Compound

Abstract

This invention provides a novel compound that fully absorbs light around 440 nm and has high weather resistance. The compounds of the present invention comprise anions having a partial structure as shown in formula (X). [In formula (X), ring W1 represents a ring structure having at least one substituent. Ring W1 is preferably a ring with 5 to 7 carbon atoms.]

Description

Technical Field ,

[0001] The present invention relates to a compound. Prior Art

[0002] In recent years, due to the popularization of mobile devices such as smartphones, the time of visually viewing a display at a short distance has been continuously increasing. As the time of visually viewing a display at a short distance increases, the influence of light in the wavelength range of 400 nm to 500 nm (so-called blue light) on health has also been attracting much attention. One of the methods for reducing the influence of blue light on health is to provide a function of blocking blue light on the surface of a display, glasses, contact lenses, etc. An absorber that absorbs light with a wavelength of 400 to 500 nm can be mixed in the surface of a display, glasses, contact lenses, etc., or a layer containing an absorber that absorbs light with a wavelength of 400 to 500 nm can be laminated to provide a function of blocking blue light.

[0003] For example, it is described in Reference 1 that C.I. Solvent Yellow 33, which belongs to a quinoline-based compound, is used as a compound that effectively absorbs light near a wavelength of 440 nm even among blue light. [Prior Art Documents] [Patent Documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2015-17152 Summary of the Invention Problems to be Solved by the Invention

[0005] However, quinoline-based compounds such as C.I. Solvent Yellow 33 have a problem of insufficient weather resistance. Means for Solving the Problems

[0006] The present invention includes the following inventions. [1] A compound comprising an anion having a partial structure represented by formula (X). [In formula (X), ring W1 represents a ring structure having at least one substituent.] [2] The compound according to [1], wherein the anion having the partial structure represented by formula (X) is any one of the anions represented by formula (I) to formula (VIII). [In the formula, ring W1 represents the same meaning as above.] Rings W2, W3, W4, W5, W6, W7, W8, W9, W10, W11, W12, W13, and W14 each independently represent a ring structure, which may have substituents. R1, R2, R4, R5, R12, R14, R15, R22, R24, R25, R32, R34, R35, R42, R44, R45, R52, R54, R55, R62, R64, R65, R71, R72, R74, R75, R81, R82, R84, R85, R91, R92, R94, R95, R101, R102, R104, R105, R111, R112, R114, R115, R121, R122, R124, R125, R131, R132, R134, and R135 each independently represent electron-withdrawing groups. R3 represents a monovalent substituent. R13, R23, R33, R43, R53, R63 and R133 represent monovalent substituents. R1 and R2 can be connected to each other to form a loop. R2 and R3 can be connected to each other to form a loop. R3 and R4 can be connected to form a loop. R4 and R5 can be connected to form a loop. R12 and R13 can be connected to each other to form a loop. R13 and R14 can be connected to form a loop. R14 and R15 can be connected to form a loop. R22 and R23 can be connected to each other to form a loop. R23 and R24 can be connected to each other to form a loop. R24 and R25 can be connected to form a loop. R32 and R33 can be connected to each other to form a loop. R33 and R34 can be connected to each other to form a loop. R34 and R35 can be connected to form a loop. R42 and R43 can be connected to each other to form a loop. R43 and R44 can be connected to form a loop. R44 and R45 can be connected to form a loop. R52 and R53 can be connected to each other to form a loop. R53 and R54 can be connected to each other to form a loop. R54 and R55 can be connected to form a loop. R62 and R63 can be connected to each other to form a loop. R63 and R64 can be connected to form a loop. R64 and R65 can be connected to form a loop. R71 and R72 can be connected to each other to form a ring. R74 and R75 can be connected to form a ring. R81 and R82 can be connected to each other to form a loop. R84 and R85 can be connected to form a loop. R91 and R92 can be connected to each other to form a ring. R94 and R95 can be connected to form a ring. R101 and R102 can be connected to each other to form a ring. R104 and R105 can be connected to form a ring. R111 and R112 can be connected to each other to form a loop. R114 and R115 can be connected to each other to form a ring. R121 and R122 can be connected to each other to form a loop. R124 and R125 can be connected to each other to form a ring. R131 and R132 can be connected to each other to form a loop. R132 and R133 can be connected to each other to form a loop. R133 and R134 can be connected to each other to form a loop. R134 and R135 can be connected to form a loop. Rx1, Rx4, and Rx7 independently represent single-bond or divalent linker bases, respectively. Rx2 and Rx5 represent trivalent linker bases independently. Rx3 and Rx6 independently represent four-valent linker bases. [3] The compound as described in [2], wherein R3 is an electron-withdrawing group. [4] A compound as described in [2] or [3], wherein at least one selected from R1, R2, R3, R4 and R5 is a cyano group, a nitro group, a haloalkyl group, a haloaryl group, -CO-R1, -CO-O-R2, -CO-NR3R3k, -CO-S-R4, -CS-R5, -CS-O-R6, -CS-S-R7, -SO-R8, -SO2-R9 (R1, R2, R3, R3k, R4, R5, R6, R7, R8 and R9 each independently represent a hydrocarbon group or a halogen atom which may have a substituent), -OCF3, -SCF3, -SF5, -SF3, or -SO3H. [5] A compound as described in any one of [2] to [4], wherein at least one selected from R1, R2, R3, R4 and R5 is a cyano group, a nitro group, -CO-R1, -CO-O-R2, -SO2-R9 (R1, R2 and R9 each independently represent a hydrocarbon group or a halogen atom which may have a substituent), -SF5, -SF3, -SO3H, -SO2H, -OCF3 or -SCF3. [6] A compound as described in any one of [2] to [5], wherein at least one selected from R1, R2, R3, R4 and R5 is a cyano group or a nitro group. [7] A compound as described in any one of [1] to [6], which shows a maximum absorption between a wavelength of 400 nm and a wavelength of 550 nm. [8] A compound as described in any one of [1] to [7], wherein the extinction coefficient in the maximum absorption wavelength is 0.5 or more. [9] A compound as described in any one of [1] to [8] satisfies the following formula (a). ε(λmax) / ε(λmax + 30nm) ≧ 10 (a) [In the formula, ε(λmax) represents the extinction coefficient at the maximum absorption wavelength (λmax), ε(λmax + 30nm) represents the extinction coefficient at the wavelength of the maximum absorption wavelength (λmax) + 30nm, Also, the unit of the extinction coefficient is L / (g‧cm).]

[10] A composition comprising the compound as described in any one of [1] to [9].

[11] A molded article formed by molding the composition described in

[10] .

[12] The molded article as described in

[11] , the transmittance of which at a wavelength of 440 nm is 50% or less. Advantages of the Invention <This invention provides a novel compound that fully absorbs light with a wavelength around 440 nm and has high weather resistance. Implementation

[0008] The compounds of the present invention are compounds comprising anions having a partial structure as shown in formula (X) (hereinafter, sometimes referred to as compound (X)). [In formula (X), ring W1 represents a ring having at least one substituent.]

[0009] There are no particular restrictions on the ring structure of ring W1. Ring W1 can be a single ring or a condensed ring. In terms of the constituent elements of the ring, ring W1 can be a heterocycle containing heteroatoms (e.g., oxygen atoms, sulfur atoms, nitrogen atoms, etc.) or an aliphatic hydrocarbon ring composed of carbon atoms and hydrogen atoms.

[0010] Ring W1 is typically a ring with 5 to 18 carbon atoms, with a 5 to 7-membered ring structure being preferred, and a 6-membered ring structure being even better. Ring W1 is preferably a ring with 5 to 7 carbon atoms, and a 6-membered ring structure is even better. The W1 series is preferably made with a single ring. The ring W1 system is preferably composed of aliphatic hydrocarbon rings (alicyclic hydrocarbon groups).

[0011] Examples of ring structures in the W1 system include the following ring structures.

[0012] The ring W1 system has at least one substituent, and the substituent is located between the two double bonds of the ring W1. That is, the compounds of the present invention preferably comprise an anion having a partial structure shown in formula (X-1). [In formula (X-1), ring W1 has the same meaning as above, and R3 represents a monovalent substituent.]

[0013] The R3 group can be any monovalent substituent without any particular limitation. Examples include: monovalent aliphatic hydrocarbon groups, monovalent aromatic hydrocarbon groups, electron-withdrawing groups, electron-donating groups, heterocyclic groups, etc.

[0014] The monovalent aliphatic hydrocarbon group shown in R3 can include alkyl groups with 1 to 25 carbon atoms, such as methyl, ethyl, n-propyl, isopropyl, n-butyl, tributyl, dibutyl, n-pentyl, isopentyl, n-hexyl, isohexyl, n-octyl, isooctyl, n-nonyl, isononyl, n-decyl, isodecyl, n-dodecyl, isododecyl, undecyl, lauryl, myristyl, cetyl, stearyl, 2-ethylhexyl, 4-butyloctyl, etc.; cycloalkyl groups with 3 to 25 carbon atoms, such as cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, etc.; cycloalkyl groups with 4 to 25 carbon atoms, such as cyclohexylmethyl; and alkylcycloalkyl groups with 4 to 25 carbon atoms, such as isocamphenyl. Preferably, it is an alkyl group with 1 to 12 carbon atoms, either a straight-chain or branched chain.

[0015] The monovalent aromatic hydrocarbon group shown in R3 can include aryl groups with 6 to 18 carbon atoms such as phenyl, naphthyl, anthracene, fused tetraphenyl, fused pentaphenyl, phenanthrene, benzo[a]phenanthrene, triphenyl, tetraphenyl, pyrene, peryl, keryl, and biphenyl; aralkyl groups with 7 to 18 carbon atoms such as benzyl, phenylethyl, and naphthylmethyl; and arylalkoxy groups such as phenoxyethyl, phenoxydiethylene glycol, and phenoxypolyalkylene glycol, with aryl groups having 6 to 18 carbon atoms being preferred, and phenyl or benzyl being even more preferred.

[0016] The electron-donating groups shown in R3 can include hydroxyl groups; alkoxy groups with 1 to 12 carbon atoms, such as methoxy, ethoxy, propoxy, butoxy, pentoxy, hexoxy, heptoxy, and octoxy; and amino groups, such as monomethylamino, monoethylamino, dimethylamino, diethylamino, and methylethylamino, which can be replaced by one or two alkyl groups with 1 to 6 carbon atoms.

[0017] The heterocyclic groups shown in R3 can include pyrrolidine cyclic group, pyrrololin cyclic group, imidazolinidine cyclic group, imidazolin cyclic group, oxazolin cyclic group, thiazolin cyclic group, piperidine cyclic group, morpholin cyclic group, piperazine cyclic group, indole cyclic group, isoindole cyclic group, quinoline cyclic group, thiophene cyclic group, pyrrole cyclic group, thiazolin cyclic group and furan cyclic group, etc., which are aliphatic heterocyclic groups with 4 to 20 carbons or aromatic heterocyclic groups with 3 to 20 carbons.

[0018] Examples of electron-withdrawing groups represented by R3 include: halogen atoms, nitro, cyano, carboxyl, haloalkyl, haloaryl, -OCF3, -SCF3, -SF5, -SF3, -SO3H, -SO2H, and groups represented by formula (z-1). [*] [-X] [1] [-R]

[0222] [(z-1)] In formula (z-1), R222 represents a hydrogen atom, a halogen atom, or a hydrocarbon group that may have substituents. X1 represents -CO-, -COO-, -OCO-, -CS-, -CSS-, -COS-, -CSO-, -SO-, -SO2-, -NR223CO-, or -CONR224-. R223 and R224 independently represent a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or a phenyl group. * indicates a bond.

[0019] Halogen atoms can be categorized as fluorine, chlorine, bromine, and iodine. Examples of haloalkyl groups include trifluoromethyl, perfluoroethyl, perfluoropropyl, perfluoroisopropyl, perfluorobutyl, perfluorodibutyl, perfluoroterbutyl, perfluoropentyl, perfluorohexyl, dichloromethyl, bromomethyl, and iodomethyl, which have 1 to 25 carbon atoms. More preferably, they are haloalkyl groups with 1 to 12 carbon atoms; more preferably, they are fluoroalkyl groups with 1 to 12 carbon atoms; and even more preferably, they are perfluoroalkyl groups with 1 to 12 carbon atoms. Haloaryl groups can be listed as fluorophenyl, chlorophenyl, bromophenyl, etc., with fluoroaryl groups having 6 to 18 carbons being preferred, perfluoroaryl groups having 6 to 12 carbons being even better, and pentafluorophenyl being the most preferred.

[0020] X1 series components with -CO-, -COO-, or -SO2- are preferred. The halogen atoms shown in R222 can be fluorine, chlorine, bromine, and iodine. The hydrocarbon groups indicated by R222 can include aliphatic hydrocarbon groups with 1 to 25 carbon atoms or aromatic hydrocarbon groups with 6 to 18 carbon atoms. Aliphatic hydrocarbon groups having 1 to 25 carbon atoms can include methyl, ethyl, n-propyl, isopropyl, n-butyl, tributyl, dibutyl, n-pentyl, n-hexyl, 1-methylbutyl, 3-methylbutyl, n-octyl, n-decyl, 2-hexyl-octyl, cyclohexyl, etc., which are straight-chain, branched-chain, or cyclic alkyl groups having 1 to 25 carbon atoms, with alkyl groups having 1 to 12 carbon atoms being preferred. Aromatic hydrocarbon groups with 6 to 18 carbon atoms can be exemplified by aryl groups such as phenyl, naphthyl, anthracene, and biphenyl, which have 6 to 18 carbon atoms; and aralkyl groups such as benzyl, phenylethyl, and naphthylmethyl, which have 7 to 18 carbon atoms. The hydrocarbon group shown in R222 can have substituents such as halogen atoms and hydroxyl groups. The alkyl groups with 1 to 6 carbon atoms shown in R223 and R224 can include straight-chain or branched-chain alkyl groups with 1 to 6 carbon atoms such as methyl, ethyl, n-propyl, isopropyl, n-butyl, tributyl, dibutyl, n-pentyl, n-hexyl, and 1-methylbutyl.

[0021] The preferred radical system shown in formula (z-1) is -CO-R1, -CO-O-R2, -CO-NR3R3k, -CO-S-R4, -CS-R5, -CS-O-R6, -CS-S-R7, -SO-R8, -SO2-R9 (R1, R2, R3, R3k, R4, R5, R6, R7, R8 and R9 independently represent hydrocarbon groups or halogen atoms that may have substituents). -CO-R1, -CO-O-R2, and -SO2-R9 are preferred. -SO2-R9 is even better. -SO2-R10 (R10 can be an aromatic hydrocarbon group with 6 to 18 carbon atoms that has a substituent), -SO2CF3, -SO2CHF2, and -SO2CH2F are preferred.

[0022] R3 series with electron-withdrawing groups is preferred. Cyanoyl, nitro, haloalkyl, haloaryl, -SF5, -SF3, -SO3H, -SO2H, -CO-R1, -CO-O-R2, -CO-NR3R3k, -CO-S-R4, -CS-R5, -CS-O-R6, -CS-S-R7, -SO-R8, -SO2-R9 (R1, R2, R3, R3k, R4, R5, R6, R7, R8, and R9 each independently represent a hydrocarbon group or halogen atom that may have a substituent), -OCF3, or -SCF3 are preferred. Cyano, nitro, -OCF3, -SCF3, -SF5, -SF3, -SO3H, -SO2H, -CO-R1, -CO-O-R2, and -SO2-R9 are even better. Cyano, nitro, -OCF3, -SCF3, -SF5, -SO2CF3, and -SO2-R10 are preferred. Cyano or nitro groups are preferred.

[0023] The cycloW1 system may have substituents other than those shown in R3. These substituents may include halogen atoms such as fluorine, chlorine, bromine, and iodine; aliphatic hydrocarbon groups (preferably alkyl groups with 1 to 12 carbons) such as methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, and nonyl; haloalkyl groups with 1 to 12 carbons such as fluoromethyl, difluoromethyl, trifluoromethyl, 2-fluoroethyl, 2,2-difluoroethyl, 2,2,2-trifluoroethyl, 1,1,2,2-tetrafluoroethyl, and 1,1,2,2,2-pentafluoroethyl; methoxy, ethoxy... Alkoxy groups with 1 to 12 carbon atoms, such as methylthio, propoxy, butoxy, pentylthio, and hexylthio; alkylthio groups with 1 to 12 carbon atoms, such as methylthio, ethylthio, propylthio, butylthio, pentylthio, and hexylthio; fluoroalkoxy groups with 1 to 12 carbon atoms, such as monofluoromethoxy, difluoromethoxy, trifluoromethoxy, 2-fluoroethoxy, and 1,1,2,2,2-pentafluoroethoxy; fluoroalkoxy groups with 1 to 12 carbon atoms, such as trifluoromethanethioalkoxy; amino, methylamino, ethylamino, dimethylamino, and di... Ethylamino, amino groups that may be substituted by one or two alkyl groups having 1 to 6 carbon atoms, such as methylethyl; aminomethylamino, N-methylaminomethyl, N,N-dimethylaminomethyl, etc., aminomethylaminomethyl, etc., where the N-position may be substituted by an alkyl group having 1 to 6 carbon atoms; alkylcarbonyloxy, ethylcarbonyloxy, etc., having 2 to 12 carbon atoms; alkylsulfonyl, ethylsulfonyl, etc., having 1 to 12 carbon atoms; aromatic hydrocarbon groups having 6 to 25 carbon atoms, such as phenyl, naphthyl, diphenyl (preferably aryl groups having 6 to 18 carbon atoms); benzene Arylsulfonyl groups with 6 to 12 carbon atoms, such as alkylsulfonyl; alkoxysulfonyl groups with 1 to 12 carbon atoms, such as methoxysulfonyl and ethoxysulfonyl; acetyl groups with 2 to 12 carbon atoms, such as ethylcarbonyl; aldehyde groups; alkoxycarbonyl groups with 2 to 12 carbon atoms, such as methoxycarbonyl, ethoxycarbonyl, propoxycarbonyl, and butoxycarbonyl; alkoxythiocarbonyl groups with 2 to 12 carbon atoms, such as methoxythiocarbonyl and ethoxythiocarbonyl; cyano; nitro; hydroxyl; thiol; sulfonyl; aminomethyl; carboxyl; -SF3; -SF5, etc.

[0024] The anion having the partial structure shown in formula (X-1) is preferably an anion shown in formula (I) to an anion shown in formula (IV) or an anion shown in formula (VIII). [In the formula, rings W1 and R3 have the same meaning as above.] Rings W2, W3, W4, W5, W6, W7, and W14 each independently represent a ring structure, which may have substituents. R1, R2, R4, R5, R12, R14, R15, R22, R24, R25, R32, R34, R35, R42, R44, R45, R52, R54, R55, R62, R64, R65, R131, R132, R134, and R135 each independently represent electron-withdrawing groups. R13, R23, R33, R43, R53, R63 and R133 represent monovalent substituents. R1 and R2 can be connected to each other to form a loop. R2 and R3 can be connected to each other to form a loop. R3 and R4 can be connected to form a loop. R4 and R5 can be connected to form a loop. R12 and R13 can be connected to each other to form a loop. R13 and R14 can be connected to form a loop. R14 and R15 can be connected to form a loop. R22 and R23 can be connected to each other to form a loop. R23 and R24 can be connected to each other to form a loop. R24 and R25 can be connected to form a loop. R32 and R33 can be connected to each other to form a loop. R33 and R34 can be connected to each other to form a loop. R34 and R35 can be connected to form a loop. R42 and R43 can be connected to form a loop. R43 and R44 can be connected to form a loop. R44 and R45 can be connected to form a loop. R52 and R53 can be connected to each other to form a loop. R53 and R54 can be connected to each other to form a loop. R54 and R55 can be connected to form a loop. R62 and R63 can be connected to each other to form a loop. R63 and R64 can be connected to form a loop. R64 and R65 can be connected to form a loop. R131 and R132 can be connected to each other to form a loop. R132 and R133 can be connected to each other to form a loop. R133 and R134 can be connected to each other to form a loop. R134 and R135 can be connected to form a loop. Rx1 and Rx7 independently represent single-bond or divalent linker bases, respectively. Rx2 represents a trivalent linker. Rx3 represents a four-valent linker base.

[0025] There are no particular limitations on the ring structure of rings W2, W3, W4, W5, W6, W7, and W14. Rings W2 to W7 and W14 can be monocyclic or condensed rings. In terms of the constituent elements of the ring, rings W2 to W7 and W14 can be heterocyclic rings containing heteroatoms (such as oxygen, sulfur, nitrogen, etc.). Rings W2 to W7 and ring 14 are typically rings with 5 to 18 carbon atoms, with 5 to 7-membered rings being preferred, and 6-membered rings being even more preferred. Rings W2 to W7 and ring 14 are preferably rings with 5 to 7 carbon atoms, and 6-membered rings are even more preferred. The preferred rings W2 to W7 and ring 14 are each a single ring independently. Rings W2 to W7 and ring 14 may have substituents. Specifically, rings W1 other than those shown in R3 may have the same substituents.

[0026] The substituents in rings W2 to W7 and ring 14 are preferably alkyl groups having 1 to 12 carbon atoms, alkoxy groups having 1 to 12 carbon atoms, alkylthio groups having 1 to 12 carbon atoms, or amine groups having 1 to 6 carbon atoms.

[0027] Specific examples of rings W2 to W7 and ring 14 can be listed as those that are the same as specific examples of ring W1.

[0028] The monovalent substituents shown in R13, R23, R33, R43, R53, R63, and R133 are not particularly limited, and can be listed as being the same as the monovalent substituents shown in R3. Specifically, monovalent aliphatic hydrocarbon groups, monovalent aromatic hydrocarbon groups, electron-withdrawing groups, electron-donating groups, heterocyclic groups, etc., can be listed. R13, R23, R33, R43, R53, R63, and R133 are preferred systems that independently represent electron-withdrawing groups. Cyanoyl, nitro, haloalkyl, haloaryl, -CO-R1, -CO-O-R2, -CO-NR3R3k, -CO-S-R4, -CS-R5, -CS-O-R6, -CS-S-R7, -SO-R8, -SO2-R9 (R1, R2, R3, R3k, R4, R5, R6, R7, R8, and R9 each independently represent a hydrocarbon group or halogen atom that may have substituents), -OCF3, -SCF3, -SF5, -SF3, -SO2H, or -SO3H are preferred. Cyano, nitro, -OCF3, -SCF3, -SF5, -SF3, -SO3H, -SO2H, -CO-R1, -CO-O-R2, and -SO2-R9 are even better. Cyano, nitro, -OCF3, -SCF3, -SF5, -SO2CF3, and -SO2-R10 are preferred. Cyano or nitro groups are preferred.

[0029] The electron-withdrawing groups shown in R1, R2, R4, R5, R12, R14, R15, R22, R24, R25, R32, R34, R35, R42, R44, R45, R52, R54, R55, R62, R64, R65, R131, R132, R134, and R135 are the same as those shown in R3.

[0030] R1, R2, R4, R5, R12, R14, R15, R22, R24, R25, R32, R34, R35, R42, R44, R45, R52, R54, R55, R62, R64, R65, R131, R132, R134, and R135 represent cyano, nitro, haloalkyl, haloaryl, -CO-R1, and -CO-O- respectively, independently. R2, -CO-NR3R3k, -CO-S-R4, -CS-R5, -CS-O-R6, -CS-S-R7, -SO-R8, -SO2-R9 (R1, R2, R3, R3k, R4, R5, R6, R7, R8, and R9 independently represent hydrocarbon groups or halogen atoms that may have substituents.), -OCF3, -SCF3, -SF5, -SF3, -SO2H, or -SO3H are preferred. Cyano, nitro, -OCF3, -SCF3, -SF5, -SF3, -SO3H, -SO2H, -CO-R1, -CO-O-R2, and -SO2-R9 are even better. Cyano, nitro, -OCF3, -SCF3, -SF5, -SO2CF3, and -SO2-R10 are preferred. Cyano or nitro groups are preferred.

[0031] R1 and R2 can bond together to form a ring. The ring formed by the bonding of R1 and R2 can be a monocyclic ring or a condensed ring, but a monocyclic ring is preferred. In terms of the constituent elements of the ring, the ring formed by the bonding of R1 and R2 can contain heteroatoms (nitrogen atom, oxygen atom, sulfur atom, etc.). The ring formed by the mutual bonding of R1 and R2 is usually a 3 to 10 member ring, with 5 to 7 member rings being preferred, and 5 or 6 member rings being even better.

[0032] The rings formed by the mutual bonding of R1 and R2 can be exemplified by the following ring structures. [In the formula, * represents a bond.]

[0033] The ring system formed by the mutual bonding of R1 and R2 is preferably constructed in the manner shown in equations (w-1) to (w-15), (w-17), (w-31), (w-32), (w-35) to (w-42) and (w-44), and even more preferably in the manner shown in equations (w-1) to (w-6), (w-13), (w-35), (w-36), (w-42) and (w-44).

[0034] The loop formed by connecting R4 and R5 can be the same as the loop formed by connecting R1 and R2. The loop formed by connecting R4 and R5 is preferably constructed as shown in equations (w-1) to (w-15), (w-17), (w-31), (w-32), (w-35) to (w-42) and (w-44), and is even more preferably constructed as shown in equations (w-1) to (w-6), (w-13), (w-35), (w-36), (w-42) and (w-44).

[0035] The rings formed by connecting R14 and R15 can be the same as those formed by connecting R1 and R2. The rings formed by connecting R14 and R15 are preferably constructed as shown in equations (w-1) to (w-15), (w-17), (w-31), (w-32), (w-35) to (w-42), and (w-44), and even more preferably as shown in equations (w-1) to (w-6), (w-13), (w-35), (w-36), (w-42), and (w-44).

[0036] The loop formed by connecting R24 and R25 can be the same as the loop formed by connecting R1 and R2. The loop formed by connecting R24 and R25 is preferably constructed as shown in equations (w-1) to (w-15), (w-17), (w-31), (w-32), (w-35) to (w-42) and (w-44), and is even more preferably constructed as shown in equations (w-1) to (w-6), (w-13), (w-35), (w-36), (w-42) and (w-44).

[0037] The ring formed by connecting R34 and R35 can be the same as the ring formed by connecting R1 and R2. The ring formed by connecting R34 and R35 is preferably constructed as shown in equations (w-1) to (w-15), (w-17), (w-31), (w-32), (w-35) to (w-42) and (w-44), and is even more preferably constructed as shown in equations (w-1) to (w-6), (w-13), (w-35), (w-36), (w-42) and (w-44).

[0038] The ring system formed by connecting R44 and R45 can be the same as the ring system formed by connecting R1 and R2. The ring system formed by connecting R44 and R45 is preferably constructed according to the ring structures shown in equations (w-1) to (w-15), (w-17), (w-31), (w-32), (w-35) to (w-42) and (w-44), and even more preferably according to the ring structures shown in equations (w-1) to (w-6), (w-13), (w-35), (w-36), (w-42) and (w-44).

[0039] The rings formed by connecting R54 and R55 can be the same as those formed by connecting R1 and R2. The rings formed by connecting R54 and R55 are preferably constructed as shown in equations (w-1) to (w-15), (w-17), (w-31), (w-32), (w-35) to (w-42) and (w-44), and are even more preferably constructed as shown in equations (w-1) to (w-6), (w-13), (w-35), (w-36), (w-42) and (w-44).

[0040] The ring system formed by connecting R64 and R65 can be the same as the ring system formed by connecting R1 and R2. The ring system formed by connecting R64 and R65 is preferably constructed according to the ring structures shown in equations (w-1) to (w-15), (w-17), (w-31), (w-32), (w-35) to (w-42) and (w-44), and even more preferably according to the ring structures shown in equations (w-1) to (w-6), (w-13), (w-35), (w-36), (w-42) and (w-44).

[0041] The loop formed by connecting R131 and R132 can be the same as the loop formed by connecting R1 and R2. The loop formed by connecting R131 and R132 is preferably constructed as shown in equations (w-1) to (w-15), (w-17), (w-31), (w-32), (w-35) to (w-42) and (w-44), and is even more preferably constructed as shown in equations (w-1) to (w-6), (w-13), (w-35), (w-36), (w-42) and (w-44).

[0042] The ring system formed by connecting R134 and R135 can be the same as the ring system formed by connecting R1 and R2. The ring system formed by connecting R134 and R135 is preferably constructed according to the ring structures shown in equations (w-1) to (w-15), (w-17), (w-31), (w-32), (w-35) to (w-42) and (w-44), and even more preferably according to the ring structures shown in equations (w-1) to (w-6), (w-13), (w-35), (w-36), (w-42) and (w-44).

[0043] R2 and R3 can be linked together to form a ring. The ring formed by the linking of R2 and R3, in terms of its constituent elements, includes a double bond bonded to ring W1. Furthermore, the ring formed by the linking of R2 and R3, together with ring W1, forms a condensed ring. Examples of condensed ring structures formed by the linking of R2 and R3 together with ring W1 include, for example, the ring structures shown in equations (w11-1) to (w11-12) described below. [In the formula, ring W1 represents the same meaning as above.] *1 indicates a bond with R1, *2 indicates a bond with R4, and *3 indicates a bond with R5. Rf1, Rf2, and Rf3 independently represent electron-withdrawing groups, hydrocarbon groups, and hydroxyl groups, respectively. m1 represents an integer from 0 to 6, m2 represents an integer from 0 to 4, and m3 represents an integer from 0 to 2.

[0044] More specific examples of the condensed ring formed by the mutual bonding of R2 and R3 and ring W1 can be listed below, such as the ring structures described below.

[0045] R12 and R13 can be linked together to form a ring. The ring formed by the linking of R12 and R13, in terms of its constituent elements, includes a double bond bonded to ring W2. Furthermore, the ring formed by the linking of R12 and R13, together with ring W2, forms a condensation ring. Specifically, this can be exemplified by the condensation ring formed by the linking of R2 and R3 together with ring W1.

[0046] R22 and R23 can be linked together to form a ring. The ring formed by the linking of R22 and R23, in terms of its constituent elements, includes a double bond bonded to ring W3. Furthermore, the ring formed by the linking of R22 and R23, together with ring W3, forms a condensed ring. Specifically, this is the same as the condensed ring formed by the linking of R2 and R3 together with ring W1.

[0047] R32 and R33 can be linked together to form a ring. The ring formed by the linking of R32 and R33, in terms of its constituent elements, includes a double bond bonded to ring W4. Furthermore, the ring formed by the linking of R32 and R33, together with ring W4, forms a condensed ring. Specifically, the same type of condensed ring can be listed as the ring formed by the linking of R2 and R3 together with ring W1.

[0048] R42 and R43 can be linked together to form a ring. The ring formed by the linking of R42 and R43, in terms of its constituent elements, includes a double bond bonded to ring W5. Furthermore, the ring formed by the linking of R42 and R43, together with ring W5, forms a condensed ring. Specifically, the same type of condensed ring can be listed as the ring formed by the linking of R2 and R3 together with ring W1.

[0049] R52 and R53 can be linked together to form a ring. The ring formed by the linking of R52 and R53, in terms of its constituent elements, includes a double bond bonded to ring W6. Furthermore, the ring formed by the linking of R52 and R53, together with ring W6, forms a condensed ring. Specifically, the same type of condensed ring can be listed as the ring formed by the linking of R2 and R3 together with ring W1.

[0050] R62 and R63 can be linked together to form a ring. The ring formed by the linking of R62 and R63, in terms of its constituent elements, includes a double bond bonded to ring W7. Furthermore, the ring formed by the linking of R62 and R63, together with ring W7, forms a condensed ring. Specifically, the same type of condensed ring can be listed as the ring formed by the linking of R2 and R3 together with ring W1.

[0051] R132 and R133 can be linked together to form a ring. The ring formed by the connection of R132 and R133 contains, in terms of its constituent elements, a double bond bonded to ring W14. Furthermore, the ring formed by the connection of R132 and R133 together with ring W14 forms a condensed ring. Specifically, the loops formed by the mutual bonding of R2 and R3 and the condensed loops formed together with ring W1 can be listed as the same.

[0052] R3 and R4 can be linked together to form a ring. The ring formed by the linking of R3 and R4, in terms of its constituent elements, includes a double bond bonded to ring W1. Furthermore, the ring formed by the linking of R3 and R4, together with ring W1, forms a condensed ring. Specifically, the condensed ring formed by the linking of R3 and R4 together with ring W1 can be exemplified by the following rings. [In the formula, ring W1 represents the same meaning as above.] *4 indicates a bond with R1, *5 indicates a bond with R2, and *6 indicates a bond with R5. Rf4, Rf5, and Rf6 independently represent electron-withdrawing groups, hydrocarbon groups, and hydroxyl groups, respectively. m4 represents integers from 0 to 6, m5 represents integers from 0 to 4, and m6 represents integers from 0 to 2.

[0053] More specific examples of the condensed ring formed by the mutual bonding of R3 and R4 and ring W1 can be listed below, such as the ring structures described below.

[0054] R13 and R14 can be linked together to form a ring. The ring formed by the linking of R13 and R14, in terms of its constituent elements, includes a double bond bonded to ring W2. Furthermore, the ring formed by the linking of R13 and R14, together with ring W2, forms a condensed ring. Specifically, the same type of condensed ring can be listed as the ring formed by the linking of R3 and R4 together with ring W1.

[0055] R23 and R24 can be linked together to form a ring. The ring formed by the linking of R23 and R24, in terms of its constituent elements, includes a double bond bonded to ring W3. Furthermore, the ring formed by the linking of R23 and R24, together with ring W3, forms a condensed ring. Specifically, the same type of condensed ring can be listed as the ring formed by the linking of R3 and R4 together with ring W1.

[0056] R33 and R34 can be linked together to form a ring. The ring formed by the linking of R33 and R34, in terms of its constituent elements, includes a double bond bonded to ring W4. Furthermore, the ring formed by the linking of R33 and R34, together with ring W4, forms a condensed ring. Specifically, the same type of condensed ring can be listed as the ring formed by the linking of R3 and R4 together with ring W1.

[0057] R43 and R44 can be linked together to form a ring. The ring formed by the linking of R43 and R44, in terms of its constituent elements, includes a double bond bonded to ring W5. Furthermore, the ring formed by the linking of R43 and R44, together with ring W5, forms a condensed ring. Specifically, the same type of condensed ring can be listed as the ring formed by the linking of R3 and R4 together with ring W1.

[0058] R53 and R54 can be linked together to form a ring. The ring formed by the linking of R53 and R54, in terms of its constituent elements, includes a double bond bonded to ring W6. Furthermore, the ring formed by the linking of R53 and R54, together with ring W6, forms a condensed ring. Specifically, the same type of condensed ring can be listed as the ring formed by the linking of R3 and R4 together with ring W1.

[0059] R63 and R64 can be linked together to form a ring. The ring formed by the linking of R63 and R64, in terms of its constituent elements, includes a double bond bonded to ring W7. Furthermore, the ring formed by the linking of R63 and R64, together with ring W7, forms a condensed ring. Specifically, the same type of condensed ring can be listed as the ring formed by the linking of R3 and R4 together with ring W1.

[0060] R133 and R134 can be linked together to form a ring. The ring formed by the linking of R133 and R134, in terms of its constituent elements, includes a double bond bonded to ring W14. Furthermore, the ring formed by the linking of R133 and R134, together with ring W14, forms a condensed ring. Specifically, the same type of condensed ring can be listed as the ring formed by the linking of R3 and R4 together with ring W1.

[0061] The divalent linker systems shown in Rx1 and Rx7 can be listed as aliphatic hydrocarbon groups with 1 to 18 carbon atoms that can have substituents, or aromatic hydrocarbon groups with 6 to 18 carbon atoms that can have substituents. The -CH2- group contained in the aforementioned divalent aliphatic hydrocarbon groups and divalent aromatic hydrocarbon groups can be substituted by -O-, -S-, -NR1B- (R1B represents a hydrogen atom or an alkyl group with 1 to 6 carbon atoms), -CO-, -SO2-, -SO-, and -PO3-. Furthermore, the substituents that the aforementioned divalent aliphatic hydrocarbon groups may have include halogen atoms, hydroxyl groups, carboxyl groups, amino groups, and aryl groups with 6 to 16 carbon atoms. The substituents that the aforementioned divalent aromatic hydrocarbon groups can have include halogen atoms, hydroxyl groups, carboxyl groups, amino groups, aldehyde groups, etc.

[0062] Specific examples of the divalent linkers shown in Rx1 and Rx7 can be listed below. In the formula, * represents a bond.

[0063]

[0064]

[0065]

[0066]

[0067]

[0068] The divalent linkers shown in Rx1 and Rx7 are preferably, independently, a divalent aliphatic hydrocarbon group having 1 to 12 carbon atoms and a divalent aromatic hydrocarbon group having 6 to 12 carbon atoms (the -CH2- group contained in the divalent aliphatic hydrocarbon group and the divalent aromatic hydrocarbon group can be replaced by -O-, -S-, -NR1B-, -CO-, -SO2-), and the linkers described below are more preferred.

[0069] The trivalent linker system shown in Rx2 can be categorized as trivalent aliphatic hydrocarbon groups having 1 to 18 carbon atoms that may have substituents, or trivalent aromatic hydrocarbon groups having 6 to 18 carbon atoms that may have substituents. The -CH2- group contained in the aforementioned trivalent aliphatic hydrocarbon groups and the aforementioned trivalent aromatic hydrocarbon groups can be substituted with -O-, -S-, -CS-, -CO-, -SO-, -SO2-, or -NR11B- (R11B represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms). The substituents that the aforementioned trivalent aliphatic hydrocarbon groups and the aforementioned trivalent aromatic hydrocarbon groups may have include halogen atoms, hydroxyl groups, carboxyl groups, and amino groups. The trivalent linker group shown in Rx2 is preferably an aliphatic hydrocarbon group with trivalent carbon number 1 to 18 (where the -CH2- group in the aforementioned trivalent aliphatic hydrocarbon group can be replaced by -O-, -CO-, or -SO2-) and an aromatic hydrocarbon group with trivalent carbon number 6 to 18 (where the -CH2- group in the aforementioned trivalent aromatic hydrocarbon group can be replaced by -O-, -CO-, or -SO2-). Specific examples of the trivalent linker shown in Rx2 can be listed below.

[0070]

[0071]

[0072] The tetravalent linker shown in Rx3 can be an aliphatic hydrocarbon group with 1 to 18 carbon atoms that may have a substituent, or an aromatic hydrocarbon group with 6 to 18 carbon atoms that may have a substituent. The -CH2- group contained in the aforementioned tetravalent aliphatic hydrocarbon group and the aforementioned tetravalent aromatic hydrocarbon group can be substituted with -O-, -S-, -CS-, -CO-, -SO-, -SO2-, or -NR11C- (R11C represents a hydrogen atom or an alkyl group with 1 to 6 carbon atoms). The substituents that the aforementioned tetravalent aliphatic hydrocarbon groups and the aforementioned tetravalent aromatic hydrocarbon groups may have include halogen atoms, hydroxyl groups, carboxyl groups, and amino groups. The preferred system of tetravalent linkers shown in Rx3 consists of tetravalent aliphatic hydrocarbon groups with 1 to 18 carbon atoms (where the -CH2- group in the aforementioned tetravalent aliphatic hydrocarbon group can be replaced by -O-, -CO-, or -SO2-) and tetravalent aliphatic hydrocarbon groups with 6 to 18 carbon atoms (where the -CH2- group in the aforementioned tetravalent aromatic hydrocarbon group can be replaced by -O-, -CO-, or -SO2-). Specific examples of the four-valent linker shown in Rx3 can be listed below.

[0073]

[0074] The anion shown in formula (I) is preferably the anion shown in formula (IA). In equation (IA), R1, R2, R3, R4 and R5 represent the same meanings as above. RE1, RE2, RE3, RE4, RE5, and RE6 independently represent a hydrogen atom, a hydrocarbon group (1 to 25 carbon atoms), or an alkoxy group. In formula (IA), at least one of R1, R2, R3, R4 and R5 is preferred, consisting of cyano, nitro, haloalkyl, haloaryl, -SCF3, -SF5, -SF3, -SO3H, -SO2H, -CO-R1, -CO-O-R2, -CO-NR3R3k, -CO-S-R4, -CS-R5, -CS-O-R6, -CS-S-R7, -SO-R8, -SO2-R9 (R1, R2, R3, R3k, R4, R5, R6, R7, R8 and R9 each independently represent a hydrocarbon group or halogen atom that may have substituents.) -OCF3 or -SCF3, Cyano, nitro, -OCF3, -SF5, -SF3, -SO3H, -SO2H, -CO-R1, -CO-O-R2, and -SO2-R9 are preferred. Cyano, nitro, -CO-R1, -CO-O-R2, -SO2-R9, -OCF3, -SCF3, or -SF5 are preferred. Cyano, nitro, -OCF3, -SCF3, -SF5, -SO2CF3, -SO2-R10 (R10 can be an aromatic hydrocarbon group with 6 to 18 carbon atoms as the substituent) are preferred. Cyano or nitro groups are preferred.

[0075] Examples of anions represented by formula (I) include those described below.

[0076]

[0077]

[0078]

[0079]

[0080]

[0081] Examples of anions represented by formula (II) include those described below.

[0082]

[0083]

[0084]

[0085]

[0086]

[0087]

[0088]

[0089]

[0090]

[0091]

[0092] Examples of anions represented by formula (III) include those described below.

[0093]

[0094]

[0095]

[0096]

[0097]

[0098]

[0099]

[0100]

[0101]

[0102] Examples of anions represented by formula (IV) include those described below.

[0103]

[0104]

[0105]

[0106] Examples of anions represented by formula (VIII) include those described below.

[0107]

[0108] When ring W1 has at least one substituent other than R3, anionic systems having the partial structure shown in formula (X) can be listed as, for example, anions shown in formula (V) to anions shown in formula (VII). [In the formula, rings W1, R1, R2, R4 and R5 have the same meaning as above.] Rings W8, W9, W10, W11, W12, and W13 each independently represent a ring structure, which may have substituents. R71, R72, R74, R75, R81, R82, R84, R85, R91, R92, R94, R95, R101, R102, R104, R105, R111, R112, R114, R115, R121, R122, R124, and R125 each independently represent electron-withdrawing groups. R71 and R72 can be connected to each other to form a ring. R74 and R75 can be connected to form a ring. R81 and R82 can be connected to each other to form a loop. R84 and R85 can be connected to form a loop. R91 and R92 can be connected to each other to form a ring. R94 and R95 can be connected to form a ring. R101 and R102 can be connected to each other to form a ring. R104 and R105 can be connected to form a ring. R111 and R112 can be connected to each other to form a loop. R114 and R115 can be connected to each other to form a ring. R121 and R122 can be connected to each other to form a loop. R124 and R125 can be connected to each other to form a ring. Rx4 represents a single bond or a divalent linker. Rx5 represents a trivalent linker. Rx6 represents a four-valent linker base.

[0109] There are no particular limitations on the ring structure of rings W8, W9, W10, W11, W12, and W13. Rings W9 to W12 can be monocyclic or condensed rings. In terms of the constituent elements of the rings, rings W9 to W12 can be heterocyclic rings containing heteroatoms (such as oxygen, sulfur, nitrogen, etc.). Rings W9 to W12 are typically 5 to 18 carbon rings, with 5 to 7-membered rings being preferred, and 6-membered rings being even more preferred. Rings W9 to W12 are preferably 5 to 7 carbon rings, with 6-membered rings being even more preferred. The preferred systems for rings W9 to W12 are each independently a single ring. Rings W9 to W12 may have substituents; specifically, rings W1 may have substituents other than those shown in R3 that are identical to those shown in R3.

[0110] The substituents in rings W9 to W12 are preferably amino groups substituted with alkyl groups having 1 to 12 carbon atoms, alkoxy groups having 1 to 12 carbon atoms, alkylthio groups having 1 to 12 carbon atoms, or alkyl groups having 1 to 6 carbon atoms.

[0111] Specific examples of rings W9 to W12 can be listed that are the same as those of ring W1.

[0112] The electron-withdrawing groups shown in R71, R72, R74, R75, R81, R82, R84, R85, R91, R92, R94, R95, R101, R102, R104, R105, R111, R112, R114, R115, R121, R122, R124, and R125 are the same as those shown in R3.

[0113] R71, R72, R74, R75, R81, R82, R84, R85, R91, R92, R94, R95, R101, R102, R104, R105, R111, R112, R114, R115, R121, R122, R124, and R125 are preferably cyano, nitro, haloalkyl, haloaryl, -SF5, -SF3, -SO3H, - SO2H, -CO-R1, -CO-O-R2, -CO-NR3R3k, -CO-S-R4, -CS-R5, -CS-O-R6, -CS-S-R7, -SO-R8, -SO2-R9 (R1, R2, R3, R3k, R4, R5, R6, R7, R8, and R9 independently represent hydrocarbon groups or halogen atoms that may have substituents), -OCF3, or -SCF3. Cyano, nitro, -OCF3, -SCF3, -SF5, -SF3, -SO3H, -SO2H, -CO-R1, -CO-O-R2, and -SO2-R9 are preferred. Cyano, nitro, -CO-R1, -CO-O-R2, -SO2-R9, -OCF3, -SCF3, or -SF5 are preferred. Cyano, nitro, -OCF3, -SCF3, -SF5, -SO2CF3, -SO2-R10 (R10 series, aromatic hydrocarbon groups with 6 to 18 carbon atoms that can have substituents) are preferred. Cyano or nitro groups are preferred.

[0114] R71 and R72 can bond together to form a ring. The ring formed by the bonding of R71 and R72 can be a monocyclic ring or a condensed ring, but a monocyclic ring is preferred. In terms of the constituent elements of the ring, the ring formed by the bonding of R71 and R72 can include heteroatoms (nitrogen atom, oxygen atom, sulfur atom, etc.). The ring formed by the mutual bonding of R71 and R72 is usually a 3 to 10 member ring, with 5 to 7 member rings being preferred, and 5 or 6 member rings being even better. The ring systems formed by the mutual bonding of R71 and R72 can be listed as those that are the same as the ring systems formed by the mutual bonding of R1 and R2. The ring system formed by bonding R71 and R72 together is preferably the type shown in formulas (w-1) to (w-15), (w-17), (w-31), (w-32), (w-35) to (w-42) and (w-44), and even more preferably the type shown in formulas (w-1) to (w-6), (w-13), (w-35), (w-36), (w-42) and (w-44).

[0115] The ring system formed by connecting R74 and R75 can be the same as the ring system formed by connecting R71 and R72. The ring system formed by bonding R74 and R75 is preferably constructed as shown in equations (w-1) to (w-15), (w-17), (w-31), (w-32), (w-35) to (w-42) and (w-44), and even more preferably as shown in equations (w-1) to (w-6), (w-13), (w-35), (w-36), (w-42) and (w-44).

[0116] The ring system formed by connecting R81 and R82 can be the same as the ring system formed by connecting R71 and R72. The ring system formed by bonding R81 and R82 is preferably constructed according to the ring structures shown in equations (w-1) to (w-15), (w-17), (w-31), (w-32), (w-35) to (w-42) and (w-44), and even more preferably according to the ring structures shown in equations (w-1) to (w-6), (w-13), (w-35), (w-36), (w-42) and (w-44).

[0117] The ring system formed by connecting R84 and R85 can be the same as the ring system formed by connecting R71 and R72. The ring system formed by bonding R84 and R85 is preferably constructed according to the ring structures shown in equations (w-1) to (w-15), (w-17), (w-31), (w-32), (w-35) to (w-42) and (w-44), and even more preferably according to the ring structures shown in equations (w-1) to (w-6), (w-13), (w-35), (w-36), (w-42) and (w-44).

[0118] The ring system formed by connecting R91 and R92 can be the same as the ring system formed by connecting R71 and R72. The ring system formed by bonding R91 and R92 is preferably constructed according to the ring structures shown in equations (w-1) to (w-15), (w-17), (w-31), (w-32), (w-35) to (w-42) and (w-44), and even more preferably according to the ring structures shown in equations (w-1) to (w-6), (w-13), (w-35), (w-36), (w-42) and (w-44).

[0119] The ring system formed by connecting R94 and R95 can be the same as the ring system formed by connecting R71 and R72. The ring system formed by bonding R94 and R95 is preferably constructed according to the ring structures shown in equations (w-1) to (w-15), (w-17), (w-31), (w-32), (w-35) to (w-42) and (w-44), and even more preferably according to the ring structures shown in equations (w-1) to (w-6), (w-13), (w-35), (w-36), (w-42) and (w-44).

[0120] The ring system formed by connecting R101 and R102 can be the same as the ring system formed by connecting R71 and R72. The ring system formed by bonding R101 and R102 is preferably constructed according to the ring structures shown in equations (w-1) to (w-15), (w-17), (w-31), (w-32), (w-35) to (w-42) and (w-44), and even more preferably according to the ring structures shown in equations (w-1) to (w-6), (w-13), (w-35), (w-36), (w-42) and (w-44).

[0121] The ring system formed by linking R104 and R105 can be the same as the ring system formed by linking R71 and R72. The ring system formed by linking R104 and R105 is preferably formed by the ring structures shown in equations (w-1) to (w-15), (w-17), (w-31), (w-32), (w-35) to (w-42) and (w-44), and even more preferably by the ring structures shown in equations (w-1) to (w-6), (w-13), (w-35), (w-36), (w-42) and (w-44).

[0122] The ring system formed by connecting R111 and R112 can be the same as the ring system formed by connecting R71 and R72. The ring system formed by bonding R111 and R112 is preferably constructed as shown in equations (w-1) to (w-15), (w-17), (w-31), (w-32), (w-35) to (w-42) and (w-44), and is even more preferred.

[0123] The ring system formed by connecting R114 and R115 can be the same as the ring system formed by connecting R71 and R72. The ring system formed by bonding R114 and R115 is preferably constructed as shown in equations (w-1) to (w-15), (w-17), (w-31), (w-32), (w-35) to (w-42) and (w-44), and the ring system is even more preferred.

[0124] The ring system formed by connecting R121 and R122 can be the same as the ring system formed by connecting R71 and R72. The ring system formed by bonding R121 and R122 is preferably constructed as shown in equations (w-1) to (w-15), (w-17), (w-31), (w-32), (w-35) to (w-42) and (w-44), and is even more preferred.

[0125] The ring system formed by connecting R124 and R125 can be the same as the ring system formed by connecting R71 and R72. The ring system formed by bonding R124 and R125 is preferably constructed as shown in equations (w-1) to (w-15), (w-17), (w-31), (w-32), (w-35) to (w-42) and (w-44), and is even more preferred.

[0126] The divalent linker system shown in Rx4 can include aliphatic hydrocarbon groups with 1 to 18 carbon atoms that can have substituents, or aromatic hydrocarbon groups with 6 to 18 carbon atoms that can have substituents. The -CH2- group contained in the aforementioned divalent aliphatic hydrocarbon groups and divalent aromatic hydrocarbon groups can be substituted by -O-, -S-, -NR1B- (R1B represents a hydrogen atom or an alkyl group with 1 to 6 carbon atoms), -CO-, -SO2-, -SO-, and -PO3-. Furthermore, the substituent systems that the aforementioned divalent aliphatic hydrocarbon groups and divalent aromatic hydrocarbon groups can have include halogen atoms, hydroxyl groups, carboxyl groups, and amino groups. The specific examples of the divalent linker shown in Rx4 are the same as those of the specific examples of the divalent linker shown in Rx1. The divalent linker shown in Rx4 is preferably the linker described below.

[0127] The divalent linker system shown in Rx5 can be categorized as aliphatic hydrocarbon groups with 1 to 18 carbon atoms that may have substituents, or aromatic hydrocarbon groups with 6 to 18 carbon atoms that may have substituents. The -CH2- group contained in the aforementioned trivalent aliphatic hydrocarbon group can be substituted by -O-, -S-, -CS-, -CO-, -SO-, or -NR11B- (R11B represents a hydrogen atom or an alkyl group with 1 to 6 carbon atoms). The substituent systems that the aforementioned trivalent aliphatic hydrocarbon groups and the aforementioned trivalent aromatic hydrocarbon groups may have include halogen atoms, hydroxyl groups, carboxyl groups, and amino groups. The trivalent linker system shown in Rx5 is preferably an aliphatic hydrocarbon group with a trivalent carbon number of 1 to 12 that can have substituents. The specific examples of the trivalent linker shown in Rx5 are the same as those of the trivalent linker shown in Rx2. The linker base shown in Rx5 is preferably one of the linkers described below.

[0128] The tetravalent linker system shown in Rx6 can be categorized as aliphatic hydrocarbon groups with 1 to 18 carbon atoms that can have substituents, or aromatic hydrocarbon groups with 6 to 18 carbon atoms that can have substituents. The -CH2- group contained in the aforementioned tetravalent aliphatic hydrocarbon groups can be substituted by -O-, -S-, -CS-, -CO-, -SO-, or -NR11C- (R11C represents a hydrogen atom or an alkyl group with 1 to 6 carbon atoms). The substituent systems that the aforementioned tetravalent aliphatic hydrocarbon groups and the aforementioned tetravalent aromatic hydrocarbon groups may have include halogen atoms, hydroxyl groups, carboxyl groups, and amino groups. The tetravalent linker group shown in Rx6 preferably represents a tetravalent aliphatic hydrocarbon group that may have 1 to 12 carbon atoms as a substituent. The specific examples of the 4-valent linker shown in Rx6 are the same as those of the specific examples of the 4-valent linker shown in Rx3. The four-valent linker system shown in Rx6 is preferably the linker system described below.

[0129] Examples of anions represented by formula (V) include those described below.

[0130]

[0131] Examples of anions represented by formula (VI) include those described below.

[0132]

[0133] Examples of anions represented by formula (VII) include those described below.

[0134]

[0135]

[0136] <Cation> The compounds of this invention are composed of an anion represented by formula (X) and paired cations. The combination is not limited if the valence of the anion represented by formula (X) is the same as that of the cation. When the valence of the anion represented by formula (X) is 2 or higher, the cation can be a cation with the same valence as the anion represented by formula (X), or a plurality of cations with a valence of 1, in a manner that is the same as that of the anion represented by formula (X). Furthermore, to achieve the same valence as the anion represented by formula (X), a cation with a valence of 1 and a cation with a valence other than 1 (e.g., a cation with a valence of 2 or higher) can be an anion represented by formula (X) with a valence of 1, in a manner that is the same as that of the cation. Furthermore, to achieve the same valence as the cation, an anion represented by formula (X) with a valence of 1 and an anion represented by formula (X) with a valence other than 1 can be present.

[0137] The cation can be an organic cation or an inorganic cation. Furthermore, when the valence of the anion shown in formula (X) is 2 or higher, the compound (X) can have both organic and inorganic cations as cations.

[0138] Organic cation systems can include pyridinium cations such as N-methylpyridinium, N-ethylpyridinium, N-propylpyridinium, N-ethyl-2-methylpyridinium, N-ethyl-3-methylpyridinium, 1-ethyl-3-(hydroxymethyl)pyridinium, N-butylpyridinium, N-butyl-4-methylpyridinium, N-butyl-3-methylpyridinium, N-hexylpyridinium, N-octylpyridinium, N-octyl-4-methylpyridinium, 1,1'-dimethyl-4,4'-bipyridinium, and 1,1'-diphenylmethyl-4,4'-bipyridinium; Hexahydropyridinium cations such as 1-butyl-1-methylhexahydropyridinium and 1-methyl-1-propylhexahydropyridinium; Pyrrolidone cations include 1-allyl-1-methylpyrrolidone, 1-butyl-1-methylpyrrolidone, 1-ethyl-1-methylpyrrolidone, 1-methyl-1-propylpyrrolidone, 1-(2-methoxyethyl)-1-methylpyrrolidone, 1-methyl-1-n-octylpyrrolidone, and 1-methyl-1-pentylpyrrolidone. 2-Methyl-1-dihydropyrroleonium and other cations with a dihydropyrrole skeleton; 1-Butyl-2,3-dimethylimidazolium, 3,3'-(butane-1,4-diyl)bis(1-vinyl-3-imidazolium), 1-benzyl-3-methylimidazolium, 1,3-dimethylimidazolium, 1,2-dimethyl-3-propylimidazolium, 1-decyl-3-methylimidazolium, 1-dodecyl-3-methylimidazolium, 1-ethyl-2,3-dimethylimidazolium, 3-ethyl-1-vinylimidazolium, 3-ethyl-1-vinylimidazolium, 1-methyl-3-(4-sulfobutyl)imidazolium, 1-ethyl-3-methylimidazolium, 1-butyl-3-methylimidazolium, and other imidazolium cations; Ammonium cations include pentyltriethylammonium, butyltrimethylammonium, benzyl(ethyl)dimethylammonium, cyclohexyltrimethylammonium, diethyl(methyl)propylammonium, diethyl(2-methoxyethyl)methylammonium, ethyl(2-methoxyethyl)dimethylammonium, ethyl(dimethyl)(2-phenylethyl)ammonium, methyltri-n-octylammonium, tetrabutylammonium, tetrahexylammonium, tetrapentylammonium, tetra-n-octylammonium, tetraheptylammonium, tetrapropylammonium, and N,N,N,N',N',N'-hexamethyl-3-[2-[(trimethylammonium)ethyl]-1,5-pentanediammonium ion; Trimethylsappanium, tributylsappanium, triethylsappanium, and other trialkylsappanium cations; Tributylhexadecanylphosphonium, tributylmethylphosphonium, tributyl-n-octylphosphonium, tributyl-n-octylphosphonium, tetra-n-octylphosphonium, tributyl(2-methoxyethyl)phosphonium, tributylmethylphosphonium, trihexyl(tetradecyl)phosphonium, trihexyl(tetradecyl)phosphonium and other phosphonium cations; 4-Ethyl-4-methylmorpholinium and other morpholinium cations; Triphenylmethane cations such as Methylium and triarylmethane.

[0139] Inorganic cation systems can include alkali metal ions such as lithium ions, sodium ions, potassium ions, rubidium ions, and cesium ions; Monovalent metal ions such as copper(I) ions, silver ions, and iron(I) ions; Alkaline earth metal ions such as beryllium ions, magnesium ions, calcium ions, strontium ions, and barium ions; Divalent metal ions include copper(II) ions, nickel ions, cobalt ions, iron(II) ions, manganese ions, palladium ions, zinc ions, and germanium(IV) ions; Trivalent metal ions include aluminum ions, cobalt(III) ions, iron(III) ions, chromium(III) ions, scandium ions, iridium ions, ruthenium(III) ions, gallium ions, and indium ions; Tetravalent metal ions include titanium ions, vanadium(IV) ions, zirconium ions, hafnium ions, germanium(IV) ions, and molybdenum(IV) ions; NH4+, etc.

[0140] The preferred cations are alkali metal ions, alkaline earth metal ions, copper(I) ions, copper(II) ions, nickel ions, cobalt(III) ions, iron(II) ions, iron(III) ions, palladium ions, and organic cations. Potassium ions, calcium ions, barium ions, magnesium ions, copper(I) ions, copper(II) ions, nickel ions, and organic cations are even better, with potassium ions and organic cations being the most preferred.

[0141] Compound (X) can be exemplified by, for example, the compounds described in Tables 1 to 9 below. Also, compound (1) in Table 1 is the compound shown below.

[0142] [Table 1]

[0143] [Table 2]

[0144] [Table 3]

[0145] [Table 4]

[0146] [Table 5]

[0147] [Table 6]

[0148] [Table 7]

[0149] [Table 8]

[0150] [Table 9]

[0151] The compound (X) with an anion shown in formula (I) (hereinafter sometimes referred to as compound (I)) may include compounds (1) to (63), with compounds (2), (3), (7) to (11), (13) to (18), (24), (28), (31), (32), (37), (40) to (44), (46), (47), (49), (50), (55), (58), and (60) being preferred.

[0152] Compounds (X) with an anion as shown in formula (II) (hereinafter sometimes referred to as compound (II)) may include compounds (64) to (92), with compounds (64), (65), (67), (70), (72), (75) to (77), (79), (80), (83), (84), (86), and (87) being preferred. Compounds (X) with an anion as shown in formula (III) (hereinafter sometimes referred to as compound (III)) may include compounds (93) to (118), with compounds (93), (94), (96), (101) to (105), (107), (109), (111), (115), and (116) being preferred. Compounds (X) with an anion as shown in formula (IV) (hereinafter sometimes referred to as compound (IV)) may include compounds (119) to (129), with compound (125) being preferred.

[0153] Compounds (X) with an anion as shown in formula (V) (hereinafter sometimes referred to as compound (V)) can be listed as compounds (130) to (139), with compounds (130), (131), (134), and (135) being preferred. Compounds (X) having an anion as shown in formula (VI) (hereinafter sometimes referred to as compound (VI)) may include compounds (140) to (144), with compounds (140), (142), and (144) being preferred. Compounds (X) with an anion as shown in formula (VII) (hereinafter sometimes referred to as compound (VII)) can be listed as compounds (145) to (153). Compounds (X) with an anion as shown in formula (VIII) (hereinafter sometimes referred to as compound (VIII)) can be listed as compounds (154) to (163).

[0154] <Method for manufacturing compound (I)> Compound (I) can be obtained, for example, by reacting a compound of formula (M-1) (hereinafter, sometimes referred to as compound (M-1)) with a compound of formula (M-2) (hereinafter, sometimes referred to as compound (M-2)). In formula (M-1), R3, R4 and R5 have the same meaning as above, and ring W1A represents a ring structure. In equation (M-2), R1 and R2 have the same meaning as described above.

[0155] The reaction between compound (M-1) and compound (M-2) is usually carried out by mixing compound (M-1) and compound (M-2), preferably by adding compound (M-2) to a mixture of base and compound (M-1). The reaction of (M-1) with compound (M-2) is preferably carried out in the presence of a methylating agent. It is preferable to add compound (M-2) to the mixture of compound (M-1), methylating agent and base.

[0156] Alkali systems can include metal hydroxides such as sodium hydroxide, lithium hydroxide, potassium hydroxide, cesium hydroxide, rubidium hydroxide, calcium hydroxide, barium hydroxide, and magnesium hydroxide (preferably alkali metal hydroxides); metal alkoxides such as sodium methoxy, potassium methoxy, lithium methoxy, sodium ethoxy, sodium isopropoxy, sodium tributoxy, and potassium tributoxy (preferably alkali metal alkoxides); metal hydrides such as lithium hydride, sodium hydride, potassium hydride, lithium aluminum hydride, sodium boron hydride, aluminum hydride, and sodium aluminum hydride; and calcium oxide. Metal oxides such as magnesium oxide; metal carbonates such as sodium bicarbonate, sodium carbonate, and potassium carbonate (preferably alkaline earth metal carbonates); organoalkyl metal compounds such as n-butyllithium, tributyllithium, methyllithium, and Grignard reagent; amine compounds such as ammonia, triethylamine, diisopropylethylamine, ethanolamine, pyrrolidine, hexahydropyridine, diazabicycloundecene, diazabicyclononene, guanidine, tetramethylammonium hydroxide, tetraethylammonium hydroxide, pyridine, aniline, dimethoxyaniline, ammonium acetate, and β-alanine (preferably tertiary amines such as triethylamine and diisopropylethylamine); metal amine compounds such as lithium diisopropylamine, sodium amine, and potassium hexamethyldisilazane (preferably alkali metal amines); strontium compounds such as trimethylstrontium hydroxide; strontium compounds such as diphenylmethane hydroxide; and phosphonium alkali bases, etc. The amount of base used relative to 1 mol of compound (M-1) is usually 0.1 to 10 mol, preferably 0.5 to 5 mol.

[0157] Methylating agents include iodomethane, dimethyl sulfate, methyl methanesulfonate, methyl fluorosulfonate, methyl p-toluenesulfonate, methyl trifluoromethanesulfonate, and trimethyloxo-tetrafluoroborate. The amount of methylating agent used is typically 0.1 to 10 mol relative to 1 mol of compound (M-1), with 0.5 to 5 mol being preferred.

[0158] The reaction between compound (M-1) and compound (M-2) can be carried out in the presence of a solvent. Examples of solvents include acetonitrile, benzene, toluene, acetone, ethyl acetate, chloroform, dichloroethane, monochlorobenzene, methanol, ethanol, isopropanol, tributanol, 2-butanone, tetrahydrofuran, diethyl ether, dimethyl sulfoxide, N,N-dimethylacetamide, N,N-dimethylformamide, and water. Preferred solvents are acetonitrile, tetrahydrofuran, chloroform, dichloromethane, and diethyl ether; more preferred are acetonitrile, tetrahydrofuran, and chloroform; and even more preferred are acetonitrile. Furthermore, dehydrating solvents are preferred.

[0159] The reaction time between compound (M-1) and compound (M-2) is typically 0.1 to 10 hours, preferably 0.2 to 3 hours. The reaction temperature of compound (M-1) and compound (M-2) is usually -50 to 150°C, preferably -20 to 100°C. The amount of compound (M-2) used is usually 0.1 to 10 mol relative to 1 mol of compound (M-1), with 0.5 to 5 mol being preferred.

[0160] Compound (M-1) can be listed below.

[0161] Compound (M-2) can be a commercially available product, such as malononitrile.

[0162] Compound (I), obtained by reacting compound (M-1) and compound (M-2) in the presence of a base, typically has a cation derived from the base as its relative cation. To exchange the cation of compound (I) for a desired cation, ion exchange can be performed by mixing compound (I) with a salt containing the desired cation. This ion exchange can be carried out in the presence of a solvent. Examples of salt systems containing the desired cation include: chloride salts composed of the desired cation and chloride ions; bromide salts composed of the desired cation and bromide ions; iodide salts composed of the desired cation and iodide ions; fluoride salts composed of the desired cation and fluoride ions; nitrates composed of the desired cation and nitrate ions; sulfates composed of the desired cation and sulfate ions; perchlorates composed of the desired cation and perchlorate ions; sulfonates composed of the desired cation and sulfonic acid ions; carboxylates composed of the desired cation and carboxylic acid ions; hypochlorites composed of the desired cation and hypochlorite ions; hexafluorophosphate salts composed of the desired cation and hexafluorophosphate ions; and amide salts composed of the desired cation and amide.

[0163] Compound (M-1) is obtained by reacting the compound shown in formula (M-3) (hereinafter, sometimes referred to as compound (M-3)) with the compound shown in formula (M-4) (hereinafter, sometimes referred to as compound (M-4)). In formula (M-3), rings W1A, R4, and R5 have the same meaning as described above. In equation (M-4), R3 has the same meaning as described above, and E1 represents the detachment basis.

[0164] Examples of detached radicals shown in E1 include halogen atoms, p-toluenesulfonyl groups, and trifluoromethylsulfonyl groups.

[0165] The reaction between compound (M-3) and compound (M-4) is carried out by mixing compound (M-3) and compound (M-4). The amount of compound (M-4) used is usually 0.1 to 5 mol relative to 1 mol of compound (M-3), with 0.5 to 2 mol being preferred.

[0166] The reaction between compounds (M-3) and (M-4) is preferably carried out in the presence of a base. Alkali compounds include metal alkoxides such as sodium methoxy, potassium methoxy, lithium methoxy, sodium ethoxy, sodium isopropoxy, sodium tributoxy, and potassium tributoxy (preferably alkali metal alkoxides); metal hydroxides such as lithium hydroxide, sodium hydroxide, and potassium hydroxide; metal hydrides such as sodium hydride, lithium aluminum hydride, and sodium borohydride; and amine compounds such as lithium diisopropylamine, pyridine, triethylamine, diisopropylethylamine, hexahydropyridine, pyrrolidine, and proline. The amount of base used relative to 1 mol of compound (M-3) is usually 0.1 to 10 mol, preferably 0.5 to 5 mol.

[0167] The reaction between compounds (M-3) and (M-4) can be carried out in the presence of a solvent. Examples of solvents include acetonitrile, benzene, toluene, acetone, ethyl acetate, chloroform, dichloroethane, monochlorobenzene, methanol, ethanol, isopropanol, tributanol, 2-butanone, tetrahydrofuran, diethyl ether, dimethyl sulfoxide, N,N-dimethylacetamide, N,N-dimethylformamide, and water. Preferred solvents are acetonitrile, tetrahydrofuran, chloroform, dichloromethane, and diethyl ether; more preferred are acetonitrile, tetrahydrofuran, and chloroform; and even more preferred are methanol, ethanol, isopropanol, and acetonitrile. The reaction time between compound (M-3) and compound (M-4) is typically 0.1 to 10 hours. The reaction temperature of compound (M-3) and compound (M-4) is usually between -50 and 150°C.

[0168] Compound (M-3) can be listed below.

[0169] Compound (M-4) is a commercially available product. Examples include: cyanogen chloride, cyanogen bromide, p-toluenesulfonyl cyanide, trifluoromethanesulfonyl cyanide, 1-chloromethyl-4-fluoro-1,4-aza-onium bicyclo[2.2.2]octanebis(tetrafluoroborate (also known as SELECTFLUOR (a registered trademark of Air Products and Chemicals)), benzoyl(phenyliodo)(trifluoromethanesulfonyl)methane, 2,8-difluoro-5-(trifluoromethyl)-5H-dibenzo[b,d]thiophene-5-onium trifluoromethanesulfonate, N-bromosuccinimide, N-chlorosuccinimide, N-iodosuccinimide, etc.

[0170] Compound (M-3) can be obtained by reacting the compound shown in formula (M-5) (hereinafter, sometimes referred to as compound (M-5)) with compound (M-2a). [In equation (M-5), rings W1A, R4, and R5 have the same meaning as described above.]

[0171] The reaction between compound (M-5) and compound (M-2a) can be carried out by mixing compound (M-5) and compound (M-2a). The reaction of compound (M-5) with compound (M-2a) is preferably carried out in the presence of a base. Examples of bases that are the same as those used in the reaction of compound (M-1) with compound (M-2) can be listed. The amount of base used is typically 0.1 to 5 mol relative to 1 mol of compound (M-5), preferably 0.5 to 2 mol. The reaction between compound (M-5) and compound (M-2a) can be carried out in the presence of a solvent. Preferred solvents include methanol, ethanol, isopropanol, toluene, and acetonitrile. The reaction time between compound (M-5) and compound (M-2a) is typically 0.1 to 10 hours. The reaction temperature of compound (M-5) with compound (M-2a) is typically between -50 and 150 °C. The amount of compound (M-2a) used is usually 0.1 to 10 mol relative to 1 mol of compound (M-5), with 0.5 to 2 mol being preferred.

[0172] Compound (M-5) may include the compounds described below.

[0173] In compound (I), when the combination of R1 and R2 is the same as the combination of R4 and R5, compound (I) can also be obtained by reacting the compound shown in formula (M-6) (hereinafter, sometimes referred to as compound (M-6)) with compound (M-2). [In equation (M-6), rings W1A and R3 have the same meaning as described above.]

[0174] The reaction between compound (M-6) and compound (M-2) can be carried out by mixing compound (M-6) and compound (M-2). The reaction between compound (M-6) and compound (M-2) is preferably carried out in the presence of a base or a methylating agent, and even more preferably in the presence of a base and a methyl group. The reaction of compound (M-6) and compound (M-2) is better when the mixture of compound (M-6), compound (M-2), base, and methylating agent is used. It is even better to mix compound (M-2) and base in a mixture of compound (M-6) and methylating agent.

[0175] The base used in the reaction of compound (M-6) with compound (M-2) can be the same as that used in the reaction of compound (M-1) with compound (M-2), preferably a metal carbonate, and even better if it is an alkaline earth metal carbonate. The amount of base used is usually 0.1 to 5 mol relative to 1 mol of compound (M-6), with 0.5 to 2 mol being preferred.

[0176] The methylating agent used in the reaction of compound (M-6) and compound (M-2) can be the same as that used in the reaction of compound (M-1) and compound (M-2), with dimethyl sulfuric acid being preferred. The amount of methylating agent used is typically 0.1 to 5 mol relative to 1 mol of compound (M-6), with 0.5 to 2 mol being preferred.

[0177] The reaction between compound (M-6) and compound (M-2) can be carried out in the presence of a solvent. Examples of solvents include acetonitrile, benzene, toluene, acetone, ethyl acetate, chloroform, dichloroethane, monochlorobenzene, methanol, ethanol, isopropanol, tributanol, 2-butanone, tetrahydrofuran, diethyl ether, dimethyl sulfoxide, N,N-dimethylacetamide, N,N-dimethylformamide, and water. Preferred solvents are acetonitrile, tetrahydrofuran, chloroform, dichloromethane, and diethyl ether; more preferred are acetonitrile, tetrahydrofuran, and chloroform; and even more preferred are acetonitrile. Furthermore, dehydrating solvents are preferred.

[0178] The reaction time between compound (M-6) and compound (M-2) is typically 0.1 to 10 hours, preferably 0.2 to 3 hours. The reaction temperature of compound (M-6) and compound (M-2) is usually -50 to 150°C, preferably -20 to 100°C. The amount of compound (M-2) used is usually 0.1 to 10 mol relative to 1 mol of compound (M-6), with 0.5 to 5 mol being preferred.

[0179] Compound (M-6) can be exemplified by 2-methyl-1,3-cyclohexanedione, etc.

[0180] The molecular weight of compound (X) is preferably below 3000, more preferably below 2000, and even more preferably below 1000. Also, it is preferably above 50, more preferably above 100, and even more preferably above 200.

[0181] Compound (X) preferably exhibits maximum absorption at wavelengths between 400 and 550 nm. The wavelength of maximum absorption (λmax) of compound (X) is preferably between 410 and 500 nm, more preferably between 420 and 480 nm, and even more preferably between 430 and 450 nm.

[0182] The absorptivity ε at the maximum absorption wavelength (λmax) is preferably 0.5 or higher, more preferably 1.0 or higher, and exceptionally preferably 1.5 or higher. There is no particular upper limit, but it is generally below 10. If the gravimetric absorptivity ε of compound (X) is 0.5 or higher, it is preferable in terms of effectively absorbing light known as blue light.

[0183] Compound (X) is preferably satisfied by the following formula (a). ε(λmax) / ε(λmax+30nm)≧5 (a) [In the formula, ε(λmax) represents the absorption coefficient at the maximum absorption wavelength (λmax).] ε(λmax+30nm) represents the absorption coefficient at the wavelength of maximum absorption wavelength (λmax)+30nm. Furthermore, the unit of the g / (g‧cm) absorptivity is L / (g‧cm). For compound (X), the preferred ratio ε(λmax) / ε(λmax+30nm) is 5 or higher, the better ratio is 10 or higher, and the exceptionally good ratio is 20 or higher. There is no particular upper limit, but it is generally below 1000. If ε(λmax) / ε(λmax+30nm) is 5 or higher, it is preferable to minimize the coloration of the composition containing compound (X) from the perspective of selectively absorbing only blue light. In particular, this is suitable because it helps to suppress the impact on color display of displays, etc., or to expand the color gamut.

[0184] <Composition containing compound (X)> The present invention also includes compositions containing compound (X) (preferably any one of compound (I) to compound (VIII)). The composition comprising compound (X) of the present invention (preferably any one of compound (I) to compound (VIII)) is preferably a resin composition comprising compound (X) (preferably any one of compound (I) to compound (VIII)) and a resin.

[0185] The above-mentioned components can be used for all applications, but are particularly suitable for applications where exposure to light, including sunlight or ultraviolet rays, is possible. Specific examples include: glass substitutes and their surface coatings; coatings for windows, translucent glass, and light source protection glass for residences, facilities, and transportation machinery; window films for residences, facilities, and transportation machinery; interior and exterior cladding materials and coatings for residences, facilities, and transportation machinery, and the coatings formed therefrom; alkyd resin paints and the coatings formed therefrom; acrylic paints and the coatings formed therefrom; components for ultraviolet light sources such as fluorescent lamps and mercury lamps; components for precision machinery, electronic and electrical machinery, and shielding materials for electromagnetic waves generated from various displays; containers or packaging materials for food, chemicals, and pharmaceuticals; PET bottles, boxes, blister packs, cups, special packaging, CD coatings, agricultural and industrial films, or... Film materials; fading inhibitors for printed materials, dyed materials, pigments, etc.; protective films for polymer supports (e.g., for plastic parts of machinery and automobiles); printing outer coatings; inkjet media coatings; laminated matting films; optical films; interlayers for safety glass / windshields; electroluminescent / luminescent applications; outer coating films; solar heat control films; cosmetics such as sunscreens, shampoos, moisturizers, and hair styling products; textiles and fibers for clothing such as sportswear, socks, and hats; household interior decorations such as curtains, blankets, and wallpaper; medical devices such as plastic lenses, contact lenses, and prosthetic eyes; optical products such as optical filters, backlight display films, prisms, mirrors, and photographic materials; mold films, transfer adhesives, anti-graffiti films, tapes, and printing inks; signboards, signs, and their surface coating materials, etc.

[0186] The molded product formed by shaping the above components is preferably a polymer molded product. The shape of the molded product can be any of the following: flat film, powder, spherical particles, broken particles, blocky continuous, fibrous, tubular, hollow filament, granular, plate-like, porous, etc.

[0187] When the above-mentioned composition is a resin composition, the resin used in the resin composition may be listed from thermoplastic resins and thermosetting resins that have been used in the manufacture of various molded bodies, sheets, films and the like. Examples of thermoplastic resins include: polyethylene resin, polypropylene resin, polycyclic olefin resins and other olefin resins, poly(meth)acrylate resins, polystyrene resins, styrene-acrylonitrile resins, acrylonitrile-butadiene-styrene resins, polyvinyl chloride resins, polyvinylidene chloride resins, polyvinyl acetate resins, polyvinyl butyral resins, ethylene-vinyl acetate copolymers, ethylene-vinyl alcohol resins, polyethylene terephthalate resins, polybutylene terephthalate resins, liquid crystal polyester resins and other polyester resins, polyacetal resins, polyamide resins, polycarbonate resins, polyurethane resins, and polyphenylene sulfide resins. One or more of these resins can be used as polymer blends or polymer adhesives.

[0188] Examples of thermosetting resins include: epoxy resin, melamine resin, unsaturated polyester resin, phenolic resin, urea resin, alkyd resin, thermosetting polyimide resin, etc.

[0189] When using the above-mentioned resin composition as an ultraviolet absorbing filter or ultraviolet absorbing film, a transparent resin is preferred.

[0190] The above-mentioned resin composition can be obtained by mixing compound (X) with resin. Compound (X) is only required to impart the desired properties, and may be contained in the necessary amount, for example, 0.00001 to 99 parts by mass relative to 100 parts by mass of resin. The composition of this invention may contain solvents, crosslinking catalysts, thickeners, plasticizers, softeners, dyes, pigments, inorganic fillers and other additives as needed.

[0191] <Components for eyeglass lenses> The aforementioned components and resin components can be used as components for eyeglass lenses. Eyeglass lenses can be formed by molding or other methods using these components. The molding methods for eyeglass lens components can be injection molding or casting polymerization molding. Casting polymerization molding primarily involves injecting an eyeglass lens component composed of monomeric or oligomeric resin into a lens mold, and then hardening the component using heat or light to form a lens. The composition of an eyeglass lens can be any composition suitable for its molding method. For example, when an eyeglass lens is formed by injection molding, it can be a resin composition for an eyeglass lens containing resin and compound (X). Similarly, when an eyeglass lens is formed by casting polymerization, it can be a composition for an eyeglass lens containing a curable monomer that hardens by heat or light and compound (X).

[0192] The resins contained in the components of eyeglass lenses may include the resins listed above, with transparent resins being preferred. Preferably, the resins contained in the components of eyeglass lenses are one or more of the following: poly(meth)acrylate resins, polycarbonate resins, polyamide resins, polyurethane resins, and polythiourethane resins, as polymer blends or polymer adhesives. Furthermore, in addition to polymers, monomer components may also be included.

[0193] The lens composition for eyeglasses may be a composition comprising a curing monomer and a compound (X). The curing monomer system may contain two or more types. Specifically, it may be a mixture of a polyol compound and an isocyanate compound, or a mixture of a thiol compound and an isocyanate compound, with a mixture of a thiol compound and an isocyanate compound being preferred, and a mixture of a polyfunctional thiol compound and a polyfunctional isocyanate compound being even more preferred.

[0194] Thiol compounds are defined as compounds having at least one thiol group within their molecule, without particular limitation. They can be chain-like or cyclic. Furthermore, they can have thioether bonds, polythioether bonds, or other functional groups within their molecule. Specific examples of thiol compounds include aliphatic polythiols, aromatic polythiols, cyclic compounds containing thiol groups, and thioether compounds containing thiol groups, as described in Japanese Patent Application Publication No. 2004-315556, which refers to organic compounds containing one or more thiol groups per molecule. Among these, in terms of increasing the refractive index and glass transition temperature of the lens, polyfunctional thiol compounds with two or more thiol groups are preferred, especially aliphatic polythiol compounds with two or more thiol groups and sulfide compounds with two or more thiol groups. Bis(mercaptomethyl)sulfide, 1,2-bis[(2-mercaptoethyl)thio]-3-mercaptopropane, neopentyl tert-tetrathiopropionate, and 4,8-dimercaptomethyl-1,11-mercapto-3,6,9-trithioundecane are even more preferred. Furthermore, the aforementioned thiol compounds can be used alone or in combination of two or more.

[0195] The isocyanate compound is preferably a polyfunctional isocyanate compound having at least two isocyanate groups (-NCO) in the molecule. Examples include: aliphatic isocyanate compounds (such as hexamethylene diisocyanate), alicyclic isocyanate compounds (such as isoflavone diisocyanate, hydrogenated diphenylmethane diisocyanate, hydrogenated xylene diisocyanate), and aromatic isocyanate compounds (such as toluene diisocyanate, xylene diisocyanate, diphenylmethane diisocyanate, naphthalene diisocyanate, triphenylmethane triisocyanate, etc.). Alternatively, it may be a derivative of an isocyanate prepolymer type that undergoes an addition reaction with a polyol compound of the aforementioned isocyanate compound [e.g., an adduct obtained from glycerol, trimethylolpropane, etc.], a triisocyanate compound, a biuret-type compound, a polyether polyol, a polyester polyol, an acrylic polyol, a polybutadiene polyol, a polyisoprene polyol, etc.

[0196] When the composition of an eyeglass lens contains a curing monomer, a curing catalyst may be included to improve curability. Examples of curing catalysts include tin compounds such as dibutyltin chloride, or amines, phosphines, quaternary ammonium salts, quaternary phosphonium salts, tertiary strontium salts, secondary monazine salts, inorganic acids, Lewis acids, organic acids, silicic acids, tetrafluorinated boric acids, peroxides, azo compounds, condensates of aldehydes and amine compounds, guanidines, thioureas, thiazoles, sulfenamides, thiurams, dithiocarbamates, xanthates, and acidic phosphates. These curing catalysts may be used alone or in combination of two or more.

[0197] When the composition of the spectacle lens is a resin composition, the content of compound (X) in the spectacle lens composition may be, for example, 0.01 to 20 parts by mass relative to 100 parts by mass of the resin. Furthermore, when the composition of the spectacle lens is a curable composition, for example, the content of compound (X) may be 0.00001 to 20 parts by mass relative to 100 parts by mass of the curable component. The content of compound (X) relative to 100 parts by mass of the resin or curable component is preferably 0.0001 to 15 parts by mass, more preferably 0.001 to 10 parts by mass, even more preferably 0.01 to 5 parts by mass, and particularly preferably 0.1 to 3 parts by mass. The amount of hardening catalyst added relative to 100% by mass of the lens composition for eyeglasses is preferably 0.0001 to 10.0% by mass, and more preferably 0.001 to 5.0% by mass. Other additives may be included in the composition system of eyeglass lenses.

[0198] When the composition of the present invention is used in optical products such as optical filters, it can be applied, for example, to optical display devices. When the above-mentioned resin composition is applied to an optical display device, the layer formed by the above-mentioned resin composition can be any of a film layer, an adhesive layer, a coating layer, etc., with an adhesive layer or a coating layer being preferred.

[0199] <Adhesive composition> When the layer formed by the composition of the present invention is an adhesive layer, the adhesive layer is formed from an adhesive composition comprising a resin (A), a compound (X), a crosslinking agent (B), and a silane compound (C) (hereinafter, sometimes referred to as adhesive composition (i)). Adhesive composition (i) may further contain a free radical curing component (D), an initiator (E), a light-absorbing compound (F) other than compound (X) (hereinafter, sometimes referred to as a light-selective absorbing compound (F)), an antistatic agent, etc., preferably comprising at least one of the group consisting of a free radical curing component (D), an initiator (E), and a light-selective absorbing compound (F).

[0200] Resin (A) is any resin used in adhesive compositions and is not particularly limited. Preferably, resin (A) does not exhibit maximum absorption in the wavelength range of 300 nm to 780 nm. Resin (A) is preferably a resin with a glass transition temperature (Tg) below 40°C. The glass transition temperature (Tg) of resin (A) is preferably below 20°C, even more preferably below 10°C, and particularly preferably below 0°C. Furthermore, the glass transition temperature of resin (A) is generally above -80°C, preferably above -70°C, even more preferably above -60°C, even more preferably above -55°C, and particularly preferably above -50°C. If the glass transition temperature of resin (A) is below 40°C, it is advantageous in improving the adhesion of the adhesive layer formed by the adhesive composition (i) to the adherend. Furthermore, if the glass transition temperature of resin (A) is above -80°C, it is advantageous in improving the durability of the adhesive layer formed by the adhesive composition (i). The glass transition temperature can be measured using a differential scanning calorimeter (DSC).

[0201] Resin (A) may include (meth)acrylic resins, polysiloxane resins, rubber resins, ethyl carbamate resins, etc., with (meth)acrylic resins being preferred.

[0202] (Meth)acrylate resins are preferably polymers in which (meth)acrylate-derived structural units are the main components (preferably comprising 50% by mass or more). The structural units derived from (meth)acrylate may include structural units derived from monomers other than (meth)acrylate (e.g., structural units derived from monomers having polar functional groups such as hydroxyl, carboxyl, and amino groups).

[0203] The content of resin (A) in 100% by weight of the solids of adhesive composition (i) is typically 50% to 99.9% by weight, preferably 60% to 95% by weight, and even more preferably 70% to 90% by weight. The content of compound (X) is typically 0.01 to 20 parts by weight relative to 100 parts by weight of resin (A), preferably 0.1 to 20 parts by weight, more preferably 0.2 to 10 parts by weight, and especially preferably 0.5 to 5 parts by weight.

[0204] Crosslinking agents (B) can include isocyanate-based crosslinking agents, epoxy-based crosslinking agents, aziridine-based crosslinking agents, metal chelate-based crosslinking agents, etc. In particular, from the viewpoint of the pot life of the adhesive composition (i) and the durability and crosslinking speed of the adhesive layer, isocyanate-based crosslinking agents are preferred. The content of crosslinking agent (B) is typically 0.01 to 25 parts by weight relative to 100 parts by weight of resin (A), preferably 0.1 to 15 parts by weight, more preferably 0.15 to 7 parts by weight, even more preferably 0.2 to 5 parts by weight, and particularly preferably 0.25 to 2 parts by weight.

[0205] Examples of silane compounds (C) include: vinyltrimethoxysilane, vinyltriethoxysilane, vinyltri(2-methoxyethoxy)silane, 3-epoxypropoxypropyltrimethoxysilane, 3-epoxypropoxypropyltriethoxysilane, 3-epoxypropoxypropylmethyldimethoxysilane, 3-epoxypropoxypropylethoxydimethylsilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-chloropropylmethyldimethoxysilane, 3-chloropropyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, etc. Silane compounds (C) can be polysiloxane oligomers. The content of silane compound (C) relative to 100 parts by weight of resin (A) is usually 0.01 to 20 parts by weight, preferably 0.1 to 10 parts by weight, more preferably 0.15 to 7 parts by weight, even more preferably 0.2 to 5 parts by weight, and particularly preferably 0.25 to 2 parts by weight.

[0206] Free radical hardening components (D) can be listed as compounds or oligomers that harden through free radical polymerization reactions. Free radical polymerizable components (D) can include (meth)acrylate compounds, styrene compounds, vinyl compounds, etc. The adhesive composition (i) may contain two or more free radical hardening components (D).

[0207] (Meth)acrylate compounds include, but are not limited to, (meth)acrylate monomers having at least one (meth)acrylic acid group, (meth)acrylamide monomers, and (meth)acrylate oligomers having at least two (meth)acrylic acid groups. (Meth)acrylate oligomers are preferably (meth)acrylate oligomers having at least two (meth)acrylic acid groups. A single (meth)acrylate compound may be used, or two or more may be used in combination.

[0208] (Meth)acrylate monomers can be categorized as monofunctional (meth)acrylate monomers having one (meth)acrylamide group, difunctional (meth)acrylate monomers having two (meth)acrylamide groups, and polyfunctional (meth)acrylate monomers having three or more (meth)acrylamide groups. (Meth)acrylate compounds are preferred, and polyfunctional (meth)acrylate compounds are even more preferred. Polyfunctional (meth)acrylate compounds are preferably trifunctional or more.

[0209] The content of free radical curing component (D) relative to 100 parts by weight of resin (A) is usually 0.5 to 100 parts by weight, preferably 1 to 70 parts by weight, more preferably 3 to 50 parts by weight, even more preferably 5 to 30 parts by weight, and particularly preferably 7.5 to 25 parts by weight.

[0210] The initiator (E) is either a compound that can undergo a polymerization reaction by absorbing thermal energy (thermal polymerization initiator) or a compound that can undergo a polymerization reaction by absorbing light energy (photopolymerization initiator). Furthermore, the "light" referred to here is preferably an active energy line such as visible light, ultraviolet light, X-rays, or an electron beam.

[0211] Examples of thermal polymerization initiators include compounds that generate free radicals through heating (thermal free radical generators), compounds that generate acids through heating (thermal acid generators), and compounds that generate bases through heating (thermal base generators). Photopolymerization initiators can be categorized into compounds that generate free radicals by absorbing light energy (photoradical generators), compounds that generate acids by absorbing light energy (photoacid generators), and compounds that generate bases by absorbing light energy (photoalkali generators), etc.

[0212] The initiator (E) is preferably selected from those suitable for the polymerization reaction of the free radical hardening component (D) mentioned above, with free radical polymerization initiators being more preferred, and photoradioactive free radical polymerization initiators being even more preferred. Examples of free radical polymerization initiators include alkylphenol compounds, benzoin compounds, dibenzocresol compounds, oxime ester compounds, and phosphine compounds. Photoradical polymerization initiators are preferred, and from the perspective of polymerization reactivity, oxime ester-based photoradical polymerization initiators are even better. By using oxime ester-based photoradical polymerization initiators, the reaction rate of the free radical hardening component (D) can be increased even under hardening conditions with low illuminance or light intensity.

[0213] The content of initiator (E) is usually 0.01 to 20 parts by weight relative to 100 parts by weight of resin (A), preferably 0.3 to 10 parts by weight, even better 0.5 to 5 parts by weight, even better 0.75 to 4 parts by weight, and preferably 1 to 3 parts by weight.

[0214] The light-selective absorbing compound (F) is a light-absorbing compound other than compound (X), such as a compound that absorbs light with wavelengths from 250 nm to 380 nm (preferably above 250 nm and below 360 nm) (ultraviolet absorber), a compound that absorbs light with wavelengths from 380 nm to 780 nm (pigment), or a compound that absorbs light with wavelengths from 780 nm to 1500 nm (infrared absorber). Ultraviolet absorbers are compounds that absorb light with wavelengths from 250 nm to 380 nm. Their structure is not particularly limited, but compounds such as benzotriazole compounds, benzophenone compounds, triazine compounds, salicylic acid compounds, cyanoacrylate compounds, and benzoxazine compounds are preferred. The content of light-selective absorbing compound (F) relative to 100 parts by weight of resin (A) is usually 0.1 to 50 parts by weight, preferably 0.2 to 40 parts by weight, more preferably 0.5 to 30 parts by weight, even more preferably 1 to 25 parts by weight, and especially preferably 2 to 20 parts by weight.

[0215] The molded article formed from the composition containing compound (X) preferably has a transmittance of 50% or less at a wavelength of 440 nm, and more preferably 30% or less. [Example]

[0216] The present invention will now be described in more detail with reference to examples and comparative examples, but the invention is not limited to these examples. In the examples, the percentages and parts representing the content or amount used are, unless otherwise specified, mass measurements.

[0217] (Example 1) Synthesis of the compound shown in formula (1) In a 100 mL four-necked flask equipped with a Dai-type condenser and thermometer, under a nitrogen atmosphere, 2 parts of 2-methyl-1,3-cyclohexanedione, 1.3 parts of dimethyl sulfate, and 10 parts of acetonitrile were added, and the mixture was heated to reflux for 3 hours with stirring. To the resulting mixture, 0.75 parts of malononitrile, 1.2 parts of potassium carbonate, and 10 parts of isopropanol were mixed, and the mixture was heated to reflux for 3 hours with stirring. After distilling off the solvent from the resulting mixture, it was purified to obtain 0.1 parts of the compound shown in formula (1).

[0218] The formation of the compound represented by formula (1) was confirmed by LC-MS determination and 1H-NMR analysis. 1H-NMR: 1.70 (m, 2H), 2.16 (s, 3H), 2.50 to 2.62 (m, 4H) LC-MS;[M]-=221.3

[0219] Determination of Maximum Absorption Wavelength and Absorption Coefficient ε A 0.006 g / L solution of the 2-butanone compound represented by formula (1) was placed in a 1 cm quartz cell. The quartz cell was installed in a UV-2450 spectrophotometer (manufactured by Shimadzu Corporation). The absorbance in the wavelength range of 300 to 800 nm was measured using the double-beam method in nm increments. The absorbance value, the concentration of the compound represented by formula (1) in the solution, and the optical path length of the quartz cell were used to calculate the gamma absorption coefficient for each wavelength. ε(λ)=A(λ) / CL [In the formula, ε(λ) represents the gamma-ray absorptivity of the compound shown in formula (1) at wavelength λnm (L / (g‧cm)), A(λ) represents the absorbance at wavelength λnm, C represents the concentration (g / L), and L represents the optical path length of the quartz trough (cm).] The maximum absorption wavelength of the compound shown in formula (1) is 457 nm. The ε(λmax) of the compound shown in formula (1) is 150.6 L / (g‧cm), ε(λmax+30nm) is 3.8 L / (g‧cm), and ε(λmax) / ε(λmax+30nm) is 39.6.

[0220] (Example 2) Synthesis of the compound shown in formula (2) A 300 mL four-necked flask equipped with a Dai-type condenser and thermometer was placed under a nitrogen atmosphere and filled with 70 parts of 5,5-dimethyl-1,3-cyclohexanedione, 10.4 parts of malononitrile, 40.6 parts of diisopropylethylamine, and 100 parts of ethanol. The mixture was heated to reflux for 3 hours with stirring. After distilling off the solvent from the resulting mixture, it was purified to obtain 15.1 parts of the compound shown in formula (M-5).

[0221] Under nitrogen atmosphere, 5 parts of the compound shown in formula (M-5), 5.8 parts of p-toluenesulfonic acid cyanide, 3 parts of potassium tributoxy, and 50 parts of ethanol were mixed. The resulting mixture was stirred at 0 to 5°C for 3 hours. After distilling off the solvent from the resulting mixture, it was purified to obtain 3.3 parts of the compound shown in formula (M-6).

[0222] Under nitrogen atmosphere, 5 parts of the compound shown in formula (M-6), 7.7 parts of methyl trifluoromethanesulfonate, 3.2 parts of potassium carbonate, and 50 parts of methyl ethyl ketone were mixed. The resulting mixture was stirred at 0 to 5°C for 3 hours. 4.6 parts of malononitrile and 13.0 parts of potassium carbonate were added to the resulting mixture, and the mixture was stirred at 0 to 5°C for 3 hours. After removing the solvent by distillation, the mixture was purified to obtain 3.1 parts of the compound shown in formula (2).

[0223] The formation of the compound shown in formula (2) was confirmed by LC-MS determination and 1H-NMR analysis. ¹H-NMR (heavy DMSO) δ: 0.92 (s, 6H), 2.45 to 2.52 (s, 4H) LC-MS;[M]-=260.2

[0224] Furthermore, the maximum absorption wavelength and gamma absorptivity were determined in the same manner as above. The maximum absorption wavelength of the compound shown in formula (2) was 432 nm. The ε(λmax) of the compound shown in formula (2) was 237 L / (g‧cm), ε(λmax+30nm) was 4.4 L / (g‧cm), and ε(λmax) / ε(λmax+30nm) was 53.9.

[0225] (Example 3) Preparation of resin composition (1) (adhesive composition (1)) Polymerization Example 1: Preparation of Acrylic Resin (A) In a reaction vessel equipped with a condenser, nitrogen inlet pipe, thermometer, and stirrer, a mixed solution of 81.8 parts ethyl acetate, 96 parts butyl acrylate, 3 parts 2-hydroxyethyl methyl acrylate, and 1 part acrylic acid was added as a solvent. Nitrogen gas was used to replace the air in the reaction vessel to create an oxygen-free environment, and the internal temperature was raised to 55°C. Then, the entire volume of a solution containing 0.14 parts azobisisobutyronitrile (polymerization initiator) dissolved in 10 parts ethyl acetate was added. After adding the polymerization initiator, the temperature was maintained for 1 hour. Then, while maintaining the internal temperature at 54-56°C, ethyl acetate was continuously added to the reaction vessel at a rate of 17.3 parts / hr. The addition of ethyl acetate was stopped when the acrylic resin concentration reached 35%, and the temperature was maintained at this level for 12 hours. Finally, ethyl acetate was added to adjust the acrylic resin concentration to 20%, thus preparing an ethyl acetate solution of the acrylic resin. The obtained acrylic resin, converted from polystyrene obtained by GPC, has a weight-average molecular weight (Mw) of 1.47 million and an Mw / Mn ratio of 5.5. This is used as acrylic resin (A).

[0226] <Preparation of Resin Composition (1)> Relative to 100 parts of the solids of the ethyl acetate solution of acrylic resin (A) (resin concentration: 20%), 0.3 parts of the mixed crosslinking agent (manufactured by TOSOH Co., Ltd.: trade name "Coronate L", isocyanate compound, solids 75%), 0.28 parts of the silane compound (manufactured by Shin-Etsu Chemical Co., Ltd.: trade name "KBM3066"), and 1.5 parts of the compound shown in formula (2), ethyl acetate was added to make the solids concentration 14%, and resin composition (1) (adhesive composition) was obtained. The above-mentioned amount of crosslinking agent is the mass fraction of the active ingredient.

[0227] (Examples 4 to 7 and Comparative Example 1) Preparation of resin compositions (2) to (6) As shown in Table 10, except for changes in the components and their contents, the adhesive composition (2) to adhesive composition (6) were prepared in the same manner as in Example 3. Furthermore, the amount of crosslinking agent is the mass fraction of the active ingredient, and resin (A) is the mass fraction of the solids.

[0228] [Table 10]

[0229] Furthermore, the abbreviations in Table 1 have the following meanings. Acrylic resin (A): Acrylic resin (A) synthesized in polymerization example 1. Formula (2): The compound of Formula (2) synthesized in Example 2 Coronate L: Manufactured by TOSOH Corporation, trade name: Coronate L, isocyanate-based crosslinking agent. KBM3066: Manufactured by Shin-Etsu Chemical Industry Co., Ltd., trade name: KBM3066, silane coupling agent. A-DPH-12E: Manufactured by Shin-Nakamura Chemical Industry Co., Ltd.; trade name; A-DPH-12E, a hexafunctional (meth)acrylate compound. NCI-730: Manufactured by ADEKA Corporation, trade name: NCI-730, belongs to the oxime ester compound family and is a photoradical generator. RUVA-93: Manufactured by Otsuka Chemical Co., Ltd., a benzotriazole-based ultraviolet absorber, trade name: RUVA-93, maximum absorption wavelength λmax = 337nm CIY33: Sumiplast Lemon Yellow HL (CI Solvent Yellow 33, manufactured by Sumitomo Chemical Chemtex Co., Ltd.)

[0230] <Evaluation of the molded body of resin composition (1)> [Fabrication of resin molded body (1)] The obtained resin composition (1) was applied using an applicator to the release-treated surface of a release membrane (trade name "PLR-382190" obtained from LINTEC Corporation) made of polyethylene terephthalate film, and dried at 100°C for 1 minute to produce a resin molded body (adhesive layer) (1). The thickness of the obtained resin molded body (1) was 15 μm.

[0231] The obtained resin molded body (1) was laminated onto a 23 μm thick cyclic olefin membrane containing ultraviolet absorber (trade name "ZEONOR" obtained from ZEON Corporation of Japan) using a laminator, and then cured for 7 days at a temperature of 23°C and a relative humidity of 65% to obtain a laminate (1) of cyclic olefin membrane / resin molded body (1) / separation membrane.

[0232] [Absorbance measurement of resin molded body (1)] The obtained laminate (1) was cut into 30mm × 30mm pieces, the separation membrane was peeled off, and the resin molded body (1) and alkali-free glass (trade name "EAGLE XG" manufactured by CORNING Co., Ltd.) were bonded together to form a sample (1). The absorbance of the prepared sample (1) in the wavelength range of 300 to 800 nm was measured using a spectrophotometer (UV-2450: manufactured by Shimadzu Corporation) in nm increments. The absorbance at a wavelength of 440 nm was taken as the absorbance of the resin molded body (1) at a wavelength of 440 nm. The results are presented in Table 11. Furthermore, the absorbance of the alkali-free glass monomer and the cycloolefin membrane monomer at wavelengths of 330 nm and 440 nm were 0, respectively. Furthermore, the transmittance at wavelengths of 440 nm and 330 nm was calculated according to the following formula. The results are presented in the T440 column of Table 11, showing the transmittance at a wavelength of 440 nm, and in the T330 nm column, showing the transmittance at a wavelength of 330 nm. T = 10 - A × 100 (T represents transmittance, A represents absorbance.)

[0233] [Determination of absorbance retention rate of resin molded body (1)] The sample (1) after absorbance measurement was placed in a sunshine weathermeter (manufactured by SUGA Testing Machine Co., Ltd.) at a temperature of 63°C and a relative humidity of 50%RH for 75 hours to conduct a weathering test. The absorbance of the sample (1) after removal was measured using the same method as above. From the measured absorbance, the absorbance retention rate of the sample at a wavelength of 440nm was calculated according to the following formula. In the following formula, A(440) represents the absorbance at a wavelength of 440nm. The results are presented in Table 11. The closer the absorbance retention rate is to 100, the less the light selective absorption function deteriorates, indicating good weather resistance. Absorbance retention rate (%) = (A(440) after durability test / A(440) before durability test) × 100

[0234] [Evaluation of the exudation resistance of the resin molded body (1)] A separation membrane was then deposited on one side of the obtained resin molded body (1) to obtain a resin molded body (1) with separation membranes on both sides. The obtained resin molded body (1) with separation membranes on both sides was stored in air at 23 to 25°C for 1 month. The presence or absence of crystallization of the compound in the resin molded body (1) with separation membranes on both sides after storage was confirmed using a microscope. No crystallization was marked as a, and crystallization was marked as b. The evaluation results are presented in the bleed resistance column of Table 11.

[0235] Resin composition (2) was used to replace resin composition (1) to prepare resin molded body (2), laminated body (2), and resin molded body (2) with separation membranes on both sides, and the same evaluation was performed. The results are presented in Table 11.

[0236] Resin composition (3) was used to replace resin composition (1) to prepare resin molded body (3), laminated body (3), and resin molded body (3) with separation membranes on both sides, and the same evaluation was performed. The results are presented in Table 11.

[0237] Resin composition (6) was used to replace resin composition (1) to prepare resin molded body (6), laminated body (6), and resin molded body (6) with separation membranes on both sides, and the same evaluation was performed. The results are presented in Table 11.

[0238] <Evaluation of the molded articles of resin composition (4)> [Preparation of resin-molded body (4)] Using an applicator, the resin composition (4) was applied to the release-treated surface of the release membrane (trade name "PLR-382190" obtained from LINTEC Corporation) made of polyethylene terephthalate membrane after release treatment to a thickness of 5 μm after drying. The membrane was then dried at 100°C for 1 minute. Subsequently, from the release membrane side, an ultraviolet irradiation device ("electrodeless UV lamp system H BULB" manufactured by FUSION UV SYSTEMS) was used to irradiate the membrane with UV-A (wavelength 320 to 390 nm) to an illuminance of 500 mW and a cumulative light intensity of 500 mJ to produce a resin molded body (adhesive layer) (4). The obtained resin molded body (4) is bonded to alkali-free glass. After peeling off the separation membrane, a 23μm cyclic olefin membrane containing ultraviolet absorber (trade name "ZEONOR" obtained from ZEON Corporation of Japan) is bonded to the resin molded body (4) to make a laminate (4) consisting of cyclic olefin membrane / resin molded body (4) / glass.

[0239] [Absorbance measurement of resin molded body (4)] The fabricated laminate (4) was mounted on a UV-2450 spectrophotometer (manufactured by Shimadzu Corporation), and the absorbance was measured using the double-beam method in a wavelength range of 300 to 800 nm increments. The absorbance measured at 440 nm was set as the absorbance of the resin molded body (4) at 440 nm. Furthermore, the absorbances of the alkali-free glass monomer and the cyclic olefin film monomer at wavelengths of 330 nm and 440 nm were both 0. Furthermore, the transmittance at wavelengths of 440 nm and 330 nm is calculated using the following formula. The results are presented in the T440 column of Table 11, showing the transmittance at wavelength 440 nm, and in the T330 nm column, showing the transmittance at wavelength 330 nm. T = 10 - A × 100 (T represents transmittance, A represents absorbance.)

[0240] [Determination of absorbance retention rate of resin molded body (4)] The laminate (4) after absorbance measurement was placed in a sunshine weather meter (manufactured by SUGA Testing Machine Co., Ltd.) at a temperature of 63°C and a relative humidity of 50%RH for 75 hours to conduct a weathering test. The absorbance of the resin molded body (4) of the laminate (4) after removal was measured using the same method as above. From the measured absorbance, the absorbance retention rate of the sample at a wavelength of 440nm was calculated according to the following formula. In the following formula, A(440) represents the absorbance at a wavelength of 440nm. The results are presented in Table 11. The closer the absorbance retention rate is to 100, the less the light selective absorption function deteriorates, indicating good weather resistance. Absorbance retention rate (%) = (A(440) after durability test / A(440) before durability test) × 100

[0241] [Evaluation of exudation resistance of resin molded body (4)] A separation membrane was then deposited on one side of the obtained resin molded body (4) to obtain a resin molded body (4) with separation membranes on both sides. The obtained resin molded body (4) with separation membranes on both sides was stored in air at 23 to 25°C for 1 month. The presence or absence of crystallization of the compound in the resin molded body (4) with separation membranes on both sides after storage was confirmed using a microscope. No crystallization was marked as a, and crystallization was marked as b. The evaluation results are presented in the bleed resistance column of Table 11.

[0242] Resin composition (4) was replaced with resin composition (5) to prepare resin molded body (5), laminated body (5), and resin molded body (5) with separation membranes on both sides, and the same evaluation was performed. The results are presented in Table 11.

[0243] [Table 11]

[0244] (Example 8) Modification of resin composition and molded body for eyeglass lenses 40 parts of xylene diisocyanate, 60 parts of trimethylolpropane tris(hydrothioacetate), 0.01 parts of the compound of formula (2) synthesized in Example 2, 0.2 parts of release agent (trade name: ZELEC-UN, from Sigme-Aldrich), and 0.03 parts of dibutyltin dichloride as a curing catalyst were mixed and stirred. The resulting mixture was allowed to stand in a vacuum dryer for 1 hour and degassed. The resulting mixture was poured into a glass mold and heated at 120°C for 1 hour. Only the molded body was peeled off from the glass mold to produce a resin plate with a thickness of 2 mm and a diameter of 3 cm × 3 cm as the molded body.

[0245] (Examples 9 to 12) The resin composition and molded body for eyeglass lenses were prepared in the same manner as in Example 8, except that the content of the compound shown in Formula (2) was changed to the content [parts] shown in Table 12.

[0246] [Table 12]

[0247] <Evaluation of Resin Boards> [Determination of absorbance of resin plates] The absorbance of the resin plate obtained above was measured in the wavelength range of 300 to 800 nm using a spectrophotometer (UV-2450: manufactured by Shimadzu Corporation) in nm increments. Furthermore, the transmittance at a wavelength of 440 nm is calculated using the following formula. The results are presented in the T440 column of Table 13. T = 10 - A × 100 (T represents transmittance, A represents absorbance.)

[0248] [Determination of absorbance retention rate of resin plates] Resin boards with absorbance measured were placed in a sunshine weathermeter (manufactured by SUGA Testing Machine Co., Ltd.) at 63°C and 50% RH for 75 hours to conduct a weathering test. The absorbance of the removed resin boards was measured using the same method as described above. From the measured absorbance, the absorbance retention rate of the resin board at a wavelength of 440 nm was calculated according to the following formula. In the formula, A(440) represents the absorbance at a wavelength of 440 nm. The results are presented in Table 13. The closer the absorbance retention rate is to 100, the less deterioration there is in the selective absorption function, indicating good weather resistance. Absorbance retention rate (%) = (A(440) after durability test / A(440) before durability test) × 100

[0249] [Table 13]

[0250] (Examples 13 to 15) Preparation of resin compositions (7) to (9) (adhesive compositions (7) to (9)) Polymerization Example 2: Preparation of Acrylic Resin (A1) In a reaction vessel equipped with a condenser, nitrogen inlet pipe, thermometer, and stirrer, a mixed solution of 81.8 parts ethyl acetate, 70 parts butyl acrylate, 1 part 2-hydroxyethyl methyl acrylate, 1 part acrylic acid, 8 parts phenoxyethyl acrylate, and 0.5 parts butoxymethacrylamide was added as a solvent. Nitrogen gas was used to replace the air in the reaction vessel to create an oxygen-free environment, and the internal temperature was raised to 55°C. Then, the entire volume of a solution containing 0.14 parts azobisisobutyronitrile (polymerization initiator) dissolved in 10 parts ethyl acetate was added. After adding the polymerization initiator, the temperature was maintained for 1 hour. Then, while maintaining the internal temperature at 54-56°C, ethyl acetate was continuously added to the reaction vessel at a rate of 17.3 parts / hr. The addition of ethyl acetate was stopped when the concentration of acrylic resin reached 35%, and the temperature was maintained at this level for 12 hours. Finally, ethyl acetate was added to adjust the concentration of acrylic resin to 20%, thus preparing an ethyl acetate solution of acrylic resin. The obtained acrylic resin, converted from polystyrene obtained by GPC, has a weight-average molecular weight (Mw) of 1.25 million and an Mw / Mn ratio of 4.5. This is used as the acrylic resin (A1).

[0251] As shown in Table 14, except for changes in the components and their contents, the adhesive composition (7) to adhesive composition (9) were prepared in the same manner as in Example 3. Furthermore, the amount of crosslinking agent is the mass fraction of the active ingredient, and resin (A) is the mass fraction of the solids.

[0252] [Table 14]

[0253] Furthermore, the abbreviations in Table 14 have the following meanings. Acrylic resin (A1): The acrylic resin (A1) synthesized in polymerization example 2. Formula (2): The compound of Formula (2) synthesized in Example 2 Coronate L: Manufactured by TOSOH Corporation, trade name: Coronate L, isocyanate-based crosslinking agent. KBM3066: Manufactured by Shin-Etsu Chemical Industry Co., Ltd., trade name: KBM3066, silane coupling agent. KBM403: Manufactured by Shin-Etsu Chemical Industry Co., Ltd., trade name: KBM403, silane coupling agent. M-130G: Manufactured by Shin-Nakamura Chemical Industry Co., Ltd.; Trade name: M-130G, Monofunctional methoxy polyethylene glycol methacrylate. Ionic compounds: Ionic compounds represented by the following formulas

[0254] <Evaluation of the molded articles of resin composition (7)> [Fabrication of resin molded body (7)] The obtained resin composition (7) was applied using an applicator to the release-treated surface of a release membrane (trade name "PLR-382190" obtained from LINTEC Corporation) made of polyethylene terephthalate film, and dried at 100°C for 1 minute to produce a resin molded body (adhesive layer) (7). The thickness of the obtained resin molded body (7) was 20 μm.

[0255] The obtained resin molded body (7) was laminated onto a 23 μm thick cyclic olefin membrane containing ultraviolet absorber (trade name "ZEONOR" obtained from ZEON Corporation of Japan) using a laminator, and cured for 7 days at a temperature of 23°C and a relative humidity of 65% to obtain a laminate (7) of cyclic olefin membrane / resin molded body (7) / separation membrane.

[0256] [Absorbance measurement of resin molded body (7)] The resulting laminate (7) was cut into 30mm × 30mm pieces, the separation membrane was peeled off, and the resin molded body (7) and alkali-free glass (CORNING Corporation, trade name "EAGLE XG") were bonded together to form a sample (7). The absorbance of the prepared sample (7) in the wavelength range of 300 to 800 nm was measured using a spectrophotometer (UV-2450: Shimadzu Corporation) in nm increments. The absorbance at a wavelength of 440 nm was taken as the absorbance of the resin molded body (7) at 440 nm. The results are presented in Table 15. Furthermore, the absorbance of the alkali-free glass monomer and the cycloolefin membrane monomer at wavelengths of 330 nm and 440 nm were both 0. Furthermore, the transmittance at wavelengths of 440 nm and 330 nm is calculated using the following formula. The results are presented in the T440 column of Table 15, showing the transmittance at wavelength 440 nm, and in the T330 nm column, showing the transmittance at wavelength 330 nm. T = 10 - A × 100 (T represents transmittance, A represents absorbance.)

[0257] [Determination of absorbance retention rate of resin molded body (7)] The sample (7) after absorbance measurement was placed in a sunshine weathermeter (manufactured by SUGA Testing Machine Co., Ltd.) at a temperature of 63°C and a relative humidity of 50%RH for 75 hours to conduct a weathering test. The absorbance of the sample (7) after removal was measured using the same method as above. From the measured absorbance, the absorbance retention rate of the sample at a wavelength of 440nm was calculated according to the following formula. In the following formula, A(440) represents the absorbance at a wavelength of 440nm. The results are presented in Table 15. The closer the absorbance retention rate is to 100, the less the light selective absorption function deteriorates, indicating good weather resistance. Absorbance retention rate (%) = (A(440) after durability test / A(440) before durability test) × 100

[0258] [Evaluation of the exudation resistance of the resin molded body (7)] A separation membrane was then deposited on one side of the obtained resin molded body (7) to obtain a resin molded body (7) with separation membranes on both sides. The obtained resin molded body (7) with separation membranes on both sides was stored in air at 23 to 25°C for 1 month. The presence or absence of crystallization of the compound in the resin molded body (7) with separation membranes on both sides after storage was confirmed using a microscope. No crystallization was marked as a, and crystallization was marked as b. The evaluation results are shown in the bleed resistance column of Table 15.

[0259] Resin composition (7) was replaced with resin composition (8) to prepare resin molded bodies (8), laminated bodies (8), and resin molded bodies (8) with separation membranes on both sides, and the same evaluation was performed. The results are presented in Table 15.

[0260] Resin composition (7) was replaced with resin composition (9) to prepare resin molded bodies (9), laminated bodies (9), and resin molded bodies (9) with separation membranes on both sides, and the same evaluation was performed. The results are presented in Table 15.

[0261] [Table 15]

[0262] The compounds of this invention exhibit high absorption selectivity for short-wavelength visible light up to 440 nm. Furthermore, resin compositions containing the compounds of this invention also exhibit high absorbance retention after weathering tests and demonstrate good weather resistance.

Claims

1. A compound comprising an anion represented by formula (I–A) and a cation paired with the aforementioned anion, wherein, The aforementioned cation system includes at least one of organic cations and inorganic cations; in formula (I–A), RE1, RE2, RE3, RE4, RE5 and RE6 independently represent hydrogen atoms or hydrocarbon groups having 1 to 25 carbon atoms; R1, R2, R3, R4 and R5 are as shown below [A–1a] or [A–2a]: [A–1a] R1, R2, R3, R4 and R5 are independently cyano or nitro; [A–2a] R1, R2, R4 and R5 are independently cyano or nitro, and R3 is a straight-chain or branched alkyl group having 1 to 12 carbon atoms.

2. The compound as claimed in claim 1, wherein, In the aforementioned formula (I–A), R1, R2, R3, R4 and R5 are as shown in [A–1b] or [A–2b] below: [A–1b] R1, R2, R3, R4 and R5 are cyano groups; [A–2b] R1, R2, R4 and R5 are cyano groups, and R3 is a straight-chain or branched alkyl group having 1 to 12 carbon atoms.

3. The compound as claimed in claim 1, wherein, R1, R2, R3, R4 and R5 are as shown in [A–1a] above.

4. The compound as claimed in claim 1, wherein, Maximum absorption is observed between wavelengths of 400 nm and 550 nm.

5. The compound as claimed in claim 1, wherein, The absorption coefficient at the maximum absorption wavelength is 0.5 or higher.

6. The compound described in any one of claims 1 to 5 satisfies the following formula (a): ε(λmax) / ε(λmax+30nm)≧5 (a) where ε(λmax) represents the gamma absorption coefficient at the maximum absorption wavelength (λmax), ε(λmax+30nm) represents the gamma absorption coefficient at the wavelength of the maximum absorption wavelength (λmax) + 30nm, and the unit of gamma absorption coefficient is L / (g・cm).

7. A composition comprising any one of the compounds described in claims 1 to 6.

8. A molded article formed by shaping the components described in claim 7.

9. The molded article as described in claim 8 has a transmittance of less than 50% at a wavelength of 440 nm.