhesive Material F2: Second adhesive material T: Machine L1: First axis L2: Second axis L3: Third axis Lp: pivot point R1: First trajectory R2: Second Trajectory R3: Third Track S1: First tray S2: Second tray W1: Fiber optic array element W11: Optical Coupler Section W111: Prism W112: First side view W12: Socket section W121: Second side W122: First Seat W123: Second Seat W124: Guide hole W13: Fiber Optics Department W131: Fiber Optic W2: Integrated circuit element W21: Carrier Plate W22: Cover W221: First cover W222: Second cover W223: Hollowed-out section W23: Photonic Integrated Circuit W231: Lens Array W2311: Lens W3: Optical signal d1: First direction d2: Second direction d3:Third direction r1: radius r2: radius r3: radius
Claims
1. A component coupling device, comprising on a machine base: a first stage device for supporting an integrated circuit component; a second stage device for supporting an optical fiber array component; an adhesive application station for applying a first adhesive to the optical fiber array component; and a component coupling device for holding the optical fiber array component using a holding mechanism, the holding mechanism being drivable to move the optical fiber array component sequentially between the second stage, the adhesive application station, and the first stage; wherein... The first platform device and the second platform device are arranged side by side with a distance between them; the first platform device is provided with a first platform rail seat that can drive the first platform to move; the second platform device is provided with a second platform rail seat that can drive the second platform to move.
2. The component coupling device as described in claim 1, wherein, The machine is equipped with a testing station located between the first stage device and the second stage device, which can inspect the fiber optic array elements.
3. The component coupling device as described in claim 1, wherein, The first platform device is provided with a first rotating seat that can drive the first platform to rotate, and the first platform rail can drive the first rotating seat and the first platform to move.
4. The component coupling device as described in claim 1, wherein, The machine is equipped with a first track device and a second track device arranged side by side at a distance from each other; the first track device has a first track for conveying a first material tray, and the second track device has a second track for conveying a second material tray; the integrated circuit element can be carried on the first material tray, and the fiber optic array element can be carried on the second material tray.
5. The component coupling device as described in claim 4, wherein, The machine is equipped with a component transfer device, which includes a gantry frame spanning above the first track device and the second track device, a first pick-and-place mechanism mounted on the gantry frame, and a second pick-and-place mechanism mounted on the gantry frame. The first pick-and-place mechanism and the second pick-and-place mechanism are movable on the gantry frame. The first pick-and-place mechanism is movable between the first material tray and the first platform, and the second pick-and-place mechanism is movable between the second material tray and the second platform.
6. A component coupling device, comprising on a machine base: a first stage device for supporting an integrated circuit component; a second stage device for supporting an optical fiber array component; an adhesive application station for applying a first adhesive to the optical fiber array component; and a component coupling device for holding the optical fiber array component using a holding mechanism, the holding mechanism being drivable to move the optical fiber array component sequentially between the second stage, the adhesive application station, and the first stage; wherein... The machine is equipped with two coupling devices for this component arranged in opposite directions.
7. A component coupling device, comprising on a machine base: a first stage device for supporting an integrated circuit component; a second stage device for supporting an optical fiber array component; an adhesive application station for applying a first adhesive to the optical fiber array component; and a component coupling device for holding the optical fiber array component using a holding mechanism, the holding mechanism being drivable to move the optical fiber array component sequentially between the second stage, the adhesive application station, and the first stage; wherein... The adhesive application station is equipped with a first adhesive valve for applying the first adhesive material and a second adhesive valve for applying the second adhesive material; the first adhesive valve is equipped with a first nozzle that can dispense adhesive upwards, and the second adhesive valve is equipped with a second nozzle that can dispense adhesive upwards; the holding mechanism can keep the fiber optic array element moving relative to the first adhesive valve and the second adhesive valve; the first adhesive valve applies the first adhesive material to the lower surface of an optical coupler portion of the fiber optic array element, and the second adhesive valve applies the second adhesive material to the lower surface of a socket portion of the fiber optic array element.
8. A component coupling device, comprising on a machine base: a first stage device for supporting an integrated circuit component; a second stage device for supporting an optical fiber array component; an adhesive application station for applying a first adhesive to the optical fiber array component; and a component coupling device for holding the optical fiber array component using a holding mechanism, the holding mechanism being driveable to move the optical fiber array component sequentially between the second stage, the adhesive application station, and the first stage; wherein... The component coupling device is provided with an inspection mechanism for inspecting the integrated circuit component. The inspection mechanism is provided with a first imaging component and a first distance sensor. The first imaging component can capture an image of a photonic integrated circuit or a lens array above the integrated circuit component to obtain the orientation of the photonic integrated circuit or the lens array. The first distance sensor can sense the upper surface of the photonic integrated circuit to obtain the flatness of the upper surface of the photonic integrated circuit.
9. A component coupling device, comprising on a machine base: a first stage device for supporting an integrated circuit component; a second stage device for supporting an optical fiber array component; an adhesive application station for applying a first adhesive to the optical fiber array component; and a component coupling device for holding the optical fiber array component using a holding mechanism, the holding mechanism being driveable to move the optical fiber array component sequentially between the second stage, the adhesive application station, and the first stage; wherein... The machine is equipped with a testing station for inspecting the fiber array element. The testing station is equipped with a second imaging component and a second distance sensor. The second imaging component can take an image of an optical coupler or a prism below the fiber array element held in the holding mechanism to obtain the orientation of the optical coupler or the prism. The second distance sensor can sense the lower surface of the optical coupler to obtain the flatness of the lower surface of the optical coupler.
10. The component coupling device as described in claim 9, wherein, The testing station is equipped with an optical integrator that can measure the intensity value of an optical signal below the fiber array element held in the holding mechanism.
11. A component coupling device, comprising on a machine base: a first stage device for supporting an integrated circuit component; a second stage device for supporting an optical fiber array component; an adhesive application station for applying a first adhesive to the optical fiber array component; and a component coupling device for holding the optical fiber array component using a holding mechanism, the holding mechanism being drivable to move the optical fiber array component sequentially between the second stage, the adhesive application station, and the first stage; wherein... The component coupling device is provided with a first driving mechanism and a second driving mechanism. The second driving mechanism is provided on the first driving mechanism and can be driven by the first driving mechanism to make linear movements in multiple axes. The holding mechanism is provided on the second driving mechanism and can be driven by the second driving mechanism to make rotational movements in multiple axes.
12. The component coupling device as described in claim 11, wherein, The first driving mechanism includes a first direct-acting component, a second direct-acting component disposed on the first direct-acting component, and a third direct-acting component disposed on the second direct-acting component; the first driving mechanism can drive the second driving mechanism to drive the holding mechanism to move the fiber array element in a first direction, a second direction, and a third direction in a linear motion; the first direction, the second direction, and the third direction are orthogonal to each other, the first direction and the second direction are transverse, and the third direction is longitudinal.
13. The component coupling device as described in claim 11, wherein, The second driving mechanism includes a first rotating component, a second rotating component, and a third rotating component disposed on the first driving mechanism; the second driving mechanism can drive the holding mechanism to rotate the fiber array element around a first axis, a second axis, and a third axis; the first axis is parallel to a third direction, the second axis is parallel to a first direction, the third axis is parallel to a second direction, the first direction, the second direction, and the third direction are orthogonal to each other, the first direction and the second direction are transverse, and the third direction is longitudinal.
14. The component coupling device as described in claim 13, wherein, The first axis, the second axis, and the third axis intersect at a common axis point; the second drive mechanism can drive the holding mechanism to rotate the fiber array element around the axis point as the rotation center.
15. A component coupling device, comprising on a machine base: a first stage device for supporting an integrated circuit component; a second stage device for supporting an optical fiber array component; an adhesive application station for applying a first adhesive to the optical fiber array component; and a component coupling device for holding the optical fiber array component using a holding mechanism, the holding mechanism being drivable to move the optical fiber array component sequentially between the second stage, the adhesive application station, and the first stage; wherein... The holding mechanism includes a holding member for holding the fiber array element and a docking member connected to a measurement unit; the docking member can move relative to the holding member to selectively dock with or not dock with the fiber array element.
16. The component coupling device as described in claim 15, wherein, The holding mechanism includes a drive assembly, which includes a drive member and a moving member. The docking member is disposed on the moving member and can be driven by the drive member to reciprocate relative to the holding member, thus selectively docking with or not docking with the fiber array element.
17. A component coupling device, comprising on a machine base: a first stage device for supporting an integrated circuit component; a second stage device for supporting an optical fiber array component; an adhesive application station for applying a first adhesive to the optical fiber array component; and a component coupling device for holding the optical fiber array component, wherein the holding mechanism is driveable to move the optical fiber array component sequentially between the second stage, the adhesive application station, and the first stage; wherein... The holding mechanism includes a holding member for holding the fiber optic array element. The holding member has a first holding portion and a second holding portion spaced apart from the first holding portion. The first holding portion holds an optical coupler portion of the fiber optic array element, and the second holding portion holds a socket portion of the fiber optic array element. The first holding portion has a first holding surface and a first negative pressure hole communicating with the first holding surface. The optical coupler portion of the fiber optic array element can be adsorbed and held on the first holding surface through the first negative pressure hole. The second holding portion has a second holding surface and a second negative pressure hole communicating with the second holding surface. The socket portion of the fiber optic array element can be adsorbed and held on the second holding surface through the second negative pressure hole.
18. The component coupling device as described in claim 17, wherein, The retaining member has a first limiting part and a second limiting part. The first limiting part is located on the side of the second retaining part closer to the first retaining part, and the second limiting part is located on the side of the second retaining part away from the first retaining part. The first limiting part and the second limiting part can restrict the movement of the fiber array element.
19. The component coupling device as described in claim 18, wherein, The first limiting part has a first clearance area through which an optical fiber portion of the optical fiber array element passes, and the second limiting part has a second clearance area through which the socket portion of the optical fiber array element passes.
20. The component coupling device as described in claim 17, wherein, The holding mechanism is provided with a curing component, which is provided with a first light source and a second light source. The first light source can irradiate ultraviolet light in the direction of the first holding portion of the holding member, and the second light source can irradiate laser light in the direction of the second holding portion of the holding member.