Multicolor inkjet chip structure

Abstract

This invention relates to a multi-color inkjet chip structure, comprising a chip substrate and a plurality of heaters arranged on the chip substrate in an array of at least three longitudinal axes. The chip substrate has an aspect ratio greater than 10, and each of the plurality of heaters in the array of axes provides ink droplets of a different color. The plurality of heaters are arranged on the chip substrate at a density greater than 25 heaters per square millimeter. The chip substrate includes an identification circuit with dynamic verification and polymorphic identification logic structures. Specifically, in an inkjet printer, the model and type of the inkjet head can be identified by reading the identification code stored in the identification circuit on the chip substrate, and a fixed verification mechanism can be implemented to prevent back-end instructions or microprocessor (MCU) emulation and replacement, thereby improving system security.

Description

Technical Field

[0001] This invention relates to inkjet printing apparatus, and more particularly to a multicolor inkjet chip structure having a high-density heater arrangement and an integrated security identification module. Prior Technology

[0002] Currently, besides laser printers, inkjet printers are widely used in offices and homes due to their low price, simple operation, and low noise. However, existing inkjet head structures face several challenges in improving printing speed and resolution. Especially with high-density heater arrangements, excessive heaters can lead to excessive heat buildup inside the inkjet head, affecting print quality and even damaging the print head. Therefore, how to increase the number and density of heaters to improve printing speed and accuracy without compromising print quality has become a pressing technological challenge.

[0003] Furthermore, most current identification systems rely on microcontrollers (MCUs) to perform the identification process. However, because MCUs can be simulated or their instructions reconfigured by software, they cannot effectively prevent third-party manufacturers from bypassing the authorization mechanism through counterfeiting. This makes the counterfeiting and unauthorized use of consumables an increasingly serious problem.

[0004] Therefore, how to develop a multicolor inkjet head structure that can improve upon the shortcomings of the aforementioned conventional technologies is an urgent problem that needs to be solved. Summary of the Invention

[0005] The main objective of this case is to provide a multi-color inkjet chip structure that enables high-resolution, high-speed printing by increasing the number of heaters. At the same time, because the inkjet chip structure enhances the security of the identification system, it makes consumables easier to counterfeit or rewrite the recorded content to bypass the authorization mechanism, thus preventing third-party manufacturers from counterfeiting the chip's identity through software emulation.

[0006] To achieve the above objectives, one of the broader embodiments of this invention is to provide a multicolor inkjet chip structure, comprising a chip substrate and a plurality of heaters disposed on the chip substrate and arranged in an array of at least three longitudinal axes, characterized in that: the aspect ratio of the chip substrate is greater than 10, each heater in the array of axes provides ink droplets of different colors, and the plurality of heaters are disposed on the chip substrate at a density of more than 25 heaters per square millimeter (mm2).

[0007] Another broader implementation of this case is to provide a multi-color inkjet chip structure. The chip substrate includes an identification circuit, which includes a fuse identification code unit that stores and records fixed identification data. Once the data is burned, it cannot be changed, thus realizing a unique identifier (UID); an identification status recording unit that stores and records the status of the chip substrate and can be rewritten and updated multiple times to record variable data; and an identification verification logic unit, which has a built-in hardware comparison logic unit implemented with masking logic or non-programmable logic gates. It performs authorization comparison based on the identifier (UID) and status data. Moreover, the hardware comparison logic unit cannot be simulated or replaced by microprocessor (MCU) software or reconfigured instructions, thus performing a fixed verification mechanism. Simple Explanation of the Diagram

[0008] Figure 1A shows a schematic diagram of the structure of the inkjet head of the present invention. Figure 1B shows a schematic diagram of the structure of the multicolor inkjet chip of the present invention. Figure 1C is a schematic diagram of the structure after removing the nozzle plate from Figure 1B. Figure 1D is a structural diagram of Figure 1B after removing part of the nozzle plate. Figure 2 is a diagram of the internal structure of the identification circuit of the chip substrate of the present invention. Figure 3 is a flowchart of the identification and verification process of the identification circuit of the wafer substrate of the present invention. Implementation

[0009] Some typical embodiments that embody the features and advantages of this case will be described in detail in the following description. It should be understood that this case can have various variations in different forms, all of which do not depart from the scope of this case, and the descriptions and illustrations therein are essentially for illustrative purposes and not for limiting this case.

[0010] Please refer to Figure 1A, which shows a schematic diagram of the inkjet head, and Figure 1B, which shows a schematic diagram of the structure of the multicolor inkjet chip. In this embodiment, the inkjet head 10 includes an elongated multicolor inkjet chip structure, and includes a chip substrate 11, an electrical connection piece 12, an nozzle plate 13, and a plurality of heaters 15 with at least three axial arrays 14 (as shown in Figure 1C). The nozzle plate 13 includes a plurality of nozzles 131 corresponding to the heaters 15, so as to perform multi-pass color printing with a certain printing resolution. Please refer to Figures 1C and 1D. Figure 1C is a structural diagram of Figure 1B after removing the nozzle plate, and Figure 1D is a structural diagram of Figure 1B after removing part of the nozzle plate. As shown in the figures, the heaters 15 on the surface of the chip substrate 11 of the inkjet head 10 in this embodiment are configured as an axial array 14 extending along the reference axis L and are laterally or sideways isolated from each other relative to the reference axis L. In addition, the chip substrate 11 has three ink supply channels 16 parallel to the reference axis L for conveying ink of different colors. They are arranged side by side and separated from each other in the vertical direction relative to the reference axis L, thereby providing different colors of ink to the heaters 15 of the corresponding three axial arrays 14. Each axial array 14 can be composed of two rows of multiple heaters 15 of the same color ink arranged on both sides of the ink supply channel 16, all parallel to the reference axis L. The two rows of multiple heaters 15 are arranged in an alternating manner on both sides of the ink supply channel 16.

[0011] In this embodiment, each axial array 14 may contain 1200 or more heaters 15, that is, each row of heaters 15 may consist of more than 600 heaters 15. Therefore, the total number of heaters 15 in at least three axial arrays 14 is greater than 3600. The distance between two adjacent heaters 15 in the same row in each axial array 14 is the first distance P, and the vertical distance between two adjacent heaters 15 in different rows is the second distance P / 2. In this embodiment, the total length Lr2 of each row of heaters 15 is about 1 inch, the first distance P can be 1 / 600 inch, and the second distance P / 2 is 1 / 1200 inch.

[0012] In some embodiments, the distance between two adjacent heaters 15 in the same row in each axial array 14 can be 1 / 600 to 1 / 1200 inch, and the vertical distance between two adjacent heaters 15 in different rows can be 1 / 1200 to 1 / 2400 inch.

[0013] In this embodiment, the chip substrate 11 of the inkjet head 10 can be a rectangular structure. The chip substrate 11 has 6 rows of heaters 15. The width Wd2 of the chip substrate 11 is approximately 2 mm, the length Ld2 is approximately 37.9 mm, and the total area is 75.8 square millimeters (mm2). The aspect ratio is Ld2 / Wd2 = 37.9 / 2 = 18.95, which is greater than 10. The total number of heaters 15 in at least three axial arrays 14 is greater than 3600. The chip substrate 11 has at least three axial arrays. The density of heaters 15 in column 14 is approximately 3600 / (37.9×2)=48 per square millimeter (mm2). Therefore, it is preferable that the density of heaters 15 in at least three axial arrays 14 on the wafer substrate 11 is greater than 25 per square millimeter (mm2). The total length Lr2 of each row of heaters 15 is approximately 1 inch. The width Sd2 of each ink supply channel 16 can be 0.15 mm, the length Ls2 of each ink supply channel 16 can be 15 mm, and the spacing Cd between two adjacent ink supply channels 16 can be 0.5 mm. Therefore, in the embodiments of the present invention, the aspect ratio of the wafer substrate 11 is designed to be greater than 10, which can be applied to high-frequency large-area printing equipment, providing a longer printing path and flexible ink channel configuration. Furthermore, the total number of heaters 15 in at least three-axis arrays 14 is more than 3600, and the number of heaters 15 in at least three-axis arrays 14 is controlled to be greater than 25 per square millimeter. Combined with the staggered distribution and flow channel heat insulation design, the wafer substrate 11 can balance high-speed printing and stable heat dissipation, avoiding heat accumulation that could shorten the lifespan of the nozzles 131. Generally, in order to maintain high-speed printing of lightweight ink droplets, the heaters 15 need to operate at a very high frequency. The inkjet head 10 of this invention provides high-resolution high-speed printing by combining a high jet frequency with a high-density staggered arrangement of heaters 15. The jet frequency used by the heaters 15 of the inkjet head 10 of this invention exceeds 20 kHz, with a preferred frequency range of 22 to 26 kHz. This embodiment operates at a working frequency of 24 kHz.

[0014] Current inkjet printer printhead consumable identification mechanisms mostly combine hardware identification components with microcontroller (MCU) control logic. However, the MCU can simulate the identification process through software, allowing third-party manufacturers to bypass authorization and copy unauthorized chips. To improve the security of the identification system, a logic verification structure that cannot be simulated by software is required. As shown in Figures 2 and 3, the chip substrate 11 of the printhead 10 has an identification module with dynamic verification and polymorphic identification logic structure applied to the identification structure and anti-counterfeiting technology of the consumable chip of the inkjet printer printhead 10. This prevents third-party manufacturers from bypassing authorization and copying unauthorized chips, thus preventing the MCU, flash memory, and OTP-ROM from impersonating authorized chips. The identification circuit is used to record relevant information about the inkjet head 10. For example, during the production of the inkjet head 10, an identification code corresponding to the model or serial number of the inkjet head 10 is burned into the identification circuit, so that the inkjet printer can identify the model and type of the inkjet head 10 by reading the identification code stored in the identification circuit of the chip substrate 11.

[0015] The aforementioned identification circuit includes: a fuse identification code unit 20, which stores and records fixed identification data. Once the data is burned, it cannot be changed, realizing a unique identifier (UID). The fuse identification code unit 20 includes one of a metal fuse, a polysilicon fuse, an electronic fuse, or an over-the-air (OTP) read-only memory. Once burned, it realizes the unique identifier (UID) data in an unchangeable form, providing anti-counterfeiting and anti-counterfeiting functions. Therefore, the data recorded in the inkjet head 10 is fixed once burned, such as the inkjet head manufacturing date, the inkjet head expiration date, and the inkjet printer to which the inkjet head is applicable; and an identification status recording unit 30, which stores and records the status of the chip substrate 11. The identification status recording unit 30 includes one or a combination of electronically erasable programmable read-only memory (EEPROM) and flash memory, which can be modified multiple times. The variable data in the update record can be repeatedly rewritten and updated in the inkjet head 10, including specific specifications on the chip substrate 11, such as ink usage, number of nozzles, inkjet control circuit, number of ink uses, whether it is the first use, whether it is expired, and binding parameters with the corresponding printer model. An identification and verification logic unit 40 has a built-in hardware comparison logic unit implemented with masking logic or non-programmable logic gates. It performs authorization comparison based on the identification code (UID) and status data. This hardware comparison logic unit cannot be simulated or recombined by microprocessor (MCU) software to perform a fixed verification mechanism to prevent back-end instructions or microprocessor (MCU) simulation from replacing it, thereby improving system security.

[0016] Therefore, the identification circuit of this invention includes three key units: a fuse identification code unit 20, an identification status recording unit 30, and an identification verification logic unit 40. The fuse identification code unit 20 stores fixed identification data, which cannot be changed once programmed, ensuring the uniqueness of the chip substrate 11. The identification status recording unit 30 stores variable data that can be updated multiple times, such as usage count and activation status. The most critical identification verification logic unit 40 employs non-programmable hardware comparison logic to compare the identification code with the status data, ensuring that only authorized chip substrates 11 can pass verification and be activated. This design greatly enhances the system's anti-counterfeiting capabilities, preventing third-party counterfeiting and unauthorized use.

[0017] The following describes a specific implementation of the chip substrate 11 with dynamic verification and polymorphic recognition logic structure in an inkjet printer. This implementation allows for the identification of the inkjet head 10's model and type by reading the identification code stored in the identification circuit of the chip substrate 11, and also establishes a fixed verification mechanism to prevent backend instructions or microprocessor (MCU) emulation and replacement, thereby enhancing system security. After the printer's main control board is powered on, the identification process is explained in the following steps:

[0018] Step S1: The printer main control board starts up and initiates the identification program for the inserted consumable chip substrate 11. The started main control board will initialize the communication protocol and open the consumable identification interface (such as I2C or SPI bus) to ensure that only the authorized chip substrate 11 can communicate.

[0019] Step S2: Read the fuse identification code unit 20. The main control board reads the identification code (UID) content through the sequence bus to obtain the device's unique identification code. The identification code (UID) data is an immutable identification code written during the programming of the chip substrate 11. It cannot be simulated or reproduced by a microcontroller (MCU) to prevent counterfeit products from passing the verification by simulating the microcontroller (MCU).

[0020] Step S3: Read the identification status recording unit 30. The identification status recording provides device operation logic parameters, such as usage limit, maintenance reset mark, consumable status flag, usage count, authorization code, and bound model information, which affect whether the printer enables the inkjet head consumable.

[0021] Step S4: Input the identification verification logic unit 40, and input the identification code (UID) and identification status record status data into the built-in hardware comparison logic unit in the logic verification area. The hardware comparison logic unit is a mask circuit design, which cannot be programmed, and only accepts specific combinations of identification code (UID) and identification status record status, providing circuit-level anti-counterfeiting verification.

[0022] Step S5: Hardware logic comparison result. If the hardware logic unit comparison is successful, the chip substrate 11 is authorized and its functions and data areas are unlocked; if the comparison fails, the system refuses to use the chip substrate 11, and the printer's main control board can return an error status or display a warning. The printer's main control board makes authorization or rejection decisions based on the comparison result, improving the non-counterfeiting nature of the identification mechanism and strengthening the authorization control of consumables.

[0023] Therefore, in practical implementation, when the printer is started and the consumable chip substrate 11 is inserted, the main control board immediately starts the identification program, initializes the communication protocol, and opens the identification interface. Through the I2C or SPI bus, the main control board reads the unique identifier (UID) in the fuse identification code unit 20 for authentication. Subsequently, the identification status recording unit 30 provides the operating parameters of the chip substrate 11, including the number of ink uses and expiration status, and sends them to the identification verification logic unit 40 for final comparison. If the comparison result is successful, the chip substrate 11 is allowed to be used; otherwise, the system will refuse to use the chip substrate 11 and display an error message, thereby effectively preventing unauthorized counterfeit products from entering the market.

[0024] In summary, this application provides a multi-color inkjet chip structure that enables high-resolution, high-speed printing by increasing the number of heaters. At the same time, the inkjet head structure enhances the security of the identification system, making it difficult for consumables to be counterfeited or for the recorded content to be rewritten to bypass the authorization mechanism. This prevents third-party manufacturers from counterfeiting the chip's identity through software emulation, thus meeting the needs of industrial use. Therefore, this application is filed in accordance with the law.

[0025] 10: Inkjet head 11: Wafer substrate 12: Electrical connector 13: Nozzle plate 131: Nozzle 14: Axis Array 15: Heater 16: Ink supply channel 20: Fuse Identification Code Unit 30: Identification Status Recording Unit 40: Identification and Verification Logic Unit P: First distance P / 2: Second distance Wd2: Width Ld2: Length Lr2: Total length of heater Ls2: Length of the ink supply channel Sd2: Width of the ink supply channel Cd: Spacing between two adjacent ink supply channels L: Reference axis S1~S5: Steps

Claims

1. A multi-color inkjet chip structure, comprising: a chip substrate; a plurality of heaters disposed on the chip substrate and arranged in an array along at least three axes extending longitudinally, wherein the aspect ratio of the chip substrate is greater than 10, and each heater in the array of axes provides ink droplets of a different color, the plurality of heaters being disposed on the chip substrate at a density of more than 25 heaters per square millimeter (mm2); and an identification circuit disposed on the chip substrate, the identification circuit comprising: a fuse identification code unit storing and recording fixed identification data, the data being immutable once burned, realizing a unique identifier (UID); an identification status recording unit storing and recording the status of the chip substrate, capable of being rewritten and updated multiple times to record variable data; and an identification verification logic unit, incorporating a hardware comparison logic unit implemented with masking logic or non-programmable logic gates, performing authorization comparison based on the identifier (UID) and status data, and the hardware comparison logic unit cannot be simulated or replaced by microprocessor (MCU) software or reconfigured instructions, for performing a fixed verification mechanism.

2. The multicolor inkjet chip structure as described in claim 1, wherein the fuse identification code unit is one of a metal fuse, a polysilicon fuse, an electronic fuse, or an over-the-air (OTP-ROM).

3. The multicolor inkjet chip structure as described in claim 1, wherein the identification status recording unit is one of electronically erasable programmable read-only memory (EEPROM) or flash memory.

4. The multicolor inkjet chip structure as described in claim 1, wherein the identification status recording unit stores and records the status of the chip substrate, including the number of ink uses, whether it is the first use, whether it is expired, and binding parameters with the corresponding printer model.

5. The multicolor inkjet chip structure as described in claim 1, wherein the identification and verification logic unit is made using a masking logic or wiring block method.

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