Transceiving module and transceiving device

Abstract

A transceiver module includes a base, a heat sink, and a transceiver. A first opening is located on a first side of the base, and a second opening is located on a second side of the base. The heat sink includes a first engaging structure and a thermal interface material. The heat sink is disposed on the first side of the base, and the first engaging structure and the thermal interface material are located within the first opening. The transceiver includes a second engaging structure. When the transceiver is inserted into the base through the second opening, the transceiver lifts the heat sink. When the transceiver is inserted to the end of the base, the first engaging structure and the second engaging structure align and engage, causing the heat sink to reset and the thermal interface material to adhere to the transceiver.

Description

Technical Field

[0001] This invention relates to a transceiver module, and more particularly to a transceiver module that can prevent damage to the thermal interface material during assembly, and a transceiver device equipped with the transceiver module. Prior Technology

[0002] As the power consumption of transceiver modules continues to rise, heat sinks are typically added to meet cooling requirements. Currently, the most common cooling solution for transceiver modules is the riding heat sink. Generally, the bottom of the heat sink has a thermal interface material (TIM) to improve heat transfer. When the transceiver module's transceiver is inserted into the heat sink housing, the front end of the transceiver will rub against the TIM, causing damage to the TIM during assembly and thus reducing heat transfer efficiency. Summary of the Invention

[0003] According to one embodiment, the transceiver module includes a base, a heat sink, and a transceiver. A first side of the base has a first opening, and a second side of the base has a second opening, wherein the first side is adjacent to the second side. The heat sink includes a first engaging structure and a thermal interface material. The heat sink is disposed on the first side of the base, and the first engaging structure and the thermal interface material are located within the first opening. The transceiver includes a second engaging structure. When the transceiver is inserted into the base through the second opening, the transceiver lifts the heat sink. When the transceiver is inserted to the end of the base, the first engaging structure and the second engaging structure align and engage, causing the heat sink to reset and the thermal interface material to adhere to the transceiver.

[0004] According to another embodiment, the transceiver device includes a circuit board and a transceiver module. The transceiver module is disposed on the circuit board. The transceiver module includes a base, a heat sink, and a transceiver. A first side of one of the bases has a first opening, and a second side of one of the bases has a second opening, wherein the first side is adjacent to the second side. The heat sink includes a first engaging structure and a thermal interface material. The heat sink is disposed on the first side of the base, and the first engaging structure and the thermal interface material are located in the first opening. The transceiver includes a second engaging structure. When the transceiver is inserted into the base through the second opening, the transceiver lifts the heat sink. When the transceiver is inserted to the end of the base, the first engaging structure and the second engaging structure align and engage, causing the heat sink to reset, and the thermal interface material to adhere to the transceiver. Simple Explanation of the Diagram

[0005] Figure 1 is a perspective view of a transceiver device according to an embodiment of the present invention. Figure 2 is an exploded view of the transceiver module in Figure 1. Figure 3 is a three-dimensional view of the heat sink in Figure 2 from another perspective. Figure 4 is a cross-sectional view of the transceiver module in Figure 1 before assembly. Figure 5 is a cross-sectional view of the transceiver insertion base shown in Figure 4. Figure 6 is a cross-sectional view of the transceiver inserted into the end of the base, as shown in Figure 5. Implementation

[0006] Please refer to Figures 1 through 6. Figure 1 is a perspective view of a transceiver device 1 according to an embodiment of the present invention. Figure 2 is an exploded view of the transceiver module 12 in Figure 1. Figure 3 is a perspective view of the heat sink 122 in Figure 2 from another perspective. Figure 4 is a cross-sectional view of the transceiver module 12 in Figure 1 before assembly. Figure 5 is a cross-sectional view of the transceiver 124 in Figure 4 inserted into the base 120. Figure 6 is a cross-sectional view of the transceiver 124 in Figure 5 inserted to the end of the base 120.

[0007] As shown in Figures 1 and 2, the transceiver device 1 includes a circuit board 10 and a transceiver module 12, wherein the transceiver module 12 is disposed on the circuit board 10. The transceiver device 1 may be a network card, a motherboard, or other electronic device equipped with the transceiver module 12, depending on the actual application. The transceiver module 12 includes a housing 120, a heat sink 122, and a transceiver 124. The transceiver 124 may be a fiber optic transceiver, but is not limited thereto.

[0008] One of the seat bodies 120 has a first opening 1200 on its first side S1 and a second opening 1202 on its second side S2, wherein the first side S1 is adjacent to the second side S2. In other words, the first opening 1200 and the second opening 1202 are respectively formed on two adjacent sides of the seat body 120.

[0009] As shown in Figure 3, the heat sink 122 includes a first engaging structure 1220 and a thermal interface material 1222. The heat sink 122 may be a heat sink with heat dissipation fins, but is not limited thereto. The thermal interface material 1222 may be thermal paste or a similar component, depending on the actual application. Both the first engaging structure 1220 and the thermal interface material 1222 are formed at the bottom of the heat sink 122. In this embodiment, the first engaging structure 1220 may be higher than the thermal interface material 1222. For example, the first engaging structure 1220 may include a plurality of first protrusions 1220a and a plurality of second protrusions 1220b, wherein the plurality of first protrusions 1220a are arranged in a row on one side of the thermal interface material 1222, and the plurality of second protrusions 1220b are arranged in a row on the other side of the thermal interface material 1222. In other words, a plurality of first protrusions 1220a and a plurality of second protrusions 1220b are arranged in two rows on opposite sides of the thermal interface material 1222.

[0010] In this embodiment, at least two of the plurality of first protrusions 1220a have different dimensions. The first protrusions 1220a may be semi-circular, but are not limited thereto. For example, the dimensions of the plurality of first protrusions 1220a may gradually decrease in the direction away from the second opening 1202 of the seat 120 (direction of arrow A). Furthermore, the distance between any two adjacent first protrusions 1220a is different. For example, the distance between any two adjacent first protrusions 1220a may gradually increase in the direction away from the second opening 1202 of the seat 120 (direction of arrow A). In another embodiment, some of the first protrusions 1220a may have the same dimensions, depending on the actual application. It should be noted that the structural design of the plurality of second protrusions 1220b is the same as the structural design of the plurality of first protrusions 1220a, and will not be described again here.

[0011] As shown in Figure 2, the transceiver 124 includes a second engaging structure 1240. The transceiver 124 can be an optical fiber transceiver, but is not limited thereto. The second engaging structure 1240 is formed on the top of the transceiver 124 and corresponds to the first engaging structure 1220 of the heat sink 122. In this embodiment, the second engaging structure 1240 may include a plurality of first grooves 1240a and a plurality of second grooves 1240b, wherein the positions of the plurality of first grooves 1240a correspond to the positions of the plurality of first protrusions 1220a, and the positions of the plurality of second grooves 1240b correspond to the positions of the plurality of second protrusions 1220b. Furthermore, the dimensions of the plurality of first grooves 1240a correspond to the dimensions of the plurality of first protrusions 1220a, and the dimensions of the plurality of second grooves 1240b correspond to the dimensions of the plurality of second protrusions 1220b.

[0012] As shown in Figures 1 and 4, the heat sink 122 is disposed on the first side S1 of the base 120, and the first engaging structure 1220 and the thermal interface material 1222 are located in the first opening 1200. In this embodiment, the transceiver module 12 may further include an elastic fixing member 126 for fixing the heat sink 122 to the base 120. As shown in Figure 2, the elastic fixing member 126 may have a plurality of fastening holes 1260 on opposite sides, and the base 120 may have a plurality of fastening portions 1204 on opposite sides, wherein the positions of the plurality of fastening holes 1260 correspond to the positions of the plurality of fastening portions 1204. In addition, the elastic fixing member 126 may have a plurality of elastic deformation portions 1262. The heat sink 122 can be first disposed on the first side S1 of the base 120, and then the fastening hole 1260 can be fastened with the fastening part 1204, so that the elastic fastener 126 is fixed to the base 120, and the elastic deformation part 1262 abuts against the heat sink 122. In this way, the elastic fastener 126 can fix the heat sink 122 to the base 120.

[0013] Next, the user can insert the transceiver 124 into the base 120 through the second opening 1202. When the transceiver 124 is inserted into the base 120 through the second opening 1202, the transceiver 124 will lift the heat sink 122, as shown in Figure 5. Furthermore, since the first engaging structure 1220 is higher than the thermal interface material 1222, when the transceiver 124 is inserted into the base 120 through the second opening 1202, the front end of the transceiver 124 will first touch the first engaging structure 1220 and push the first protrusion 1220a and the second protrusion 1220b (as shown in Figure 3), thereby lifting the heat sink 122. When the transceiver 124 lifts the heat sink 122, the heat sink 122 will push the elastic deformation portion 1262 of the elastic fixing member 126 to elastically deform. This avoids friction between the front end of the transceiver 124 and the thermal interface material 1222, thereby preventing damage to the thermal interface material 1222 during assembly.

[0014] In some embodiments, the thermal interface material 1222 may be located further away from the second opening 1202 of the base 120 than the first engaging structure 1220, to ensure that the transceiver 124 does not come into contact with the thermal interface material 1222 when inserted into the base 120. For example, the bottom of the heat sink 122 may have a slope 1224, and the thermal interface material is limited to the planar layered structure where the reference numeral 1222 is located, excluding the structure of the slope 1224.

[0015] As shown in Figure 6, when the transceiver 124 is inserted to the end of the base 120, the first protrusion 1220a and the second protrusion 1220b of the first engaging structure 1220 (as shown in Figure 3) will align and engage with the first groove 1240a and the second groove 1240b of the second engaging structure 1240 (as shown in Figure 2), respectively, so that the heat sink 122 is reset. In this embodiment, when the first engaging structure 1220 and the second engaging structure 1240 are aligned and engaged, the elastic deformation portion 1262 of the elastic fixing member 126 drives the heat sink 122 to reset, so that the thermal interface material 1222 of the heat sink 122 is in contact with the transceiver 124, thereby improving the heat transfer effect.

[0016] In summary, when the transceiver is inserted into the housing, the first and second engaging structures lift the heat sink, preventing friction between the transceiver's tip and the thermal interface material, thus avoiding damage to the thermal interface material during assembly. Therefore, the thermal interface material does not need to be covered with a wear-resistant layer, effectively improving heat dissipation. Furthermore, the size and distance design of the first and second engaging structures ensures that the heat sink only resets when the transceiver is inserted to the end of the housing, preventing premature descent and ensuring that the transceiver does not come into contact with the thermal interface material during assembly. The above description is only a preferred embodiment of the present invention. All equivalent changes and modifications made in accordance with the claims of the present invention shall be covered by the present invention.

[0017] 1: Transceiver device

[0018] 10: Circuit board

[0019] 12: Transceiver Module

[0020] 120: base body

[0021] 122: Heat sink

[0022] 124: Transceiver

[0023] 126: Flexible fastener

[0024] 1200: First Opening

[0025] 1202: Second opening

[0026] 1204: Fastening part

[0027] 1220: First engagement structure

[0028] 1220a: First protrusion

[0029] 1220b: Second protrusion

[0030] 1222: Thermal interface materials

[0031] 1224: Incline

[0032] 1240: Second engagement structure

[0033] 1240a: First groove

[0034] 1240b: Second groove

[0035] 1260: Fastening hole

[0036] 1262: Elastic Deformation Part

[0037] A: Arrow

[0038] S1: First side

[0039] S2: Second side

Claims

1. A transceiver module, comprising: a base, wherein a first side of the base has a first opening, and a second side of the base has a second opening, the first side being adjacent to the second side; a heat sink, comprising a first engaging structure and a thermal interface material, the heat sink being disposed on the first side of the base, the first engaging structure and the thermal interface material being located in the first opening, the first engaging structure comprising a plurality of first protrusions arranged in a row on one side of the thermal interface material; and a transceiver, comprising a second engaging structure, the second engaging structure comprising a plurality of first grooves, the positions of the plurality of first grooves corresponding to the positions of the plurality of first protrusions; wherein... When the transceiver is inserted into the base through the second opening, the transceiver pushes the plurality of first protrusions to lift the heat sink; when the transceiver is inserted to the end of the base, the first engaging structure and the second engaging structure align and engage, so that the heat sink is reset and the thermal interface material adheres to the transceiver.

2. The transceiver module as described in claim 1, wherein the thermal interface material is farther away from the second opening than the first engagement structure.

3. The transceiver module as described in claim 1, wherein the first engagement structure is higher than the thermal interface material.

4. The transceiver module as claimed in claim 1, wherein at least two of the plurality of first protrusions have different dimensions, and the dimensions of the plurality of first recesses correspond to the dimensions of the plurality of first protrusions.

5. The transceiver module as described in claim 4, wherein the dimensions of the plurality of first protrusions gradually decrease in the direction away from the second opening.

6. The transceiver module as described in claim 1, wherein the distance between any two adjacent first protrusions is different.

7. The transceiver module as described in claim 6, wherein the distance between any two adjacent first protrusions gradually increases in the direction away from the second opening.

8. The transceiver module as described in claim 1, wherein the first engaging structure includes a plurality of second protrusions, the second engaging structure includes a plurality of second grooves, the plurality of first protrusions and the plurality of second protrusions are arranged in two rows on opposite sides of the thermal interface material, and the positions of the plurality of second grooves correspond to the positions of the plurality of second protrusions.

9. The transceiver module as described in claim 1 further includes an elastic fastener for fixing the heat sink to the base, wherein when the transceiver lifts the heat sink, the heat sink pushes the elastic fastener to elastically deform; when the first engaging structure and the second engaging structure are aligned and engaged, the elastic fastener drives the heat sink to reset.

10. A transceiver device, comprising: a circuit board; and a transceiver module disposed on the circuit board, the transceiver module comprising: a base, a first opening on a first side of the base, and a second opening on a second side of the base, the first side adjacent to the second side; a heat sink comprising a first engaging structure and a thermal interface material, the heat sink being disposed on the first side of the base, the first engaging structure and the thermal interface material being located in the first opening; and a transceiver comprising a second engaging structure; wherein... When the transceiver is inserted into the base through the second opening, the transceiver lifts the heat sink; when the transceiver is inserted to the end of the base, the first engaging structure and the second engaging structure align and engage, so that the heat sink is reset and the thermal interface material adheres to the transceiver.

11. The transceiver as claimed in claim 10, wherein the thermal interface material is further away from the second opening than the first engagement structure.

12. The transceiver as claimed in claim 10, wherein the first engaging structure is higher than the thermal interface material.

13. The transceiver as claimed in claim 10, wherein the first engaging structure includes a plurality of first protrusions, the second engaging structure includes a plurality of first grooves, the plurality of first protrusions are arranged in a row on one side of the thermal interface material, and the positions of the plurality of first grooves correspond to the positions of the plurality of first protrusions; when the transceiver is inserted into the base through the second opening, the transceiver pushes the plurality of first protrusions to lift the heat sink.

14. The transceiver as claimed in claim 13, wherein at least two of the plurality of first protrusions have different dimensions, and the dimensions of the plurality of first recesses correspond to the dimensions of the plurality of first protrusions.

15. The transceiver as claimed in claim 14, wherein the size of the plurality of first protrusions gradually decreases in the direction away from the second opening.

16. The transceiver as claimed in claim 13, wherein the distance between any two adjacent first protrusions is different.

17. The transceiver as claimed in claim 16, wherein the distance between any two adjacent first protrusions gradually increases in the direction away from the second opening.

18. The transceiver as claimed in claim 13, wherein the first engaging structure includes a plurality of second protrusions, the second engaging structure includes a plurality of second grooves, the plurality of first protrusions and the plurality of second protrusions are arranged in two rows on opposite sides of the thermal interface material, and the positions of the plurality of second grooves correspond to the positions of the plurality of second protrusions.

19. The transceiver as claimed in claim 10, wherein the transceiver module further includes an elastic retainer for fixing the heat sink to the base; when the transceiver lifts the heat sink, the heat sink pushes the elastic retainer to elastically deform; when the first engaging structure and the second engaging structure are aligned and engaged, the elastic retainer returns to its original position to drive the heat sink to reset.

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