A substrate, a substrate comprising a connector footprint and an electronic assembly

Abstract

This invention provides an electrical interconnect for transmitting high-speed signals with high density and high signal integrity via an electronic system. The interconnect includes an electrical connector and a transition portion to which the connector is mounted on a printed circuit board (PCB). Signal conductors are connected to pads on the surface of the PCB using edge-to-pad mounting. These pads are aligned with the middle portions of the signal conductors, thus avoiding transitions within the connector that could degrade signal integrity. The signal conductors can be coupled via wide-side pairs of individual shields positioned in a row extending within the connector. Surface traces on the PCB connect the pads to signal vias aligned for vertical routing outside the connector's occupied area. A ground plane beneath these surface traces facilitates a transition from the signal paths in the connector to the signal paths in the PCB, wherein low-mode transitions prevent resonance in the connector shielding.

Description

Technical Field

[0001] This patent application is generally related to interconnection systems for interconnecting electronic assemblies, such as those systems including electrical connectors. Prior Technology

[0002] Electrical connectors are used in many electronic systems. It is generally easier and more cost-effective to manufacture a system as a separate electronic assembly (such as a printed circuit board (PCB) that can be coupled with electrical connectors). A known configuration for joining several PCBs is to have one PCB act as a base plate. Other PCBs, called "daughter boards" or "daughter cards," can be connected via the base plate.

[0003] A known backplane is a printed circuit board to which numerous connectors can be mounted. Conductive traces in the backplane are electrically connected to signal conductors in the connectors, allowing signals to be routed between the connectors. Daughter cards may also have connectors mounted on them. Connectors mounted on the daughter cards can be inserted into connectors mounted on the backplane. In this way, signals can be routed between daughter cards via the backplane. Daughter cards can be inserted into the backplane at right angles. Connectors used in these applications may therefore include right-angle bends and are often referred to as "right-angle connectors."

[0004] Connectors can also be used in other configurations for interconnecting printed circuit boards. Some systems use a mid-plane configuration. Similar to the backplane, the mid-plane has connectors mounted on one surface that are interconnected via routing channels within the mid-plane. The mid-plane also has connectors mounted on a second side, allowing daughter cards to be inserted into both sides of the mid-plane.

[0005] Daughters inserted from the opposite side of the midplane often have an orthogonal orientation. This orientation positions the edge of each adjacent board inserted into the opposite side of the midplane at one edge of each printed circuit board. The traces within the midplane connecting the board on one side of the midplane to the board on the other side of the midplane can be short to achieve the desired signal integrity properties.

[0006] The change in the mid-plane configuration is called "direct attachment." In this configuration, the daughter card is inserted from the opposite side of the system. These boards are also orthogonally oriented such that the edge of the board inserted from one side of the system is adjacent to the edge of the board inserted from the opposite side of the system. These daughter cards also have connectors. However, the connectors on each daughter card are directly inserted into the connectors on the printed circuit board inserted from the opposite side of the system, rather than into the connectors on the mid-plane.

[0007] The connector used for this configuration is often referred to as an orthogonal connector. Examples of orthogonal connectors are shown in U.S. Patents 7,354,274, 7,331,830, 8,678,860, 8,057,267, and 8,251,745. Summary of the Invention

[0008] In one embodiment, this application discloses a substrate comprising: an insulating layer including a surface; a pair of signal vias; a pair of signal contact pads disposed on the surface, wherein the pair of contact pads are spaced apart from each other along a first line; and conductive traces disposed on the surface and electrically coupling the respective contact pads of the pair of contact pads and the signal vias of the pair of signal vias, wherein the signal vias of the pair of signal vias are spaced apart from each other along a second line disposed at an angle of at least 45 degrees relative to the first line.

[0009] In another embodiment, this application discloses a substrate configured to receive an electrical connector, the substrate comprising: a first conductive layer; a second conductive layer; an insulating layer between the first conductive layer and the second conductive layer; a third conductive layer; and a pair of vias; wherein: the first conductive layer is disposed on the insulating layer and includes: a pair of signal contact pads; and a pair of transition regions electrically coupling the pair of vias to each of the pair of contact pads; the second conductive layer is adjacent to the first conductive layer and includes a ground portion adjacent to at least a portion of each of the pair of transition regions; and the third conductive layer includes signal traces thereon, and the pair of vias are connected to the signal traces on the third conductive layer.

[0010] In yet another embodiment, this application discloses a substrate comprising a connector-occupied area, wherein the connector-occupied area comprises a plurality of regions arranged in columns and rows, each region comprising: a pair of signal vias, wherein the pair of signal vias are spaced apart from each other along a row direction; a pair of conductive pads, wherein the pair of conductive pads are spaced apart from each other along a column direction; and conductive traces that interconnect the respective signal vias and conductive pads.

[0011] In yet another embodiment, this application discloses an electronic assembly comprising: a substrate having a plurality of conductive pads and a plurality of vias on one surface of the substrate, wherein the conductive pads are connected to signal traces within the substrate and the vias are connected to a grounding structure within the substrate; and a connector mounted to the substrate, wherein: the connector includes a plurality of signal conductors and a plurality of shielding members, the plurality of shielding members at least partially surrounding a subset of the plurality of signal conductors; the signal conductors include contact tails including wide edges and edges, and the edges face and connect to each of the plurality of conductive pads; the plurality of shielding members include contact tails inserted into each of the plurality of vias. Simple Explanation of the Diagram

[0012] [Figure 1] is a perspective view of a direct attachment orthogonal connector according to some specific examples of mating;

[0013] [Figure 2A] is a perspective view of the first electrical connector 102a in Figure 1;

[0014] [Figure 2B] is a perspective view of the second electrical connector 102b in Figure 1;

[0015] [Figure 3A] is a front view of an alternative specific example of the first electrical connector 102a in Figure 1;

[0016] [Figure 3B] is a front view of an alternative specific example of the second electrical connector 102b of Figure 1 configured to mate with the connector of Figure 3A;

[0017] [Figure 3C] is a bottom view of the third electrical connector 302a in Figure 3A;

[0018] [Figure 3D] is an enlarged view of the mounting interface of the third electrical connector 302a as shown in Figure 3C;

[0019] [Figure 3E] is a front view of another alternative specific example of the first electrical connector 102a in Figure 1;

[0020] [Figure 3F] is a front view of another alternative specific example of the second electrical connector 102b in Figure 1;

[0021] [Figure 4A] is a partial exploded view of the first electrical connector 102a in Figure 1;

[0022] [Figure 4B] is a partial exploded view of the second electrical connector 102b in Figure 1;

[0023] [Figure 5] is a partial exploded view of an electrical connector with the front housing removed and a flexible shielding component, based on some specific examples;

[0024] [Figure 6A] is a perspective view of the flat piece 130 of the electrical connector 102 illustrated in Figure 5;

[0025] [Figure 6B] is a plan view of the flat piece 130 of Figure 5 with the flat piece housing component 133b cut out;

[0026] [Figure 7A] is a perspective view of the connector module 200 in Figure 6B;

[0027] [Figure 7B] is a perspective view of the connector module 200 of Figure 6B with the outer insulating components 180a and 180b and the inner insulating component 230 removed;

[0028] [Figure 8A] is a perspective view of the connector module 200 of Figure 6B with the electromagnetic shielding component 210 cut out;

[0029] [Figure 8B] is a side view of the connector module 200 in Figure 8A;

[0030] [Figure 9A] is a perspective view of the connector module 200 of Figure 6B with the electromagnetic shielding component 210 and the external insulating components 180a and 180b cut off;

[0031] [Figure 9B] is a side view of the connector module 200 in Figure 9A;

[0032] [Figure 10A] is a perspective view of the signal conductors 260a and 260b of the connector module 200 shown in Figures 9A to 9B;

[0033] [Figure 10B] is an enlarged view of the flexible portion 266 of the signal conductors 260a and 260b shown in Figure 10A;

[0034] [Figure 10C] is a front view of signal conductors 260a and 260b in Figure 10A;

[0035] [Figure 11A] is a side perspective view of a portion of a substrate configured to receive an electrical connector, according to some specific examples;

[0036] [Figure 11B] is a top perspective view of the top conductive layer and the lower ground layer of the substrate 1100 in Figure 11A;

[0037] [Figure 11C] is a top view of the substrate 1100 layer shown in Figure 11B;

[0038] [Figure 12A] is a top view of the conductive layer 1202 of a substrate 1200 having a connector occupied area according to some specific examples;

[0039] [Figure 12B] is a top view of the inner layer 1204 of the substrate 1200 in Figure 12A;

[0040] [Figure 12C] is a top view of the signal routing conductive layer 1220 of the substrate 1200 in Figure 12;

[0041] [Figure 12D] is a cross-sectional view of a portion of the substrate 1200 in Figure 12A;

[0042] [Figure 13A] is an exploded view of an electronic assembly 1300 including the substrate 1100 of Figure 11A and one pair of contact ends of an electrical connector;

[0043] [Figure 13B] is a perspective view of the electronic assembly 1300 in Figure 13A;

[0044] [Figure 14A] A partial exploded view of the electronic assembly 1300 of Figure 13A, which further illustrates the shielding component of the electrical connector;

[0045] [Figure 14B] is an exploded view of the electronic assembly 1300 in Figure 14A;

[0046] [Figure 14C] is a perspective view of the electronic assembly 1300 of Figure 14A, cut off at half of the contact tail 1312 and shielding component 1320;

[0047] [Figure 14D] is a perspective view of the electronic assembly 1300 of Figure 14A, with half of each contact tail 1312 and a portion of the shielding component 1320 cut off.

[0048] [Figure 15] is a perspective view of the head connector;

[0049] [Figure 16] is a perspective view of an alternative configuration of connectors in which some connector modules are configured for attachment to a printed circuit board and other connector modules are terminated to a cable;

[0050] [Figure 17A] is a side view of a portion of an alternative connector module 1700 that may be included in an electrical connector, according to some specific examples;

[0051] [Figure 17B] is a front view of a portion of the connector module 1700 in Figure 17A;

[0052] [Figure 18] is a side view of a portion of the connector module 1700 of Figure 17A with the electromagnetic shielding component 1710a cut off;

[0053] [Figure 19A] is a side view of a portion of the connector module 1700 of Figure 17 with the electromagnetic shielding component 1710a and the external insulation component 1780a cut off;

[0054] [Figure 19B] is a perspective view of a portion of the connector module 1700 shown in Figure 19A;

[0055] [Figure 20] is a perspective view of a portion of the connector module 1700 of Figure 17 with the electromagnetic shielding component 1710a, the external insulation component 1780a, and the signal conductor 1760a cut off;

[0056] [Figure 21A] is a perspective view of a portion of the signal conductor 1760a of the connector module 1700;

[0057] [Figure 21B] is a side view of the flexible portion 1766a of the signal conductor 1760a;

[0058] [Figure 22] is a top view of the first conductive layer 2202 of an alternative substrate 2200 configured to receive a portion of an electrical connector, according to some specific examples;

[0059] [Figure 23] is a top view of a portion of a substrate 2200 including the first conductive layer 2202 of Figure 22. Implementation

[0060] The inventors have developed techniques for manufacturing electrical connectors and electronic assemblies capable of supporting high-speed signals and possessing high density (including at 112 Gb / s and above). These techniques include the design of mounting interfaces for connectors that enable operation at high frequencies without resonance or other degradation of signal integrity. The mounting interfaces can be used in connectors with individual shielding modules and a pair of signal conductors, thereby providing low crosstalk and good impedance control. In some specific examples, the connector footprint of a printed circuit board can be integrated with the connector mounting interface to provide a compact footprint and efficient routing paths with low mode transitions, which the inventors recognize and understand can limit the operational range of interconnect systems.

[0061] In some specific examples, the connector's signal conductor may be connected at its distal edge to a pad on the surface of a substrate, such as a printed circuit board (PCB). In some specific examples, the signal conductor may be press-mounted to the PCB. The signal conductor may have a flexible portion extending perpendicular to the surface of the PCB, such that when the connector is pressed against the PCB, the signal conductor is compressed, wherein the flexible portion generates a spring force that presses the edge of the signal conductor against the pad.

[0062] The signal conductor can be shaped to reliably form an edge-to-gasket pressure mount connection. In some specific instances, for example, the end of the signal conductor can be pointed, or additionally formed with a tip that can penetrate oxide layers or other contaminants on the gasket. Alternatively or additionally, the signal conductor can be configured to twist when compressed. Twisting can further assist in penetrating oxides or other contaminants on the gasket.

[0063] In some specific instances, surface mount welding technology can be used to form edge-to-gasket connections.

[0064] In some specific instances, the signal conductors of a connector can be configured to carry differential signals. Signal conductor pairs can pass through the connector, with the middle portion of the signal conductors configured for wide-edge coupling. Wide-edge coupling in a right-angle connector provides low-skew interconnect when a pair of signal conductors are aligned in a direction parallel to the edge of the PCB where the connector is mounted.

[0065] Because variations in the geometry along a signal path can cause impedance changes, mode transitions, or other artifacts that degrade signal integrity, high signal integrity can be achieved by aligning the mounting ends of signal conductors with the middle portions of signal conductors adjacent to the mounting interface. Similarly, edge-to-pad mounting on PCB pads aligned with those middle portions of signal conductors avoids variations in geometry along the signal path and similarly promotes signal integrity.

[0066] Regardless of the pads' positioning on the PCB within the connector's occupied area to align with the signal conductors within the connector, signal vias connecting those pads to traces within the PCB can be positioned to allow those traces to be effectively routed outside the connector's occupied area. The inventors have recognized and understand techniques for providing good signal integrity (even at high frequencies) and effective routing, which facilitate cost-effective design of electronic systems using connectors. Appropriate transition areas within the PCB allow pads positioned to align with the connector's signal conductors to connect to vias positioned for effective routing of signal traces within the PCB, while simultaneously providing good signal integrity.

[0067] The transition area may include pairs of pads aligned in the first trace and pairs of vias aligned in the second trace. The first trace may be transverse to the second trace. In some specific instances, the first and second traces may be orthogonal, supporting wide-edge coupling within the connector and vertical routing channels within the PCB. The pads and vias may connect to surface traces. A conductive layer beneath the PCB may be connected to ground, providing a ground plane beneath the surface traces. The ground plane in that location can provide low-mode-conversion and other required signal integrity characteristics at the transition.

[0068] As a result, signal vias can be aligned in a single row, supporting vertical routing of signal traces outside the connector's occupied area, even if the corresponding signal conductors within the connector are aligned in a single row. Furthermore, because signal vias do not accept press fittings, they can be smaller, for example, with a diameter less than 12 mils. Small-diameter vias enable wide routing channels, allowing more traces per layer to be routed outside the connector's occupied area and reducing the number of layers required to route all signals out of the connector's occupied area. This design provides both efficient trace routing and high signal integrity.

[0069] These technologies can be used individually or in combination in any form. Because of the improved electrical properties achieved through these technologies, the electrical connectors and electronic assemblies described herein can be configured to operate at high bandwidths for high data transfer rates. For example, the electrical connectors and electronic assemblies described herein can operate at 40 GHz or above and can have a bandwidth of at least 50 GHz, such as up to and including 56 GHz and / or frequencies in the range of 50 to 60 GHz. Such electrical connectors and electronic assemblies can, for example, transmit data at rates up to 112 GB / s.

[0070] Turning to the figures, Figures 1 and 2A-2B illustrate electrical connectors of an electrical interconnect system according to some specific examples. Figure 1 is a perspective view of an electrical interconnect system 100 including first and second mating connectors (here configured to directly attach orthogonal connector 102a and right-angle connector 102b). Figure 2A is a perspective view of the first electrical connector 102a, and Figure 2B is a perspective view of the second electrical connector 102b, showing the mating interfaces and mounting interfaces of those connectors. In the illustrated specific examples, the mating interfaces are complementary, such that the first electrical connector 102a mates with the second electrical connector 102b. In the illustrated specific examples, the mounting interfaces are similar because each includes an array of press-fit contact tails configured for mounting to a printed circuit board. In an alternative specific example, some or all of the contact tails of the first electrical connector 102a and the second electrical connector 102b may be configured for edge-to-pad mounting, such as by press-fitting to conductive pads on the surface of a substrate. Alternatively or additionally, some or all of the contact tails may be configured for use as conductive pads soldered to the substrate using mating connectors. These alternative tail configurations may be used for the signal conductors of either or both of the connector, while the contact tails of the connector shield may be press-fit fittings.

[0071] In the illustrated example, each of the connectors is a right-angle connector and may each have a wide-side coupling pair of signal conductors, wherein the conductors of the pair are aligned in a single-row direction to minimize intra-pair skew. Each of the pairs may be partially or completely surrounded by a shield. The first electrical connector 102a and the second electrical connector 102b may be manufactured using similar techniques and materials. For example, the first electrical connector 102a and the second electrical connector 102b may include substantially the same flat plate 130 (Figures 4A, 5, 6A to 6B). The first electrical connector 102a and the second electrical connector 102b having flat plates 130 that can be manufactured and / or assembled in the same process may have low manufacturing costs.

[0072] In the specific example illustrated in Figure 1, the first connector 102a includes a first tab 130a, comprising one or more individual tabs 130 positioned side-by-side. The tab 130 includes one or more connector modules 200, each of which may include a pair of signal conductors and shielding for that pair. Connector modules are further described herein (including with reference to Figure 10B).

[0073] The tab 130 also includes a tab housing 132 for holding the connector module 200. The tabs are held side-by-side such that contact tails extending from the tab 130 of the first connector 102a form a first contact tail array 136a. The contact tails of the first contact tail array 136a can be configured for mounting to a substrate, such as substrate 1100 or 1200 as described herein (including with reference to Figures 11A to 11C and Figures 12A to 12D). In some specific embodiments, the contact tail array 136a can be configured to compress in one direction in which the first electrical connector 102a is pressed for mounting to the substrate. The first contact tail array 136a may include contact tails configured for press-fit insertion. Alternatively or additionally, some or all of the contact tails may be configured for pressure mounting or surface mount soldering. In other specific instances, some or all of the contact ends may have other mounting configurations for mounting to any of the conductors within a printed circuit board or cable.

[0074] In the specific example described, the first electrical connector 102a includes an extender housing 120, within which is an extender module 300, further described herein (including with reference to FIG. 2A). In the specific example described, the first electrical connector 102a includes contact tails having signal conductors that form part of a first contact tail array 136a. The signal conductors have intermediate portions that engage the contact tails to mating ends. In the specific example described, the mating ends are configured to mate with other signal conductors in the extender module 300. In some specific examples, a separable interface to the extender module 300 may exist. In other specific examples, that interface may be configured for single mating, rather than dispairing and re-pairing. The signal conductors in the extender module 300 also have mating ends that form the mating interfaces visible in FIG. 2A for the first electrical connector 102a. The grounding conductor similarly extends from the flat strip 130a via the extender module 300 to the mating interface of the first electrical connector 102a, which is visible in FIG2A.

[0075] The second electrical connector 102b includes a second flat plate 130b, which includes one or more flat plates 130 positioned side-by-side. The flat plates 130b of the second flat plate 130b can be configured as described with respect to the first flat plate 130a. For example, the flat plates 130b of the second flat plate 130b have a flat plate housing 132b. Additionally, the second contact tail array 136b of the second electrical connector 102b is formed from the contact tails of conductive elements within the second flat plate 130b. Similar to the first contact tail array 136a, some or all of the contact tails of the second contact tail array 136b can be configured to compress in one direction in which the second electrical connector 102b is pressed for mounting to a substrate. Alternatively or additionally, some or all of the contact tails of the contact tail array 136b can be configured for press-fit insertion, compression mounting, solder mounting, or any other mounting configuration for mounting to any conductor within a printed circuit board or cable.

[0076] As shown in Figure 1, the first contact tail array 136a faces a first direction, and the second contact tail array 136b faces a second direction perpendicular to the first direction. Therefore, when the first contact tail array 136a is mounted to a first substrate (such as a printed circuit board) and the second contact tail array 136b is mounted to a second substrate, the surfaces of the first and second substrates can be perpendicular to each other. Furthermore, the first electrical connector 102a and the second electrical connector 102b are mated along a third direction perpendicular to each of the first and second directions. During the mating process of the first electrical connector 102a and the second electrical connector 102b, one or both of the first electrical connector 102a and the second electrical connector 102b move towards the other connector along the third direction.

[0077] It should be understood that although the first electrical connector 102a and the second electrical connector 102b are shown in the direct attachment orthogonal configuration in Figure 1, the connectors described herein can be adapted to other configurations. For example, the connectors illustrated in Figures 3E to 3F have mating interfaces angled in opposite directions and can be used in a coplanar configuration. Figure 15 illustrates that the construction techniques described herein can be used in baseboard, midplane, or mezzanine configurations. However, the mating interface is not required for board-to-board configurations. Figure 16 illustrates that some or all of the signal conductors within the connector can be terminated to a cable, thereby creating a cable connector or a hybrid cable connector. Other configurations are also possible.

[0078] As shown in Figure 2A, the first electrical connector 102a includes an extender module 300 that provides a mating interface for the first electrical connector 102a. For example, the mating portion of the extender module 300 forms a first mating end array 134a. Additionally, the extender module 300 can be mounted to a connector module 200 of a first flat tab 130a. An extender housing 120 holds the extender module 300 and surrounds at least a portion of the extender module 300. Here, the extender housing 120 surrounds the mating interface and includes a groove 122 for receiving a second electrical connector 102b. The extender housing 120 may also include an aperture through which the extender module 300 extends.

[0079] As shown in Figure 2B, the second electrical connector 102b has a front housing 110b, which is shaped to fit into an opening in the extender housing 120. A second flat tab 130b is attached to the front housing 110b, as further described herein (including with reference to Figure 4B).

[0080] The front housing 110b provides a mating interface for the second electrical connector 102b. For example, the front housing 110b includes a protrusion 112 configured to be received in a groove in the extender housing 120. The mating ends of the signal conductors of the tab 130b are exposed within a hole 114b of the front housing 110b, forming a second mating end array 134b, such that the mating ends can engage with the signal conductors of the tab 130a of the first electrical connector 102a. For example, the extender module 300 extends from the first electrical connector 102a and can be received by the pair of signal conductors of the second electrical connector 102b. The ground conductors of the tab 130b are similarly exposed within a hole 114b and can similarly mate with ground conductors in the extender module 300, which are in turn connected to ground conductors in the tab 130a.

[0081] In Figures 2A and 2B, the first electrical connector 102a is configured to receive the second electrical connector 102b. As illustrated, the groove 122 of the extender housing 120 is configured to receive the protrusion 112 of the front housing 110b. Additionally, the hole 114b is configured to receive the mating portion of the extender module 300.

[0082] It should be understood that in some specific instances, the first flat tab 130a of the first electrical connector 102a and the second flat tab 130b of the second electrical connector 102b may be substantially identical. For example, the first electrical connector 102a may include a front housing 110a that can receive the flat tab from one side and may be configured similarly to the corresponding side of the front housing 110b. The opposite side of the front housing 110a may be configured for attachment to the extender housing 120 such that the front housing 110a is positioned between the first flat tab 130a and the extender housing 120. The front housing 110a is further described herein (including with reference to FIG. 4).

[0083] The front housing 110b can be configured to mate with the extender housing 120. In some specific instances, the extender housing 120 can be configured such that features that may latch onto a characteristic slide in and out when inserted into one side of the extender housing 120, to support detachable mating when inserted into the opposite side of the extender housing 120. In this configuration, the same components can be used for either the front housing 110a or the front housing 110b. Using extender modules to form an interface between the same connectors allows the manufacture of a single type of connector for use on each side of the electrical interconnect system, thus reducing the cost of manufacturing the electrical interconnect system. Even if the front housings 110a and 110b are shaped differently to support either a fixed attachment to the extender housing 120 or a sliding engagement to the extender housing 120, efficiency is achieved by using a flat piece that can be manufactured using the same tools employed for both the first electrical connector 102a and the second electrical connector 102b. Similar efficiency can be achieved in other configurations, such as when the front housing 110a and the extender housing 120 are manufactured as a single component.

[0084] Compared to those shown in Figures 2A and 2B, the electrical connectors described herein can have a different number of signal conductors. Figure 3A is a front view of a third electrical connector 302a with an extender housing 320 according to an alternative specific example. Although the third electrical connector 302a is described as having fewer signal pairs than the first electrical connector 102a, the third electrical connector 302a can be additionally assembled using components as described with reference to the first electrical connector 102a. For example, the third electrical connector 302a can be assembled from the extender housing 320 and a third flat 330a having a third mating end array 334a and a third contact tail array 336a, which can be configured as described herein with reference to the extender housing 120, the first flat 130a, the first mating end array 134a, and the first contact tail array 136a.

[0085] In some specific examples, the third electrical connector 302a may be a right-angle connector configured for mounting adjacent to the edge of a substrate, such as substrate 1100 or 1200 as described herein (including with reference to Figures 11A-11C and Figures 12A-12D). In the specific example illustrated in Figure 3A, pairs of contact ends of the third contact end array 336a may be configured for mounting to the substrate. In some specific examples, the contact ends of the third contact end array 336a are configured for insertion into holes (e.g., plated through-holes) in the substrate. In some specific examples, some or all of the contact ends of the third contact end array 336a are configured for connection to conductive pads in an edge-to-pad configuration of the substrate, such as using surface mount soldering techniques and / or using butt joints. Alternatively or additionally, some or all of the contact ends may support pressure-mount contacts. The contact tail end configured for pressure mounting can extend from the housing of the third electrical connector 302a or from the organizer of the housing between 6 and 12 mils, and can be pushed back into the housing when the housing is pressed against the substrate for mounting, generating a spring force for pressure mounting.

[0086] In the specific example described, the pairs of the paired ends of the third paired end array 334a are connected along the parallel line 338a and arranged at a 45-degree angle relative to each of the paired row direction 340a and the paired column direction 342a.

[0087] Figure 3B is a front view of a fourth electrical connector 302b configured to mate with the third electrical connector 302a illustrated in Figure 3A. Although the fourth electrical connector 302b is illustrated to have fewer signal pairs than the second electrical connector 102b, the fourth electrical connector 302b can be configured in a different manner with reference to the manner described for the second electrical connector 302b. For example, the electrical connector 302b can be assembled from a front housing 310b and a fourth flat plate 330b having a fourth mating end array 334b ​​and a fourth contact tail array 336b. These components can be configured in a manner described herein with reference to the front housing 110b, the second flat plate 130b, the second mating end array 134b, and the second contact tail array 136b.

[0088] In Figure 3B, the fourth electrical connector 302b can also be configured for mounting to a substrate. In some specific examples, the fourth electrical connector 302b includes an edge connector configured for edge mounting adjacent to a substrate (e.g., a printed circuit board). The contact tails of the fourth contact tail array 336b can be configured for mounting to a substrate. In some specific examples, the contact tails of the fourth contact tail array 336b can be configured for insertion into holes (e.g., plated through-holes). In some specific examples, some or all of the contact tails of the fourth contact tail array 336b can be configured for use as pads, such as those soldered to the substrate in an edge-to-pad configuration via surface mount components. Alternatively or additionally, some or all of the contact tails can support pressure-mount contacts.

[0089] The front housing 310b includes a hole 314b in which the mating ends of the signal conductor pair of the fourth flat 330b are positioned, thereby allowing the signal conductor from the third electrical connector 302a, which is inserted into the hole 314b, to mate with the signal conductor of the fourth flat 330b. Similarly, the ground conductor of the fourth flat 330b is exposed within the hole 314b for mating with the ground conductor from the third electrical connector 302a.

[0090] The fourth pairing end array 334b ​​comprises columns extending along the column direction 342b and spaced apart from each other in the row direction 340b perpendicular to the column direction 342b. The pairs of the pairing ends of the fourth pairing end array 334b ​​are aligned along the parallel line 338b. In the specific example described, the parallel line 338b is positioned at a 45-degree angle relative to the column direction 342b.

[0091] In the specific example described, the mating ends of the signal conductors of the second flat plate are connected along parallel line 338b, and are positioned at a 45-degree angle relative to each of the mating row direction 340b and the mating column direction 342b.

[0092] Figure 3C is a bottom view of the third electrical connector 302a in Figure 3A, and Figure 3D is an enlarged view of the connector shown in Figure 3C. Figures 3C to 3D illustrate the contact tail array 336a of the third electrical connector 302a, including contact tails 312a corresponding to signal conductors and shielding contact tails 316a.

[0093] The pairs of contact tails 312a are positioned in columns along column direction 344a and rows along row direction 346a. Each pair of contact tails 312a is shown in a wide-side coupling configuration along column direction 346a. Shielded contact tails 316a may extend from the electromagnetic shield of the connector module including contact tails 312a.

[0094] Therefore, the shielded contact tail 316a is also positioned in the column along the column direction 344a and in the row along the row direction 346a. The shielded contact tail 316a is angularly offset relative to the contact tail 312a. For example, the shielded contact tail 316a is shown positioned at a 45-degree angle relative to the row direction 344a and the column direction 346a. In the specific example described, there are four shielded contact tails 316a for each pair of signal contact tails 312a. For example, this configuration corresponds to a connector formed by the shielded modules shown in FIG. 7A. For example, the contact tail array 336a includes the contact tails of an array of such shielded modules. The configurations illustrated in FIG. 3C and FIG. 3D correspond to a 4×4 array of such modules. The technology described herein allows the modules to be closely spaced in the plane of that array. Here, the contact end of the mounting interface of each module is assembled in a 2.4 mm × 2.4 mm area, so that the modules can be spaced at a distance of 2.4 mm or less in both the column direction and the row direction.

[0095] As shown, the shielded contact tail 316a includes a crimping end configured to compress in a direction perpendicular to the direction in which the third electrical connector 302a is pressed for mounting to a substrate. For example, after insertion into a plated through-hole having a wall perpendicular to the surface of the PCB to which the connector is mounted, the crimping end can be configured to compress such that the crimping end exerts an outward force against the wall of the through-hole, thereby forming an electrical connection and providing mechanical retention between the two. Additional retention force can be provided by fasteners or other structures of the connector. For example, the underside of the connector housing may include a hole 350 for receiving screws or other fasteners inserted through the PCB to which the connector is mounted. In use, by inserting the shielded contact tail 316a into a through-hole in the PCB, the connector having the mounting interface shown in Figure 3D can be mounted on a PCB or other substrate. Because the PCB can be manufactured with pads positioned relative to those through-holes, inserting the shielded contact tail 316a of the connector module into the through-holes positions the module so that the contact tail 312a of the module aligns with the corresponding pad. A pressure fitting on the shielded contact tail 316a provides sufficient holding force to maintain the position of the contact tail 312a until a fastener is inserted into the hole 350 to secure the connector to the PCB. In a specific example where the contact tail 312a is soldered to a pad, the shielded contact tail 316a can hold the contact tail 312a in place during soldering.

[0096] Figure 3D illustrates a specific example of contact tail 312a configured for pressure mounting. Both signal contact tail 312a and shielding contact tail 316a extend through the lower surface 352 of the connector, which in this example may be the surface of an organizer or flexible shield (such as the flexible shield 170 described below). The opening through which the signal contact tail 312a extends may be shaped to facilitate a pressure-mount connection. When the connector is mounted to the substrate, the contacts configured for pressure mounting are compressible and retractable into the connector housing. Therefore, the opening can be sufficiently large to allow the contact tips to slide relative to the housing, while still providing support for the mating ends.

[0097] In some specific instances, the contact can be configured such that the contact tail rotates as it retracts into the housing. Rotation can help break up oxides or remove other contaminants from the gasket surface and can promote better electrical connection. The opening can be configured to allow rotation of the contact tail. In the example of Figure 3D, the opening through which the contact tail 312a passes has a first region 354a on one side of the contact tail and a second region 354b radially opposite to region 354a. This configuration restricts the translation of the contact tail 312a relative to the central axis of the contact tail, but allows rotation about that central axis. Regions 354a and 354b can be shaped to allow rotation of 5 to 25 degrees, such as 10 to 20 degrees.

[0098] Similar to the first electrical connector 102a and the second electrical connector 102b (Figures 1 and 2), Figures 3A and 3B illustrate the third electrical connector 302a and the fourth electrical connector 302b with a direct attachment orthogonal configuration. Figures 3E and 3F illustrate electrical connectors 102c' and 102d' with a coplanar configuration. When connectors 102c' and 102d' are mated, substrates 104c' and 104d' can be coplanar. Substrates 104c' and 104d' on which connectors 102c' and 102d' are mounted can be aligned in parallel. In this example, connectors 102c' and 102d' differ from the first electrical connector 102a, the second electrical connector 102b, and the third electrical connector 302a and the fourth electrical connector 302b because the mating interfaces of connectors 102c' and 102d' are angled in opposite directions, while the first electrical connector 102a, the second electrical connector 102b, and the third electrical connector 302a and the fourth electrical connector 302b are angled in the same direction. Furthermore, connectors 102c' and 102d' can be constructed in the manner described for the first electrical connector 102a, the second electrical connector 102b, and the third electrical connector 302a and the fourth electrical connector 302b.

[0099] The mating end arrays 134c' and 134d' can be adapted for a coplanar configuration. Similar to Figures 3A and 3B, the mating ends of mating end array 134c' are positioned along parallel line 138c', and the mating ends of mating end array 134d' are positioned along parallel line 138d'. In Figures 3E and 3F, parallel lines 138c' and 138d' are perpendicular to each other, as if mating end arrays 134c' and 134d' were shown facing in the same direction. For example, while the same connector can be used on both sides of the direct attachment orthogonal configuration shown in Figures 3A and 3B, variations of the same connector can be used in the coplanar configuration shown in Figures 3E and 3F.

[0100] In some specific instances, the relative positions of the pairs of paired ends of the paired end array 134c' may be rotated 90 degrees relative to the relative positions of the pairs of paired ends of the paired end array 134d'. In some specific instances, the parallel line 138c' may be positioned at a 45-degree counterclockwise angle (e.g., +45 degrees) relative to the paired column direction 142c', and the parallel line 138d' may be positioned at a 45-degree clockwise angle (e.g., -45 degrees, or +135 degrees counterclockwise) relative to the paired column direction 142d'. It should be understood that, alternatively, the parallel line 138d' may be positioned at a 45-degree counterclockwise angle (e.g., +45 degrees) relative to the paired column direction 142d', and the parallel line 138c' may be positioned at a 45-degree clockwise angle (e.g., -45 degrees, or +135 degrees counterclockwise) relative to the paired column direction 142c'.

[0101] Figures 4A and 4B are partially exploded views of the first electrical connector 102a and the second electrical connector 102b of Figures 1 and 2A to 2B, respectively. In the specific example illustrated in Figure 4A, the extender housing 120 is shown removed from the front housing 110a to reveal the array of the front housing 110a and the extender module 300.

[0102] In the specific example illustrated, the front housing 110a is attached to the flat plate 130a. The front housing 110a can be formed using a dielectric material such as plastic, for example, in one or more molding processes. Also as shown, the front housing 110a includes a protrusion 112a, configured here to latch the front housing 110a to the extender housing 120. For example, the protrusion 112a can be received in an opening 124 of the extender housing 120. The extender module 300 is shown protruding from the front housing 110a. The extender module 300 can be mounted to the signal conductors of the flat plate 130 to form a mating array 134a. Engagement of the protrusion 112a in the opening 124 can be achieved by applying a force exceeding the mating force required to press the first electrical connector 102a and the second electrical connector 102b together for mating, or to separate those connectors during disassembly. Therefore, the extender housing 120 can be secured to the front housing 110a during operation of the first electrical connector 102a and the second electrical connector 102b.

[0103] The aperture of the extender housing 120 can be sized to allow the mating end of the extender module 300 to extend through the aperture. The mating ends of the signal and ground conductors of the extender module 300 are then exposed within the cavity, serving as a mating interface area defined by the walls of the extender housing 120. The opposing ends of the signal and ground conductors within the extender module 300 can be electrically coupled to the corresponding signal and ground conductors within the flat plate 130a. In this way, the connection between the flat plate 130a and the signal and ground conductors within the second electrical connector 102b is inserted into the mating interface area.

[0104] The extender housing 120 can be formed using a dielectric material such as plastic, for example, in one or more molding processes. In a specific example illustrated, the extender housing 120 includes a groove 122. The groove 122 is configured to receive a protrusion 112b of the housing 110b preceding the second electrical connector 102b (FIG. 4B). The sliding of the protrusion 112b in the groove 122 before the two connectors are slid into the mating configuration assists in aligning the mating array 134a of the first electrical connector 102a with the mating array 134b of the second electrical connector 102b.

[0105] Figure 4B is a partially exploded view of the second electrical connector 102b of Figure 1. Here, the front housing 110b is shown separate from the tab 130b. As shown in Figure 4B, each tab 130b of the second electrical connector 102b is formed from a plurality of connector modules 200. In the specific example described, each tab has eight connector modules. The mating ends 202 of the connector modules 200 extend from the tab housing 132b to form a mating end array 134b. When the front housing 110b is attached to the tab 130b, the mating end array 134b extends into the front housing 110b. The mating ends 202 are accessible via individual holes 114b.

[0106] In a direction perpendicular to the direction in which the mating end 202 extends, the contact tail 206 extends from the flat housing 132b to form a contact tail array 136b. The connector module 200 also includes an electromagnetic shielding component 210 to provide isolation from electrical signals carried by signals from adjacent connector modules 200. In the specific example described, the shield also has a structure formed at the mating contact portion of the mating end 202 and a structure forming contact tails within the contact tail array 136b. The electromagnetic shield can be formed from a conductive material (such as a thin sheet of bent metal) and shaped as described to form a conductive shield.

[0107] Figure 5 is a partially exploded view of an electrical connector 102 having a flexible shield 170 and no front housing. The inventors recognize and understand that signal integrity in the electrical connector 102 can be improved by the pairing of the contact tail 206 and / or the electromagnetic shield tail 220 of the flexible shield 170.

[0108] The contact ends 206 of the contact end array 136 can extend through the flexible shield 170. In a specific example where the conductive elements in the connector are configured for pressure mounting, the conductive elements can extend sufficiently far beyond the flexible shield in its uncompressed state. This sufficient distance is such that when the flexible shield is compressed between the connector and the substrate to which the connector is mounted, the conductive elements are compressed by a sufficient distance to generate sufficient force for a reliable pressure-mounted connection. For example, that distance can be between 5 and 15 mils. For example, the force generated can be between 20 and 60 grams.

[0109] The flexible shield 170 may include damaged and / or conductive portions, and may also include insulating portions. The contact tail 206 may pass through an opening in the flexible shield 170 or an insulating portion, and may be insulated from the damaged or conductive portions. The grounding conductor within the connector 102 may be electrically coupled to the damaged or conductive portions, such as by passing through the damaged or conductive portions via the electromagnetic shield tail 220, or by pressing the electromagnetic shield tail 220 against the damaged or conductive portions.

[0110] In some specific instances, the conductive portion may be flexible, such that its thickness can be reduced when the connector 102 is pressed between the connector 102 and the printed circuit board when mounted to the printed circuit board. The flexibility may originate from the materials used and may, for example, from elastomers filled with conductive particles or conductive foam. Such materials can lose volume or shift when force is applied to them to exhibit flexibility. The conductive and / or damaged portion may, for example, be a conductive elastomer, such as an organosilicon elastomer filled with conductive particles (such as particles of silver, gold, copper, nickel, aluminum, nickel-coated graphite, or combinations or alloys thereof). Alternatively or additionally, this material may be a conductive open-cell foam, such as a polyethylene foam coated with copper and nickel.

[0111] If an insulating portion is present, it can also be flexible. Alternatively or additionally, the flexible material may be thicker than the insulating portion of the flexible shield 170, such that the flexible material can extend from the mounting interface of the connector 102 to the surface of the printed circuit board to which the connector 102 is mounted.

[0112] The flexible material can be positioned to align with pads on the surface of a printed circuit board to which it is attached or inserted by contact tails 206 of contact tail array 136. These pads can be connected to a grounding structure within the printed circuit board, such that when connector 102 is attached to the printed circuit board, the flexible material contacts the grounding pads on the surface of the printed circuit board.

[0113] Conductive or damaged portions of the flexible shield 170 can be positioned to form an electrical connection with the electromagnetic shield 210 of the connector module 200. Such a connection can be formed, for example, by passing through and contacting the electromagnetic shield tail 220 of the damaged or conductive portion. Alternatively or additionally, in specific instances where the damaged or conductive portion is flexible, those portions can be positioned to press against the electromagnetic shield tail 220 or other structures extending from the electromagnetic shield when the electrical connector 102 is attached to the printed circuit board.

[0114] The insulating portion 176 can be arranged in columns along the column direction 172 and the row direction 174. When the contact tails 206 of the contact tail array 136 extend through the insulating portion 176, the column direction 172 of the flexible shield 170 can be substantially aligned with the contact tail column direction 146, and the row direction 174 of the flexible shield 170 can be substantially aligned with the contact tail row direction 144.

[0115] In the specific example described, the conductive member 178 engages with the insulating portion 176 and is located between columns of the contact tail array 136. In this position, it can contact the electromagnetic shield tail 220, either by pressing against the tail when compressed or by the shield tail 220 passing through the conductive member 178.

[0116] Figure 6A is a perspective view of the flat tab 130 of the electrical connector 102. In the specific embodiment described, the flat tab housing 132 is formed by two housing components 133a and 133b. Figure 6B is a perspective view of the flat tab 130 with the flat tab housing component 133a cut off. As shown in Figures 6A and 6B, the flat tab 130 includes a connector module 200 between the two flat tab housing components 133a and 133b. In the specific embodiment described, the flat tab housing components 133a and 133b hold the connector module 200 within the flat tab 130.

[0117] In some specific instances, the flat housing components 133a and 133b may be formed of a detrimental conductive material or an insulating material, or the flat housing components 133a and 133b may include a detrimental conductive material or an insulating material, such as a plastic plated in a conductive manner. The inventors recognize and understand that using a detrimental conductive material to implement the flat housing components 133a and 133b provides attenuation of undesired resonant modes within and between the connector modules 200, thereby improving the signal integrity of signals carried by the electrical connector 102.

[0118] Any suitable lossy material can be used in these and other "lossy" structures. Materials that conduct electricity but have some loss, or other physical structures that can absorb electromagnetic energy within the frequency range of interest, are generally referred to herein as "lossy" materials. Electrically lossy materials can be formed from lossy dielectrics and / or poorly conductive and / or lossy magnetic materials. Magnetically lossy materials can be formed, for example, from materials traditionally considered ferromagnetic, such as those with a magnetic loss tangent greater than approximately 0.05 in the frequency range of interest. The "magnetic loss tangent" is the ratio of the imaginary to the real part of the material's composite electromagnetic conductivity. Actual lossy magnetic materials or mixtures containing lossy magnetic materials can also exhibit useful amounts of dielectric or conductive loss effects within a portion of the frequency range of interest. Electrically lossy materials can be formed from materials traditionally considered dielectrics, such as those with an electrical loss tangent greater than approximately 0.05 in the frequency range of interest. The "electrical loss tangent" is the ratio of the imaginary to the real part of the material's composite permittivity. Electrically lossy materials can also be formed from materials that are generally considered to be conductors but are relatively poor conductors in the frequency range of interest. Electrically lossy materials may contain conductive particles or regions that are sufficiently dispersed so that they do not provide high conductivity, or these conductive particles or regions may be prepared for other reasons to have relatively weak bulk conductivity in the frequency range of interest compared to good conductors such as copper.

[0119] Electrically lossy materials typically have a bulk conductivity of about 1 siemen / m to about 10,000 siemens / m, and more preferably about 1 siemen / m to about 5,000 siemens / m. In some specific examples, materials with a bulk conductivity between about 10 siemens / m and about 200 siemens / m can be used. As a specific example, a material with a conductivity of about 50 siemens / m can be used. However, it should be understood that the conductivity of the material can be selected empirically or through electrical simulation using known simulation tools to determine an appropriate conductivity that provides appropriately low crosstalk with suitable low signal path attenuation or insertion loss.

[0120] Electrically lossy materials can be partially conductive materials, such as those with a surface resistivity between 1 ohm / sqm and 100,000 ohm / sqm. In some specific examples, electrically lossy materials have a surface resistivity between 10 ohm / sqm and 1,000 ohm / sqm. As a particular example, a material may have a surface resistivity between about 20 ohm / sqm and 80 ohm / sqm.

[0121] In some specific instances, electrically lossy materials are formed by adding a filler containing conductive particles to an adhesive. In this specific instance, the lossy component can be formed by molding or otherwise shaping the adhesive and filler into the desired form. Examples of conductive particles that can be used as fillers to form electrically lossy materials include carbon or graphite formed as fibers, sheets, nanoparticles, or other types of particles. Metals in the form of powders, sheets, fibers, or other particles can also be used to provide suitable electrically lossy properties. Alternatively, combinations of fillers can be used. For example, plated metallic carbon particles can be used. Silver and nickel are suitable metals for plated fibers. Coated particles can be used alone or in combination with other fillers, such as carbon sheets. The adhesive or matrix can be any material that will solidify, cure, or otherwise position the filler material. In some specific instances, the adhesive can be a thermoplastic material, traditionally used in the manufacture of electrical connectors to facilitate the molding of electrically damaging materials into the desired shape and location (as part of the manufacturing of the electrical connector). Examples of such materials include liquid crystal polymers (LCPs) and nylon. However, many alternative forms of adhesive materials can be used. Curable materials such as epoxy resins can act as adhesives. Alternatively, materials such as thermosetting resins or adhesives can be used.

[0122] Furthermore, although the aforementioned adhesive materials can be used to generate electrically lossy materials by forming an adhesive around conductive particle fillers, this application is not limited thereto. For example, conductive particles can be impregnated into or coated onto the formed matrix material, such as by applying a conductive coating to a plastic or metal component. As used herein, the term "adhesive" encompasses encapsulating fillers, materials impregnated with fillers, or materials that otherwise act as a filler-retaining matrix.

[0123] Preferably, the filler is present in a sufficient volume percentage to allow for particle-to-particle conductive paths. For example, when using metal fibers, the fibers can be present in the form of approximately 3% to 40% by volume. The amount of filler can affect the electrical conductivity of the material.

[0124] The filler material is commercially available, such as materials sold by Celanese Corporation under the trademark Celestran®, which may be filled with carbon fiber or stainless steel filaments. Detrimental materials such as detrimental conductive carbon-filled adhesive preforms (such as those sold by Techfilm (Bellerica, Massachusetts)) may also be used. This preform may comprise an epoxy adhesive filled with carbon fiber and / or other carbon particles. The adhesive surrounds the carbon particles, acting as reinforcement for the preform. Such preforms may be inserted into connector flats to form all or part of a housing. In some specific instances, the preform may be adhered via an adhesive within the preform, which may be cured during heat treatment. In some specific instances, the adhesive may be in the form of a separate conductive or non-conductive adhesive layer. In some specific instances, alternatively or additionally, the adhesive in the preform may be used to fasten one or more conductive elements, such as foil strips, to a detrimental material.

[0125] Reinforcing fibers in various forms, whether woven or non-woven, coated or uncoated, can be used. Non-woven carbon fiber is a suitable material. Other suitable materials, such as custom blends sold by RTP, can be used, as the invention is not limited in this respect.

[0126] In some specific instances, the damaged portion can be manufactured by stamping a preform or a sheet of damaged material. For example, the damaged portion can be formed by stamping a preform as described above with a suitable opening pattern. However, other materials can be used as alternatives to or supplements to such preforms. For example, a sheet of ferromagnetic material can be used.

[0127] However, damaged portions can also be formed in other ways. In some specific instances, damaged portions can be formed by interleaving layers of damaged material with layers of conductive material, such as metal foil. These layers can be rigidly attached to each other, such as by using epoxy resin or other adhesives, or can be held together by any other suitable means. These layers can have the desired shape before being fastened to each other, or can be stamped or otherwise shaped after they are held together. Alternatively, damaged portions can be formed by applying a damaged coating (such as diffusion metal coating) to plastics or other insulating materials.

[0128] As shown in Figure 6A, connector module 200 is aligned along mating row direction 140. As shown in Figure 6B, connector module 200 includes mating end 202 and mounting end, where the contact tail 206 of the signal conductor within the module is exposed at the mounting end. The mating end and mounting end of module 200 are connected by an intermediate portion 204. Connector module 200 also includes an electromagnetic shielding component 210, which has an electromagnetic shielding tail 220 and an electromagnetic shielding mating end 212 at the mounting end and mating end of the module, respectively.

[0129] In the specific example described, the mating ends of the signal conductors of each connector module are separated along parallel lines 138 at mating ends 202, forming a 45-degree angle relative to the mating row direction 140.

[0130] In the specific example described, the contact tails 206 of the signal conductors within the connector module are positioned in the row along the contact tail row direction 144, and pairs of contact tails 206 are also separated along the contact tail row direction 144. As shown, the contact tail row direction 144 is orthogonal to the mating row direction 140. However, it should be understood that the mating ends and mounting ends can have any desired relative orientation. The contact tails 206 can be edge-coupled or wide-side-coupled depending on the specific example.

[0131] Figure 7A is a perspective view of a representative connector module 200. As shown in Figure 6B, the flat strips may include rows of connector modules 200. Each connector module may be in a separate column at the connector mating and mounting interface. In right-angle connectors, modules in each column may have different lengths of intermediate portions 204. In some specific instances, the mating end and the mounting end may be the same.

[0132] As shown in Figure 7A, electromagnetic shielding components 210a and 210b are positioned around the internal insulating component 230. In the specific example described, electromagnetic shielding component 210 completely covers the connector module 200 on both sides, with gaps 218 on the remaining two sides, such that only partial coverage is provided on those sides. The internal insulating component 230 is exposed via the gaps 218. However, in some specific examples, electromagnetic shielding component 210 may completely cover the internal insulating component 230 on all four sides. The gaps 218 may be relatively narrow to prevent any significant electromagnetic energy from passing through. For example, in some specific examples, the gap may be less than half or less than a quarter of the wavelength of the highest frequency in the connector's intended operating range. The signal conductors within the connector module 200 are described herein (including with reference to Figures 10A through 10C). Electromagnetic shielding component 210 may be a conductive shield. For example, electromagnetic shielding component 210 may be stamped from a sheet of metal.

[0133] Figure 7A indicates the transition region 208 of the connector module 200. In the transition region 208, the mating end 202 is connected to the intermediate portion 204.

[0134] Electromagnetic shielding components 210a and 210b include an electromagnetic shielding mating end 212 at mating end 202 and an electromagnetic shielding tail end 220 extending from the module 200 parallel to the contact tail end 206 of the signal conductor within the module 200 and along the edges of those contact tail ends. The electromagnetic shielding mating end 212 surrounds the mating end of the signal conductor.

[0135] The electromagnetic shielding mating end 212 is embossed with an outwardly protruding portion 214 in the transition region 208 and an inwardly protruding portion 216 at the mating end 202. Thus, the outwardly protruding portion 214 is positioned between the intermediate portion 204 and the inwardly protruding portion 216. Embosing the electromagnetic shielding mating end 212 with the outwardly protruding portion 214 causes an impedance shift along the length of the connector module 200, which is associated with a shape change of the connector module 200 in the transition region. The impedance along the signal path through the connector module 200 can, for example, be between 90 ohms and 100 ohms at frequencies between 45 and 56 GHz. In some specific examples, the electromagnetic shielding components 210a and 210b can define an area encompassing the intermediate portion 204 and the contact end 206 and having a cross-sectional area of ​​less than 2.6 mm², such as the square areas of electromagnetic shields 211a, 211b, and 221c illustrated in Figures 7A and 7B. In some specific instances, these regions can be configured to support TE 1,0 resonant modes with frequencies greater than 56 GHz, thereby enabling reliable propagation of signals at speeds of at least 112 GB / s via a differential pair.

[0136] Between an operating state in which the connector module 200 is firmly pressed against the mating connector, and an operating state in which the connector module 200 is partially disassembled such that there is a gap between the connector module 200 and the mating connector, but the connector is sufficiently close to the signal conductors in those connector matings, the electromagnetically shielded mating end 212 with an inwardly projecting portion 216 provides a more constant impedance. In some specific instances, the impedance change between the fully mated and partially disassembled configurations of the mating end 202 is less than 5 ohms at the connector's operating frequency (e.g., in the range of 45 to 56 GHz). Figure 7B is a perspective view of the connector module 200 of Figure 6B with the external insulating components 180a and 180b and the internal insulating component 230 removed;

[0137] Figures 8A and 8B are perspective and side views, respectively, of the connector module 200 with electromagnetic shielding components 210a and 210b cut out. As shown in Figures 8A and 8B, external insulating components 280a and 280b are disposed on opposite sides of the internal insulating component 230. The external insulating components 280a and 280b can be formed using a dielectric material such as plastic. The protrusion 232 of the internal insulating component 230 is disposed closer to the contact tail 206 than the mating end 202, and extends in a direction opposite to the direction along which the contact tail 206 extends.

[0138] The mating ends 202 of the signal conductors within the connector module 200 include flexible sockets 270a and 270b, each having mating arms 272a and 272b. In the specific example described, the flexible sockets 270a and 270b are configured to receive and make contact with the mating portions of the signal conductors of the mating connector located between the mating arms 272a and 272b.

[0139] As also shown in Figures 8A and 8B, the insulating portions of the connector module 200 insulate the sockets 270a and 270b from each other. These insulating portions also position the sockets 270a and 270b and provide holes through which the mating portions of the mating connectors can enter the sockets 270a and 270b. These insulating portions may be formed as part of the internal insulating member 230. In a specific example illustrated, the internal insulating member 230 has an extension 234, which includes arms 236a and 236b. The extension 234 extends beyond the flexible sockets 270a and 270b in the direction along which the mating ends 202 extend. The arms 236a and 236b are spaced further away from the mating ends 202. The holes in the extension 234 can be configured to receive wires passing through it, such that the wires extend into the flexible sockets 270a and 270b. For example, the gap between the mating arms 272a and 272b of the flexible sockets 270a and 270b can be aligned with the hole.

[0140] Figures 9A and 9B are perspective and side views, respectively, of a connector module 200 with electromagnetic shielding components 210a and 210b and external insulating components 280a and 280b cut out. As shown in Figures 9A and 9B, the connector module 200 includes signal conductors 260a and 260b, shown here as differential pairs. When the connector module 200 is assembled, signal conductor 260a can be positioned between the external insulating component 280a and the internal insulating component 230, and signal conductor 260b can be positioned between the external insulating component 280b and the internal insulating component 230.

[0141] One or more of the internal insulating component 230 and the external insulating components 280a and 280b may include features for holding the insulating components together, thereby securely positioning the signal conductors 260a and 260b within the insulating structure. In a specific example described, the first holding member 240 and the second holding member 242 of the internal insulating component 230 may extend into the openings of the external insulating components 280a and 280b. In a specific example described, the first holding member 240 is disposed adjacent to the mating end 202 and extends in a direction perpendicular to the direction along which the mating end 202 extends. The second holding member 242 is disposed adjacent to the contact tail end 206 and extends in a direction perpendicular to the direction along which the contact tail end 206 extends.

[0142] The intermediate portions of signal conductors 260a and 260b are located on opposite sides of the internal insulating component 230. In the specific embodiment described, signal conductors 260a and 260b are each stamped from a sheet of metal and then bent into the desired shape. The intermediate portions are flat and have a thickness equal to that of the sheet of metal. As a result, the intermediate portions have opposing wide sides, which are joined by edges that are thinner than the wide sides. In the specific embodiment, the wide sides of the intermediate portions are aligned with each other, thereby providing wide-side coupling within the module 200.

[0143] In Figures 9A and 9B, signal conductors 260a and 260b include mating end 262, intermediate portion 264, and flexible portion 266 located at mating end 202, intermediate portion 204, and contact tail end 206 of connector module 200, respectively. As shown, mating end 262 includes flexible sockets 270a and 270b. Mounting end includes flexible portion 266, which is configured to compress in one direction in which the connector is pressed for connection to the substrate, as described herein (including with reference to Figures 10A to 10C).

[0144] The transition region 268 of signal conductors 260a and 260b connects the mating ends 262 to the intermediate portion 264. Within the transition region 268, the angular position changes about an axis parallel to the longitudinal dimension of the paired signal conductors 260a and 260b. The angular distance between signal conductors 260a and 260b can remain constant, such as at 180 degrees. In the specific example described, the angular position of signal conductors 260a and 260b changes by 45 degrees within the transition region 268, such that across the transition region 268, an angular distortion to the pair is considered to exist.

[0145] The internal insulating component 230 may be shaped to accommodate one of the pair of signal conductors having this transition region. In some specific embodiments, signal conductors 260a and 260b may be disposed in trenches on opposite sides of the internal insulating component 230. The transition region 268 of signal conductors 260a and 260b may be disposed within a transition guide of the trench.

[0146] Figures 10A to 10C illustrate the signal conductors 260a and 260b of the connector module 200 of Figures 9A and 9B. Figure 10A is a perspective view of signal conductors 260a and 260b, Figure 10B is an enlarged view of the flexible portions 266a and 266b of signal conductors 260a and 260b, and Figure 10C is a front view of signal conductors 260a and 260b. As shown in Figures 10A to 10C, mating ends 262a and 262b extend in a first direction, and flexible portions 266a and 266b extend in a second direction at right angles relative to the first direction. Flexible portions 266a and 266b connect contact ends (here shaped as pointed tips 1050a and 1050b) to the middle portion of the signal conductor.

[0147] In some specific examples, each of the signal conductors may be stamped and formed from a sheet of metal of uniform thickness, and each segment of the signal conductor may have the same thickness. For example, that thickness may be between 2 and 4 mils. However, in some specific examples, the thickness of the beam at the mating ends 262a and 262b, which forms a reliable connection from the mating connector to the contact, may be greater than the thickness of the flexible portions 266a and 266b at the tips 1050a and 1050b that generate the required contact force. In these specific examples, the mating ends 262a and 262b may be thicker than the flexible portions of the contact ends 266a and 266b. The signal conductors may be formed in this configuration, for example, by die-stamping the portions of the flexible portions 266a and 266b.

[0148] In the specific example described, in the direction in which signal conductors 260a and 260b extend adjacent to flexible portions 266a and 266b, flexible portions 266a and 266b may include portions configured to be compressed in that direction. In the specific example described, this direction is perpendicular to the surface of the printed circuit board to which the connector is mounted. For example, flexible portions 266a and 266b may be configured such that when the connector including flexible portions 266a and 266b is close to the substrate in the mounting direction, flexible portions 266a and 266b may be compressed in the mounting direction. In some specific examples, flexible portions 266a and 266b may be compressed such that when a force is applied to tips 1050a and 1050b in that direction, tips 1050a and 1050b retract toward the housing of the electrical connector. In some specific instances, the flexible portions 266a and 266b can be compressed in one direction, which is perpendicular to the dimension (e.g., column and row direction) of the contact tail array including the flexible portions 266a and 266b.

[0149] In some specific examples, the flexible portions 266a and 266b can be configured as the serpentine portion 1001 illustrated in FIG. 10. The serpentine portion 1001 is shown to include several arcuate segments separated by openings. In some specific examples, the serpentine portion 1001 may include segments between 4 and 8. These segments can be compressed by reducing the openings between the arcuate segments.

[0150] The serpentine portion 1001 may terminate in the pointed tips 1050a and 1050b, as described. In some specific embodiments, the tips may include gold plating.

[0151] As shown in Figure 10B, the flexible portion 266b includes a first bend 1002 and a second bend 1004. The bends 1002 and 1004 of the flexible portion 266b are shown spaced apart by a first distance. When the flexible portion 266b is mounted to a surface, the distance between the bends 1002 and 1004 decreases because the bend 1004 is compressed toward the bend 1002. As a result, when the connector having the flexible portions 266a and 266b is pressed against the substrate, the bends 1002 and 1004 are closer together. As explained, the bends 1002 and 1004 are conductive. When the bends 1002 and 1004 are compressed together, they can make physical contact and / or be sufficiently close together so that signals carried by the signal conductors 260a and 260b can pass through the flexible portions 266a and 266b with little or no degradation. The compression of the section also generates a spring force, which forces the tips 1050a and 1050b toward the substrate that the connector is pressing against.

[0152] In some specific examples, the flexible portions 266a and 266b can rotate upon compression. Rotation can be imparted by cutting the tapering edges of the segments forming the flexible portions 266a and 266b, such that when the segments are pressed together, one segment can straddle the tapering edge of an adjacent segment, allowing the segments (which may be coplanar in their uncompressed state) to move out of plane. For example, in Figure 10B, the bent member 1004 can press against the spring portion 1006 upon compression, and the spring portion 1006 can tilt, causing the bent member 1004 to twist as it slides along the inclined plane. When other bending elements of flexible portions 266a and 266b are placed across a similar inclined plane, the bending elements of flexible portions 266a and 266b can also be twisted, thereby causing flexible portions 266a and 266b to rotate about axes 1052a and 1052b passing through tips 1050a and 1050b when compressed. In some specific examples, flexible portions 266a and 266b can be configured to generate a force between 20 and 60 grams when compressed. In some specific examples, the flexible portions can be configured to generate a force between 25 and 45 grams when compressed.

[0153] Here, each signal conductor 260a and 260b is configured to carry a component of the differential signal. Signal conductors 260a and 260b can each be formed as a single integrated conductive element, which can be stamped from a sheet of metal. However, in some specific instances, signal conductors 260a and 260b can each be formed from multiple conductive elements fused, welded, soldered, or otherwise joined together. For example, portions of signal conductors 260a and 260b (such as contact ends 266a and 266b and mating ends 262a and 262b) can be formed using a hyperelastic conductive material.

[0154] Hyperelastic materials can include shape memory materials that undergo a reversible martensitic phase transformation when a suitable mechanical driving force is applied. This phase transformation can be a diffusionless solid-to-solid phase transformation with associated shape change; compared to conventional (i.e., non-hyperelastic) materials, this shape change allows hyperelastic materials to accommodate relatively large strains, and therefore hyperelastic materials often exhibit a much larger elastic limit than conventional materials. The elastic limit is defined herein as the maximum strain at which a material can reversibly deform without buckling. While conventional conductors typically exhibit an elastic limit of up to 1%, hyperelastic conductors can have an elastic limit of up to 7% or 8%. As a result, hyperelastic conductors can be made smaller without sacrificing the ability to withstand considerably large strains. Furthermore, even when strain exceeds their elastic limit, some hyperelastic conductors can return to their initial form upon exposure to a specific transition temperature for the material. In contrast, conventional conductors typically deform permanently after strain exceeds their elastic limit.

[0155] Such materials enable smaller signal conductors while providing a robust structure. These materials facilitate a reduction in the width of the electrical conductors in the electrical connectors, which can result in a reduction in the spacing between the electrical conductors and the electromagnetic shielding in the connector module 200. For example, the hyperelastic component may have a diameter (or effective diameter, as a result of a cross-sectional area having an area equal to that of a circle) in some specific instances between 20 mils (such as between 8 and 14 mils), or in some specific instances between 5 and 8 mils, or in any subrange of the range between 5 and 14 mils.

[0156] In addition to enabling routing channels in both column and row directions, the more compact connector module can have unintended resonant modes at high frequencies, which are outside the desired operating frequency range of the electrical connector. This reduction in unintended resonant frequency modes that may exist within the operating frequency range of the electrical connector provides increased signal integrity for signals carried by the connector module.

[0157] In some specific instances, the contact ends of the contact end array 336a (or 336b, 136a, 136b, etc.) may comprise a hyperelastic (or pseudoelastic) material. Depending on the specific instance, the hyperelastic material may have suitable inherent conductivity, or may be suitably conductive by coating or attaching to a conductive material. For example, suitable conductivity may be in the range of about 1.5 µΩcm to about 200 µΩcm. Examples of hyperelastic materials that may have suitable inherent conductivity include, but are not limited to, metal alloys such as copper-aluminum-nickel, copper-aluminum-zinc, copper-aluminum-manganese-nickel, nickel-titanium (e.g., nickel-titanium intermetallic compounds), and nickel-titanium-copper. Additional examples of potentially suitable metallic alloys include Ag-Cd (approximately 44-49 at% Cd), Au-Cd (approximately 46.5-50 at% Cd), Cu-Al-Ni (approximately 14-14.5 wt%, approximately 3-4.5 wt% Ni), Cu-Au-Zn (approximately 23-28 at% Au, approximately 45-47 at% Zn), Cu-Sn (approximately 15 at% Sn), Cu-Zn (approximately 38.5-41.5 wt% Zn), Cu-Zn-X (X = Si, Sn, Al, Ga, approximately 1-5 at% X), Ni-Al (approximately 36-38 at% Al), Ti-Ni (approximately 49-51 at% Ni), Fe-Pt (approximately 25 at% Pt), and Fe-Pd (approximately 30 at% Pd).

[0158] In some specific instances, a particular hyperelastic material may be selected based on its mechanical response rather than its electronic properties, and the hyperelastic material may not possess suitable inherent conductivity. In such instances, the hyperelastic material may be coated with a highly conductive metal, such as silver, to improve conductivity. For example, chemical vapor deposition (CVD), physical vapor deposition (PVD), or any other suitable coating process may be used to apply the coating, as the invention is not limited thereto. Coated hyperelastic materials can also be particularly advantageous in high-frequency applications where most electrical conduction occurs near the surface of the conductor.

[0159] In some specific instances, connector elements incorporating hyperelastic materials can be formed by attaching the hyperelastic material to a conventional material that may have higher conductivity than the hyperelastic material. For example, the hyperelastic material may be used only in a portion of the connector element that is likely to undergo significant deformation, while the other portions of the connector that do not deform significantly during connector operation may be made of a conventional (highly conductive) material.

[0160] The inventors have recognized and understand that using a hyperelastic conductive material to implement parts of an electrical connector achieves a smaller structure. Nevertheless, the smaller structure is sufficiently robust to withstand the operational requirements of the electrical connector, and thus facilitates a higher signal conductor density within those parts made of the hyperelastic material. This closer spacing can be implemented via an interconnect system. For example, the mounting area for receiving a third electrical connector 302a on the substrate can be adapted to receive a high-density contact tail array 336b, as described herein (including with reference to FIG. 12A).

[0161] Due to transition region 268a, mating ends 262a and 262b are separated from each other along line 138, while intermediate portions 264a and 264b adjacent to mating ends 262a and 262b are separated along the mating column direction 142. As illustrated, for example in FIG5, connector 102 may be configured such that all modules 200 positioned in a row extend in the column direction 142. All modules may include similarly oriented mating ends such that, for each module, the mating ends of the signal conductors will be separated from each other along a line parallel to line 138.

[0162] The relative positions of signal conductors 260a and 260b vary along transition region 268, such that at the first end of transition region 268 adjacent to mating ends 262a and 262b, signal conductors 260a and 260b are aligned along a first parallel line 138, and at the second end of transition region 268 adjacent to intermediate portions 264a and 264b, signal conductors 260a and 260b are aligned along mating column direction 142. In the illustrated example, transition region 268 provides a 45-degree twist between line 138 and mating column direction 142. Within transition region 268, signal conductor 260a extends away from contact tail row direction 144, and signal conductor 260b extends toward contact tail row direction 144.

[0163] Regardless of the relative positions of signal conductors 260a and 260b across the transition region, the signal integrity of the pair of signal conductors can be enhanced by configuring module 200 to maintain each of signal conductors 260a and 260b adjacent to the same respective electromagnetic shielding component 210a or 210b throughout the transition region. Alternatively or additionally, the spacing between signal conductors 260a and 260b and the respective electromagnetic shielding component 210a or 210b can be relatively constant within the transition region. For example, the spacing between the signal conductors and the shielding component may vary by no more than 30%, 20%, or 10% in some specific instances.

[0164] Module 200 may include one or more features providing this relative positioning and spacing between the signal conductors and the shielding components. As can be seen, for example, from a comparison of Figures 7A, 10A, and 10C, electromagnetic shielding components 210a and 210b have a generally planar shape in an intermediate portion 204, which is parallel to the intermediate portion 264 of the respective signal conductors 260a or 260b. The mating ends 212 of the shielding components may be formed from the same sheet metal as the intermediate portions, wherein the mating ends 212 of the shielding components are twisted relative to the intermediate portions 204. The twisting of the shielding components may have the same angle and / or the same angular twist rate as the signal conductors, ensuring that for each signal conductor, the same shielding component is adjacent to the same signal conductor throughout the transition region.

[0165] Furthermore, as shown in Figures 10A and 10C, the mating ends 262a and 262b are formed from a conductive material formed by rewinding a thin metal sheet, and the signal conductors 260a and 260b are formed from this conductive material in a generally tubular configuration. The material is rewinding towards the centerline between the mating ends 262a and 262b. This configuration leaves a flat surface on the signal conductor facing outwards toward the shielding component, which helps maintain a constant distance between the signal conductor and the shielding component, even in twisted areas.

[0166] It should be understood that the spacing between signal conductors 260a and 260b can be substantially constant in units of distance. Alternatively, the spacing can provide substantially constant impedance. In this case (e.g., where the signal conductors are wider, such as as a result of being rolled back into a tube), the spacing relative to the shield can be adjusted to ensure that the impedance of the signal conductors is substantially constant.

[0167] Figure 17A is a side view of a portion of an alternative connector module 1700 that may be included in an electrical connector, according to some specific examples. Figure 17B is a front view of a portion of the connector module 1700 of Figure 17A. In some specific examples, the connector module 1700 may be configured as described herein (including in conjunction with Figures 6B to 10C) for the connector module 200. For example, in Figures 17A and 17B, the connector module 1700 includes electromagnetic shielding components 1710a and 1710b including electromagnetic shielding tails 1720, external insulation components 1780a and 1780b, internal insulation component 1730, and signal conductors 1760a and 1760b having contact tails 1706a and 1706b shown in Figures 17A to 17B. The signal conductors 1760a and 1760b are further described herein (including in conjunction with Figures 19A to 21B).

[0168] As shown in Figure 17A, electromagnetic shielding components 1710a and 1710b may include grooves 1712 projecting toward signal conductors 1760a and 1760b. In some specific embodiments, the grooves 1712 may provide a closer distance between the electromagnetic shielding component 1710a and the signal conductor 1760a. In some specific embodiments, the grooves 1712 may extend parallel to the signal conductors 1760a and 1760b, as illustrated in Figure 17A, where the illustrated groove 1712 follows a right-angle bend of the signal conductor 1760a.

[0169] In some specific instances, connector module 1700 may include one or more insulating components configured to control the rotation of contact tails 1706a and 1706b when they are compressed. Contact tails 1706a and 1706b may include serpentine portions with segments (e.g., serpentine portion 2101, FIG. 21A) that are pressed together when the contact tails are compressed. The inventors have recognized that compression causes each segment to contact its adjacent segments, resulting in desired electrical characteristics, and further recognize that controlling the rotation of contact tails 1706a and 1706b can impede the application of compression and / or stress to contact tails 1706a and 1706b, which would otherwise prevent the contact tails from being compressed to a state with the desired electrical characteristics. In some specific examples, the insulating components of connector module 1700 can be configured to control contact tails 1706a and 1706b to rotate in the same direction when compressed. In some specific examples, and as further described herein (including in conjunction with Figures 21A and 21B), contact tails 1706a and 1706b can be configured to rotate the abutment substrate about the insertion axis when compressed along the insertion axis.

[0170] In some specific examples, the insulating components of connector module 1700 may include protrusions configured to abut contact tails 1706a and 1706b when the contact tails 1706a and 1706b rotate toward the protrusions about the insertion axis. For example, as shown in FIG17B, the outer insulating component 1780 includes protrusions 1784a and 1784b protruding toward contact tails 1706a and 1706b, respectively. Also shown in FIG17B, the inner insulating component 1730 includes protrusions 1738a and 1738b protruding toward signal conductors 1706a and 1706b, respectively. In the illustrated example, protrusion 1784a is offset from protrusion 1738a, and protrusion 1784b is offset from protrusion 1738b in a direction perpendicular to the direction by which contact tails 1706a and 1706b are spaced apart. In the described configuration, the contact ends 1706a and 1706b can be configured to rotate around the insertion axis in the same direction (e.g., counterclockwise in Figure 17B) when inserted along the insertion axis against the substrate.

[0171] It should be understood that in some specific instances, protrusion 1784a may be aligned with protrusion 1738a, protrusion 1738b and / or protrusion 1784b, as is the case hereof, but not limited to the specific instances described herein.

[0172] Figure 18 is a side view of a portion of the connector module 1700 shown in Figure 17A, with the electromagnetic shielding component 1710a cut off. In Figure 18, the external insulating component 1780a includes a groove 1782, which can be configured to accommodate the groove 1712 of the electromagnetic shielding component 1710a.

[0173] Figure 19A is a side view of a portion of the connector module 1700 shown in Figure 17A, with the electromagnetic shielding component 1710a and the external insulating component 1780a cut off. Figure 19B is a perspective view of the connector module 1700. Figures 19A and 19B show the signal conductor 1760a and its flexible portion 266a housed in a slot in the internal insulating component 1730. In Figure 19A, the middle portion 1764a of the signal conductor 1760a is shown as a circularly opposed right-angled bend. Figure 19A also shows a portion of the flexible socket 1770a, which serves as the mating end of the signal conductor 1760a, and can be configured as described herein for the flexible socket 270a of the connector module 200. In Figures 19A and 19B, the internal insulating component 1730 is shown as including a protrusion 1732, retaining components 1734a and 1734b, and protrusions 1736a, 1736b, and 1738a configured to engage the signal conductor 1760a. In some specific embodiments, the retaining components 1734a and 1734b and the protrusions 1736a, 1736b, and 1738a may be configured to control the rotation of the contact tail 1706a about the insertion axis when the contact tail 1706a is compressed along the insertion axis.

[0174] Figure 20 is a perspective view of a portion of the connector module 1700 of Figure 19B, with the electromagnetic shielding component 1710a, the external insulation component 1780a, and the signal conductor 1760a cut off. As shown in Figure 20, in some specific examples, protrusions 1736a, 1736b, and 1738a may extend along the edge of the contact tail 1706a in the direction of elongation of the contact tail 1706a.

[0175] Figure 21A is a perspective view of a portion of the signal conductor 1760a of the connector module 1700. Figure 21B is a side view of the flexible portion 1766a of the signal conductor 1760a. In some specific embodiments, the flexible portion 1766a can be configured in the manner described herein (including in conjunction with Figure 10B) for the flexible portion 266a. For example, in Figures 21A and 21B, the flexible portion 1766a includes a serpentine portion 2101, a first bend 2102, a second bend 2104, and a tab 2106. Similar to the flexible portion 266a, in some specific embodiments, the flexible portion 1766a can be configured to compress in one direction of elongation of the signal conductor 1760 adjacent to the flexible portion 1766a. In some specific embodiments, the flexible portion 1766a can rotate (e.g., about axis 2152a) when compressed.

[0176] In the specific examples of Figures 21A and 21B, the serpentine portion 2101 resembles a ladder, having alternating cut tracks on the sides between each rung. The cut tracks are bent into tabs 2106, which are inclined in opposite directions on opposite sides. In this configuration, when the contact is compressed, on one side, each rung and track segment can be compressed in the opposite direction toward the cut rung behind it. The rearward edge of the cut rung is pushed out of the plane of contact as it travels along the ramp of the tab 2106 behind it. When the tab is inclined in the opposite direction, the opposite side of the contact will be deflected in the opposite direction perpendicular to the plane of the undeflected contact, thus imparting rotation to the contact.

[0177] In contrast to the pointed tip 1050a of the flexible portion 266a, the flexible portion 1766a includes a rounded tip 2150a, which in some specific embodiments may include gold plating. In some specific embodiments, the rounded tip 2150a may be configured to physically contact conductive pads on a substrate over a larger area, thereby making it easier to place the rounded tip 2150a onto the conductive pads during mounting and reducing the impedance of the mounting interface between the connector module 1700 and the conductive pads.

[0178] In some specific instances, the flexible portion 1766a may have fewer than six bends. The inventors have recognized that including a small number of bends in the flexible portion can be advantageous because it creates a more reliable mounting interface. For example, in some specific instances, one of the flexible portions that fails to contact each other can cause an impedance increase of up to 7 ohms (Ω) to an adjacent bend, which can lead to impedance mismatch problems. By including fewer bends in the flexible portion (such as fewer than eight, fewer than seven, or even fewer than six), the fewer bends of the flexible portion may not contact each other, thereby reducing the likelihood of this impedance discontinuity at the mounting interface.

[0179] In some specific examples, the angle at which the tabs 2106 of the flexible portion 1766a are tilted relative to the contacting uncompressed plane reduces both the average magnitude and variability of any impedance discontinuities. In some specific examples, each of the tabs 2106 may be tilted at an angle of less than 45 degrees relative to the axis 2152a. For example, by reducing the angle by which the spring portion of the flexible portion 1766a bends (such as less than 45 degrees, less than 35 degrees, or 30 degrees), it is unlikely that the spring portion will not contact the adjacent bent portion of the flexible portion 1766a when the flexible portion 1766a is compressed, thereby further reducing the chance of impedance discontinuities when mounting the connector module 1700 to the substrate. According to some specific examples, the tabs 2106 may be tilted at an angle having an absolute value between 20 and 45 degrees, or in some specific examples between 25 and 40 degrees.

[0180] Returning to Figure 10A, signal conductors 260a and 260b in each of the modules are shown as wide-edge coupled. In a right-angle connector, wide-edge coupling of the signal conductors of each differential pair (aligned in the column direction parallel to the edge of the PCB to which the connector is mounted) provides the required electrical performance. Alignment in the column direction allows the two signal conductors of each pair to have the same length. Conversely, a pair of signal conductors aligned in the row direction may require different lengths, which can cause skew within the pair. Since skew within the pair reduces signal integrity, alignment of the signal conductors in the column direction promotes signal integrity. As illustrated, for example, in Figures 6A and 6B, connector modules as described herein can be incorporated into the connector, where wide-edge coupled signal couplings are aligned in the column direction.

[0181] However, the inventors have recognized and understand that the configuration of the traces outside the connector-occupied area of ​​a PCB to the effective route of the PCB to which the connector is mounted, using conventional connector mounting techniques, may be incompatible with the wide-edge coupled signal conductors within the connector. The effective PCB configuration allows the pairs of signal vias to be aligned in a direction perpendicular to the edge of the PCB. Frequently, in electronic systems, connectors are mounted to the edge of a PCB, and other components to which the connectors are connected by traces within the PCB are mounted in the interior portion of the PCB. To form a connection between the connector and these components, traces within the PCB can be routed from vias coupled to the signal conductors of the connector in a direction perpendicular to the edge of the PCB. However, for the connector-occupied area, traces are conventionally routed in routing channels parallel to the direction in which the signal vias are separated. Such routes created by vias to which the signal conductors are attached are separated in the same direction as the signal conductors.

[0182] Conventionally, the ends of the signal conductors in the connector are aligned with vias in the PCB to which the connector is mounted. For connectors with wide-edge coupled signal conductors in each pair aligned in the column direction, the corresponding signal vias in the PCB extend in a direction parallel to the edge rather than perpendicular to the edge. As a result, the wide-edge coupling used to achieve low skew within the connector typically results in routing channels within the connector's occupied area parallel to the edge, which may not be effective for some systems.

[0183] The inventors have recognized and understand that, regardless of the wide-edge coupling connector (where each pair of signal conductors is separated in the column direction), signal vias coupled to those signal conductors can be positioned for more efficient routing channels perpendicular to the edges. That configuration can be achieved through the directional transition of the signal conductors within the top layer of the PCB.

[0184] Figures 11A to 11C are, respectively, a side perspective view, a top perspective view, and a top view of a portion of a substrate 1100 configured for mounting an edge-to-pad receiving electrical connector for a signal conductor. For example, the substrate 1100 can be configured for connection to the third electrical connector 302a or the fourth electrical connector 302b of Figures 3A to 3D. The portions illustrated in Figures 11A, 11B, and 11C can correspond to structures in the substrate connected to the tail ends of the signal conductors and shielding of the connector module. Therefore, the illustrated portions can correspond to the occupied area of ​​a module and can be replicated for each similar module of connectors mounted to the substrate.

[0185] In some specific instances, substrate 1100 may be a printed circuit board. Figures 11A, 11B, and 11C illustrate only two layers of the printed circuit board in which the transition area is implemented. The printed circuit board may have other layers on which signal traces are routed and other ground layers used to separate those layers, which are not shown for simplicity.

[0186] The substrate 1100 includes a first conductive layer 1102 and a second conductive layer 1104 separated from the first conductive layer 1102 by an insulating layer 1101. For example, the first conductive layer 1102 and the second conductive layer 1104 may be disposed on opposite surfaces of the insulating layer 1101. The substrate 1100 may also include one or more vias, such as vias 1108 and 1112. The substrate 1100 may include an array of portions illustrated in Figures 11A to 11C, and / or additional conductive layers as described herein (including with reference to Figures 12A to 12D), such as a third conductive layer.

[0187] The conductive layer of substrate 1100 can be configured for coupling to an electrical connector. For example, a first conductive layer 1102 (which may be the top layer of substrate 1100) includes a conductive contact pad 1106, which can be configured for attaching and / or electrically connecting to the contact tails of the electrical connector. As shown in Figures 11A to 11C, the conductive contact pad 1106 can be configured to receive a pair of contact tails carrying components of a differential signal and provide the differential signal components to a via 1108. In this example, the conductive contact pad 1106 can be positioned to align with the distal edges of the contact tails of a pair of signal conductors configured for wide-edge coupling in the connector, as illustrated in Figures 10A to 10C. The conductive contact pad 1106 can be exposed to facilitate physical contact between the conductive contact pad 1106 and the contact tails of the connector during mounting. The contact pads may be plated with gold or other precious metals, or other plating to resist oxidation for reliable pressure mounting connections.

[0188] In one example, the contact tail of the connector can be press-fitted to the conductive contact pad 1106 (e.g., the flexible portion 266 of Figures 10A to 10C). In another example, the contact tail of the connector can be soldered to the conductive contact pad 1106 using a butt joint. In some specific examples, the conductive contact pad 1106 may have a diameter between 10 and 14 mils, or in some specific examples between 11 and 13 mils.

[0189] A portion of the first conductive layer 1102 can be configured to contact the grounding structure of a connector mounted to the substrate 1100. For example, certain locations of the ground plane portion 1114 can be configured to receive the electromagnetic shielding tail of the electrical connector. When the connector is mounted, such portions can be exposed to facilitate physical contact between the exposed portions and the shielding tail. In the specific example described, a connection is formed with a press-fit contact tail extending from the shield of each module. The shielding contact tail can be inserted into the through-hole 1112.

[0190] Ground plane portion 1114 can be electrically connected to via 1112, making via 1112 a ground via. Signal via 1108 can be electrically isolated from ground portion 1114. As shown, via 1108 is located within an opening in ground plane portion 1114. Similar openings in other ground plane layers within the printed circuit board can be provided concentrically with signal via 1108, separating via 1108 from the grounding structure of substrate 1100. Conversely, ground via 1112 can be electrically coupled to a second conductive layer 1104, which can also be grounded. In some specific embodiments, ground via 1112 can have a drill diameter of less than 16 mils but greater than 10 mils to accommodate a pressure fitting.

[0191] The signal via 1108 can be electrically coupled to a third and / or additional conductive layer of the substrate 1100, which can serve as a signal routing layer. The third conductive layer (Figures 12A to 12D) having signal traces coupled to the via 1108 can be positioned adjacent to the second conductive layer 1104 (e.g., with the second insulating layer located between the second and third conductive layers), or the additional insulating layer can be located between the second and third conductive layers.

[0192] In some specific examples, the via 1108 may have a drill diameter of less than 10 mils. In some specific examples, the via 1108 may have a drill diameter between 7 and 9 mils. As shown in Figures 11A to 11C, conductive contact pads 1106 are spaced apart from each other along a first line 1140, and vias 1108 are spaced apart from each other along a second line 1142. In some specific examples, the first line 1140 and the second line 1142 may be positioned at an angle of at least 45 degrees relative to each other. For example, in Figures 11A to 11C, the first line 1140 and the second line 1142 are perpendicular to each other. For example, line 1140 may be parallel to the edge of the PCB adjacent to the illustrated occupied area. Line 1142 may be perpendicular to the edge.

[0193] Conductive trace 1110 connects conductive contact pad 1106 to via 1108. In the specific example described, conductive trace 1110 extends at an angle of approximately 45 degrees relative to the second line 1142. Conductive trace 1110 can be used to gradually transition the relative positioning of conductive contact pad 1106 to the relative positioning of via 1108. A portion 1118 of the second conductive layer 1104 can be positioned adjacent to conductive trace 1110, wherein insulating layer 1101 separates portion 1118 from conductive trace 1110.

[0194] In some specific instances, the second conductive layer 1104 may be spaced a few millimeters from the first conductive layer 1102 to provide a ground reference for the conductive trace 1110. A portion 1118 may accommodate a transition from the relative positioning of the conductive contact pad 1106 to the relative positioning of the via 1108. A ground reference coupled to both the shield within the connector, which serves as a reference for the signal conductors in the connector, and a ground plane coupled to the ground reference for the traces within the substrate, allows reference to the continuity of the ground current carrying the differential signal throughout the transition. This ground reference further facilitates the transition of the signal path in the absence of mode transitions or other undesirable signal integrity characteristics. Avoiding mode transitions for connector modules with per-pair shields prevents excitation resonance within the module's shields and provides improved signal integrity. Furthermore, the through configuration of the mounting ends of the signal conductors (e.g., as illustrated above in Figure 10A) allows the maximum size of the shield to be smaller than in cases where transitions or other geometric changes are included in the module. In the specific example described, the shield can be substantially square for each connector module. This configuration provides high frequencies with the lowest resonant mode supported by the shield, which further facilitates high-frequency operation of the connector.

[0195] For example, the signal conductors of the mounting connector may be wide-edge coupled to each other adjacent to substrate 1100, wherein the signal conductors are spaced apart from each other along a first line 1140. The connector may have wide-edge coupled contact tails, and the transition may be achieved using trace 1110, such that the signal is edge-coupled at via 1108, rather than transitioning the wide-edge coupled signal conductors to the edge-coupled contact tails for mounting to substrate 1100. In some specific instances, the electrical connector mounted to substrate 1100 can transmit differential signals with an extraction loss of less than -40 dB in the frequency range of 25 GHz to 56 GHz.

[0196] Figures 12A to 12D illustrate portions of an exemplary substrate 1200 including an array of portions of the substrate 1100 illustrated in Figures 11A to 11C. Figure 12A is a top view of the first conductive layer 1202 of the substrate 1200, Figure 12B is a top view of the second conductive layer 1204 of the substrate 1200, Figure 12C is a top view of the third conductive layer 1220 of the substrate 1200, and Figure 12D is a cross-sectional view illustrating a portion of the substrate 1200 including the insulating layer 1201 and the conductive layers 1202, 1204 and 1220.

[0197] In FIG12A, the first conductive layer 1202 includes connector-occupied areas having regions disposed in columns along column direction 1240 and rows along row direction 1242. Each region of the connector-occupied area may include a portion of the conductive layer 1102 illustrated in FIGS. 11A to 11C. For example, as shown in FIG12A, each region includes a pair of signal vias 1208 and a pair of conductive contact pads 1206, and a trace 1210 interconnects one of the pairs of signal vias 1208 and one of the pairs of contact pads 1206. The vias 1208, contact pads 1206 and trace 1210 may be configured as described herein (including with reference to FIGS. 11A to 11C) for the vias 1108, conductive contact pads 1106 and trace 1110, respectively. Furthermore, each pair of signal vias 1208 is shown to be spaced apart from each other along the row direction 1242, and the contact pads are shown to be spaced apart from each other along the column direction 1240. The conductive layer 1202 is also shown to include a ground via 1212. Figure 12B shows a second conductive layer 1204 disposed on the side of the insulating layer 1201 opposite to the first conductive layer 1202.

[0198] The spacing between the vias 1208 and / or the grounding vias 1212 on the substrate 1200 can be adjusted to match, for example, the spacing between the contact ends and / or the electromagnetic shielding ends of the electrical connector 102. Therefore, closer spacing between signal conductors and / or smaller spacing between signal conductors and ground conductors results in a more compact occupancy area. Alternatively or additionally, more space can be used for routing channels. Furthermore, closer spacing allows for a reduction in the maximum size of the shielding enclosure of the module to be installed in the occupancy area, thereby increasing the connector's operating frequency range.

[0199] In some specific instances, the contact tail of the electrical connector 102 (or the third electrical connector 302a, the fourth electrical connector 302b, etc.) can be implemented with a superelastic conductive material, which can achieve smaller through holes and closer spacing between adjacent pairs compared to conventional contact tails.

[0200] For example, this proximity distance can be achieved using thin contact tails, such as ultra-elastic wires with a diameter less than 10 mils. In some specific examples, the contact tails of the connectors described herein can be configured to insert into plated holes formed with an unplated diameter less than or equal to 20 mils. In some specific examples, the contact tails can be configured to insert into through-holes drilled with an unplated diameter less than or equal to 10 mils. In some specific examples, the contact tails can each have a width between 6 and 20 mils. In some specific examples, the contact tails can each have a width between 6 and 10 mils, or in other specific examples, a width between 8 and 10 mils. In some specific examples, each area of ​​the connector occupying region can have an area less than 2.5 mm². For example, rows of connector occupying regions can be center-to-center separated by less than 2.5 mm in the row direction 1242, and columns of connector occupying regions can be center-to-center separated by less than 2.5 mm in the column direction 1240.

[0201] Figure 12C illustrates a third conductive layer 1220, which may be a routing layer of the substrate 1220. For example, as shown in the schematic cross-section of Figure 12D, some or all of the signal vias 1208 may be connected to the third conductive layer 1220, and traces 1230 may route signals from vias 1208 to other portions of the substrate 1220. For example, the third conductive layer may support connections to one or more electronic devices (such as microprocessors and / or memory devices) and / or other electrical connectors mounted in the central portion of the PCB and to which traces 1230 may be connected. The signal vias 1208 may terminate at the routing layer where their connections are located. This configuration may be achieved by extending the portion of the signal vias beyond the routing layer vias through back-drilled holes. Ground vias 1212 may also extend partially into the PCB, for example, extending only to the extent necessary to receive a press-fit fitting. However, in other specific instances, the signal and / or ground vias may extend further into the PCB than illustrated in Figure 12D.

[0202] As shown in Figure 12C, trace 1230 can extend in the row direction 1242 between pairs of vias 1208 in adjacent rows, perpendicular to the edge 1209 of the board adjacent to the connector occupying area. As can be seen in Figure 12C, each routing layer supports a routing channel wide enough for two pairs of traces to route through that channel. In some specific instances, the connector occupying area may have one routing layer for every two columns that must be routed outside the occupying area. Because adding routing layers to a printed circuit board increases cost, efficient routing of two columns per layer results in a lower-cost PCB.

[0203] Figure 22 is a top view of a portion of a conductive layer 2202 of an alternative substrate configured to receive a portion of an electrical connector, according to some specific examples. In some specific examples, conductive layer 2202 can be configured in the manner described herein (including in conjunction with Figures 12A to 12C) for conductive layer 1202. For example, in some specific examples, the substrate including conductive layer 2202 may also include a second conductive layer configured in the manner described herein (including in conjunction with Figure 12B) for second conductive layer 1204, and / or a third conductive layer configured in the manner described herein (including in conjunction with Figure 12C) for third conductive layer 1220.

[0204] As shown in Figure 22, the conductive layer 2202 includes connector-occupied areas located in the columns along column direction 2240 and in the rows along row direction 2242. Each area shown in Figure 22 includes a pair of signal vias 2208 and a pair of conductive contact pads 2206, wherein traces 2210 interconnect one of the pairs of signal vias 2208 and one of the pairs of contact pads 2206. The conductive layer 2202 is also shown to include a ground via 2212. Figure 22 also shows that the conductive layer 2202 includes auxiliary vias 2214 located on three sides of the signal vias 2208. In some specific embodiments, the auxiliary vias 2214 may be configured to provide additional electromagnetic shielding between adjacent pairs of signal vias 2208. For example, the auxiliary vias 2214 may extend from the conductive layer 2202 to a second and / or third conductive layer of the substrate. In some specific instances, the auxiliary via 2214 may have a smaller diameter than the grounding via 2212, allowing the auxiliary via 2214 to be positioned too small to accommodate the grounding via 2212. For example, in some specific instances, the grounding via 2212 may have a borehole diameter of less than 16 mils and greater than 10 mils, and the auxiliary via 2214 may have a borehole diameter of less than 10 mils (such as less than 8 mils and greater than 5 mils).

[0205] Figure 23 is a top view of a region of substrate 2200 including conductive layer 2202 of Figure 21. In Figure 23, conductive layer 2202 further includes conductive trace 2230 configured as described herein (including in conjunction with Figure 12C) for trace 1230. For example, in some specific instances, conductive trace 2230 may be disposed on a third conductive surface of substrate 2200 and includes a signal via 2208 extending from conductive layer 2202 shown in Figure 22. As shown in Figure 23, the second conductive layer of substrate 2200, including the ground plane, is hidden in the view to show the positioning of conductive trace 2230 relative to signal via 2208, ground via 2212, and auxiliary via 2214. For example, in Figure 23, conductive trace 2230 is routed between two ground vias 2212 and then between ground via 2212 and auxiliary via 2214. In some specific instances, the illustrated configuration can provide additional shielding for the conductive trace 2230.

[0206] Figures 13A and 13B illustrate a portion of an electronic assembly 1300 including an electrical connector and a substrate 1100. Figure 13A is an exploded view showing the contact tail 1312 of the electrical connector away from the substrate 1100. Figure 13B shows the contact tail 1312 connected to a through-hole 1108 of the substrate 1100 along with a conductive contact pad 1106. The contact tail 1312 can be configured for edge-to-pad mounting. In some specific examples, the contact tail 1312 can be configured for pressure mounting. In some specific examples, the contact tail 1312 can be configured to mount the conductive contact pad 1106 using a butt joint soldered in place.

[0207] Such edge-to-pad connections are used to achieve wide-edge coupling within a compact shield for each pair of signal conductors. Figures 14A and 14B are partially exploded views, and Figures 14C and 14D are perspective views of the electronic assembly 1300 with portions of the shield 1320 cut out. Figures 14A and 14B further illustrate the shield 1320 of the electrical connector, which is positioned around the contact tail 1312. For example, the shield 1320 and the contact tail 1312 may be part of the same connector module of the electrical connector. In Figure 14A, the shield 1320 is shown separated from the substrate 1100, while the contact tail 1312 is shown pressed against the conductive contact pad 1106 of the substrate 1100. In Figure 14B, both the shield 1320 and the contact tail 1312 are shown separated from the substrate 1100. In each case, the distal portion of the contact tail extending from the shield 1320 is not shown. The remote end can be a press fitting as described above. Alternatively or additionally, the remote end can be electrically connected to the grounding structure in the substrate 1100 in other ways (such as using pressure mounting or surface mount soldering).

[0208] Figures 14A and 14B illustrate a single shielding component 1320 surrounding a pair of signal conductors. The shielding surrounding each differential pair may be interspersed with one or more slots (such as slot 1450) along some or all of the length of the signal conductors. Here, the slots are shown aligned with the midpoint of the differential pair. Such slots may be formed, for example, by cutting material from a single component. Alternatively or additionally, the slots may be formed by forming shielding components 1320 in multiple components that commonly partially surround the pair, thus leaving the slots as illustrated.

[0209] In Figure 14C, a portion of the shielding member 1320 is cut off, revealing the shielding tail 1322 of the shielding member 1320 connected to a portion 1114 of the substrate 1100, which may be a ground plane.

[0210] In Figure 14D, a portion of the shielding component 1320 and half of each contact tail 1312 are cut off, thereby revealing the contact tail 1312 connected to the conductive contact pad 1106.

[0211] Figure 15 illustrates a head connector 2120, which may be mounted to a printed circuit board having a module 2130 formed using the construction techniques described above. In this example, the head connector 2120 has the same mating interface as the first electrical connector 102a. In the specific example illustrated, both have mating ends of pairs of signal conductors aligned along parallel lines at a 45-degree angle relative to the row and / or column directions of the mating interface. Therefore, the head connector 2120 can be mated with the connector in the form of a second electrical connector 102b.

[0212] However, the mounting interface 2124 of the head connector 2120 is in a different orientation relative to the mating interface compared to the mounting interface of the first electrical connector 102a. Specifically, the mounting interface 2124 is parallel to, rather than perpendicular to, the mating interface 2122. However, the mounting interface may include an edge-to-pad connection between the signal conductor and the substrate (such as a PCB). The signal conductor may support wide-edge coupling, allowing the shield to be configured to suppress low-frequency resonances as described above.

[0213] The head connector 2120 can be adapted for use on a base plate, intermediate plate, mezzanine, and other such configurations. For example, the head connector 2120 can be mounted to a base plate, a mid-plane, or another substrate perpendicular to a daughter card or other printed circuit board to which a right-angle connector (such as the second electrical connector 102b) is attached. Alternatively, the head connector 2120 can accept a mezzanine connector having the same mating interface as the second electrical connector 102b. The mating end of the mezzanine connector can face a first direction, and the contact tail end of the mezzanine connector can face a direction opposite to the first direction. For example, the mezzanine connector can be mounted to a printed circuit board parallel to the substrate on which the head connector 2120 is mounted. In some specific embodiments, the contact tail end of the head connector 2120 can be configured to compress in the direction in which the head connector 2120 is attached or mounted to the substrate.

[0214] In the specific example illustrated in Figure 15, the head connector 2120 has a housing 2126, which may be formed of an insulating material such as molded plastic. However, some or all of the housing 2126 may be formed of a lossy or conductive material. The bottom of the housing 2126 (through which the connector module passes) may, for example, be formed of or include a lossy material that couples to the electromagnetic shielding of the connector module 2130. As another example, the housing 2126 may be die-cast metal or metal-plated plastic.

[0215] Housing 2126 may have features that enable mating with a connector. In the specific example described, similar to housing 120, housing 2126 has features that enable mating with a second electrical connector 102b. Therefore, a portion of housing 2126 providing a mating interface is described above in conjunction with housing 120 and FIG. 2A. The mounting interface 2124 of housing 2126 is adapted for mounting to a printed circuit board.

[0216] This connector can be formed by inserting connector modules 2130 into housing 2126 in a column and row configuration. Each module may have mating contact portions 2132a and 2132b, which may be shaped similarly to mating portions 304a and 304b, respectively. The mating contact portions 2132a and 2132b may similarly be made of small-diameter, highly elastic wires.

[0217] The modularity of the components described herein supports other connector configurations using the same or similar components. Those connectors can be easily configured to mate with connectors as described herein. Figure 16 illustrates, for example, a single-mode connector where some of the connector modules (rather than having contact tails configured for mounting to a printed circuit board) are configured to terminate cables (such as tethered cables). However, those portions of the connector configured for mounting to the PCB can utilize edge-to-pad mounting techniques as described herein for high-frequency operation.

[0218] In the example of Figure 16, the connector has a tab assembly 2204, a cable-connecting tab 2206, and a housing 2202. In this example, the cable-connecting tab 2206 is positioned side-by-side with the tabs in the tab assembly 2204 and is inserted into the housing 2202 in the same manner as the tabs are inserted into the housing 110 or 120 to provide a mating interface with a socket or pin. In alternative specific examples, the connector of Figure 16 may be a hybrid cable connector, such as shown with the side-by-side tab assembly 2204 and the cable-connecting tab 2206, or in some specific examples, the hybrid cable connector is shown with some modules in the tabs configured for attachment to a printed circuit board tail, and other modules configured for terminating cable tails.

[0219] In a cable-connected configuration, signals from the mating interface of the connector can be coupled to other components within the electronic system, including connector 2200. This electronic system may include a printed circuit board to which connector 2200 is mounted. Signals from the mating interface in a module mounted to that printed circuit board can be transmitted via traces in the printed circuit board to other components also mounted to that printed circuit board. Other signals from the mating interfaces in the cable-connected modules can be routed to other components in the system via cables terminated to those modules. In one system, the other end of those cables can be connected to components on other printed circuit boards that are not reachable via traces in the printed circuit board.

[0220] In other systems, those cables can be connected to components mounted on the same printed circuit board to another connector module. This configuration can be useful because connectors, as described herein, support signals with frequencies that can be reliably transmitted through the printed circuit board via relatively short traces. High-frequency signals (such as those transmitting 56 or 112 Gbps signals) attenuate significantly in traces of approximately 6 inches or longer. Therefore, a system can be implemented in which connectors mounted to the printed circuit board have connector modules for cabling such high-frequency signals, wherein the cables terminating those connector modules are also connected at the mid-plane of the printed circuit board, such as 6 inches or more from the edge or other location on the printed circuit board where the connector is mounted. In some specific examples, the contact tail of the connector of Figure 16 can be configured to be compressed in one direction in which the connector is mounted or attached to the substrate.

[0221] In the example of Figure 16, the pair at the mating interface is not rotated about the column or row direction. However, connectors with one or more flat tabs for cable connections can be implemented with rotation of the mating interface as described above. For example, the mating ends of the signal conductor pair can be positioned at a 45-degree angle relative to the mating column and / or mating row direction. The mating row direction for the connector can be perpendicular to the board mounting interface, and the mating column direction can be parallel to the board mounting interface.

[0222] Additionally, it should be understood that although Figure 16 shows a cable-connected connector module in only one flat panel, and all flat panels have only one type of connector module, this is not a limitation on the modularization technology described herein. For example, one or more top columns of the connector module may be cable-connected connector modules, while the remaining columns may have connector modules configured for mounting to a printed circuit board.

[0223] Having described several aspects of at least one specific embodiment of the invention as such, it should be understood that those skilled in the art will readily conceive of various alterations, modifications, and improvements.

[0224] For example, connector module 200 in Figures 6B to 10C is shown as including signal conductors 260a and 260b including flexible portions 266, and an electromagnetic shielding component 210 including an electromagnetic shielding tail end 220 configured as a press-fit end. Connector module 1700 in Figures 17 to 20B is shown as including signal conductor 1760 including a flexible portion 1766a, and an electromagnetic shielding component 1710 including an electromagnetic shielding tail end 1720 configured as a press-fit end. However, it should be understood that electromagnetic shielding tail ends 220 and / or 1720 may alternatively or additionally include flexible portions (e.g., configured as described herein with respect to flexible portions 266 and / or 1766a). Depending on various specific examples, connector modules described herein may include flexible signal portions and press-fit shielding tail ends, flexible shielding tail ends and press-fit signal portions, and / or flexible shielding tail ends and flexible signal portions.

[0225] Such alterations, modifications, and improvements are intended to be part of this disclosure and are intended to be within the spirit and scope of the invention. Furthermore, while advantages of the invention are indicated, it should be understood that not every specific embodiment of the invention will include every described advantage. Some specific embodiments may not implement any features described herein and in some cases as advantageous. Therefore, the foregoing description and figures are merely illustrative.

[0226] The various forms of this invention can be used individually, in combination, or in various configurations not specifically discussed in the specific examples described above, and are therefore not limited to the details and configurations of the components set forth in the foregoing description or illustrated in the figures. For example, a form described in one specific example can be combined in any way with forms described in other specific examples.

[0227] Furthermore, the present invention can be embodied as a method for which examples have been provided. The actions performed as part of the method can be ordered in any suitable manner. Thus, specific examples can be constructed in which actions are performed in an order different from the order described, which may include performing some actions simultaneously, even if such actions are shown as consecutive actions in the illustrative specific examples.

[0228] The use of ordinal terms such as "first," "second," and "third" to modify elements in the scope of a patent application does not imply any priority, precedence, or order of one element relative to another, or any temporal order of the execution of a method action. Rather, it is merely a marker to distinguish one element with a certain name from another element with the same name (but using ordinal terms), thus differentiating those elements.

[0229] All definitions defined and used herein should be understood to be within the scope of dictionary definitions, definitions in references, and / or the general meaning of the defined terms.

[0230] Unless explicitly indicated to the contrary, the indefinite articles “a” and “an” used herein in the specification and claims shall be understood to mean “at least one”.

[0231] As used in this specification and the claims, the phrase "at least one" in relation to a list of one or more elements should be understood to mean at least one element selected from any one or more elements in the list of elements, but does not necessarily include every single element specifically listed in the list of elements, nor does it exclude any combination of elements in the list of elements. This definition also allows for the presence of elements other than those specifically identified in the list of elements referred to by the phrase "at least one," whether related to or unrelated to those specifically identified elements.

[0232] As used in this specification and the claims, the phrase "and / or" should be understood to mean "any one or both" of the elements so combined, that is, elements that exist in combination in some cases and not in combination in others. Multiple elements listed using "and / or" should be interpreted in the same way, that is, "one or more" of the elements so combined. Other elements may exist, whether related to or unrelated to those specifically identified by the phrase "and / or," depending on the circumstances. Therefore, as a non-limiting example, when referring to "A and / or B" is used in conjunction with open-ended terms such as "comprising," in one specific instance it may refer only to A (including elements other than B, depending on the circumstances); in another specific instance it may refer only to B (including elements other than A, depending on the circumstances); in yet another specific instance it may refer to both A and B (including other elements, depending on the circumstances); and so on.

[0233] As used in this specification and the claims, "or" should be understood to have the same meaning as "and / or" as defined above. For example, when separating items in a list, "or" or "and / or" should be interpreted as inclusive, that is, including at least one of some or a list of elements and including more than one, and (where applicable) other unlisted items. Only terms indicating the exact opposite, such as "only one of" or "exact one of," or, when used in the claims, "consisting of," will refer to including exactly one of some or a list of elements. Generally, when placed before exclusive terms such as "any," "one of," "only one of," or "exact one of," the term "or," as used herein, should be interpreted only to indicate an exclusive alternative (i.e., "one or the other, but not both"). When used in the claims, "consisting primarily of" should have the ordinary meaning as it is used in the field of patent law.

[0234] Furthermore, the wording and terminology used herein are for descriptive purposes and should not be considered restrictive. The use of "including," "comprising," or "having," "containing," "involving," and variations thereof herein means to cover the items listed thereafter and their equivalents, as well as additional items.

[0235] 100: Electrical interconnection system 102a: Direct attachment orthogonal connector / first electrical connector 102b: Right-angle connector / Second electrical connector 102c', 102d': Electrical connectors 104c',104d':Substrate 110a, 110b: Front shell 112, 112a, 112b: Protrusions 114b, 314b, 350: Hole 120, 320: Extender housing 122: Trench 124: Opening 130: Flat piece 130b: Second flat plate 132, 132b: Flat shell 133a, 133b: Flat shell components 134a: First Paired End Array 134b: Second Paired End Array 134c', 134d': Paired end array 136: Contact Tail Array 136a: First contact tail array 136b: Second contact tail array 138, 138c', 138d', 338a, 338b: Parallel lines 140, 340a, 340b: Pairing row direction 142,142c',142d',342a,342b: Paired column directions 144: Contact tail end travel direction 146: Contact tail column direction 170: Flexible shielding component 172,344a,346a,1240,2240: Column direction 174,1242,2242: Row direction 176: Insulation Part 178: Conductive components 200: Connector Module 202: Pairing end 204, 264, 264a, 264b: Middle section 206, 312a, 1312, 1706a, 1706b: Contact tail end 210, 210a, 210b, 1710a, 1710b: Electromagnetic shielding components 211a, 211b, 211c: Electromagnetic shielding 212: Electromagnetic shielding pairing end 214: Outward-protruding part 216: Inward protrusion 218: Gap 220, 1720: Electromagnetic shielding tail end 230: Internal insulation components 232: Protrusion 234: Extension 236a, 236b: Arm 240: First holding component 242: Second holding component 260a, 260b: Signal conductors 262, 262a, 262b: Pairing ends 266, 266a, 266b: Flexible components 268: Transition Zone 270a, 270b, 1770a: Flexible socket 272a, 272b: Paired arms 280a, 280b: External insulation components 300: Extender Module 302a: Third electrical connector 302b: Fourth electrical connector 316a: Shielded contact tail end 330b: Fourth flat plate 334a: Third Paired End Array 334b: Fourth Paired End Array 336a: Third contact tail array 336b: Fourth Contact Tail Array 352: Lower surface 354a, 354b: Area 1001, 2101: Serpentine section 1002,2102: First bending component 1004, 2104: Second bending component 1006: Spring section 1050a, 1050b: sharp tip 1052a, 1052b, 2152a: Shaft 1100,1200:Substrate 1101: Insulation layer 1102, 1202: First conductive layer 1104: Second conductive layer 1106: Conductive contact pad 1108, 1112, 1208: Through holes 1110: Conductive trace 1114: Grounding plane portion 1118: Part 1140: First Line 1142: Second Line 1201: Insulation layer 1204: Inner Layer 1206: Contact gasket 1209: Edge 1210, 1230: Traces 1212: Grounding via 1220: Conductive layer 1300: Electronic Assembly 1320: Shielding components 1322: Shielded tail end 1450: Slot 1700: Connector Module 1712, 1782: Trench 1730: Internal insulation components 1732, 1736a, 1736b, 1738a, 1738b, 1784a, 1784b: Protrusions 1734a, 1734b: Holding components 1760a, 1760b: Signal conductors 1764a: Middle section 1766a: Flexible Part 1780a, 1780b: External insulation components 2106: Convex plate 2120: Head connector 2122: Pairing Interface 2124: Installation Interface 2126: Outer shell 2130: Connector Module 2150a: Rounded top 2200:Substrate 2202: Conductive layer / outer shell 2204: Flat plate assembly 2206: Flat contact pad / cable connector 2208: Signal via 2210: Trajectory 2212: Grounding Through Hole 2214: Auxiliary through hole 2230: Conductive trace

Claims

1. A substrate including a connector occupied area, wherein the connector occupied area comprises a plurality of regions arranged in columns and rows, each region comprising: a pair of signal vias, wherein the pair of signal vias are spaced apart from each other along a first direction; a pair of conductive pads, wherein the pair of conductive pads are spaced apart from each other along a second direction orthogonal to the first direction; and a conductive trace electrically connecting each of the signal vias and conductive pads, wherein the substrate includes a conductive layer, the conductive layer including a ground portion positioned adjacent to the conductive trace.

2. The substrate as claimed in claim 1, wherein: The signal vias of the plurality of regions are aligned with the signal vias of the adjacent regions of the plurality of regions along the second direction; and the conductive pads of the plurality of regions are aligned with the conductive pads of the adjacent regions of the plurality of regions along the first direction.

3. The substrate of claim 1 or 2, further comprising: a routing channel extending in the first direction between pairs of signal vias in adjacent rows.

4. The substrate as claimed in claim 3, wherein each region further comprises: a plurality of ground vias.

5. The substrate of claim 4, further comprising a first grounding via disposed between a first region and a second region of the plurality of regions.

6. The substrate of claim 5, wherein the first grounding via is disposed between the first region and the second region in the second direction, and the substrate further includes a second grounding via disposed between the first region and a third region of the plurality of regions in the first direction.

7. The substrate of claim 6, wherein the plurality of grounding vias in each region have a first drill diameter and the first grounding via and the second grounding via have drill diameters smaller than the first drill diameter.

8. The substrate of claim 3, further comprising an edge, wherein: The connector occupies an area adjacent to the edge; and the first direction is perpendicular to the edge.

9. The substrate as claimed in claim 1, wherein: Each of the plurality of regions has an area of ​​less than 2.5 mm².

10. The substrate as claimed in claim 1, wherein: The center-to-center interval of the plurality of zones in the first direction is less than 2.5 mm.

11. The substrate as claimed in claim 1, wherein: The center-to-center interval of the plurality of zones in the second direction is less than 2.5 mm.

12. An electronic assembly comprising: a substrate including: a plurality of conductive pads on one surface of the substrate; a plurality of signal vias; a plurality of conductive traces electrically connecting the plurality of signal vias and each of the plurality of conductive pads; a conductive layer including a ground portion positioned adjacent to the plurality of conductive traces; and a plurality of ground vias, wherein the plurality of conductive pads are respectively connected to the signal traces within the substrate via the plurality of signal vias, and the plurality of ground vias are connected to a ground structure within the substrate; and a connector mounted to the substrate, wherein: The connector includes a plurality of signal conductors and a plurality of shielding members, the plurality of shielding members at least partially surrounding a subset of the plurality of signal conductors; the plurality of signal conductors include contact tails including wide sides and edges, and the edges facing and connecting to each of the plurality of conductive pads; the plurality of shielding members include contact tails inserted into each of the plurality of grounding vias.

13. The electronic assembly as claimed in claim 12, wherein: These contact ends are connected to the individual conductive pads using welded butt joints.

14. The electronic assembly as claimed in claim 12, wherein: These contact ends are connected to each of the plurality of conductive pads using a pressure-mounted connection.

15. The electronic assembly of claim 12, wherein the substrate further includes a first auxiliary through-hole disposed between a first pair and a second pair of the plurality of signal conductors of the connector in a first direction, the first direction separating the wide sides of the first pair of the plurality of signal conductors.

16. The electronic assembly of claim 15, wherein the substrate further includes a second auxiliary through-hole disposed between a first pair and a third pair of the plurality of signal conductors of the connector in a second direction, the second direction being parallel to the surface of the substrate and perpendicular to the first direction.

17. The electronic assembly of claim 16, wherein the first auxiliary through-hole and the second auxiliary through-hole have a drill diameter smaller than the drill diameter of the plurality of grounding through-holes.

18. A substrate comprising: a first insulating layer including a surface; a pair of signal vias; a pair of signal contact pads disposed on the surface, wherein the pair of contact pads are spaced apart from each other along a first line; a first conductive layer including conductive traces electrically coupling the respective contact pads of the pair of contact pads and the signal vias of the pair of signal vias; and a second conductive layer including ground portions located adjacent to the conductive traces, wherein the signal vias of the pair of signal vias are spaced apart from each other along a second line disposed at an angle of at least 45 degrees relative to the first line.

19. The substrate of claim 18, wherein the angle is 90 degrees.

20. The substrate of claim 18, wherein: The first insulating layer further includes a ground plane on the surface, the ground plane including an opening; the pair of signal contact pads and the pair of signal vias are located within the opening; and the substrate further includes a plurality of ground vias electrically coupled to the ground plane.

21. The substrate of claim 20, wherein the plurality of grounding vias have a drill diameter of less than 16 mils.

22. The substrate of claim 20, wherein the ground plane includes a plurality of portions exposed for physical contact with a grounding structure of one of the connectors mounted to the substrate.

23. The substrate of claim 20, wherein the plurality of grounding vias includes a first grounding via having a first drilling diameter and a second grounding via having a second drilling diameter, the second drilling diameter being different from the first drilling diameter.

24. The substrate of claim 23, wherein the first grounding via is exposed for physically contacting a grounding structure of a connector mounted to the substrate.

25. The substrate of claim 23, wherein the second ground via is spaced apart from the pair of signal contact pads along the first line.

26. The substrate of claim 23, wherein the second ground via is spaced apart from the pair of signal vias along the second line.

27. The substrate of claim 20, wherein: The signal contact pads and the ground plane include a first conductive layer of the substrate; The ground plane is a first ground plane; and the substrate further includes a second conductive layer, the second conductive layer including a second ground plane, the second ground plane being electrically coupled to the first ground plane through the plurality of grounding vias.

28. The substrate of claim 27, further comprising a third conductive layer including a plurality of conductive routing traces electrically coupled to each of the conductive traces via the pair of signal vias, wherein the pair of signal vias extends from the conductive traces through the second conductive layer to the third conductive layer.

29. The substrate of claim 28, further comprising: an electrical connector including a pair of wide-side coupled signal conductors coupled to the pair of signal contact pads; wherein: The conductive traces connected to the pair of signal vias on the third conductive layer are edge-coupled; and the substrate and the electrical connector are configured such that the differential signal is coupled between the pair of wide-edge coupled signal conductors of the electrical connector and the conductive traces on the third conductive layer with an extraction loss of less than -40 dB in the frequency range of 56 GHz to 112 GHz.

30. The substrate of claim 29 further includes a pair of unplated vias extending from the first conductive layer toward the third conductive layer and concentric with the pair of signal vias.

31. The substrate of claim 18, wherein the signal vias have a drill diameter of less than one 10 mils.

32. The substrate of claim 18, wherein the signal vias have a drill diameter between 7 and 9 mils.

33. The substrate of claim 18, wherein the signal contact pads have a diameter between 10 mils and 14 mils.

34. A substrate configured to receive an electrical connector, the substrate comprising: a pair of signal contact pads; a first conductive layer; a second conductive layer; an insulating layer between the first conductive layer and the second conductive layer; a third conductive layer; and a pair of through-holes; wherein: The first conductive layer is disposed on the insulating layer and includes a pair of transition regions electrically coupling the pair of vias to each of the pair of contact pads; the second conductive layer is adjacent to the first conductive layer and includes a ground portion adjacent to at least a portion of each of the pair of transition regions; and the third conductive layer includes signal traces thereon, and the pair of vias are connected to the signal traces on the third conductive layer.

35. The substrate of claim 34, wherein: The first conductive layer further includes a first ground plane; the ground portion of the second conductive layer is a second ground plane, which is electrically coupled to the first ground plane through a plurality of vias; and the plurality of vias are configured to receive a plurality of ground contact tails.

36. The substrate of claim 34, further comprising an electrical connector including a pair of signal conductors coupled to each of the respective pads of the pair of signal contact pads, wherein the signal conductors are press-fitted to the respective pads.

37. The substrate of claim 34, further comprising an electrical connector including a pair of signal conductors coupled to each of the individual pads of the pair of signal contact pads, wherein the signal conductors are soldered to the individual pads using a butt joint.

38. The substrate as claimed in claim 34, wherein: The contact pads of the pair of contact pads are spaced apart from each other along a first line; the vias of the pair of vias are spaced apart from each other along a second line; the second line is perpendicular to the first line; and the portion of each of the pair of transition regions adjacent to the ground portion of the second conductive layer extends at an angle of 45 degrees relative to the second line.

39. The substrate of claim 38, further comprising: an electrical connector including a pair of wide-side coupled signal conductors coupled to the pair of signal contact pads.

40. The substrate as claimed in claim 39, wherein: The signal traces connected to the third conductive layer of the vias are edge-coupled; and the substrate and the electrical connector are configured such that differential signals are coupled between the signal conductors of the connector and the signal traces on the third conductive layer with a draw loss of less than -40 dB in the frequency range of 56 GHz to 112 GHz.

41. The substrate of claim 34, wherein the substrate has a first surface and a second surface, a first conductive layer is closer to the first surface of the substrate than the second surface of the substrate, and the substrate further includes unplated vias extending from the second surface toward the third conductive layer and concentric with the vias.

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