Substrate processing apparatus and method

Abstract

This disclosure relates to apparatus and methods for performing maskless lithography. A substrate processing apparatus includes a thick plate having a plurality of guide rails coupled to and extending along the thick plate. A first shuttle is disposed on the plurality of guide rails, a second shuttle is disposed on the first shuttle, and a measuring rod is coupled to the second shuttle. The measuring rod includes a plurality of first sensors coupled to the measuring rod. A plurality of second sensors coupled to the measuring rod are disposed laterally inside the plurality of first sensors.

Description

[Technical Field]

[0001] Embodiments of the present invention generally relate to systems and methods for processing one or more substrates, and more specifically to systems and methods for performing photolithography, metrology and inspection processes. [Previous Technology]

[0002] Photolithography is widely used in the manufacture of semiconductor components (such as for back-end processing of semiconductor components) and display devices (such as liquid crystal displays (LCDs)). For example, large-area substrates are frequently used in the manufacture of LCDs. An LCD is a flat panel display commonly used in active matrix displays in devices such as computers, touchpad devices, personal digital assistants, mobile phones, television monitors, and the like. Some flat panel displays include a layer of liquid crystal material sandwiched between cross-polarizers. The liquid crystal material is also sandwiched between two conductive plates. When a voltage from a power source is applied across or through the liquid crystal material, the amount of light transmitted through the liquid crystal material changes, and the light transmission through the cross-polarizer also changes. This technique enables the light transmission of each pixel in a closely packed pixel array, which is selectively modulated to generate an image on the display.

[0003] Photolithography is typically used to create electrical features incorporated as part of the liquid crystal material layer forming pixels. According to this technique, a photoresist is typically applied to a surface of a substrate. A pattern generator then exposes selected areas of the photoresist to cause a chemical change in the photoresist within the selected areas, preparing these areas for subsequent material removal and / or material addition processes to create the electrical features.

[0004] During pattern generation, it is beneficial to know the precise position of the substrate relative to the pattern imaging system, because even the slightest difference in the substrate's position can cause mura or blurriness in the image generated on the substrate. Current lithography systems typically use laser interferometers to determine the substrate's position relative to the pattern generator. Such systems are expensive and can be susceptible to various environmental factors, such as system vibration and variations in the interferometer's air path.

[0005] In order to provide display devices and other devices to consumers at prices demanded by consumers, new equipment and methods are needed to accurately and cost-effectively create patterns on substrates (such as large-area substrates). More specifically, what is needed in the art is a machine measurement and metrology system for lithography systems and related methods of use, the machine measurement and metrology system accurately measuring the position of the processing stage relative to a fixed processing unit. [Summary of the Invention]

[0006] Embodiments of this disclosure generally relate to apparatus and methods for performing photolithography. In one embodiment, a substrate processing apparatus includes a thick plate having a plurality of guide rails coupled to and extending along the thick plate. A first shuttle is disposed on the plurality of guide rails, a second shuttle is disposed on the first shuttle, and a metering rod is coupled to the second shuttle. The metering rod includes a plurality of first sensors coupled to the metering rod. A plurality of second sensors coupled to the metering rod are disposed laterally inside the plurality of first sensors.

[0007] In one embodiment, a substrate processing apparatus includes: a thick plate; a plurality of guide rails coupled to and extending along the thick plate; a processing unit coupled to the thick plate via a support member; a first shuttle member disposed on the plurality of guide rails; a second shuttle member disposed on the plurality of guide rails and opposite to the first shuttle member; a third shuttle member including a first clamping plate disposed on the first shuttle member; a fourth shuttle member including a second clamping plate disposed on the second shuttle member; and a first measuring rod and a second measuring rod, the first measuring rod being coupled to the first clamping plate and the second measuring rod being coupled to the second clamping plate. Each of the first measuring rod and the second measuring rod includes a plurality of first sensors disposed at a distal end of the measuring rod and a plurality of second sensors disposed laterally inside the plurality of first sensors.

[0008] In another embodiment, a substrate processing method includes the steps of: positioning a substrate on a clamp, wherein the clamp is coupled to a second shuttle disposed on a first shuttle. The first shuttle determines the position of the substrate within a processing unit via a measuring bar including a sensor coupled to the clamp opposite to the substrate, and in response to determining the position of the substrate, moves one or both of the first shuttle and the second shuttle to position the substrate relative to the processing unit.

Implementation Method

[0017] Embodiments of this disclosure generally relate to apparatus and methods for performing photolithography, metrology, or inspection using a two-dimensional platform with precise metrology. More specifically, embodiments of this disclosure relate to apparatus and methods for determining the position of a substrate during a lithography or inspection operation (including maskless lithography) and further providing real-time feedback to a processing unit. In one embodiment, a substrate processing apparatus includes a thick plate having a plurality of guide rails coupled to and extending along the thick plate. A first shuttle and a second shuttle are disposed on the plurality of guide rails. The guide rails are disposed on both the first shuttle and the second shuttle orthogonal to the guide rails on the thick plate. A third shuttle and a fourth shuttle are coupled to the guide rails of the first shuttle and the second shuttle. A plurality of metering rods are coupled to the third shuttle and the fourth shuttle. Each metering rod includes a plurality of first sensors coupled to the metering rod. A plurality of second sensors coupled to the metering rod are disposed laterally inside the plurality of first sensors.

[0018] Figure 1 is a perspective view of a system 100 from an embodiment disclosed herein. System 100 includes a base frame 110, a plate 120, two or more clamps 130, and a processing unit 160. The base frame is mounted on the floor of the manufacturing facility and supports the plate 120. A passive air isolator 112 is positioned between the base frame 110 and the plate 120. The passive air isolator 112 is capable of reducing vibrational movement of the plate 120 relative to the base frame 110. The plate 120 may be made of various materials that generally have high rigidity and can produce a very flat surface thereon. In one embodiment, the plate 120 is a monolithic granite block.

[0019] A first shuttle 150 and a second shuttle 170 are disposed on a thick plate 120 within the system 100. The second shuttle 170 is coupled to the first shuttle 150, and a chuck 130 is disposed on the second shuttle 170. The chuck 130 is aligned in a first direction (such as the X direction) as shown in Figure 1. A substrate 140 is supported by each of the chucks 130. A plurality of holes (not shown) are formed in each chuck 130 for a plurality of lifting pins (not shown) to extend through. The lifting pins rise to an extended position to receive a substrate, such as a substrate from a transfer robot (not shown). The transfer robot positions the substrate 140 on the lifting pins, and the lifting pins lower the substrate 140 onto each chuck 130.

[0020] The substrate 140 is made of alkaline earth borosilicate glass and serves as part of a flat panel display. In other embodiments, the substrate 140 may be made of other materials. In some embodiments, the substrate 140 is coated with photoresist. The photoresist is sensitive to radiation and may be positive or negative. For example, portions of the photoresist exposed to radiation may be soluble or insoluble in a photoresist developer, which is applied to the photoresist after a pattern has been written into it by exposure to electromagnetic radiation. The chemical composition of the photoresist determines whether it will be negative or positive. For example, the photoresist includes at least one of diazonapthoquinone, phenol formaldehyde resin, poly(methyl methacrylate), poly(methyl glutraimide), and SU-8. In this way, a pattern is generated in the photoresist layer, and after development and etching, the pattern is transferred to the bottom layer on the surface of the substrate 140 to form electronic circuit components.

[0021] System 100 further includes a pair of support members 122 and a pair of guide rails 124. The pair of support members 122 are disposed on the thick plate 120. In one embodiment, the pair of support members 122 and the pair of guide rails 124 are separate components and are made of the same or different materials. In another embodiment, the pair of support members 122 and the pair of guide rails 124 are made of a single piece of material. In another embodiment, the pair of support members 122 and the pair of guide rails 124 are integrally formed with the thick plate 120. In another embodiment, the pair of guide rails 124 are disposed on the pair of support members 122. The guide rails 124 and the support members 122 are made of the same or different materials. In one embodiment, the thick plate 120, the pair of support members 122, and the pair of guide rails 124 are made of a single piece of material. The pair of support members 122 and the pair of guide rails 124 are positioned substantially parallel to each other and extend along the thick plate 120 in the X direction.

[0022] A first shuttle 150 is disposed on a guide rail 124. In operation, the first shuttle 150 moves along the guide rail 124 in a first direction (such as the X direction). In one embodiment, the pair of guide rails 124 are a pair of parallel magnetic channels. As shown, each track of the pair of guide rails 124 is linear. In other embodiments, the guide rails 124 have a non-linear shape. A second shuttle 170 is disposed on the first shuttle 150 and the second shuttle 170 is configured to move along the first shuttle 150 in a direction orthogonal to the first shuttle 150 (such as the Y direction).

[0023] The processing apparatus 160 includes a support 162 and a processing unit 164. The support 162 supporting the processing unit 164 is disposed on a thick plate 120 and includes an opening 166 for the chuck 130 to pass beneath the processing unit 164. In one embodiment, the processing unit 164 is a pattern generator configured to expose photoresist in photolithography. In another embodiment, the pattern generator is configured to perform maskless photolithography. The processing unit 164 includes a plurality of image projection systems disposed in a housing 165. The processing apparatus 160 is used to perform maskless direct patterning. During operation, one of two or more chuck 130 assemblies disposed on the pair of guide rails 124 moves in the X direction from a loading position as shown in Figure 1 to a processing position. The processing position refers to one or more positions of the chuck 130 as it passes beneath the processing unit 164.

[0024] A pair of scales 185 (shown in detail in Figures 3, 4, and 6) are disposed in the opening 166. In one embodiment, the scales 185 are encoder scales. In one embodiment, the scales 185 are mounted to the inner wall 128 of the opening 166. In another embodiment, the encoder scales 185 are coupled to the bottom 163 of the support 162 within the opening 166. The scales 185 are disposed and extend collinearly with the guide rail 124. In one embodiment, the scales 185 are substantially perpendicularly aligned with the guide rail 124. Alternatively, the scales 185 may be positioned laterally outside the guide rail 124. In one embodiment, the scales 185 are made of ceramic, glass, or other suitable material. The scales 185 include etched or marked features configured to provide position data to the readhead sensor 382 of the metering bar 180 (shown in detail with respect to Figures 4, 5, and 6).

[0025] During operation, two or more chucks 130 move along the pair of guide rails 124 and through the opening 166 via the first shuttle 150 to pass under the processing device 160. The two or more chucks 130 can also move in a second direction (such as the Y direction) by the movement of the second shuttle 170. Therefore, the X-Y movement of the chucks 130 and the substrate 140 disposed thereon is achieved by the first shuttle 150 and the second shuttle 170. It is also conceivable that, if desired, the chucks 130 can move vertically in the Z direction by the movement of one or both of the first shuttle 150 and the second shuttle 170.

[0026] The measuring rod 180 is coupled to the chuck 130 relative to the surface of the chuck 130 supporting the substrate 140. The measuring rod 180, having a readhead sensor 382 at its opposite end, extends in a direction perpendicular to the principal axis of the parallel guide rail 124. During movement of the chuck 130 within or near the opening 166, the readhead sensor 382 is substantially aligned below the scale 185. The measuring rod 180 serves to provide the relative position of the chuck 130 (and therefore the substrate 140) to the processing unit 164 for more precise patterning of the substrate 140. The measuring rod 180 allows vibrations and stray displacements of the plate 120 to be detected, measured, and taken into account when determining the position of the substrate 140.

[0027] System 100 also includes a controller 290 (see Figure 2). Controller 290 is designed to facilitate control and automation of the processing technology described herein. Depending on the desired implementation, controller 290 is coupled to or communicates with one or more of the processing system 100, chuck 130, shuttles 150, 170, readhead sensor 382, ​​and processing device 160. A scale 185 of the processing system 100 is read by readhead sensor 382 to generate and provide information about substrate position and alignment to controller 290. For example, processing device 160 provides information to controller 290 at least in part based on the position of chuck 130 relative to processing device 160 to alert controller 290 that substrate processing has been completed. The location information provided to controller 290 is then used to control the position of chuck 130 and the digital pattern projected from processing device 160.

[0028] Controller 290 includes a central processing unit (CPU) (not shown), memory (not shown), and support circuitry (or I / O) (not shown). The CPU may be one of any type of computer processor used in an industrial environment to control various processes and hardware (e.g., pattern generators, motors, and other hardware) and monitor processes (e.g., processing time and substrate position). The memory is connected to the CPU and may be one or more types of memory readily available locally or remotely (such as random access memory (RAM), read-only memory (ROM), floppy disk, hard disk, or any other form of digital storage). Software instructions and data may be encoded and stored in the memory to instruct the CPU. Support circuitry is also conventionally connected to the CPU to support the processor. Support circuitry may include conventional caches, power supplies, clock circuits, input / output circuits, subsystems, and the like. A program (software or computer instructions) readable by controller 290 determines which tasks may be performed on substrate 140. In one example, the program is software readable by controller 290 and includes code for monitoring and controlling, for example, processing time and substrate position.

[0029] Figure 2 is a perspective view of a shuttle assembly according to one embodiment. The first shuttle 150 has a body 352 and a guide 354. In one embodiment, the body 352 and the guide 354 are integral components made of the same material. In another embodiment, the body 352 and the guide 354 are separate components coupled together and made of the same or different materials. The guide 354 is disposed on the pair of guide rails 124.

[0030] The guide 354 has an inner surface 356, a top surface 357, and an outer surface 358. The inner surface 356, top surface 357, and outer surface 358 define a recess 359. The recess 359 is shaped and configured to be formed along or guided by the guide rail 124. The inner surface 356 of the guide 354 is coupled to the body 352 of the first shuttle 150. The length of the body 352 in the Y direction is less than the distance between the relative guide rails 124. At least one motor (not shown) (such as a linear motor of the same type) is disposed within the first shuttle 150 to move the guide 354 along the guide rail 124.

[0031] A second shuttle 170 is disposed above the body 352 of the first shuttle 150. The length of the second shuttle 170 in the Y direction is less than the length of the body 352. The second shuttle 170 has a body 372 and an overhang 374. In one embodiment, the body 372 and the overhang 374 are integral components made of the same material. The overhang 374 extends downward from the body 372 along and adjacent to the body 352 of the first shuttle 150. At least one motor is disposed within the second shuttle 170 to move the second shuttle 170 in the Y direction along the body 352 of the first shuttle 150. In one embodiment, the second shuttle 170 is configured to move in the Y direction by an amount between about 1 mm and about 200 mm. Alternatively, the motor may be used to move the second shuttle 170 in the X direction along the body 352.

[0032] A plurality of actuators 202 are disposed on the second shuttle 170. A chuck 130 is disposed on the plurality of actuators 202 such that the actuators 202 are positioned between the second shuttle 170 and the chuck 130. The actuators 202 enable the chuck 130 to move in a third direction (such as the Z direction). The movement of the chuck 130 in the third direction enables the system 100 to adjust for varying thicknesses of the substrate 140 during processing by the processing unit 160. The actuators 202 are mechanical actuators, electric actuators, pneumatic actuators, hydraulic actuators, or other types of read actuators capable of precisely moving the chuck 130. In one example, the actuator 202 is an air bearing or the like.

[0033] A measuring rod 180 is coupled to the bottom of a clamp 130. The distal end 386 of the measuring rod 180 extends laterally beyond the periphery of the clamp 130. The measuring rod 180 is made of a lightweight, thermally stable material with a high specific thickness. In one embodiment, the measuring rod 180 is made of a ceramic material, such as silicon carbide. In another embodiment, the measuring rod 180 is made of a metal, such as magnesium. The measuring rod 180 includes a readhead sensor 382 (a plurality of first sensors) coupled to the distal end 386 of the measuring rod 180. In operation, the sensor 382 is used to determine the relative position of the clamp 130 (and therefore the substrate 140) in a first direction (such as the X direction).

[0034] Figure 3 shows an exploded view of the shuttle assembly of Figure 2 according to an embodiment of this disclosure. The measuring rod 180 has a plurality of second sensors 384 coupled to or disposed within the measuring rod 180. The plurality of second sensors 384 are disposed laterally inside a plurality of first sensors 382. In operation, the plurality of second sensors 384 are used to determine the relative position of the clamp 130 (and therefore the substrate 140) in a second direction (such as the Y direction). In one embodiment, sensors 382, ​​384 are optical encoders. In another embodiment, sensors 382, ​​384 are magnetocapacitive sensors. In yet another embodiment, sensors 382, ​​384 are inductive linear encoders.

[0035] Encoders (such as sensors 382, ​​384) are position measurement tools that offer many advantages over other measurement tools (such as interferometers). Encoders are thin, one-dimensional devices and are inherently unsuitable for measuring locations in two-dimensional areas. Encoders (such as sensor 382) are used to measure the position of the first shuttle 150 relative to the granite slab 120, while encoders (such as sensor 384) are used to measure the position of the second shuttle 170 relative to the first shuttle 150. The measurements obtained from sensors 382, ​​384 are typically vertically displaced from the top surface of the substrate 140. Any tilting or undesired displacement between the shuttles 150, 170 and the slab 120 results in a measurement error known as Abbe offset error. Ideally, sensors 382, ​​384 are coplanar with the top surface of the substrate 140, thereby eliminating any Abbe offset error.

[0036] Figure 4 shows a top perspective view of a plurality of first sensors 382 positioned on the distal end 386 of the measuring rod 180. Figure 5 shows a bottom perspective view of the measuring rod 180 mounted to the chuck base 132. The measuring rod 180 is disposed within a bearing 632. The bearing 632 is coupled to the chuck base 132. In one embodiment, the bearing 632 is an air bearing. Alternatively, the bearing 632 is a magnetic bearing. The bearing 632 is disposed on opposite sides of the measuring rod 180 and the measuring rod 180 extends through the bearing 632. The bearing 632 is configured to provide substantially frictionless movement of the measuring rod 180 relative to the chuck base 132.

[0037] A plurality of first scales 686 are coupled to the chuck base 132 between bearings 632. The plurality of first scales 686 are disposed opposite to a plurality of second sensors 384 of the measuring rod 180. The scales 686 are made of a glass material. In one embodiment, the glass is a zero-expansion glass material. In another embodiment, the glass thermally expands by up to about 9 micrometers. The scales 686 include features (such as etching or the like) that can be read by the plurality of second sensors 384 to determine the position of the measuring rod in the Y direction. In one embodiment, the feature is a fine grating structure etched into the surface of the scale 686. Similar to scales 686, scales 185 include features (such as etched grating patterns or the like) that can be read by the plurality of first sensors 382 to determine the position of the measuring rod 180 in the X direction. The encoder scale 185 includes an encoder strip 685 containing grating pattern features disposed opposite to the guide rail 124. In one embodiment, the scale 185 and the encoder strip 685 with grating features are substantially perpendicularly aligned with the guide rail 124. In another embodiment, a sliding collar attached to the scale 185 is used to align a plurality of first sensors 382 with the pattern features of the encoder strip 685. In yet another embodiment, an attachment to the first shuttle 150 or a servo mechanism is used to maintain alignment with the encoder strip 685.

[0038] Bearing 632 allows the position of the measuring rod 180 to remain fixed as the second shuttle 170 moves relative to the first shuttle 150, thereby enabling the sensor 382 attached to the measuring rod 180 to detect its position relative to an encoder (such as scale 185), thus providing a position coordinate. A second readhead (such as sensor 384) is attached to the measuring rod 180 to detect its position relative to an encoder (such as scale 686), thereby providing a second orthogonal position coordinate. Both sensors 382 and 384 are coplanarly positioned with respect to the top surface of the substrate 140 to minimize Abbe offset error. The accuracy of the position obtained from the second readhead (such as sensor 384) depends on the position of the measuring rod 180 relative to the centerline of the encoder scale 185 attached to the thick plate 120. In one embodiment, a second encoder feature pattern is added to an encoder strip 685 having features perpendicular to the first encoder feature pattern, enabling accurate measurement and correction of any positioning errors of the measuring rod 180.

[0039] In one embodiment, a plurality of sensors 382, ​​384 are disposed on the measuring rod 180 and fixed encoder scales 185, 686 are disposed opposite to the sensors 382, ​​384. In another embodiment, the locations of the scales 185, 686 and the sensors 382, ​​384 are reversed, wherein the scales 185, 686 may be disposed on the measuring rod 180, while the sensors 382, ​​384 are disposed on the thick plate 120 and the second shuttle 170, respectively.

[0040] In operation, a plurality of first sensors 382 provide information to processing device 160 via controller 290, indicating the relative position of chuck 130 (and thus substrate 140) in a first direction (such as the X direction) as the first shuttle 150 moves along guide rail 124 in a first direction. A plurality of second sensors 384 also provide information to processing device 160 via controller 290, indicating the relative position of chuck 130 (and thus substrate 140) in a second direction (such as the Y direction) as the shuttle 170 moves along body 352 of first shuttle 150 in a second direction. In one embodiment, processing device 160 and / or controller 290 use the relative position information generated by sensors 382, ​​384 to calculate a yaw angle or rotation of chuck 130 about the Z-axis. Such calculation is possible because the relative positions in the first and second directions are detected by sensors 382, ​​384.

[0041] Referring back to Figure 4, a plurality of third sensors 388 are disposed in a measuring rod 180 to measure the relative position of the substrate 140 in a third direction (such as the Z direction). In one embodiment, the plurality of third sensors 388 are coupled to or otherwise disposed within the measuring rod 180 between a plurality of first sensors 384 and a plurality of second sensors 384. In one embodiment, the sensor 388 is an optical sensor that determines the distance in the Z direction between the sensor 388 and the bottom surface of the substrate 140. The plurality of third sensors 388 are interrogated by a third fixed encoder scale (not shown). The third fixed encoder scale is mounted to a support 162 within an opening 166 and extends parallel to a first fixed encoder scale 185. Alternatively, the sensor 388 determines the distance in the Z direction between the sensor 388 and the chuck base 132. It is contemplated that information derived from the sensor 388 will be used to compensate for thickness variations of the substrate 140 in the Z direction and variations of the guide rail 124. The above configuration provides two sensors 382 and 388 capable of monitoring the substrate position in the direction of the first guide rail 124. The average of the positions generated by the two sensors 382 and 388 is an accurate measurement of the position of the substrate 140. In another embodiment, the position of the substrate 140 is derived from a weighted average of the positions generated by the two sensors 382 and 388. In this embodiment, the weights vary depending on the position of the measuring rod 180 relative to the second shuttle 170. The difference between the two readings is a measurement of the twist of the second shuttle 170 in the Z direction, which is the direction of the plane of the substrate 140.

[0042] In one embodiment, sensors 382, ​​384, and 388 are optical encoder readheads, and scales 686 and 185 are made of zero-expansion glass. The optical encoder readheads 382, ​​384, and 388 utilize LED light or laser light. In one embodiment, a reflective film is deposited on scales 686 and 185 (and scale features) and etched to create a precision grating pattern. When sensors 382 and 384 move relative to scales 686 and 185, the grating pattern from the readhead device is projected onto a matching grating pattern on scales 686 and 185, generating a sinusoidal variation of reflected light. The sinusoidal oscillations read by sensors 382 and 384 provide the relative position of substrate 140 to processing device 160. Furthermore, the sine curve is converted into distance, thereby providing an accuracy between approximately 1 nanometer (nm) and approximately 10 nm. Therefore, the system 100 is able to perform extremely precise position detection by utilizing the measuring bar 180 and the described sensors 382, ​​384 and scales 686, 185.

[0043] Figure 6 illustrates the operation of a method 700 for reducing positional errors of patterns formed on a substrate according to various embodiments. At block 702, the substrate is moved in a first direction (such as the X direction) under image projection (e.g., processing device 160). The substrate may be a substrate 140 disposed on a chuck 130 of system 100. Substrate 140 includes surfaces to be patterned by a plurality of image projection systems. At block 704, mask pattern data is provided to the image projection systems. Next, at block 706, location and position information of the moved substrate is provided to controller 290 for each processing sequence. The location and position of the moved substrate are used to correct the mask pattern data, as shown at block 708. In addition to forming a predetermined pattern on the substrate surface by using the operation of method 700, when the location and position of the substrate have deviated from the predetermined location and position, the operation of method 700 is used to match the pattern exposed by the system 100 from the surface of the substrate by other exposure tools.

[0044] In addition to the operation of method 700 shown in Figure 6, during each processing sequence, the positional error of the pattern formed on the substrate can be further reduced by reducing the electromagnetic energy delivered to the surface of the substrate. In other words, a single optical image pixel formed on a region of the substrate surface may not be bright enough to form a pattern, and it may require multiple optical image pixels to be clustered on the same region to be bright enough to form a pattern. In this way, if the location of any single optical image pixel on the surface of the substrate is incorrect, the single optical image pixel does not contain enough energy to form a pattern. Since the location of subsequent optical image pixels is corrected using the operation of method 700 described in Figure 6, the positional error of the pattern formed on the substrate is further reduced.

[0045] In summary, the embodiments described herein provide an improved maskless lithography system. The system utilizes a measuring rod and associated sensors to determine the position of the chuck (and thus the substrate) relative to the imaging processing unit. Furthermore, a plurality of shuttles are used to move the chuck in the X and Y directions to correct potential alignment of the substrate during processing. It is evident from the above description that the apparatus and method described herein can reduce maskless lithography errors. [Simplified Explanation of the Diagram]

[0009] In order to understand in detail the above-described features of this disclosure, a more specific description of the disclosure briefly summarized above can be obtained by referring to the embodiments, some of which are shown in the accompanying drawings. However, it should be noted that the accompanying drawings only show exemplary embodiments and should therefore not be considered as limiting its scope, and other equivalent embodiments are permissible.

[0010] Figure 1 is a perspective view of a system that may benefit from the embodiments disclosed herein.

[0011] Figure 2 is a perspective view of a shuttle assembly according to one embodiment.

[0012] Figure 3 is an exploded view of a shuttle assembly according to one embodiment.

[0013] Figure 4 is an enlarged schematic diagram of a measuring bar according to an embodiment disclosed herein.

[0014] Figure 5 is a schematic diagram of the mounting mechanism of a measuring rod according to one embodiment.

[0015] Figure 6 shows steps for reducing positional errors of patterns formed on a substrate according to various embodiments.

[0016] For ease of understanding, the same element symbols are used where possible to represent the same elements common to the drawings. It is contemplated that elements and features of one embodiment may be advantageously incorporated into other embodiments without further description. [Biomaterial Storage]

[0047] Domestic storage information (please note in order of storage institution, date, and number): None. International storage information (please note in order of storage country, institution, date, and number): None.

Claims

1. A substrate processing apparatus comprising: a thick plate; at least one guide rail coupled to and extending along the thick plate; a first shuttle disposed on the at least one guide rail; a second shuttle disposed on the first shuttle; and a measuring rod coupled to a bottom of a clamp disposed on the second shuttle, wherein each distal end of the measuring rod extends laterally beyond a periphery of the clamp, the measuring rod comprising: at least one first sensor coupled to at least one distal end of the measuring rod; and at least one second sensor laterally inside the at least one first sensor.

2. The device as claimed in claim 1, wherein a plurality of air bearings are disposed on opposite sides of the measuring rod.

3. The device as described in claim 2, further comprising: A second scale is coupled to the clamp.

4. The device as claimed in claim 3, wherein the second scale is configured to be opposite the at least one second sensor.

5. The device as described in claim 1, further comprising: A processing unit is coupled to the thick plate by a support member.

6. The device as described in claim 5, further comprising: A first scale is coupled to the support member opposite the at least one guide rail.

7. The device as claimed in claim 1, wherein the at least one second sensor is recessed within the measuring rod and the at least one first sensor extends from the measuring rod.

8. The device as claimed in claim 1, wherein the first shuttle includes one or more first motors and the second shuttle includes one or more second motors.

9. The device as claimed in claim 8, wherein the first motor is configured to move the first shuttle in a first direction, and the second motor is configured to move the second shuttle in a second direction orthogonal to the first direction.

10. The device as claimed in claim 9, wherein the second motor is configured to move the second shuttle in the second direction by an amplitude between about 1 mm and about 300 mm.

11. The device as claimed in claim 1, wherein the at least one first sensor and the at least one second sensor comprise a plurality of optical sensors.

12. A substrate processing apparatus comprising: a thick plate; at least one guide rail coupled to and extending along the thick plate; a processing unit coupled to the thick plate via a support member; a first shuttle disposed on the at least one guide rail; a second shuttle disposed on the first shuttle; a clamp disposed on the second shuttle; and a measuring rod coupled to a bottom of the clamp, wherein each distal end of the measuring rod extends laterally beyond a periphery of the clamp, the measuring rod comprising: at least one first scale coupled to the measuring rod; and at least one second scale coupled to the measuring rod laterally inside the at least one first scale.

13. The device as described in claim 12, further comprising: A first sensor is coupled to the support member opposite the at least one guide rail.

14. The device as claimed in claim 12, wherein a plurality of air bearings are disposed on opposite sides of the measuring rod.

15. The device as claimed in claim 12, wherein the first shuttle includes one or more first motors and the second shuttle includes one or more second motors.

16. The device as claimed in claim 15, wherein the first motor is configured to move the first shuttle in a first direction, and the second motor is configured to move the second shuttle in a second direction orthogonal to the first direction.

17. The device as described in claim 13, wherein a second sensor is coupled to the clamp.

18. The device as claimed in claim 17, wherein the first sensor and the second sensor comprise a plurality of optical sensors.

19. A substrate processing method comprising the steps of: positioning a substrate on a clamp, wherein the clamp is coupled to a second shuttle disposed on a first shuttle; determining a position of the substrate within a processing unit via a measuring rod coupled to a bottom of the clamp, the measuring rod including a first sensor or scale and a second sensor or scale coupled to a laterally inner side of the first sensor or scale, wherein each distal end of the measuring rod extends laterally beyond a periphery of the clamp; and, in response to determining the position of the substrate, moving one or both of the first shuttle and the second shuttle to position the substrate relative to the processing unit.

Images