Laminated substrates and peeling methods

Abstract

This invention provides a multilayer substrate that suppresses damage to the electronic device and the support substrate during separation of the support substrate. The multilayer substrate of this invention comprises a glass support substrate, a polyimide resin layer, a component layer, and a resin layer. The thickness of the resin layer is 50–200 μm, and the tensile modulus of elasticity of the resin layer is 1–5 GPa.

Description

[Technical Field] This invention relates to a multilayer substrate and a peeling method. [Previous Technology] In the manufacture of electronic devices such as solar cells, liquid crystal displays (LCDs), organic OLED (Electroluminescence) panels, and sensor panels for sensing electromagnetic waves, X-rays, ultraviolet rays, visible light, and infrared light, as described in Patent Document 1, a method is disclosed in which a polyimide resin layer is used as a substrate. The polyimide resin layer is used as a laminated substrate formed by depositing it on a glass substrate, and the laminated substrate is supplied in the manufacture of the electronic device. After the electronic device is formed, the polyimide resin layer, which serves as the substrate of the electronic device, is separated from the glass substrate, which serves as the support substrate, by peeling or the like. [Prior Art Documents] [Patent Documents] [Patent Document 1] Japanese Patent Application Publication No. 2015-104843 [Summary of the Invention] [The problem the invention aims to solve] As described above, in order to form various electronic device components constituting an electronic device on a polyimide resin layer in a laminated substrate, the polyimide resin layer, which serves as the substrate of the electronic device, is separated from the glass substrate after the electronic device is formed. Ideally, neither the electronic device nor the glass substrate should be damaged during this separation. Damage to either the electronic device or the glass substrate will lead to a deterioration in manufacturing yield. However, Patent Document 1 does not consider the separation of the polyimide resin layer from the glass substrate at all. During the manufacture of the electronic device, a protective film is applied to protect the electronic device. The inventors focused on the relationship between this protective film and the separation of the polyimide resin layer and the glass substrate, and studied the damage to the electronic device and the glass substrate during separation. They found that, depending on the type of protective film used, there are cases where the electronic device and the glass substrate are damaged when the polyimide resin layer separates from the glass substrate. Therefore, the object of the present invention is to provide a laminated substrate and a peeling method that suppress damage to the electronic device and the support substrate during separation of the support substrate. [Technical Means for Solving the Problem] The inventors have conducted intensive research and discovered that the above-mentioned objectives can be achieved through the following configuration. A first aspect of the present invention provides a multilayer substrate, which comprises a glass support substrate, a polyimide resin layer, a component layer, and a resin layer. The resin layer has a thickness of 50–200 μm and a tensile modulus of elasticity of 1–5 GPa. Preferably, an adhesive layer is provided between the support substrate and the polyimide resin layer. Preferably, a close-fitting layer is provided between the component layer and the resin layer. Preferably, the polyimide resin layer is directly disposed on the surface of the support substrate, the resin layer has a thickness of 100–200 μm, and a tensile modulus of elasticity of 3–5 GPa. Preferably, an adhesive layer is provided between the support substrate and the polyimide resin layer, the resin layer has a thickness of 100–200 μm, and a tensile modulus of elasticity of 3–5 GPa. The adhesive layer is preferably a silicone resin layer. The resin layer is preferably an optically functional layer. A second embodiment of the present invention provides a peeling method in which, on a multilayer substrate having an adhesive layer in the first embodiment, the polyimide resin layer, element layer, and resin layer are peeled off from the adhesive layer on a supporting substrate, with the adhesive layer and the polyimide resin layer as the boundary. A third embodiment of the present invention provides a peeling method in which, on a multilayer substrate in the first embodiment without an adhesive layer, the polyimide resin layer, element layer, and resin layer are peeled off from the supporting substrate, with the supporting substrate and the polyimide resin layer as the boundary. The resin layer is preferably an optically functional layer. [Effects of the Invention] According to the present invention, a multilayer substrate is provided that suppresses damage to the electronic device and the support substrate when the support substrate separates. Furthermore, the support substrate can be separated from the electronic device without damaging the support substrate.

Implementation Method

Claims

1. A multilayer substrate comprising a glass support substrate, a polyimide resin layer, a component layer, and a resin layer, wherein the resin layer has a thickness of 100-200 μm and a tensile modulus of elasticity of 1-5 GPa, an adhesive layer is disposed between the support substrate and the polyimide resin layer, and when peeling off the support substrate from the multilayer substrate, the polyimide resin layer, the component layer, and the resin layer are peeled off from the adhesive layer on the support substrate, with the adhesive layer and the polyimide resin layer in the multilayer substrate as the boundary.

2. The multilayer substrate of claim 1, wherein a bonding layer is provided between the element layer and the resin layer.

3. The multilayer substrate of claim 1, wherein the tensile modulus of the resin layer is 3 to 5 GPa.

4. The multilayer substrate of claim 1, wherein the adhesive layer is a silicone resin layer.

5. A multilayer substrate as claimed in any one of claims 1 to 4, wherein the resin layer has an optically functional layer.

6. A peeling method comprising peeling the polyimide resin layer, the element layer and the resin layer from the adhesive layer on the support substrate, with the adhesive layer and the polyimide resin layer as the boundary, in a multilayer substrate as claimed in claim 1 or 4.

7. The peeling method of claim 6, wherein the resin layer has an optically functional layer.

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