Curable organopolysiloxane compositions and their cured products, protective agents or adhesives, and electrical / electronic machinery

Abstract

This invention provides a curable organopolysiloxane composition that exhibits excellent storage stability in its single-liquid form, good curability and adhesion even at relatively low temperatures, and a suitable pot life. It provides a curable organopolysiloxane composition that exhibits excellent curability, particularly at temperatures below 80°C, and excellent adhesion to resins such as polyesters and polyphenylene sulfide. Furthermore, this invention provides a curable organopolysiloxane composition that can be cured quickly in a short time using high temperature when rapid curing is required. The single-component curable organopolysiloxane composition of the present invention comprises the following components (A) to (F): (A) an organopolysiloxane having at least two alkenyl groups in one molecule, (B) an organopolysiloxane having at least two silicon atoms bonded to hydrogen atoms in one molecule, (C) a photoactive catalyst for hydrogenation silylation reaction, (D) a catalyst for condensation reaction, (E) a curing inhibitor, and (F) a tackifier having at least one terminal trialkoxysilyl group.

Description

[Technical Field]

[0001] This invention relates to a curable organopolysiloxane composition and its cured form, a protective agent or adhesive, and electrical / electronic machinery. [Previous Technology]

[0002] Curable organopolysiloxane compositions are widely used as protective agents or adhesives for electrical / electronic components. As protective agents or adhesives for electrical / electronic components, excellent reliability and durability are crucial, especially when in contact with the substrate before complete curing, requiring excellent self-adhesion. In recent years, the miniaturization, multi-purpose nature, and lightweighting of electrical / electronic components have been continuously advancing, and the shapes of electrical / electronic components have become increasingly complex depending on their applications. Therefore, there are sometimes situations where curable organopolysiloxanes are used in protective or adhesive forms different from previous methods, such as small-volume bonding and film bonding.

[0003] Patent Document 1 discloses a composition comprising a specific organopolysiloxane containing alkoxysilyl and alkenyl groups as a curable organopolysiloxane that can bond well to uncleaned aluminum die-castings and PPS resin, etc. However, the composition disclosed in Patent Document 1 cannot be cured unless heated to about 100°C, and due to different substrates, excellent adhesion may not be obtained. Furthermore, when used as an adhesive in film form, sufficient initial adhesion and adhesion strength may not be obtained.

[0004] To provide a curable organopolysiloxane composition with better low-temperature curing properties and superior self-adhesion, Patent Document 2 discloses a curable organopolysiloxane composition that simultaneously uses a catalyst for hydrogenation silylation and a catalyst for condensation, and contains a specific siloxane containing a trialkoxysilyl group. However, the composition disclosed in Patent Document 2 is a two-liquid form, requiring mixing of the two liquids before use. Furthermore, the usable time after mixing is short, and there are problems with operability and stability.

[0005] Patent Document 3 discloses a single-liquid organopolysiloxane gel composition that uses a β-diketone platinum complex or a platinum complex with a cyclic diene compound as a curing catalyst. However, the composition disclosed in Patent Document 3 is gel-like and cannot achieve sufficient adhesion when used in electrical / electronic parts, making it unsuitable for applications requiring elastomer properties.

[0006] Patent Document 4 discloses a self-adhesive polysiloxane gel composition containing a platinum-based catalyst and a specific titanium compound and / or its partially hydrolyzed condensate. However, the composition disclosed in Patent Document 4 is also gel-like and fails to achieve sufficient adhesion. Furthermore, Patent Document 5 discloses a curable organopolysiloxane composition that simultaneously uses a catalyst for hydrogenation silylation and a catalyst for condensation, and contains alkoxysilanes as silanol-modified siloxanes and crosslinking agents. However, the main agent of the curable organopolysiloxane composition is not an alkenyl-containing organopolysiloxane; it cannot be sufficiently cured in a short time unless heated to a temperature above 120°C, and its adhesion to the substrate is also insufficient.

[0007] Patent Document 6 discloses an ultraviolet-curable adhesive organopolysiloxane composition using a photoactive platinum complex catalyst as a catalyst. However, the composition disclosed in Patent Document 6 is suitable for Fresnel lens materials such as concentrating solar cells, but requires sufficient transparency and is brittle and easily damaged. (Previous Art Documents, Patent Documents)

[0008] Patent Document 1: Japanese Patent Application Publication No. 2006-348119; Patent Document 2: International Publication No. 2018 / 043270; Patent Document 3: International Publication No. 2014 / 188872; Patent Document 4: Japanese Patent Application Publication No. 2018-119021; Patent Document 5: U.S. Patent Application Publication No. 2014 / 0356620; Patent Document 6: Japanese Patent Application Publication No. 2015-110752. [Summary of the Invention]

[0009] The problem that the invention aims to solve

[0010] This invention was made to solve the problems of the prior art described above, and aims to provide a curable organopolysiloxane composition that exhibits excellent storage stability in its single-liquid form, good curability at relatively low temperatures, sufficient adhesion in practical use, and an appropriate usable time. The present invention aims to provide a curable organopolysiloxane composition that exhibits excellent curability, particularly at temperatures below 80°C, and excellent adhesion to difficult-to-bond resins such as polycarbonate and polyphenylene sulfide, as well as metal substrates, during low-temperature curing. Furthermore, the present invention also aims to provide a curable organopolysiloxane composition that can be cured quickly by high temperature in a short time when rapid curing is required. Moreover, the present invention also aims to provide a curable organopolysiloxane composition that, when used for joining components after ultraviolet irradiation, has a practically sufficient usable time and excellent curability and adhesion after the curing reaction.

[0011] Furthermore, an object of the present invention is also to provide a protective agent or adhesive comprising the above-mentioned curable organopolysiloxane composition, its cured form, and electrical / electronic machinery. In particular, an object of the present invention is to provide electrical / electronic components with excellent reliability and durability by using the curable organopolysiloxane composition of the present invention, thereby providing excellent electrical / electronic machinery. Technical Means for Solving the Problem

[0012] The inventors have diligently studied the above-mentioned problems and thus completed the present invention. That is, the object of the present invention can be achieved by a single-component curable organopolysiloxane composition comprising the following (A) to (F): (A) an organopolysiloxane having at least two alkenyl groups in one molecule, (B) an organopolysiloxane having at least two silicon atoms bonded to hydrogen atoms in one molecule, (C) a photoactive catalyst for hydrogenation silylation reaction, (D) a catalyst for condensation reaction, (E) a curing inhibitor, and (F) a tackifier having at least one terminal trialkoxysilyl group.

[0013] (B) The content of component is preferably in the range of 0.3 to 10 moles of alkenyl groups bonded to hydrogen atoms relative to all components of the curable organopolysiloxane composition.

[0014] (D) The content of component is preferably less than 0.5% by mass relative to the total mass of the curable organopolysiloxane composition.

[0015] (F) is preferably a siloxane containing a trialkoxysilyl group, having one silicon atom bonded to a hydrogen atom and having at least one trialkoxysilyl group in one molecule. (F) is even more preferably a siloxane containing a trialkoxysilyl group as represented by the following formula: Chemical Formula 1 (where R1 is a monovalent hydroxyl group without an aliphatic unsaturated bond, R2 is an alkyl group, R3 is an alkyl group, and p is an integer from 1 to 50).

[0016] The content of component (F) is preferably 0.05 to 10% by mass relative to the total mass of the curable organopolysiloxane composition.

[0017] The curable organopolysiloxane composition of the present invention may further include (G) a bonding accelerator.

[0018] The curable organopolysiloxane composition of the present invention may further include (H) inorganic fillers. In particular, it may include conductive fillers, such as silver particles or silver-coated alumina or glass microparticles.

[0019] Preferably, the curable organopolysiloxane composition of the present invention is cured at a temperature below 80°C.

[0020] Preferably, the curable organopolysiloxane composition of the present invention can be formed into a polysiloxane rubber composition having a JIS A hardness of 5 or more by curing.

[0021] The present invention also relates to protective agents or adhesives for electrical / electronic components comprising the curable organopolysiloxane composition of the present invention.

[0022] The present invention also relates to conductive or thermally conductive curable compositions comprising the curable organopolysiloxane compositions of the present invention.

[0023] Furthermore, the present invention also relates to the cured form of the curable organopolysiloxane composition of the present invention.

[0024] Furthermore, the present invention also relates to electrical / electronic machines having the hardened material of the present invention.

[0025] Furthermore, the present invention also relates to electrical / electronic machines formed by bonding, sealing, or encapsulating electrical / electronic components using the curable organopolysiloxane composition of the present invention. Effects of the Invention

[0026] The curable organopolysiloxane composition of the present invention exhibits excellent storage stability when stored in single-liquid form and readily cures at relatively low temperatures below 80°C, demonstrating excellent adhesion. Especially for difficult-to-bond resins such as polycarbonate and polyphenylene sulfide, and metal substrates such as aluminum, it also exhibits excellent adhesion under low-temperature curing conditions. Furthermore, when the curable organopolysiloxane composition of the present invention is used for assembling / joining components after irradiation with ultraviolet light, it ensures sufficient usable time in practical applications. Therefore, after assembly / joining, it is also suitable for areas that are difficult to irradiate with ultraviolet light by pre-irradiation. In addition, when mixed with large amounts of inorganic fillers (especially conductive fillers such as silver), it also exhibits excellent adhesion to resin and metal substrates. Moreover, if a rapid effect is required, it can be cured in a short time at high temperatures, achieving the same performance as low-temperature curing.

[0027] Furthermore, by using the curable organopolysiloxane composition of the present invention, the reliability and durability of electrical / electronic components can be maintained for a long time, exhibiting excellent adhesion. In addition, the curable organopolysiloxane composition of the present invention can be used as a thermally conductive or electrically conductive material with excellent adhesion to the substrate.

Implementation Method

[0028] The curable organopolysiloxane composition of the present invention is a single-liquid type curable organopolysiloxane composition, comprising the following (A) to (F): (A) an organopolysiloxane having at least two alkenyl groups in one molecule, (B) an organopolysiloxane having at least two silicon atoms bonded to hydrogen atoms in one molecule, (C) a photoactive catalyst for hydrogenation silylation reaction, (D) a catalyst for condensation reaction, (E) a curing inhibitor, and (F) a tackifier having at least one terminal trialkoxysilyl group.

[0029] [(A) Component] Component (A) is the main agent of the composition involved in this invention, and is an organopolysiloxane having at least two alkenyl groups in one molecule. This component (A) is composed of one or more organopolysiloxanes containing alkenyl groups. Preferably, component (A) is an organopolysiloxane having at least two alkenyl groups in one molecule and does not have the following organopolysiloxane containing alkoxysilyl groups in the molecule. In addition, component (A) is preferably added directly to the composition without reacting with component (F) beforehand.

[0030] The molecular structure of component (A) is not particularly limited, and examples include linear, branched, cyclic, three-dimensional network structures, and combinations thereof. Furthermore, the alkenyl group bonded to the silicon atom in component (A) may be, for example, vinyl, allyl, butenyl, pentenyl, and hexenyl, preferably vinyl or hexenyl. The bonding position of the alkenyl group is not particularly limited, and examples include the ends of the molecular chain and / or the side chains of the molecular chain. Furthermore, the groups other than the alkenyl group in component (A) bonded to the silicon atom may be, for example, alkyl groups such as methyl, ethyl, propyl, butyl, pentenyl, hexyl, and heptyl; aryl groups such as phenyl, tolyl, xylyl, and naphthyl; aralkyl groups such as benzyl and phenethyl; and substituted or unsubstituted monovalent hydrocarbon groups such as chloromethyl, 3-chloropropyl, and 3,3,3-trifluoropropyl alkyl halides, preferably methyl or phenyl. Component (A) may also be a mixture of two or more having such molecular structures. The molecular structure of component (A) is preferably chain-like (including linear and branched chains) or resin-like. Furthermore, the viscosity of component (A) at 25°C is not particularly limited, but is preferably in the range of 20 to 1,000,000 mPa·s, and more preferably in the range of 100 to 100,000 mPa·s. This is because if the viscosity at 25°C does not reach the lower limit of the above range, the physical properties of the obtained hardened material, especially its flexibility and tensile strength, may decrease significantly; on the other hand, if it exceeds the upper limit of the above range, the viscosity of the obtained composition increases, and the workability may deteriorate significantly.

[0031] In this component (A), the chain-like organic polysiloxane may be, for example, a dimethylsiloxane-methylvinylsiloxane copolymer with both ends of the molecular chain capped by trimethylsiloxy groups, a dimethylsiloxane-methylvinylsiloxane-methylphenylsiloxane copolymer with both ends of the molecular chain capped by trimethylsiloxy groups, a dimethyl polysiloxane with both ends of the molecular chain capped by dimethylvinylsiloxy groups, a methylphenyl polysiloxane with both ends of the molecular chain capped by dimethylvinylsiloxy groups, or a polysiloxane with both ends of the molecular chain capped by dimethylvinylsiloxy groups. Alkenylsiloxane-methylvinylsiloxane copolymers with both ends of the molecular chain capped by dimethylphenylsiloxane, dimethylsiloxane-methylvinylsiloxane copolymers with both ends of the molecular chain capped by trimethylsiloxane, dimethylpolysiloxane-diphenylsiloxane copolymers with both ends of the molecular chain capped by dimethylvinylsiloxane, and dimethylpolysiloxanes with both ends of the molecular chain capped by methylvinylphenylsiloxane.

[0032] In this component (A), as a resinous organopolysiloxane, it may be, for example, an organopolysiloxane having multiple T units or Q units as branched siloxane units. It may be, for example, an MQ resin, MDQ resin, MTQ resin, MDTQ resin, TD resin, TQ resin, and TDQ resin composed of any combination of triorganosiloxy units (M units) (organic groups selected from alkyl, aryl, and vinyl groups, hereinafter the same), diorganosiloxy units (D units) (organic groups selected from alkyl, aryl, and alkenyl groups), monoorganosiloxy units (T units) (organic groups selected from alkyl, aryl, and alkenyl groups), and siloxane units (Q units). Furthermore, component (A) has at least two alkenyl groups within its molecule, and in addition to the aforementioned siloxane units, may also contain silanol groups or alkoxy groups.

[0033] [(B) Component] Component (B) is an organic polysiloxane having at least two silicon atoms bonded to hydrogen atoms in one molecule, and is a crosslinking agent for the composition involved in this invention. Component (B) reacts with component (A) to form a crosslinked structure in the cured material, thereby enabling the cured material to achieve flexibility, strength, and strong adhesion to the substrate (adhesion durability).

[0034] The molecular structure of component (B) can be, for example, linear, partially branched linear, branched, cyclic, resinous, or network-like. Furthermore, the bonding positions of hydrogen atoms bonded to silicon atoms in component (B) can be, for example, at the ends of the molecular chain and / or on the side chains of the molecular chain. Additionally, the groups other than hydrogen atoms bonded to silicon atoms in component (B) can be, for example, alkyl groups such as methyl, ethyl, propyl, butyl, pentyl, hexyl, and heptyl; aryl groups such as phenyl, tolyl, xylyl, and naphthyl; aralkyl groups such as benzyl and phenethyl; and substituted or unsubstituted monovalent hydrocarbon groups such as chloromethyl, 3-chloropropyl, and 3,3,3-trifluoropropyl alkyl halogenated groups, preferably methyl or phenyl. Furthermore, the viscosity of component (B) is not limited, but the viscosity at 25°C is in the range of 1 to 1,000 mPa·s, preferably in the range of 1 to 500 mPa·s. Furthermore, considering the need to prevent contact failure, low molecular weight silicate oligomers (octamethyltetrasiloxane, decamethylpentasiloxane) can be reduced or removed.

[0035] As a linear (B) component, it may be, for example, dimethyl polysiloxane with both ends of the molecular chain capped by dimethylhydrosiloxane, methyl phenyl polysiloxane with both ends of the molecular chain capped by dimethylhydrosiloxane, dimethyl siloxane-methyl phenyl siloxane copolymer with both ends of the molecular chain capped by dimethylhydrosiloxane, diphenyl polysiloxane with both ends of the molecular chain capped by dimethylhydrosiloxane, methyl hydropolysiloxane with both ends of the molecular chain capped by trimethylsiloxane, methyl hydrosiloxane-dimethyl siloxane copolymer with both ends of the molecular chain capped by trimethylsiloxane, methyl hydrosiloxane-dimethyl siloxane copolymer with both ends of the molecular chain capped by dimethylhydrosiloxane, and mixtures of two or more of these organic polysiloxanes.

[0036] The cyclic (B) component is composed of two organosilanes and is a polysiloxane having at least two methylhydrosiloxane units (CH3(H)SiO2 / 2), preferably exemplified by cyclic trisiloxanes (trimers), cyclic tetrasiloxanes (tetramers) and cyclic pentasiloxanes (pentamelis). These cyclic siloxanes may be cyclic siloxanes comprising one or more siloxane units selected from alkoxymethylsiloxane units (CH3(Alkoxy)SiO2 / 2), epoxymethylsiloxane units (CH3(Epoxy)SiO2 / 2), dimethylsiloxane units ((CH3)2SiO2 / 2), diphenylsiloxane units ((C6H5)2SiO2 / 2), and phenylmethylsiloxane units ((C6H5)(CH3)SiO2 / 2) as other diorganosiloxane units.

[0037] The resinous or three-dimensional network (B) component may, for example, be an organohydrogen polysiloxane represented by the following average composition formula: (HR2SiO1 / 2)e(R3SiO1 / 2)f(HRSiO2 / 2)g(R2SiO2 / 2)h(HSiO3 / 2)i(RSiO3 / 2)j(SiO4 / 2)k(R´O1 / 2)l

[0038] In the average composition formula, R is a group selected from monovalent saturated hydrocarbon groups, hydroxyl groups, and alkoxy groups with 1 to 12 carbon atoms that do not have aliphatic unsaturated bonds. The same applies to monovalent saturated hydrocarbon groups, hydroxyl groups, and alkoxy groups with 1 to 12 carbon atoms. R' is a hydrogen atom or an alkyl group with 1 to 6 carbon atoms. Examples of alkyl groups with 1 to 6 carbon atoms include methyl, ethyl, propyl, butyl, and hexyl. e, f, g, h, i, j, k, and l are numbers that satisfy the following conditions: e + f + g + h + i + j + k = 1, 0 ≤ l ≤ 0.1, and 0 < i + j + k ≤ 1.0.

[0039] In addition, the structural units of “HR2SiO1 / 2”, “R3SiO1 / 2”, “HRSiO2 / 2”, “R2SiO2 / 2”, “HSiO3 / 2”, “RSiO3 / 2” and “SiO4 / 2” are respectively partial structural units of organohydrogen polysiloxanes called MH units, M units, DH units, D units, TH units, T units and Q units. The resin-like or three-dimensional network (B) component contains branch units selected from TH units, T units and Q units within the molecule. “R'O1 / 2” is a group bonded to the oxygen atom in D unit, DH unit, T unit, TH unit or Q unit, which refers to the silicon atom bonded hydroxyl (Si-OH) in organosiloxane or the silicon atom bonded alkoxy group that is not reacted and remains in the manufacturing of organosiloxane. MH units are mainly found at the ends of the molecular chains of organohydrogen polysiloxanes, while DH units are found in the molecular chains of organohydrogen polysiloxanes.

[0040] In practical use, as a resinous or three-dimensional network (B) component, it may include, for example: • an organohydrogen polysiloxane resin composed of MH units, M units, and Q units; • an organohydrogen polysiloxane resin composed of MH units and / or M units, DH units, and Q units; • an organohydrogen polysiloxane resin composed of MH units and / or M units, D units, and Q units; • an organohydrogen polysiloxane resin composed of TH units. Additionally, these organohydrogen polysiloxane resins may also contain small amounts of other constituent units.

[0041] More specifically, as a resinous or three-dimensional network (B) component, it may be, for example, an organohydrogen polysiloxane resin composed of (CH3)2HSiO1 / 2 units and SiO4 / 2 units, an organohydrogen polysiloxane resin composed of (CH3)3SiO1 / 2 units, (CH3)HSiO2 / 2 units and SiO4 / 2 units, an organohydrogen polysiloxane resin composed of (CH3)2HSiO1 / 2 units, (CH3)2SiO2 / 2 units and SiO4 / 2 units, and an organohydrogen polysiloxane resin composed of (CH3)2HSiO1 / 2 units, SiO4 / 2 units and (C6H5)SiO3 / 2 units, optionally including (CH3)2HSiO1 / 2 units or (CH3)3SiO1 / 2 units, an organohydrogen polysiloxane resin essentially composed of HSiO3 / 2 units.

[0042] As component (B), it is preferably a chain-like organopolysiloxane having at least three silicon atoms bonded to hydrogen atoms per molecule. Due to its numerous cross-linking reaction sites, it can densely form a three-dimensional cross-linked structure with component (A) during the curing reaction of the curable organopolysiloxane composition of the present invention. It is particularly preferred to use a methylhydrogen polysiloxane whose molecular chain is capped at both ends with trimethylsiloxy groups.

[0043] Regarding the content of component (B), the amount of silicon atom-bonded hydrogen atoms relative to one alkenyl group in all components of the curable organopolysiloxane composition is in the range of 0.3 to 10, preferably in the range of 0.5 to 3.0, and more preferably in the range of 0.8 to 2.0. This is because if the number of silicon atom-bonded hydrogen atoms does not reach the lower limit of the above range, the obtained composition cannot be sufficiently cured; on the other hand, if it exceeds the upper limit of the above range, there is a possibility that the obtained composition will generate hydrogen gas during curing or that the heat resistance of the obtained cured product will be significantly reduced.

[0044] In the curable organopolysiloxane composition of the present invention, the content of component (B) is 0.1 to 30 parts by mass, more preferably 0.2 to 20 parts by mass, and even more preferably 0.5 to 10 parts by mass, relative to 100 parts by mass of component (A). This is because if component (B) does not reach the lower limit of the above range, the adhesion of the obtained composition film is insufficient; on the other hand, if it exceeds the upper limit of the above range, there is a tendency for the elastic modulus of the composition to decrease, and even if cohesion breaks down, the adhesion strength will significantly decrease. Furthermore, if component (B) does not reach the lower limit of the above range, there is a tendency for the obtained composition to not cure sufficiently; if it exceeds the upper limit of the above range, there is a possibility that hydrogen gas is generated during the curing process, leading to foaming.

[0045] [(C) and (D) components] In addition to components (A) and (B) mentioned above, the curable organopolysiloxane composition of the present invention also contains two different curing catalysts: (C) a photoactive hydrogenation silylation catalyst and (D) a condensation reaction catalyst. By using these two catalysts in combination with the aforementioned components, it is possible to achieve the technical effect of easy curing at room temperature to below 80°C and excellent adhesion to various substrates.

[0046] (C) is a catalyst for hydrogenation silanization reaction. It does not show activity if it is not irradiated with a high-energy line, but it shows activity in the composition by irradiation with a high-energy line. (C) is called a so-called high-energy line activated catalyst or photoactivated catalyst, which is known in the art.

[0047] High-energy rays can be, for example, ultraviolet rays, gamma rays, X-rays, alpha rays, and electron beams. In particular, they can be ultraviolet rays, X-rays, and electron beams irradiated by commercially available electron beam irradiation devices. From the viewpoint of catalyst activation efficiency, ultraviolet rays are preferred; considering industrial use, ultraviolet rays with wavelengths in the range of 280 to 380 nm are preferred. Furthermore, the irradiation dose varies depending on the type of high-energy-energy-energy-active catalyst; when using ultraviolet rays, the cumulative irradiation dose at a wavelength of 365 nm is preferably in the range of 100 mJ / cm² to 10 J / cm².

[0048] Specific examples of component (C) may include, for example, (methylcyclopentadienyl)trimethylplatinum (IV), (cyclopentadienyl)trimethylplatinum (IV), (1,2,3,4,5-pentamethylcyclopentadienyl)trimethylplatinum (IV), (cyclopentadienyl)dimethylethylplatinum (IV), (cyclopentadienyl)dimethylacetylplatinum (IV), (trimethylsilylcyclopentadienyl)trimethylplatinum (IV), (methoxycarbonylcyclopentadienyl)trimethylplatinum (IV), (dimethylphenylsilylcyclopentadienyl)trimethylcyclopentadiene Platinum (IV), trimethyl(acetylpyruvate)platinum (IV), trimethyl(3,5-heptadecanoate)platinum (IV), trimethyl(methylacetylacetic acid)platinum (IV), bis(2,4-pentanedione)platinum (II), bis(2,4-hexanedione)platinum (II), bis(2,4-heptadecanoate)platinum (II), bis(3,5-heptadecanoate)platinum (II), bis(1-phenyl-1,3-butanedione)platinum (II), bis(1,3-diphenyl-1,3-propanedione)platinum (II), and bis(hexafluoroacetylpyruvate)platinum (II). Among these, from the viewpoint of versatility and ease of acquisition, (methylcyclopentadienyl)trimethylplatinum (IV) and bis(2,4-pentanedione)platinum (II) are preferred.

[0049] Depending on the type of catalyst and the type of composition, the content of component (C) is a different amount of catalyst. Generally, relative to the curable organopolysiloxane composition, the metal atoms in the catalyst are preferably in the range of 1 to 500 ppm by mass, and more preferably in the range of 5 to 200 ppm.

[0050] Component (D), when used in conjunction with component (C), can improve the curing properties of the composition involved in the present invention when heated to temperatures from room temperature to below 80°C and its adhesion to various substrates. Specifically, component (D) is a catalyst for condensation reaction, used to promote the condensation reaction of the organopolysiloxane and to harden it. Examples of this type of (D) component include, for example, titanium compounds such as tetra(isopropoxy)titanium, tetra(n-butoxy)titanium, tetra-tert-butoxytitanium, di(isopropoxy)bis(ethyl acetate)titanium, di(isopropoxy)bis(methyl acetate)titanium, tetraacetyl acetonetitanium, and di(isopropoxy)bis(acetyl acetone)titanium; aluminum compounds such as alkyl acetate aluminum isopropoxide, aluminum triacetyl acetone, and tri(di-butoxy)aluminum; nickel compounds such as nickel diacetyl acetone; cobalt compounds such as cobalt triacetyl acetone; zinc compounds such as zinc diacetyl acetone; and zirconium compounds such as tetra-n-propyl zirconium, tetra-n-butyl zirconium, tetraacetyl acetone zirconium, tributoxy monoacetyl acetone zirconium, monobutoxy acetyl acetone zirconium, dibutoxy bis(ethyl acetate) zirconium, tetraacetyl acetone zirconium, and tributoxy monostearic acid zirconium.

[0051] Depending on the type of catalyst and the type of composition, the content of component (D) is a different amount of catalyst, which is preferably less than 0.5% by mass relative to the total mass of the curing organopolysiloxane composition, and more preferably in the range of 0.001 to 0.500% by mass.

[0052] [(E) Component] The curable organopolysiloxane composition of the present invention includes a curing inhibitor as a component for improving storage stability and workability, and extending shelf life. Examples of (E) components include acetylene compounds such as 2-methyl-3-butyn-2-ol, 3,5-dimethyl-1-hexyn-3-ol, 2-phenyl-3-butyn-2-ol, 1-ethynyl-1-cyclohexanol, and 1-ethynyl-2-cyclohexanol; enyne compounds such as 3-methyl-3-penten-1-yne and 3,5-dimethyl-3-hexen-1-yne; triazoles such as 1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane, 1,3,5,7-tetramethyl-1,3,5,7-tetrahexenylcyclotetrasiloxane, and benzotriazoles; phosphines; thiols; and hydrazines.

[0053] Regarding the content of component (E), it should be appropriately selected according to the curing conditions of the curing organopolysiloxane composition according to the present invention. The content is preferably 0.001 to 1.0% by mass, more preferably 0.01% to 0.8% by mass, relative to the total mass of the curing organopolysiloxane composition. In particular, the content of compounds with intramolecular carbon-carbon triple bonds in component (E) is preferably less than 0.5% by mass, more preferably less than 0.3% by mass, relative to the total mass of the curing organopolysiloxane composition. Component (E) may also be free of compounds with intramolecular carbon-carbon triple bonds.

[0054] [(F) Component] Component (F) is a tackifier having at least one terminal trialkoxysilyl group, which improves the adhesion of the cured polysiloxane composition obtained by curing the polysiloxane rubber obtained by curing. Because Component (F) has a trialkoxysilyl group, it has excellent reactivity and multiple condensation reactive functional groups react simultaneously. Therefore, in addition to low-temperature adhesion, it can achieve a strong and flexible adhesion to the substrate even in the case of a small amount of adhesion.

[0055] Trialkoxysilyl is preferably trimethoxysilyl or triethoxysilyl. Furthermore, the structure of component (F) is not particularly limited except for trialkoxysilyl. Also, multiple components may be used in combination.

[0056] As component (F), it may include, for example, 3-glycidoxyprolyltrimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, bis(trimethoxysilyl)ethane, 1,2-bis(trimethoxysilyl)ethane, 1,2-bis(triethoxysilyl)ethane, 1,1-bis(trimethoxysilyl)ethane, 1,4-bis(trimethoxysilyl)butane, 1,4-bis(triethoxysilyl)butane, 1-methyldimethoxysilyl-4-trimethoxysilylbutane, 1- Methyldiethoxysilyl-4-triethoxysilylbutane, 1,5-bis(trimethoxysilyl)pentane, 1,5-bis(triethoxysilyl)pentane, 1,4-bis(trimethoxysilyl)pentane, 1,4-bis(triethoxysilyl)pentane, 1-methyldiethoxysilyl-5-trimethoxysilylpentane, 1-methyldiethoxysilyl-5-triethoxysilylpentane, 1,6-bis(trimethoxysilyl)hexane, 1,6-bis(triethoxysilyl)hexane, 1,4-bis(trimethoxysilyl) Alkyl)hexane, 1,5-bis(trimethoxysilyl)hexane, 2,5-bis(trimethoxysilyl)hexane, 1-methyldimethoxysilyl-6-trimethoxysilylhexane, 1-phenyldiethoxysilyl-6-triethoxysilylhexane, 1,7-bis(trimethoxysilyl)heptane, 2,5-bis(trimethoxysilyl)heptane, 2,6-bis(trimethoxysilyl)heptane, 1,8-bis(trimethoxysilyl)octane, 2,5-bis(trimethoxysilyl)octane, 2,7-bis(trimethoxysilyl)octane Silyl)octane, 1,9-bis(trimethoxysilyl)nonane, 2,7-bis(trimethoxysilyl)nonane, 1,10-bis(trimethoxysilyl)decane, 3,8-bis(trimethoxysilyl)decane, methyltrimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, vinyltrimethoxysilane, phenyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropyltriethoxysilane, and 3-acryloxypropyltrimethoxysilane.

[0057] The above-mentioned component (F) may contain an organoalkoxysilane containing an amino group and an organoalkoxysilane containing an epoxy group, which can impart initial adhesion to various substrates in contact during curing, especially low-temperature adhesion to unwashed adhered surfaces. In this reaction mixture, the ratio of the organoalkoxysilane containing an amino group to the organoalkoxysilane containing an epoxy group, in molar ratio, is preferably in the range of (1:1.5) to (1:5), and more preferably in the range of (1:2) to (1:4). This reaction mixture can be readily synthesized by mixing an organoalkoxysilane containing an amino group and an organoalkoxysilane containing an epoxy group, and reacting them at room temperature or under heating conditions.

[0058] In this invention, a carbazosilane derivative may be generated by cyclization, particularly by an alcohol exchange reaction, when an alkoxysilane having an organic group containing an amino group reacts with an alkoxysilane having an organic group containing an epoxy group, as described in Japanese Patent Application Publication No. 10-195085. The derivative is formed by cyclization of the group represented by the general formula: Formula 2 {where R1 is an alkyl or alkoxy group, R2 is the same or different selected group from the group represented by the general formula: Formula 3 (where R4 is an alkyl or alkoxyalkyl group, R5 is a monovalent hydroxyl group, R6 is an alkyl group, R7 is an alkyl group, R8 is an alkyl, alkenyl or acetyl group, and a is 0, 1 or 2), and R3 is the same or different hydrogen atom or alkyl group}. Examples of such carbocyclic rodenticide silicon derivatives include those represented by the following structures, which contain an alkenyl group and a silicon atom bonded to an alkoxy group in a single molecule. (Chemical Formula 4)

[0059] Component (F) is preferably a siloxane containing a trialkoxysilyl group, having one silicon atom bonded to a hydrogen atom and at least one trialoxysilyl group in one molecule. In addition to the tackifiers having at least one terminal trialoxysilyl group as exemplified above, the siloxane containing a trialoxysilyl group can also be mixed. Because the siloxane containing a trialoxysilyl group has a silicon atom bonded to a hydrogen atom within its molecule, it reacts with component (A) along with other crosslinking agents (component (B)) during the curing reaction, thereby incorporating into the cured product. Here, at least a portion of component (F) can be mixed with component (A) beforehand to pre-introduce an addition reaction, or it can be mixed as a separate component. Furthermore, in this case, the groups in component (F) other than the silicon atom bonded to a hydrogen atom and the alkoxysilyl group are preferably non-reactive functional groups selected from alkyl and aryl groups.

[0060] Preferably, component (F) is a silicone containing alkoxysilane, which has silicon atoms bonded to hydrogen atoms and alkoxysilanes at both ends of the polysiloxane as represented by the following formula.

[0061] Chemical Formula 5 (where R1 is a monovalent hydroxyl group that is the same or different and does not have an aliphatic unsaturated bond, R2 is an alkyl group, R3 is an alkyl group, and p is an integer from 1 to 50).

[0062] In the above formula, R1 is a monovalent hydroxyl group without an aliphatic unsaturated bond, which may be alkyl such as methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl and octadecyl; cycloalkyl such as cyclopentyl and cyclohexyl; aryl such as phenyl, tolyl, xylyl and naphthyl; aralkyl such as benzyl, phenethyl and phenylpropyl; and halogenated alkyl such as 3-chloropropyl and 3,3,3-trifluoropropyl, preferably alkyl or aryl, and more preferably methyl or phenyl. Furthermore, in the above formula, R2 is an alkyl group, which may be methyl, ethyl, propyl, butyl, pentyl and hexyl, preferably methyl or ethyl. R3 is an alkyl group, preferably an alkyl group with 2 to 10 carbon atoms, and more preferably ethyl or propyl. Furthermore, in the above formula, p is an integer from 1 to 50, preferably an integer from 1 to 10, and more preferably an integer from 1 to 5.

[0063] Examples of this component (F) include: siloxanes containing alkoxysilyl groups as represented by Formula 6; siloxanes containing alkoxysilyl groups as represented by Formula 7; siloxanes containing alkoxysilyl groups as represented by Formula 8; and siloxanes containing alkoxysilyl groups as represented by Formula 9. These alkoxysilyl groups may be used in one or more combinations, and some or all of the methyl groups may be substituted with other alkyl groups, halogenated alkyl groups, or aryl groups.

[0064] From the viewpoint of technical effectiveness, component (F) is preferably a disiloxane containing trimethoxysilane as represented by chemical formula 10.

[0065] More specifically, relative to the curable organopolysiloxane composition as a whole, the content of an organopolysiloxane containing at least one alkoxysilyl group bonded to a silicon atom, represented by the general formula: Chemical Formula 11 (where R1 is a monovalent hydrocarbon group without an aliphatic unsaturated bond, R2 is an alkyl group, R3 is a monoalkyl group with the same or different alkyl groups, a is an integer from 0 to 2, and p is an integer from 1 to 50), is less than 5.0% by mass, preferably less than 3.0% by mass, and more preferably less than 1.0% by mass. The composition involved in this invention is particularly preferably free of organopolysiloxanes containing alkoxysilyl groups as described above. Furthermore, the functional groups exemplified by R1, R2, and R3, a, and p are the same as those in component (F).

[0066] During the curing reaction of the curable organopolysiloxane composition of the present invention, the addition reaction between component (A) and component (F) having silicon atom-bonded hydrogen atoms may temporarily form such an organopolysiloxane containing alkoxysilyl groups. However, unlike the case where pre-reactants are added, during the curing reaction, it will compete with other crosslinking agents (such as component (B)). Therefore, it is speculated that, unlike the case where an equal amount of pre-reactants are added to the composition, the reaction between component (F) having silicon atom-bonded hydrogen atoms and component (A) is random (non-selective) and occurs simultaneously with other crosslinking reactions. As a result, technical effects such as improved adhesion properties can be achieved.

[0067] The content of component (F) is preferably from 0.05% to 10% by mass, and more preferably from 0.1% to 5.0% by mass, relative to the total mass of the curable organopolysiloxane composition.

[0068] [(G) Component] Component (G) is a component used to impart good adhesion to the crosslinked product of the above-mentioned components, and unlike component (F), it is at least one tackifier, preferably selected from (i) a siloxane having at least one silicon atom bonded alkenyl group or silicon atom bonded hydrogen atom and silicon atom bonded alkoxy group in one molecule, (ii) an organosiloxane having at least one silicon atom bonded alkenyl group, silicon atom bonded alkoxy group and silicon atom bonded monovalent organic group containing epoxy group in one molecule, and (iii) a molecule having at least one silicon atom bonded alkoxy group. (iv) A mixture or reaction mixture of an organosilane or siloxane having at least one silicon atom bonded to a hydroxyl group and a silicon atom bonded to an alkenyl group, and an organosilane having at least one silicon atom bonded to an alkoxy group and a silicon atom bonded to a monovalent organic group containing an epoxy group, and an organosiloxane having at least one silicon atom bonded to a hydroxyl group and a silicon atom bonded to an alkenyl group, and (v) At least one thickener from the group consisting of alkylalkoxysilanes.

[0069] In this (G) component, the molecular structure of a siloxane having at least one silicon atom bonded to an alkenyl group or a silicon atom bonded to a hydrogen atom and a silicon atom bonded to an alkoxy group in each molecule can be, for example, linear, partially branched linear, branched, cyclic, or network, preferably linear, branched, or network. The silicon atom bonded alkenyl group in the siloxane can be, for example, vinyl, allyl, butenyl, pentenyl, and hexenyl, preferably vinyl. Furthermore, the silicon atom bonded alkoxy group in the siloxane can be, for example, methoxy, ethoxy, propoxy, butoxy, and methoxyethoxy, preferably methoxy. Furthermore, the groups other than the alkenyl, hydrogen, and alkoxy groups in the siloxane that are bonded to the silicon atom can be, for example, alkyl groups such as methyl, ethyl, propyl, butyl, pentyl, hexyl, and heptyl; aryl groups such as phenyl, tolyl, xylyl, and naphthyl; aralkyl groups such as benzyl and phenethyl; substituted or unsubstituted monovalent hydrocarbon groups such as chloromethyl, 3-chloropropyl, and 3,3,3-trifluoropropyl; glycidoxyalkyl groups such as 3-glycidoxypropyl and 4-glycidoxybutyl; (3,4-epoxycyclohexyl)alkyl groups such as 2-(3,4-epoxycyclohexyl)ethyl and 3-(3,4-epoxycyclohexyl)propyl; and ethylene oxide groups such as 4-epoxybutyl and 8-epoxyoctyl, etc., containing epoxy groups. From the viewpoint of imparting good adhesion to various substrates, it is preferable that each molecule has at least one epoxy group containing a monovalent organic group. The viscosity of this siloxane is not limited, but it is preferably in the range of 1 to 500 mPa·s at 25°C.

[0070] Furthermore, in the (G) component, in a mixture of a silane or siloxane having at least one silicon atom bonded to an alkoxy group in one molecule and an organosiloxane having at least one silicon atom bonded to a hydroxyl group and a silicon atom bonded to an alkenyl group in one molecule, the alkoxy group bonded to the silicon atom in the former silane may be, for example, methoxy, ethoxy, propoxy, butoxy, and methoxyethoxy, preferably methoxy. In addition to the alkoxy groups mentioned above, the silicon atoms of this silane may also contain alkyl groups selected from methyl, ethyl, propyl, butyl, pentyl, hexyl, and heptyl; alkenyl groups selected from vinyl, allyl, butenyl, pentenyl, and hexenyl; aryl groups selected from phenyl, tolyl, xylyl, and naphthyl; aralkyl groups selected from benzyl and phenylethyl; substituted or unsubstituted monovalent hydrocarbon groups selected from halogenated alkyl groups such as chloromethyl, 3-chloropropyl, and 3,3,3-trifluoropropyl; 3-glycidoxypropyl and 4-glycidoxypropyl. At least one group is included in the group consisting of glycidyl alkyl such as butyl; 2-(3,4-epoxycyclohexyl)ethyl and 3-(3,4-epoxycyclohexyl)propyl such as (3,4-epoxycyclohexyl)alkyl; and 4-epoxyethylene butyl and 8-epoxyethylene octyl such as epoxyalkyl, preferably having at least one monovalent organic group containing an epoxy group in a molecule, with the view that it can impart good adhesion to various substrates.

[0071] Furthermore, the molecular structure of the former siloxane can be, for example, linear, partially branched linear, branched, cyclic, or network, preferably linear, branched, or network. The alkoxy group bonded to the silicon atom in the siloxane can be, for example, methoxy, ethoxy, propoxy, butoxy, and methoxyethoxy, preferably methoxy. In addition to the aforementioned alkoxy groups, the silicon atom of the siloxane may also contain alkyl groups selected from methyl, ethyl, propyl, butyl, pentyl, hexyl, and heptyl; alkenyl groups selected from vinyl, allyl, butenyl, pentenyl, and hexenyl; aryl groups selected from phenyl, tolyl, xylyl, and naphthyl; aralkyl groups selected from benzyl and phenethyl; substituted or unsubstituted monovalent hydrocarbon groups such as chloromethyl, 3-chloropropyl, and 3,3,3-trifluoropropyl; 3-glycidoxypropyl and 4-glycidoxypropyl. The siloxane contains at least one group from the group consisting of glycidyl alkyl groups such as butyl; 2-(3,4-epoxycyclohexyl)ethyl and 3-(3,4-epoxycyclohexyl)propyl (3,4-epoxycyclohexyl)alkyl groups; and ethylene oxide alkyl groups such as 4-epoxybutyl and 8-epoxyoctyl, which contain at least one valent organic group containing an epoxy group. Preferably, each molecule contains at least one valent organic group containing an epoxy group, considering the viewpoint of imparting good adhesion to various substrates. The viscosity of this siloxane is not limited, but is preferably in the range of 1 to 500 mPa·s at 25°C.

[0072] Furthermore, the molecular structure of the latter organosiloxane can be, for example, linear, partially branched linear, branched, cyclic, or network, preferably linear, branched, or network. The alkenyl group bonded to the silicon atom in the organosiloxane can be, for example, vinyl, allyl, butenyl, pentenyl, or hexenyl, preferably vinyl. Furthermore, the groups bonded to the silicon atom in the organosiloxane, other than the hydroxyl and alkenyl groups, can be, for example, alkyl groups such as methyl, ethyl, propyl, butyl, pentyl, hexyl, and heptyl; aryl groups such as phenyl, tolyl, xylyl, and naphthyl; aralkyl groups such as benzyl and phenethyl; and substituted or unsubstituted monovalent hydrocarbon groups such as chloromethyl, 3-chloropropyl, and 3,3,3-trifluoropropyl alkyl halides. The viscosity of this organosiloxane is not limited, but it is preferably in the range of 1 to 500 mPa·s at 25°C.

[0073] The ratio of a silane or siloxane having at least one silicon atom bonded to an alkoxy group in one molecule to an organosiloxane having at least one silicon atom bonded to a hydroxyl group and a silicon atom bonded to an alkenyl group in one molecule is not limited. In particular, considering the view that good adhesion can be imparted, it is preferred that the weight ratio of the former silane or siloxane to the latter organosiloxane is in the range of 1 / 99 to 99 / 1.

[0074] As a thickener of the present invention, a reaction mixture of an alkoxysilane having an organic group containing an amino group and an alkoxysilane having an organic group containing an epoxy group can be used, wherein the reaction ratio, in molar ratio, is preferably in the range of (1:1.5) to (1:5), and more preferably in the range of (1:2) to (1:4). This component can be readily synthesized by mixing the alkoxysilane having an organic group containing an amino group and the alkoxysilane having an organic group containing an epoxy group as described above, and reacting them at room temperature or under heating conditions.

[0075] In particular, in this invention, it is especially preferred to contain a carbazosilane derivative formed by cyclization via an alcohol exchange reaction when an alkoxysilane having an organic group containing an amino group reacts with an alkoxysilane having an organic group containing an epoxy group, as described in Japanese Patent Application Publication No. 10-195085. {wherein R1 is an alkyl or alkoxy group, R2 is a group selected from the same or different groups represented by the general formula: Chemical Formula 13 (wherein R4 is an alkyl or alkyl-alkoxyalkyl group, R5 is a monovalent hydroxyl group, R6 is an alkyl group, R7 is an alkyl group, R8 is an alkyl, alkenyl, or acetyl group, and a is 0, 1, or 2), and R3 is a carbasilatrane derivative represented by the same or different hydrogen atoms or alkyl groups}. Examples of such carbocyclic rodenticide silicon derivatives include those represented by the following structure, which contain an alkenyl group and a silicon atom bonded to an alkoxy group in one molecule. Chemical Formula 14

[0076] This component is an organic compound having at least two alkoxysilyl groups in one molecule, and the silyl groups contain bonds other than silicon-oxygen bonds between them. In addition to improving initial adhesion when used alone, it can improve the adhesion durability of cured products containing this tackifier under harsh conditions, especially when used in combination with other tackifiers.

[0077] The alkylalkoxysilane, as component (G), is a component widely used as a silane coupling agent or a crosslinking agent in condensation reactions, and is selected from alkyltrialkoxysilanes, dialkyldialkoxysilanes, and trialkylalkoxysilanes. Specifically, examples include methyltrimethoxysilane, hexyltrimethoxysilane, octyltrimethoxysilane, and decyltrimethoxysilane, or equivalents.

[0078] The mixing amount of component (G) is sufficient to impart good adhesion to the crosslinked product of the above-mentioned components. For example, it is preferably in the range of 0.01 to 20 parts by mass relative to 100 parts by mass of component (A), and more preferably in the range of 0.1 to 10 parts by mass. The reason is that if the mixing amount of component (G) is less than this range, the adhesion of the cured product tends to decrease; on the other hand, even if it exceeds this range, it will not affect the adhesion, but rather tends to decrease the stability of the obtained polysiloxane elastomer.

[0079] [(H) Composition] The curable organopolysiloxane composition of the present invention optionally contains (H) inorganic filler within a range that does not impair the curability of the catalyst for photoactive hydrogenation silanization reaction. When the inorganic filler is contained, it is preferably selected from one or more of reinforcing fillers, thermally conductive fillers, and electrically conductive fillers. The curable organopolysiloxane composition of the present invention has the following advantages in particular: even when mixed with a large amount of inorganic filler, especially thermally conductive fillers or electrically conductive fillers such as silver powder or silver-coated microparticles, it exhibits good adhesion to resin or metal substrates through a low-temperature and short-time curing reaction.

[0080] The reinforcing filler is a component used to impart mechanical strength to the hardened polysiloxane composition of the present invention and to improve its performance as a protective agent or adhesive. Examples of such reinforcing fillers include inorganic fillers such as smoked silica micro powder, precipitated silica micro powder, calcined silica micro powder, smoked titanium dioxide micro powder, quartz micro powder, calcium carbonate micro powder, diatomaceous earth micro powder, alumina micro powder, aluminum hydroxide micro powder, zinc oxide micro powder, and zinc carbonate micro powder. They may also contain inorganic fillers that have undergone surface treatment with organic alkoxysilanes such as methyltrimethoxysilane, organic halosilanes such as trimethylchlorosilane, organic silazanes such as hexamethyldisilazane, α,ω-silyl-terminated dimethylsiloxane oligomers, α,ω-silyl-terminated methylphenylsiloxane oligomers, and α,ω-silyl-terminated methylvinylsiloxane oligomers.

[0081] The particle size of the reinforcing filler powder is not particularly limited. For example, the median particle size obtained by laser diffraction scattering particle size distribution measurement can be in the range of 0.01 µm to 1000 µm.

[0082] The content of reinforcing filler is not particularly limited if it is within the range that does not impair the curing properties of the catalyst for photoactive hydrogenated silanization reaction. The total mass of the curing organopolysiloxane composition other than (H) component is preferably 0.1 to 200% by mass, and more preferably 1 to 100% by mass.

[0083] The thermally conductive or electrically conductive filler is a component that imparts thermal conductivity or electrical conductivity to the polysiloxane rubber hardened material obtained by curing the curable organic polysiloxane composition of the present invention as needed. It is preferably a powder and / or fiber selected from the group consisting of pure metals, alloys, metal oxides, metal hydroxides, metal nitrides, metal carbides, metal silicates, carbon, soft magnetic alloys and ferrites. It is more preferably a metal powder, a metal oxide powder, a metal nitride powder or a carbon powder.

[0084] As a pure metal, it may be, for example, bismuth, lead, tin, antimony, indium, cadmium, zinc, silver, copper, nickel, aluminum, iron, and metallic silicon. As an alloy, it may be, for example, an alloy composed of two or more metals selected from the group consisting of bismuth, lead, tin, antimony, indium, cadmium, zinc, silver, aluminum, iron, and metallic silicon. As a metal oxide, it may be, for example, aluminum oxide, zinc oxide, silicon oxide, magnesium oxide, beryllium oxide, chromium oxide, and titanium oxide. As a metal hydroxide, it may be, for example, magnesium hydroxide, aluminum hydroxide, barium hydroxide, and calcium hydroxide. As a metal nitride, it may be, for example, boron nitride, aluminum nitride, and silicon nitride. As a metal carbide, it may be, for example, silicon carbide, boron carbide, and titanium carbide. As a metal silicate, it may be, for example, magnesium silicate, titanium silicate, zirconium silicate, tantalum silicate, niobium silicate, chromium silicate, tungsten silicate, and molybdenum silicate. Examples of carbon-based materials include diamond, graphite, fullerenes, carbon nanotubes, graphene, activated carbon, and amorphous carbon black. Examples of soft magnetic alloys include Fe-Si alloys, Fe-Al alloys, Fe-Si-Al alloys, Fe-Si-Cr alloys, Fe-Ni alloys, Fe-Ni-Co alloys, Fe-Ni-Mo alloys, Fe-Co alloys, Fe-Si-Al-Cr alloys, Fe-Si-B alloys, and Fe-Si-Co-B alloys. Examples of ferrites include Mn-Zn ferrites, Mn-Mg-Zn ferrites, Mg-Cu-Zn ferrites, Ni-Zn ferrites, Ni-Cu-Zn ferrites, and Cu-Zn ferrites. Furthermore, examples of metal powders such as gold, silver, nickel, and copper can be vapor-deposited or electroplated onto the surface of micro-powders in ceramics, glass, quartz, and organic resins.

[0085] Furthermore, silver powder, glass coated with metals such as silver, micro powders such as alumina, aluminum powder, alumina powder, zinc oxide powder, aluminum nitride powder, or graphite are preferred. In addition, when electrical insulation is required for this composition, metal oxide powders or metal nitride powders are preferred, especially silver powder, alumina powder, zinc oxide powder, or aluminum nitride powder.

[0086] The shape of the thermally conductive or electrically conductive filler is not particularly limited, and examples include spherical, needle-shaped, disc-shaped, rod-shaped and irregular shapes, with spherical or irregular shapes being more preferred. Furthermore, the average particle size of component (H) is not particularly limited, but is more preferably in the range of 0.01 to 500 µm, and even more preferably in the range of 0.01 to 300 µm.

[0087] Preferably, the thermally conductive or electrically conductive filler is heated and mixed with the (F) component at a temperature of 100 to 200°C under reduced pressure. In particular, when the (F) component is a siloxane having alkoxysilyl groups, by surface treatment of the thermally conductive or electrically conductive filler, it is possible to obtain a composition with low viscosity and excellent workability even with high filling.

[0088] There is no particular limitation on the mixing amount of this thermally conductive or conductive filler. The total mass of the curable organopolysiloxane composition excluding component (H) is preferably 0.1 to 3000% by mass, more preferably 1 to 1500% by mass. This is because, by the composition of the curable organopolysiloxane composition containing components (A) to (E) of the present invention, especially by using components (C) and (D) simultaneously, even with a large amount of thermally conductive or conductive filler, good adhesion to the substrate can be achieved through a low-temperature and short-time curing reaction.

[0089] Furthermore, the curable organopolysiloxane composition of the present invention may optionally contain, without prejudice to the purpose of the present invention, organic solvents such as toluene, xylene, acetone, methyl ethyl ketone, methyl isobutyl ketone, hexane, and heptane; non-crosslinked organopolysiloxanes such as α,ω-trimethylsiloxy-terminated dimethyl polysiloxanes and α,ω-trimethylsiloxy-terminated methylphenyl polysiloxanes; flame retardants such as carbon black; antioxidants such as hindered phenolic antioxidants; heat resistant agents such as iron oxide; plasticizers such as dialkylsiloxane oligomers with hydroxyl-dialkylsiloxy-terminated ends; and pigments, thixotropic agents, and mildew inhibitors.

[0090] The curable organopolysiloxane composition of the present invention can be manufactured by uniformly mixing the organopolysiloxane, two different curing catalysts, a tackifier, and other optional components. The mixing method for the components of the organopolysiloxane composition can use existing known methods and is not particularly limited; generally, a homogeneous mixture is obtained by simple stirring. Furthermore, when inorganic fillers or other solid components are included as optional components, it is preferable to use a mixing device for mixing. Such a mixing device is not particularly limited, and examples include single-shaft or twin-shaft continuous mixers, two-roll mills, Ross mixers, Hobart mixers, dental mixers, planetary mixers, kneading mixers, Henschel mixers, and cassette mixers.

[0091] The curable organopolysiloxane composition of the present invention can be used as a single-liquid curable organopolysiloxane composition, which is more stable and has excellent durability when stored in a single-liquid state.

[0092] Specifically, the curable organopolysiloxane composition of the present invention can be manufactured by uniformly mixing components (A) to (E) and, if necessary, components (F) to (H), and other optional components under moisture-isolated conditions. The manufactured curable organopolysiloxane composition can be rapidly cured at room temperature to 80°C to form polysiloxane rubber. Furthermore, the curing speed can be further accelerated by heating to a temperature exceeding 80°C.

[0093] The curable organopolysiloxane composition of the present invention bonds well to various substrates or matrices. Examples of substrates or matrices include glass, ceramics, mortar, concrete, wood, aluminum, copper, brass, zinc, silver, stainless steel, iron, galvanized iron sheet, tinplate, nickel-plated surfaces, epoxy resin, and phenolic resin. Examples of thermoplastic resin substrates or matrices include polycarbonate resin, polyester resin, ABS (Acrylonitrile Butadiene Styrene) resin, nylon resin, polyvinyl chloride resin, polyphenylene sulfide resin, polyphenylene ether resin, and polybutylene terephthalate resin. Furthermore, in cases where stronger adhesion is required, the aforementioned tackifier can be mixed in. Additionally, a suitable primer can be applied to the surface of the adherend or substrate, and the curable organopolysiloxane composition of the present invention can be adhered to the primer coating surface.

[0094] There is no limitation on the method of applying the curable organopolysiloxane composition of the present invention to the adherend or matrix, and it can be carried out by coating or dispensing. For example, the following methods can be used: gravure printing coating, offset printing coating, gravure offset printing, roller coating, air knife coating, curtain coating, comma knife coating, bar coating, etc., or a dispenser using a syringe-type, volumetric metering, non-contact, tubular, or plunger-type dispensing method to apply a small amount of the composition to a specific location, etc.

[0095] The curable organopolysiloxane composition of the present invention is suitable for use as a filler, potting compound, sealant, or adhesive for building components, electrical / electronic parts, or vehicle parts. Specifically, it can be used as a filler for bonding glass, a sealant for bathroom units, an adhesive or sealant for lighting parts of automobiles and other vehicles, and a protective agent or adhesive (sealant, coating material, potting compound, adhesive) for electrical / electronic parts, etc.

[0096] The curable organopolysiloxane composition of the present invention exhibits excellent improvement on the initial adhesion of various substrates in contact during curing, especially metal substrates such as uncleaned aluminum die castings, and organic resins such as polybutylene terephthalate (PBT), polyphenylene sulfide (PPS), and polycarbonate (PC). Its adhesion durability after curing is particularly excellent, achieving high adhesion strength. Therefore, it is especially suitable as a protective agent or adhesive composition for electrical / electronic components. Furthermore, the curable organopolysiloxane composition of the present invention can be cured at relatively low temperatures, making it particularly suitable as a protective agent or adhesive for plastic parts that lack heat resistance, an adhesive for optical components such as IR filters and camera lenses that are prone to deterioration due to deformation, and a protective agent or adhesive for electrical / electronic components such as motors and coils that use magnets or are susceptible to magnetic influence, such as microphones and speakers.

[0097] Similarly, even if a large amount of inorganic fillers, especially thermally conductive or conductive fillers such as silver powder or silver-coated microparticles, are mixed into the curing organic polysiloxane composition involved in the present invention, no curing problems will occur. It has excellent improvement effect on the initial adhesion to various substrates in contact during the curing period, and the adhesion durability after curing is particularly excellent, and a high adhesion strength can be achieved. Therefore, it can be used as a thermally conductive or conductive curing composition (e.g., the same protective agent or adhesive mentioned above).

[0098] The curable organopolysiloxane composition of the present invention can activate component (D), i.e., the hydrogenation silylation catalyst, by irradiation with high-energy lines such as ultraviolet light, thereby initiating a hydrogenation silylation reaction in the composition and forming a cured product. The types of high-energy lines are as described above. The irradiation dose varies depending on the type of component (D). If it is ultraviolet light, the cumulative irradiation dose at 365 nm is preferably in the range of 100 mJ / cm² to 100 J / cm², and can also be in the range of 500 mJ / cm² to 50 J / cm² or 500 mJ / cm² to 20 J / cm². That is, the curable organopolysiloxane composition of the present invention can be triggered by irradiation with high-energy lines such as ultraviolet light to begin the curing reaction. Furthermore, once the (D) component, namely the hydrogenated silanized catalyst, is activated, it will undergo a curing reaction over time under conditions such as room temperature, even after the high-energy radiation is stopped, forming a hardened product. Therefore, it can be cured at relatively low temperatures, from below 80°C to room temperature (25°C) to 80°C. The curable polysiloxane composition of this invention can be cured at room temperature or by heating. To accelerate curing, heating can be performed simultaneously at a low temperature. The heating temperature is preferably from room temperature to 10°C, and more preferably in the range of 40 to 80°C. In addition, the curable organopolysiloxane composition of this invention has the following advantages: when irradiated with high-energy radiation such as ultraviolet light, even without heating, especially at temperatures exceeding 120°C, a good curing reaction can be carried out, and initial adhesion and strong adhesion strength can be achieved. Furthermore, as described below, the curable organopolysiloxane composition of the present invention will not possess catalytic activity if it is not irradiated with high-energy rays such as ultraviolet light. Therefore, as a single-liquid composition, it can be stably stored at low temperatures (especially -20°C to 5°C). In addition, if a faster curing speed is required, the amount of high-energy irradiation can be increased, or it can be cured by heating to a temperature exceeding 80°C.

[0099] In addition, the curable organopolysiloxane composition of the present invention also has the following characteristics: by irradiating high-energy rays such as ultraviolet light, the (D) component, namely the hydrogenated silanization catalyst, is activated. When assembling / joining components at temperatures ranging from room temperature (25°C) to 80°C, the curing reaction can be carried out with sufficient usable time (open time). Therefore, after assembly / joining, for parts that are difficult to be irradiated with ultraviolet light, by irradiating them with light beforehand and then performing assembly / joining, the timing of the start of the curing (adhesion) reaction can be controlled to a certain extent. Adhesives with excellent curing properties / adhesion strength can be applied to parts that are originally difficult to be irradiated with ultraviolet light. Unlike conventional photocurable compositions, it is less likely to cause problems of poor curing or poor adhesion in the shaded areas.

[0100] [Single-component composition] The curable organopolysiloxane composition of the present invention is a single-component composition formed by pre-mixing all components. It eliminates the need to separate the catalyst, etc., used as a curing agent, to form a multi-component formulation. It can be stably stored and used as a single-component composition at low temperatures. Furthermore, as described above, by irradiating high-energy rays such as ultraviolet light, a curing reaction can be carried out at low temperatures, achieving excellent adhesion to the substrate. Therefore, it has the advantages of being easy to use and avoiding problems such as material loss, as it eliminates the need for pre-mixing processes required for multi-component compositions. Moreover, the curable organopolysiloxane composition of the present invention can be stably stored even when pre-mixed in small-scale packaging. Therefore, it has the advantage of providing a stable and economical product for micro-coating applications requiring small-scale discharge and use.

[0101] [Curing Compound] This invention also relates to a curable compound of the curable organopolysiloxane composition of this invention. By curing, the curable organopolysiloxane composition of this invention can form a polysiloxane rubber composition having a JIS A hardness of 5 or more, preferably 10 to 90. That is, the curable compound of the curable organopolysiloxane composition of this invention has a JIS A hardness of 5 or more, preferably 10 to 90. By ensuring that the hardness of the curable organopolysiloxane composition is within the above range, a curable compound with excellent adhesion can be obtained.

[0102] [Protective agents or adhesives, and electronic devices] The curable organopolysiloxane composition of the present invention can provide electrical / electronic devices having the cured form thereof. In particular, the composition is characterized by the fact that, with the above-described structure, even in small quantities and thin layers, it can achieve a strong initial bond to the adherend and a high bond strength. Furthermore, it also has the following characteristics: regardless of whether it is a single-component type, it can be cured at low temperatures by irradiation with high-energy rays such as ultraviolet light, achieving a strong bond. Therefore, the adhesive layer containing the curable organopolysiloxane composition of the present invention is firmly bonded to various adherends, forming an adhesive state that is not easily peeled off due to interface peeling, etc. (when subjected to strong peeling, it becomes a cohesive failure mode). Specifically, the curable organopolysiloxane composition of the present invention can be used in electrical / electronic devices having an adhesive layer or a protective layer. Furthermore, the curable organopolysiloxane composition involved in this invention can exhibit high initial adhesion and bonding strength to the adherend, even in bonding forms other than film bonding. Therefore, it is also useful as a previously used thick-coat pigment, potting compound, sealant or sealant, and can provide electrical / electronic machines with an adhesive layer or protective layer.

[0103] The electrical / electronic components involved in this invention are not particularly limited in that they are formed by enclosing or sealing with the aforementioned composition. Examples include electronic devices containing metal electrodes such as silver, copper, aluminum, or gold formed on substrates such as glass, epoxy resin, polyimide resin, phenolic resin, or ceramics; or metal oxide film electrodes such as ITO (Indium Tin Oxide). Protective agents or adhesives containing the curable organopolysiloxane composition involved in this invention are single-component, have low-temperature curing properties, thus exhibiting excellent operability and excellent initial adhesion improvement. Furthermore, their adhesion durability after curing is particularly excellent, achieving high adhesion strength. Therefore, when used as adhesives, potting materials, coating materials, or sealing materials for bonding, enclosing, or sealing electrical / electronic components, they can improve the reliability and durability of such components. They are particularly suitable as protective agents or adhesives for plastic parts, adhesives for optical parts, and protective agents or adhesives for parts such as motors, coils, microphones, and speakers.

[0104] The protective agent or adhesive for electrical / electronic components of the present invention can also be used as a sealing material for structures containing metals and / or resins that require durability and water resistance, such as peripheral parts of electrical / electronic machines or automotive component boxes, terminal boxes, lighting components, and solar cell modules. For example, when used in circuit boards and their storage boxes for power semiconductor applications such as engine control or power transmission systems and air conditioning controls in conveyors, it exhibits excellent initial adhesion and adhesion durability. Furthermore, when assembled into automotive electronic components such as electronic control units (ECUs) and used in harsh environments, it also provides excellent adhesion durability and improves the reliability, durability, and water resistance to rain and other substances of such power semiconductors or automotive components. There are no particular limitations on its use; for example, it can be used in the shape of an elastic sealing material in a waterproof structure for an automotive engine control circuit as described in Japanese Patent Application Publication No. 2007-235013. Similarly, it can be used as a sealing material for waterproofing purposes in automotive wiring harnesses with attached terminals as described in Japanese Patent Application Publication No. 2009-135105, and also as a waterproofing agent containing polysiloxane resin in the wire waterproofing method and wire waterproofing structure described in Japanese Patent Application Publication No. 2012-204016. Furthermore, it can also be used as a sealing resin in solar cell modules, terminal boxes, and connection methods of solar cell modules as described in Japanese Patent Application Publication No. 2002-170978, etc.

[0105] The protective agent or adhesive for electrical / electronic components of the present invention can be used as a thermally conductive or electrically conductive material. Specifically, for heat-generating components that are designed for cooling, it can be used as a thermally conductive material (thermally conductive component) at the interface between the thermal boundary of the heat-generating component and a heat dissipation component such as a heat sink or circuit board, thereby forming a heat dissipation structure incorporating the thermally conductive material. Here, there are no particular limitations on the type, size, or detailed structure of the heat-generating component. Furthermore, depending on the amount of thermally conductive filler, a thermal conductivity of 2.0 W / mK or higher is possible, preferably 3.5 W / mK or higher, and more preferably 4.0 W / mK or higher is acceptable. There are no particular limitations on electrical / electronic devices incorporating this type of thermally conductive component. Examples include secondary batteries such as cell-type lithium-ion batteries and battery stack-type fuel cells; electronic circuit boards such as printed circuit boards; IC chips that encapsulate optoelectronic semiconductor elements such as diodes (LEDs), organic electroluminescent devices (organic ELs), laser diodes, and LED arrays; CPUs used in electronic devices such as personal computers, digital video discs, mobile phones, and smartphones; and LSI chips such as driver ICs and memory chips. Furthermore, when used as a conductive material, it can be used as a grounding, static electricity removal, and EMI shielding material for electrical / electronic components. Examples

[0106] The following examples illustrate the present invention, but the present invention is not limited thereto. Furthermore, the adhesion of the curable organopolysiloxane composition was evaluated by the following method.

[0107] <Preparation Method of Curable Organopolysiloxane Composition> The curable organopolysiloxane composition shown in Table 1 below is prepared. Specifically, components (A-1), (A-2), (B), (E-1), and (E-2) are pre-mixed to form a mixture, which is then thoroughly stirred before entering a defoaming process. Furthermore, components (C-1) or (C-2), (D-1) or (D-2), (F-1), (F-2), and (F-3) are mixed and then added to the above mixture using a cartridge mixer. The resulting liquid is placed in a plastic tube sealed with aluminum.

[0108] [Viscosity Assessment] The viscosity of the obtained curable organopolysiloxane composition was measured using a rheometer (Anton Paar MCR-102) according to the capillary rheometry method at shear rates from 0.05 to 100 / s. The viscosity at a shear rate of 10 / s was recorded. Subsequently, the viscosity change was calculated using the formula: (Viscosity after 3 days at 25°C and 50% humidity) / (Initial viscosity) × 100. If no viscosity change occurs (good assessment), this value should be less than 150%. Therefore, a value less than 150% is assessed as "OK", and a value exceeding 150% is assessed as "NG", and this is recorded in the table.

[0109] [Adhesion (Destruction Mode) Evaluation in Adhesion Test] Two polycarbonate (PC) resin sheets were prepared as substrates. The substrate surfaces were pre-cleaned with isopropanol, coated with the prepared curable organopolysiloxane composition, and then irradiated with UV light (365 nm, 4 J / cm2) to activate the platinum catalyst. Subsequently, a Teflon (registered trademark) spacer was used within 5 minutes, and a 10×10×1 mm aluminum die-casting was used to press the substrate to a thickness of 360 µm. The substrate was then allowed to stand for 2 hours at 80±2℃ or 150±2℃ to harden the curable organopolysiloxane composition for determination of the destruction mode in the adhesion test.

[0110] Confirm the failure state of the adhesive after the obtained adhesive test specimen breaks. The failure state of the adhesive is divided into two types: cohesive failure and interfacial peeling (failure modes of the adhesive layer). Under ideal adhesion conditions, the failure mode is cohesive failure. Here, "OK" and "NG" in Table 1 below indicate that the failure modes are "cohesive failure (CF)" and "interfacial peeling (AF)" respectively.

[0111] The Si-H / Si-Vi system in Table 1 below represents the ratio of the mole number of silicon atoms bonded to hydrogen atoms to the mole number of vinyl groups in the composition.

[0112] The components used in Table 1 are shown below. Furthermore, the viscosity is a value measured at 25°C using a rotational viscometer.

[0113] (A-1) Dimethyl polysiloxane with dimethylvinylsiloxy groups at both ends of the molecular chain (viscosity: 10,000 mPa / s, Vi content: 0.13 wt%) (A-2) 74 wt% of dimethyl polysiloxane with dimethylvinylsiloxy groups at both ends of the molecular chain (viscosity: 2,000 mPa / s, Vi content: 0.23 wt%) and 26 wt% of smoked silica surface-treated with hexamethyldisilazane (B) Methylhydrosiloxane with trimethylsiloxy groups at both ends of the molecular chain (SiH content: 1.6 wt%) (C-1) (Methylcyclopentadiene)trimethylplatinum(IV) (C-2) Platinum 1,3-divinyl-1,1,3,3-tetramethyldisiloxane complex (platinum metal mass unit: 1.6 wt%) (D-1) Tetratert-butoxytitanium (D-2) Aluminum acetoalkoxydiisopropoxide represented by the following formula (= Aluminum isopropoxide containing C18 alkyl acetoacetate) Chemical Formula 15 (E-1) Tetramethyltetravinylcyclotetrasiloxane (E-2) 1-Ethynyl-2-cyclohexanol (F-1) Hexamethoxysilylhexane (F-2) 3-Glycidoxyprolyltrimethoxysilane (F-3) Siloxane containing SiH and trialkoxysilyl represented by the following formula (viscosity: 1.6 mPa / s, SiH content: 0.35 wt%) Chemical Formula 16

[0114] [Table 1] Composition, viscosity and adhesion of curable organopolysiloxane compositions Ingredients / Quantity (parts by weight) Example Comparative example 1 2 3 1 2 3 4 A-1 54.65 54.65 54.65 54.65 54.65 54.65 54.65 A-2 40 40 40 40 40 40 40 B 2.1 2.1 2.1 2.1 2.1 2.1 2.1 C - 1 0.16 0.16 0.16 0.16 0 0 0 C - 2 0 0 0 0 0.34 0.17 0.17 D - 1 0.1 0 0.1 0 0.1 0.1 0.1 D - 2 0 0.1 0 0 0 0 0 E - 1 0.4 0.4 0.4 0.4 0.4 0.4 0.4 E - 2 0 0 0 0 0 0.16 0.16 F - 1 0.8 0.8 0.8 0.8 0.8 0.8 0.8 F - 2 0.8 0.8 0.8 0.8 0.8 0.8 0.8 F - 3 0 0 0.5 0 0 0 0 Si-H / Si-Vi 1.5 1.5 1.5 1.5 1.5 1.5 1.5 Platinum content (ppm) 20 20 20 20 20 10 10 Hardening conditions for adhesion test 80℃, 2 hours 150℃, 1 hour Viscosity change after 3 days at 25℃ and 50% humidity OK OK OK OK Hardening during mixing (NG) OK OK For PC connectivity Early stage OK OK OK NG Hardening during mixing (NG) Unhardened PC Transformation 25℃, 50%RH, 3 days later OK OK OK NG Hardening during mixing (NG) Unhardened PC Transformation

[0115] Comparative Example 1, lacking a condensation catalyst, exhibited poor adhesion to PC, and interfacial delamination occurred from the initial stage during the failure mode evaluation. Furthermore, compared to the present invention using a photoactive catalyst for hydrogenation silanization, Comparative Examples 2 and 3, using a non-photoactive catalyst for hydrogenation silanization, could not control adhesion or curing properties, resulting in either curing during mixing (Comparative Example 2) or no curing (Comparative Example 3). Moreover, in Comparative Example 4, where the curing temperature was increased to initiate curing compared to Comparative Example 3, PC deformed. Therefore, Comparative Examples 3 and 4 could not achieve good curing properties at low temperatures, and using high temperatures would damage the substrate, thus their practicality was poor.

[0116] On the other hand, regarding the curable organopolysiloxane composition of this invention shown in Examples 1 to 3, the failure mode relative to PC is cohesive failure (CF), and the viscosity change after 3 days at 25°C and 50% humidity is also small, less than 150%. That is, the composition related to this invention, using both (C) a photoactive hydrogenated silanization catalyst and (D) a condensation reaction catalyst, achieves strong adhesion to the adherend, with minimal viscosity change over time, exhibiting stable curing characteristics. Industrial Applicability

[0117] The curable organopolysiloxane composition of the present invention can be stored in a single liquid form, thus exhibiting excellent operability. Furthermore, it can be cured at relatively low temperatures by irradiation with high-energy rays such as ultraviolet light, exhibiting excellent long-term adhesion to substrates, thus achieving good adhesion strength even on difficult-to-bond substrates such as resins. In addition, it also exhibits excellent adhesion during low-temperature curing, therefore it can be used as a protective agent or adhesive for heat-deformable plastic parts, an adhesive for optical parts, and a protective agent or adhesive for parts such as motors, coils, microphones, and speakers. Moreover, even when mixed with a large amount of inorganic fillers, the curable organopolysiloxane composition of the present invention can be cured at relatively low temperatures by irradiation with high-energy rays such as ultraviolet light, exhibiting excellent adhesion, thus it can be used as a functional filler with thermal or electrical conductivity. Furthermore, when the curable organopolysiloxane composition of the present invention is used for assembly / joining of components after irradiation with ultraviolet light, it can ensure sufficient usable time (open time) in practical applications. Therefore, for parts that are difficult to apply conventional photocurable compositions or that are difficult to irradiate with ultraviolet light after assembly / joining, the curing reaction can be carried out by irradiating light in advance, thereby improving the assembly / joining process and work efficiency of the aforementioned optical parts. [Simplified Explanation of the Diagram]

[0119] None

Claims

1. A protective agent for electrical / electronic components comprising a single-component curable organopolysiloxane composition, the single-component curable organopolysiloxane composition comprising the following (A) to (F): (A) an organopolysiloxane having at least two alkenyl groups in one molecule, (B) an organopolysiloxane having at least two silicon atoms bonded to hydrogen atoms in one molecule, (C) a photoactive catalyst for hydrogenation silylation, (D) a catalyst for condensation reaction, (E) a curing inhibitor, and (F) a tackifier having at least one terminal trialkoxysilyl group; the (F) component is of the following formula: Formula 1 (where R1 is an alkyl, cycloalkyl, aryl, aralkyl, or haloalkyl group without aliphatic unsaturated bonds, R2 is an alkyl group, R3 is an alkyl group, and p is an integer from 1 to 50). The term refers to siloxanes containing trialkoxysilyl groups.

2. The protective agent for electrical / electronic components as described in claim 1, wherein, The content of component (B) of the curable organopolysiloxane composition is in the range of 0.3 to 10 molar ratio of alkenyl groups, silicon atoms bonded to hydrogen atoms in all components of the curable organopolysiloxane composition.

3. A protective agent for electrical / electronic components as described in claim 1, wherein, The content of component (B) of the curable organopolysiloxane composition is in the range of 0.3 to 10 molar ratio of alkenyl groups, silicon atoms bonded to hydrogen atoms in all components of the curable organopolysiloxane composition, and the content of component (D) of the curable organopolysiloxane composition is in the amount of less than 0.5% by mass relative to the total mass of the curable organopolysiloxane composition.

4. A protective agent for electrical / electronic components as described in claim 1, wherein, The content of the (F) component of the curable organopolysiloxane composition is 0.05 to 10% by mass relative to the total mass of the curable organopolysiloxane composition.

5. A protective agent for electrical / electronic components as described in claim 1, wherein, Furthermore, it includes: (G) a bonding accelerator, which is different from (F) a tackifier, and is selected from (i) a siloxane having at least one silicon atom bonded to an alkenyl group or a silicon atom bonded to a hydrogen atom and a silicon atom bonded to an alkoxy group, (ii) an organosiloxane having at least one silicon atom bonded to an alkenyl group, a silicon atom bonded to an alkoxy group and a silicon atom bonded to a monovalent organic group containing an epoxy group, and (iii) a silane or siloxane having at least one silicon atom bonded to an alkoxy group and a molecule having at least one silicon atom bonded to an alkoxy group and a molecule having at least one silicon atom bonded to an alkoxy group and a molecule having at least one silicon atom bonded to an alkoxy group and a monovalent organic group containing an epoxy group. The group consisting of at least one mixture or reaction mixture of organosilicones having at least one silicon atom bonded to a hydroxyl group and a silicon atom bonded to an alkenyl group, (iv) a mixture or reaction mixture of an organosilicon or organosilicon having at least one silicon atom bonded to an alkoxy group and a silicon atom bonded to a monovalent organic group containing an epoxy group and an organosilicon having at least one silicon atom bonded to a hydroxyl group and a silicon atom bonded to an alkenyl group, and (v) at least one of the following: alkylalkoxysilanes.

6. A protective agent for electrical / electronic components as described in claim 1, wherein, This further includes: (H) inorganic fillers.

7. A protective agent for electrical / electronic components as described in claim 1, wherein, Curable organopolysiloxane compositions can be cured at temperatures below 80°C.

8. A protective agent for electrical / electronic components as described in claim 1, wherein, Curable organopolysiloxane compositions can be cured to form polysiloxane rubber compositions with a JIS A hardness of 5 or higher.

9. An adhesive for electrical / electronic components comprising a single-component curable organopolysiloxane composition, the single-component curable organopolysiloxane composition comprising the following (A) to (F): (A) an organopolysiloxane having at least two alkenyl groups in one molecule, (B) an organopolysiloxane having at least two silicon atoms bonded to hydrogen atoms in one molecule, (C) a photoactive catalyst for hydrogenation silylation, (D) a catalyst for condensation reaction, (E) a curing inhibitor, and (F) a tackifier having at least one terminal trialkoxysilyl group; the (F) component is of the following formula: Formula 1 (where R1 is an alkyl, cycloalkyl, aryl, aralkyl, or haloalkyl group without aliphatic unsaturated bonds, R2 is an alkyl group, R3 is an alkyl group, and p is an integer from 1 to 50). The term refers to siloxanes containing trialkoxysilyl groups.

10. A conductive curable composition comprising a single-component curable organopolysiloxane composition comprising the following (A) to (F): (A) an organopolysiloxane having at least two alkenyl groups in one molecule, (B) an organopolysiloxane having at least two silicon atoms bonded to hydrogen atoms in one molecule, (C) a photoactive catalyst for hydrogenation silylation, (D) a catalyst for condensation reaction, (E) a curing inhibitor, and (F) a tackifier having at least one terminal trialkoxysilyl group; wherein the (F) component is of the following formula: Formula 1 (where R1 is an alkyl, cycloalkyl, aryl, aralkyl, or haloalkyl group without aliphatic unsaturated bonds, R2 is an alkyl group, R3 is an alkyl group, and p is an integer from 1 to 50). The term refers to siloxanes containing trialkoxysilyl groups.

11. A thermally conductive curable composition comprising a single-component curable organopolysiloxane composition comprising the following (A) to (F): (A) an organopolysiloxane having at least two alkenyl groups in one molecule, (B) an organopolysiloxane having at least two silicon atoms bonded to hydrogen atoms in one molecule, (C) a photoactive catalyst for hydrogenation silylation, (D) a catalyst for condensation reaction, (E) a curing inhibitor, and (F) a tackifier having at least one terminal trialkoxysilyl group; wherein the (F) component is of the following formula: Formula 1 (where R1 is an alkyl, cycloalkyl, aryl, aralkyl, or haloalkyl group without aliphatic unsaturated bonds, R2 is an alkyl group, R3 is an alkyl group, and p is an integer from 1 to 50). The term refers to siloxanes containing trialkoxysilyl groups.

12. An electrical / electronic machine comprising a curable product of a single-component curable organopolysiloxane composition, the single-component curable organopolysiloxane composition comprising the following (A) to (F): (A) an organopolysiloxane having at least two alkenyl groups in one molecule, (B) an organopolysiloxane having at least two silicon atoms bonded to hydrogen atoms in one molecule, (C) a photoactive catalyst for hydrogenation silylation, (D) a catalyst for condensation reaction, (E) a curing inhibitor, and (F) a tackifier having at least one terminal trialkoxysilyl group; wherein the (F) component is of the following formula: Formula 1 (where R1 is an alkyl, cycloalkyl, aryl, aralkyl, or haloalkyl group without aliphatic unsaturated bonds, R2 is an alkyl group, R3 is an alkyl group, and p is an integer from 1 to 50). The term refers to siloxanes containing trialkoxysilyl groups.

13. An electrical / electronic machine comprising electrical / electronic components bonded, enclosed, sealed, or filled with a single-component curable organopolysiloxane composition, the single-component curable organopolysiloxane composition comprising the following (A) to (F): (A) an organopolysiloxane having at least two alkenyl groups in one molecule, (B) an organopolysiloxane having at least two silicon atoms bonded to hydrogen atoms in one molecule, (C) a photoactive catalyst for hydrogenation silylation, (D) a catalyst for condensation reaction, (E) a curing inhibitor, and (F) a tackifier having at least one terminal trialkoxysilyl group; wherein the (F) component is of the following formula: Formula 1 (where R1 is an alkyl, cycloalkyl, aryl, aralkyl, or haloalkyl group without aliphatic unsaturated bonds, R2 is an alkyl group, R3 is an alkyl group, and p is an integer from 1 to 50). The term refers to siloxanes containing trialkoxysilyl groups.

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