Exposure apparatus, component manufacturing method, flat panel display manufacturing method and exposure method
Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Patents
- Current Assignee / Owner
- NIKON CORP
- Filing Date
- 2022-04-07
- Publication Date
- 2026-08-01
AI Technical Summary
Existing exposure devices require significant time for alignment and correction data processing, which prolongs the exposure process and affects production efficiency.
The exposure device employs a dual-substrate platform system with independent alignment and measurement units, allowing simultaneous processing of substrates, including real-time data generation and transmission, to reduce downtime and enhance efficiency.
This configuration significantly reduces the time required for exposure processing by enabling parallel operations on multiple substrates, thereby improving overall production throughput without increasing wait times.
Smart Images

Figure TWG2TB001903239_001 
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Abstract
Description
[Technical Field]
[0001] This invention relates to an exposure apparatus, a method for manufacturing a component, a method for manufacturing a flat panel display, and an exposure method. This application claims priority based on Japanese Patent Application No. 2021-066819, filed on April 9, 2021, the contents of which are incorporated herein by reference. [Previous Technology]
[0002] Previously, as a scanning exposure apparatus that illuminates a substrate with illumination light via an optical system, an exposure apparatus is known that uses a spatial light modulation element to modulate light, which is then passed through a projection optical system to expose an image formed by the light onto a photoresist coated on a substrate (see, for example, Patent Document 1). [Prior Art Documents] [Patent Documents]
[0003] [Patent Document 1] Japanese Patent Application Publication No. 2007-108559
[0004] Here, when correcting the calibration or substrate alignment measurements relative to the digital exposure data used to drive the spatial light modulation element, the operation time required to transmit the alignment or correction data is longer than the exposure operation time. Therefore, an exposure apparatus is required in which the calculation and transmission of the correction data do not affect the cycle time. [Summary of the Invention]
[0005] One aspect of the present invention is an exposure apparatus that uses an exposure unit including an optical modulator to scan and expose a substrate, comprising: a first platform supporting a first substrate; a second platform supporting a second substrate different from the first substrate; a measurement unit measuring information of the second substrate; and a generation unit generating control data for exposing the second substrate based on the information; and the generation unit generating the control data during the exposure process of the first substrate.
[0006] Another aspect of the present invention is an exposure apparatus that uses an exposure unit including a light modulator to scan and expose a substrate, comprising: a first platform supporting a first substrate; a second platform supporting a second substrate different from the first substrate; and a generation unit that generates control data for exposing the second substrate; wherein the first platform includes an acquisition unit that acquires light-related information of the exposure unit, and the generation unit generates the control data based on the information acquired by the acquisition unit.
[0007] Another aspect of the present invention is an exposure apparatus for scanning exposure of a substrate via an optical modulator that controls a plurality of elements according to an image pattern, comprising: a platform supporting a first substrate; a receiving unit receiving information of a second substrate measured using a device different from the above-described exposure apparatus, wherein the second substrate is scanned and exposed using the above-described exposure apparatus after the first substrate has been scanned and exposed; a generating unit generating control data for controlling the plurality of elements during the scanning exposure of the second substrate based on the information received by the receiving unit; and a memory storing the control data during the exposure processing of the first substrate.
[0008] One aspect of the present invention includes: exposing the substrate using the above-described exposure apparatus; and developing the exposed substrate.
[0009] One aspect of the present invention includes: exposing a substrate for a flat panel display using the above-described exposure apparatus; and developing the exposed substrate.
[0010] One aspect of the present invention is an exposure method for scanning and exposing a substrate using an exposure unit including an optical modulator, comprising: a step of supporting a first substrate on a first platform; a step of supporting a second substrate different from the first substrate on a second platform; a step of measuring information of the second substrate; and a step of generating control data for exposing the second substrate in the exposure process of the first substrate based on the information.
[0011] One aspect of the present invention is an exposure apparatus that uses an exposure unit including a light modulator to scan and expose a substrate, comprising: a step of supporting a first substrate on a first platform including an acquisition unit that acquires light-related information of the exposure unit; a step of supporting a second substrate different from the first substrate on a second platform; and a step of generating control data for exposing the second substrate based on the information acquired by the acquisition unit.
[0012] One aspect of the present invention is an exposure method for scanning and exposing a substrate via an optical modulator that controls a plurality of elements according to an image pattern, comprising: a step of supporting a first substrate on a platform; a step of receiving, by a receiving unit, information of a second substrate measured using an exposure apparatus different from the exposure apparatus used to scan and expose the first substrate, wherein the second substrate is scanned and exposed using the exposure apparatus after the first substrate has been scanned and exposed; a step of generating control data for controlling the plurality of elements during the scanning and exposure of the second substrate based on the information received by the receiving unit; and a step of storing the control data in a memory during the exposure process of the first substrate.
[0013] One aspect of the present invention includes: exposing the substrate using the above-described exposure method; and developing the exposed substrate.
[0014] One aspect of the present invention includes: exposing a substrate for a flat panel display using the above-described exposure method; and developing the exposed substrate.
Implementation Method
[0016] Hereinafter, embodiments will be described in detail with reference to the drawings. FIG1 is a perspective view showing an example of an exposure apparatus according to this embodiment. The exposure apparatus 1 is an apparatus that illuminates a substrate 10 with illumination light via an optical system. The exposure apparatus 1 exposes light modulated by a spatial light modulation element 75 (see FIG2) by passing it through a projection optical system (illumination and projection module 7 described later) and forming an image of the light onto a photosensitive material (photoresist). The substrate 10 is a glass substrate for a display with a surface coated with, for example, a photoresist.
[0017] As shown in FIG1, the exposure apparatus 1 includes: a plurality of (two in one example) substrate platforms 4 (4A, 4B) supporting substrate 10; an exposure apparatus body 2 for scanning and exposing a predetermined exposure pattern to the substrate 10; and a substrate exchange unit 3 for transporting and placing the substrate 10 on the substrate platform 4.
[0018] Here, the direction in which the substrate platform 4 moves during scanning exposure of the substrate 10 is denoted as the first direction X1. The direction orthogonal (intersecting) with the first direction is designated as the second direction X2. Furthermore, the direction orthogonal (intersecting) with both the first direction X1 and the second direction X2 is designated as the third direction X3.
[0019] The substrate platform 4 holds the substrate 10, which is rectangular when viewed from above. During scanning exposure, the substrate platform 4 moves relative to the exposure apparatus body in the first direction X1, as described later. Furthermore, in order to expose a plurality of exposure areas on the substrate 10 respectively, the substrate platform 4 moves in the second direction X2. The second direction X2 is also referred to as the non-scanning direction.
[0020] As shown in Figures 1 and 2, the exposure device body 2 includes: an exposure unit 20, an optical plate 21, an alignment system 5, and an autofocus system 23. The exposure unit 20 contains the aforementioned spatial light modulation element 75, which is supplied with light from the light source 61 and illuminates the light with a preset exposure pattern.
[0021] The exposure unit 20 is mounted on the optical plate 21. The optical plate 21 is movably supported at three points by a column 22 that is set across the base plate 11 on which the substrate platform 4 is placed, extending in the first direction X1. The optical plate 21 is configured such that its center of gravity is approximately located in the center of the base plate 11 in the first direction X1.
[0022] The base plate 11 is mounted on the floor surface via a plurality of vibration damping platforms 111. The base plate 11 is a base plate extending in the first direction X1, and a pair of platforms 4A and 4B, described later, are mounted on its upper surface 11a. On the upper surface 11a of the base plate 11, a guide member (not shown) is provided to guide the substrate platform 4 along the first direction X1.
[0023] The column 22 includes: a pair of cross members 221 extending in the second direction X2, and feet 222 extending downward from both ends of the cross members 221 and connected to the base plate 11. Furthermore, a load mounted on the optical plate 21 is applied to the feet 222, so a vibration damping platform (not shown) can also be provided at the connection between the base plate 11 and the feet 222. Three V-grooves are formed at appropriate positions on the upper surface of the cross members 221. The optical plate 21 is mounted on the pair of cross members 221 with its upper surface 21a facing horizontally, and is supported on the aforementioned V-grooves via three spheres.
[0024] The optical plate 21 is equipped with: an illumination and projection module 7 (described later), an AF (auto-focus) system 23, and a second alignment system 5B. Furthermore, the optical plate 21 has a plurality of first through holes 21b extending through the thickness direction (see Figure 2) to guide the exposure light onto the substrate 10. The method for fixing the optical plate 21 to the post 22 can be appropriately applied if it ensures rigidity.
[0025] The substrate platform 4 is used to position the substrate 10 with high precision based on multiple partial images of the exposure pattern projected by the projection module 7B described later. The substrate platform 4 is driven with 6 degrees of freedom (first direction X1, second direction X2, third direction X3, and θX1, θX2 and θX3 directions for rotation around each axis X1, X2 and X3).
[0026] As shown in Figures 1 and 2, the substrate platform 4 includes a first substrate platform 4A disposed on one side of the base plate 11 and a second substrate platform 4B disposed on the other side. The substrate platforms 4A and 4B are formed in a flat plate shape, and the substrate 10 is held in place on its upper surface 4a by means of adsorption, such as vacuum adsorption. The pair of substrate platforms 4A and 4B are guided by a guide (not shown) on the base plate 11, and their positions are measured and controlled by an interferometer 53 or an encoder, moving them in either a first direction X1 or a second direction X2. The moving mechanism of the substrate platforms 4A and 4B can be, for example, a linear motor that allows the substrate platform 4 to float using air and moves using magnetic force.
[0027] The movable range of the first substrate platform 4A overlaps with the movable range of the second substrate platform 4B. A portion of the movable range of each substrate platform 4 is not dependent on (especially the stroke required for exposure) substrate platforms 4A and 4B, but is common and therefore repeated. In this case, in order to prevent the first substrate platform 4A and the second substrate platform 4B from colliding or interfering with each other, each substrate platform 4A and 4B must be movable, or at least one substrate platform 4 must also be equipped with a sensor to measure the distance between the substrate platforms 4A and 4B.
[0028] The moving path of the substrate platform 4 is set so that it passes under the exposure unit 20. That is, the substrate platform 4 is constructed such that it is transported to the irradiation position (also called the exposure position) of the light from the exposure unit 20 and passes through the irradiation position. Moreover, during the process of the substrate platform 4 passing through the exposure unit 20, the exposure pattern of the image formed by the exposure unit 20 is exposed on the substrate 10.
[0029] As shown in FIG. 1, on the upper surface 4a of the substrate platforms 4A and 4B, a plurality of exchange pins 41 used for exchanging the substrate 10 are configured to move in and out in the vertical direction (third direction X3). These exchange pins 41 are arranged at predetermined intervals in the first direction X1 and the second direction X2 in the area where the substrate 10 is disposed in the upper surface 4a of the substrate platform 4. If the exchange pin 41 protrudes upward, it becomes a state in which the front end of the pin supports the lower surface of the substrate 10. That is, by moving the exchange pins 41 in and out, the substrate 10 can be raised and lowered. The protruding length of the exchange pin 41 from the upper surface 4a is set to at least the length that the substrate support portion 31 of the exchange arms 3A and 3B described later can move in and out below the raised substrate 10.
[0030] As shown in FIG. 1, the substrate exchange unit 3 moves the exposed substrate 10 on the substrate platform 4 outward from the substrate platform 4, and moves the substrate 10 to be exposed next onto the substrate platform 4 where the exposed substrate 10 has been moved out. The substrate exchange unit 3 includes: a first exchange arm 3A for high-speed exchange of substrates 10 on the first substrate platform 4A; and a second exchange arm 3B for high-speed exchange of substrates 10 on the second substrate platform 4B. The first exchange arm 3A and the second exchange arm 3B are respectively provided with an infeed arm for moving the substrate 10 relative to the substrate platform 4, and an outfeed arm for moving the substrate 10 out. The exchange arms 3A and 3B include a substrate support portion 31 at the front end of the arm. The exchange arms 3A and 3B are disposed on the side of each substrate platform 4A and 4B in the second direction X2, and are configured to be movable in the first direction X1, the second direction X2, and the third direction X3. The exchange arms 3A and 3B move in the second direction X2, causing the substrate support 31 to move in and out below the substrate 10, and then rise, thereby supporting the substrate 10 from below. Then, in the second direction X2, it moves in the direction of separation from the substrate platforms 4A and 4B, thereby enabling the removal of the substrate 10 from the substrate platforms 4A and 4B. The position of the substrate platform 4 on the base plate when the substrate is transferred onto the substrate platform 4 using the substrate exchange unit is called the substrate exchange position.
[0031] The substrate 10, coated with a photosensitive photoresist, is moved into the exposure apparatus 1 and placed on a plurality of exchange pins 41 disposed on the substrate platforms 4A and 4B via exchange arms 3A and 3B. Then, the exchange pins 41 are lowered and held in place by adhering to the substrate holders on the substrate platforms 4A and 4B. As described above, the substrate platforms 4A and 4B must be driven from the substrate exchange position to the exposure position. Therefore, in the case of a platform measurement system such as the interferometer 53, the measurement beam of the interferometer 53 can be switched between the exposure position side and the substrate exchange position side to accommodate this.
[0032] Figure 3 is a diagram showing the configuration of the exposure unit 20. As shown in Figure 3, the exposure unit 20 includes: a light source unit 6 (see Figure 1); and an illumination / projection module 7, which is used to expose the light source 61 of the light source unit 6 and the light from the light source 61 using a spatial light modulation element 75 (described later).
[0033] As shown in Figure 1, a pair of light source units 6 are provided. The light source unit 6 may be: a light source unit that uses a laser with high interference as the light source 61, a light source unit that uses a light source 61 such as a semiconductor laser type UV-LD (ultraviolet-laser diode), or a light source unit that uses a lens relay type reducer. That is, the light source 61 is set as: a lamp or laser diode that emits a wavelength of 405 nm or 365 nm, and a pulse-emitting laser that is combined with the drive of the spatial modulation element 75.
[0034] As shown in Figure 3, the optical system of the illumination and projection module 7 includes: illumination module 7A, projection module 7B, and modulation unit 7C.
[0035] The lighting module 7A and the projection module 7B are in a one-to-one ratio and are the same number. The lighting module 7A uses optical fiber 71 to capture the laser light L from the light source unit 6 and enters the lighting module 7A. The collimating lens 721, compound eye lens 723 and main focusing lens 724 are used to illuminate the spatial light modulation element 75 with the laser light L in a substantially uniform manner.
[0036] A module shutter 73 is provided in the illumination module 7A, which can be opened / closed at high speed in each of the illumination module 7A and the projection module 7B for laser light L emitted from the optical fiber 71.
[0037] The illumination module 7A directs the laser light L output from the light source 61 of the light source unit 6 shown in FIG. 1 as illumination light for exposure into the spatial light modulation element 75. As described above, the illumination module 7A includes an optical fiber 71, a collimating lens 721, an illumination wedge 722, a compound eye lens 723, and a main condenser lens 724. The optical fiber 71 is, for example, a quartz fiber. The output light (laser light L) of the light source 61 is guided by the optical fiber 71 and directed into the collimating lens 721. The collimating lens 721 converts the diffused light emitted from the optical fiber 71 into parallel light and directs it out. The illumination wedge 722 adjusts the intensity (power) of the light emitted from the optical fiber 71. The light passing through the collimating lens 721 passes through the compound eye lens 723 and the main condenser lens 724 and is reflected by the mirror 725, and is directed into the spatial light modulation element 75 at a predetermined reflection angle. Furthermore, the lighting module 7A and the light source unit 6 are also considered to be the ones that illuminate the spatial light modulation element 75, and the two can also be combined and described as a lighting system.
[0038] The modulation unit 7C modulates the illumination light to create patterns, and includes a spatial light modulation element 75 and a light-absorbing plate 74. The spatial light modulation element 75 is, for example, a digital mirror element. The spatial light modulation element 75 includes a plurality of elements (the digital mirror element being a mirror).
[0039] Figure 4 shows the display of a predetermined pattern by turning the spatial light modulation element 75 on / off. Each mirror of the spatial light modulation element 75 can rotate around the X1 axis and around the X2 axis.
[0040] Figure 5A shows the spatial light modulator 75 in the off state. Figure 5B shows the spatial light modulator 75 in the on state, where light from the illumination module 7A is reflected towards the substrate 10 by tilting the mirror around the X2 axis. Figure 5C shows the spatial light modulator 75 in the off state, where light from the illumination module 7A is set as the off light L2 by tilting the mirror around the X1 axis, and the light is directed towards the off light absorption plate 74 instead of the substrate 10. As described above, the spatial light modulator 75 can control the on and off states of each mirror based on control data to form a pattern.
[0041] Each mirror of the spatial light modulation element 75 is driven periodically, which can periodically update the pattern on the spatial light modulation element 75. The light source 61 must illuminate the spatial light modulation element 75 in each update cycle of the pattern, so it is preferable to be a light source that emits pulses at a certain period or can only emit pulses during a predetermined period. In addition, the light source 61 can emit continuous light. In this case, by switching the shutter (not shown) or by using the modulation of an acoustic optical modulator (not shown), the continuous light is converted into pulsed light. Therefore, the light emitted from the light source 61 can also be considered as a substantial pulsed light.
[0042] The spatial light modulation element 75 is mounted on a platform (not shown) and moves slightly in the first direction X1 and / or the second direction X2 while mounted on the platform. As a result, the spatial light modulation element 75 can move relative to the illumination light, changing the position of the projected image of the pattern on the substrate 10, and correcting, for example, the deviation amount relative to the target value of the projection position.
[0043] As shown in FIG2, the projection module 7B is supported on the optical plate 21 and disposed below the spatial light modulation element 75 included in the modulation unit 7C. As shown in FIG3, it includes: a magnification adjustment unit 76, which adjusts the magnification used to project one pixel of the spatial light modulation element 75 at a predetermined size; and a focus adjustment unit 77, which adjusts the focus caused by the driving of the lens in the third direction X3. The projection module 7B projects, exposes, and forms an image of a pattern formed on the spatial light modulation element 75 onto the substrate 10.
[0044] The pattern on the spatial light modulation element 75 of the projection module 7B is projected onto the substrate 10 at a magnification reduced to 1 / 2 to 1 / 10. The projection module 7B corrects the projection magnification by driving the magnification adjustment lens 761 of the magnification adjustment unit 76 in the third direction X3. Furthermore, the projection magnification is not limited to reduction, but can also be enlargement or equal magnification. The focus adjustment unit 77 includes one or more focusing lenses 771, which are projected onto the substrate 10 of the spatial light modulation element 75 and are mainly used to adjust the focus.
[0045] As shown in Figure 2, the projection module 7B has a plurality of rows arranged on the optical plate 21 along the first direction X1.
[0046] As shown in Figures 6 and 7, the alignment system 5 includes at least one of a first alignment system 5A (see Figure 6) disposed on the substrate platforms 4A and 4B, and a second alignment system 5B (see Figure 7) disposed on the optical plate 21.
[0047] As shown in FIG. 6, the first alignment system 5A is embedded in a predetermined position on the substrate platforms 4A and 4B. The first alignment system 5A is used to measure the position of the substrate 10 relative to the substrate platforms 4A and 4B. The first alignment system 5A is disposed at, for example, the four corners of the substrate platform 4. On the substrate platform 4, through holes 42 extending in the thickness direction of the platform are provided at the four corners where the first alignment system 5A is disposed.
[0048] The first alignment system 5A includes: a lens 511 disposed in a through hole 42 of a substrate platform 4A; a light source 513 (e.g., an LED (Light Emitting Diode)) disposed below the lens 511, which illuminates the alignment mark 12 of the substrate 10 placed at a predetermined position on the substrate platform 4; and a measuring unit 512 that detects the light reflected from the alignment mark 12.
[0049] In the first alignment system 5A, when the substrate 10 is placed on the substrate platform 4, the alignment system can be calculated by measuring six parameters (position information): the position in the X1 direction, the position in the X2 direction, the rotation amount (θX3), the scaling factor in the X1 direction, the scaling factor in the X2 direction, and the orthogonality, for example, the positions of the four corners of the substrate 10. Furthermore, the arrangement of the first alignment system 5A on the substrate platform 4 is not limited to the four corners as described above. For example, in cases where the substrate 10 has a non-linear shape or other manufacturing process characteristics, a considerable number of first alignment systems 5A, such as four locations × four rows, can be arranged. The first alignment system 5A is a different unit from the projection module 7B, and therefore can be called an off-axis alignment system.
[0050] The first alignment system 5A measures based on the pixels of the camera in the measuring unit 512.
[0051] As shown in Figure 2, AF systems 23 are arranged on both sides of the projection module 7B in the first direction X1 on the optical plate 21 (see Figure 7). Regardless of the scanning direction (first direction X1) of the substrate 10, the AF system 23 can measure the position of the substrate 10 in the X3 direction before exposure processing. The focal length adjustment unit 77 drives the focusing lens 771 based on the measurement results of the AF system 23 to adjust the focal length of the pattern image of the spatial light modulation element 75.
[0052] Furthermore, as shown in FIG2, the substrate platform 4 includes: a calibration measurement system 52, an interferometer 53 for measuring the position of the substrate platform 4, and an illuminance measuring machine 54. The calibration measurement system 52 is used for measuring and calibrating the positions of various plurality of modules. The calibration measurement system 52 is also used for calibrating the second alignment system 5B disposed on the optical plate 21.
[0053] As described above, in the exposure apparatus 1 of this embodiment, by using the first alignment system 5A in the substrate platform 4 to measure the imaging position of the pattern generated in the spatial light modulation element 75 that is being exposed, the position of the first alignment system 5A in the substrate platform 4 relative to the imaging system can be measured by using the interferometer 53 that measures the position of the substrate platform 4 and the image position of the alignment system 5.
[0054] Furthermore, as shown in FIG7, a second alignment system 5B may also be disposed on the optical plate 21 above each of the first substrate platform 4A and the second substrate platform 4B. The second alignment system 5B is used to measure the position of the substrate 10 relative to the substrate platforms 4A and 4B. The second alignment system 5B is disposed in a second through hole 21c provided through the optical plate 21 in the thickness direction. If the configuration is to use the second alignment system 5B to measure the position of the substrate 10 relative to the substrate platforms 4A and 4B, then the configuration of disposing of the first alignment system 5A on the first substrate platform 4A and the second substrate platform 4B is not required.
[0055] The second alignment system 5B includes: a lens 551 disposed below the second through hole 21c of the optical plate 21; a photosensor 552 disposed above the lens 551, which illuminates measurement light toward the alignment mark 12 of the substrate 10 placed at a predetermined position on the substrate platform 4; and a measuring unit 553, which detects the light reflected from the alignment mark 12. The second alignment system 5B is similar to the first alignment system 5A, and when the substrate 10 is placed on the substrate platform 4, it can be calculated by measuring six parameters (position information) related to the substrate 10: the position in the first direction X1, the position in the second direction X2, the rotation amount (θX3), the magnification of the first direction X1, the magnification of the second direction X2, and the orthogonality. Furthermore, by measuring not only the entire substrate 10 but also a portion of it, the second alignment system 5B can determine the nonlinear components of the deformation of the substrate 10, or calculate six parameters (position information) in a pre-specified exposure area (e.g., an exposure area divided into four parts).
[0056] The optical plate 21 extends in the first direction X1. The second alignment system 5B is disposed on the optical plate 21, separate from the illumination / projection module 7, about the first direction X1. The substrate platform 4 moves the alignment mark 12 on the substrate 10 to a position (alignment measurement position) measurable by the second alignment system 5B. This allows for a certain degree of freedom in measuring the arrangement of the alignment mark 12 disposed on the substrate 10. Furthermore, the optical plate 21 supports the alignment system CE (the second alignment system 5B), which is disposed between the projection modules 7B, which are disposed separately about the first direction X1. When the alignment system CE measures the alignment mark on the substrate 10 using the second alignment system 5B located at both ends, the interferometer for measuring the position of the substrate platform 4 must be switched between the exposure position and the exposure interferometer. Therefore, it is configured to measure the position of the substrate 10 or the substrate platform 4 at the exposure position.
[0057] The exposure apparatus 1 is connected to and controlled by a data control unit including memory. The data control unit is connected to various parts of the exposure apparatus 1 (alignment system 5 (5A, 5B), substrate platform 4, optical system (illumination module 7A, projection module 7B, and modulation unit 7C)) and performs functions such as transmitting and receiving measurement values or issuing commands for controlling the exposure apparatus 1. The data control unit generates control data for driving the spatial light modulation element 75 through measurement and performs corrections, and stores the corrected control data in memory.
[0058] Next, based on the figures, the method for continuously exposing the substrate 10 will be described. First, as shown in FIG1, if the formula for exposure is added to the exposure apparatus 1, the mask data (pattern data, image data) used for exposure is selected from the mask pattern server. Moreover, the data control unit divides the mask data into the number of illumination / projection modules 7, generates control data from the divided mask data, and stores it in memory. At this time, the spatial light modulation element 75 updates 4 Mpixel at an update rate of approximately 10 kHz, for example, so the memory stores a large amount of control data at high speed. The data control unit sends the control data stored in the memory to each of the plurality of illumination / projection modules 7. If the illumination / projection module 7 receives the control data, it performs various exposure preparations. The illumination / projection module 7 loads the received mask data into the spatial light modulation element 75.
[0059] First, the exposure apparatus 1 measures and calibrates the illuminance (light information) according to the formula. For example, the illuminance measuring machine 54 mounted on the first substrate platform 4A measures the illuminance of the light generated from the illuminance measurement pattern on the spatial light modulation element 75. The exposure apparatus 1 uses the illuminance measurement results measured by each of the plurality of illumination modules and projection modules 7, and uses the illumination wedge 722 disposed in the illumination module 7A to adjust the illuminance in such a way that the illuminance difference between the illumination and projection modules 7 disappears.
[0060] The exposure apparatus 1 uses a calibration measurement system 52 to measure the exposure positions of the second alignment system 5B, the illumination module 7A, and the projection module 7B, which are disposed on the optical plate 21. That is, the calibration measurement system 52 measures the arrangement of the illumination module 7A and the projection module 7B, as well as the position of the second alignment system 5B, and calculates the relative positional relationship between the illumination module 7A, the projection module 7B, and the second alignment system 5B. As shown in FIG2, the position of the first alignment system 5A, disposed on the first substrate platform 4A, is measured based on the pixels of the camera in the measuring unit 512. The first alignment system 5A is measured using the exposure pattern of the spatial light modulation element 75 projected by the projection module 7B. Based on the measurement results, the exposure apparatus 1 calculates the relative positional relationship between the illumination module 7A, the projection module 7B, and the first alignment system 5A. The exposure apparatus 1 uses the same method to calculate the relative positional relationship between the illumination module 7A and the projection module 7B and the first alignment system 5A for the second substrate platform 4B. The exposure apparatus 1 calculates the relative positional relationship between the illumination module 7A and the projection module 7B and the alignment system 5 in the manner described above.
[0061] Next, as shown in FIG. 6, the substrate exchange unit 3 places the substrate 10 on the first substrate platform 4A. At this time, the first alignment system 5A observes and measures the alignment marks 12 on the substrate 10 and calculates the relative position of the device of the first alignment system 5A relative to the substrate 10. Alternatively, the first substrate platform 4A moves downward to the second alignment system 5B, and the second alignment system 5B observes and measures the alignment marks 12 on the substrate 10 and calculates the relative position of the device of the second alignment system 5B relative to the substrate 10. In this way, based on the pre-calculated relative positional relationship between the illumination module 7A and the projection module 7B and the alignment system 5, and the relative position of the alignment system 5 relative to the substrate 10, it is possible to know which position of the pattern is exposed on the substrate, that is, the projection position.
[0062] Through this operation, the position to be exposed on the formula and the offset of the exposure position on the substrate 10 due to the current arrangement of the substrate 10 and the projection module 7B can be determined. In this embodiment, in order to correct this offset, the data control unit corrects the exposure data (mask data, pattern data, control data). In addition, the exposure apparatus 1 can not only use the data control unit to correct the exposure data in order to correct the offset, but also use the data control unit to generate / correct correction data after moving the substrate platform 4 itself to reduce the offset. In this case, the amount of correction by the data control unit can be reduced. In addition, the exposure apparatus 1 can also move the platform equipped with the spatial light modulation element 75 to change the exposure position on the substrate 10. The exposure apparatus 1 can correct the offset by using the data control unit to correct the data and by moving the substrate platform 4. It can also correct the offset by using the data control unit to correct the data and by moving the spatial light modulation element 75.
[0063] Furthermore, in the exposure apparatus 1, correction values can also be calculated on the substrate 10 in panel units such as LCD TVs to obtain correction values for the substrate platform 4. When the substrate 10 is partially corrected as described above, the correction values in each of the illumination module 7A and the projection module 7B are basically different. Correction values are calculated for each of the illumination module 7A and the projection module 7B to correct the digital exposure data to be exposed.
[0064] The flowchart shown in Figure 8 illustrates an example of the operation flow for two actions performed on the first substrate platform 4A and the second substrate platform 4B: an exposure operation and a correction data creation operation. As shown in Figure 8, the first substrate platform 4A uses the first exchange arm 3A of the substrate exchange unit 3 (refer to Figure 1) to mount the substrate 10 (referred to as the first substrate) on the first substrate platform 4A. Then, the alignment system 5 measures the alignment mark 12 on the first substrate 10 (step S11).
[0065] Next, after step S11, the data control unit calculates the correction value (correction data) of the digital exposure data (step S12). Furthermore, the data control unit stores the correction data obtained in step S12 in memory and sends it to the illumination and projection module 7. Then, based on the correction data and formula information of the first substrate 10 sent, the exposure apparatus 1 performs overlapping exposure on the first substrate 10 on the first substrate platform 4A (step S13).
[0066] After the previous exposure operation (step S21) is completed on the second substrate platform 4B, the exposure apparatus 1 performs an exposure operation on the first substrate 10 on the first substrate platform 4A. During the exposure operation on the first substrate 10 on the first substrate platform 4A, the exposure apparatus 1 removes the substrate 10 exposed in step S21 from the second substrate platform 4B and transports a new substrate 10 (referred to as the second substrate) to the second substrate platform 4B (step S22). The operation of removing the exposed substrate 10 from the first substrate platform 4A and the operation of transporting the substrate 10 to be exposed next onto the first substrate platform 4A are collectively referred to as substrate transport operations. Furthermore, the first alignment system 5A and / or the second alignment system 5B measure the alignment marks 12 on the second substrate 10 (step S23). Furthermore, the correction of errors caused by the first alignment system 5A and the second alignment system 5B, and further by the alignment system CE and the interferometer conversion, is performed by correcting the platform mark or the substrate mark.
[0067] In the data control unit, based on the alignment measurement results in step 22, the correction data used in the subsequent exposure on the second substrate platform 4B, i.e., the exposure of the second substrate 10, is calculated. That is, the correction value (correction data) of the digital exposure data used to drive the spatial light modulation element 75 (step S24). Furthermore, the data control unit stores the correction data obtained in step S24 in memory and sends it to the illumination and projection module 7. Then, the exposure apparatus 1 performs overlapping exposure on the second substrate 10 on the second substrate platform 4B based on the transmitted correction data and formula information of the second substrate 10 (step S25). While performing overlapping exposure on the second substrate 10, the exposure apparatus 1 removes the first substrate 10, which is placed on the first substrate platform 4A and exposed in step 13, from the first substrate platform 4A.
[0068] As described above, the exposure apparatus 1 includes a plurality of substrate platforms 4, thereby enabling the following processing steps—from alignment measurement of the second substrate 10 to the generation and transmission of correction data—to be implemented on the second substrate platform 4B during the exposure processing of the first substrate 10 performed on one of the first substrate platforms 4A. This is achieved using the first alignment system 5A and / or the second alignment system 5B. This suppresses the occurrence of cycle delays. Here, "exposure processing" refers to processing including the following actions: the movement of the substrate platform 4 from the exchange position to the alignment measurement position; the exposure operation of the substrate 10; and the operation from the end of the exposure operation of the substrate 10 until the substrate platform 4 moves to the exchange position. Furthermore, "exposure operation" refers to any one of the following actions: the scanning exposure operation of the substrate 10; or the movement of the substrate platform 4 in the X1 or X2 direction to change the exposure area of the scanning exposure.
[0069] During the data correction operation on the first substrate platform 4A and the second substrate platform 4B, calibration (such as orthogonality measurement of the substrate platform) can also be performed during the data correction.
[0070] The data control unit may, for example, use illuminance and other light information measured by the illuminance measuring device 54 set on the second substrate platform 4B during the exposure process or by the calibration measurement system 52 to calculate correction data when exposing the substrate 10 placed on the first substrate platform 4A. Furthermore, the data control unit may calculate the correction data using only light information, or it may use the measurement results of the alignment system 5 and light information to calculate the correction data.
[0071] Furthermore, in the exposure apparatus 1, the arrangement measurement of the plurality of illumination modules 7A and projection modules 7B is combined. Measurements related to exposure position and data correction are performed first, followed by illuminance measurement or correction of the curvature (straightness) of the movable mirror 13 mounted on the substrate platform 4. This allows for the calculation of correction values using the data and the transmission of correction data during the exposure operation. Data, taking into account the alignment of the substrate 10 and the arrangement of the modules as described above, can be transmitted without affecting the cycle time.
[0072] Here, we compare the case where the exposure apparatus includes only one substrate platform with the case where the exposure apparatus 1 of this embodiment includes multiple substrate platforms. When the exposure apparatus includes only one substrate platform, the exposure apparatus uses the alignment system 5 for alignment. After using the result, the data control unit calculates a correction value, generates correction data, and sends it, the substrate is exposed. In this case, after the exposure apparatus performs alignment, there is a concern that the substrate cannot be exposed until the correction data is generated and sent. For example, if the time required to combine the exposure of the substrate on the substrate platform with the time required to remove the exposed substrate from the substrate platform (or the time required for the substrate platform to move from the exposure position to the substrate exchange position) is, for example, 100 seconds, and the time required for the processes of loading the substrate onto the substrate platform, aligning and measuring the substrate, creating correction data, and sending correction data before the substrate on the substrate platform is exposed (i.e., 50 seconds), then the time required to combine the time from loading one substrate 10 onto the substrate platform 4 to exposure and removal is 150 seconds. That is, the exposure device starts the exposure process 50 seconds after the substrate is loaded onto the substrate platform. To shorten the cycle time from loading one substrate onto the substrate platform to removing it (150 seconds in the aforementioned example), even if the time from loading the substrate onto the substrate platform to the sending time is shortened, this time cannot be set to 0, as it would affect the cycle time. The time taken from the end of the exposure of the first substrate to the start of the exposure of the second substrate is (t1 + t2 + t3) by adding the time from the exposure of the first substrate to its removal (t1), the time for the second substrate to be moved onto the substrate platform (t2), and the time required for the alignment action / generation / transmission of correction data for the second substrate (t3).
[0073] In contrast, according to the exposure apparatus 1 of this embodiment, by providing a plurality of substrate platforms 4A and 4B (two in this embodiment), the efficiency of the exposure process can be improved. Specifically, during the exposure of the first substrate 10 on one of the substrate platforms 4A and 4B (e.g., the first substrate platform 4A), all operations such as removing the exposed substrate 10, inserting the second substrate 10, alignment operations / generating correction data / transmitting data are performed on the other platform (e.g., the second substrate platform 4B). This allows the exposure of the second substrate 10 to begin immediately after the exposure of the first substrate 10 is completed. When the exposure apparatus includes only one substrate platform as described above, the time spent from the completion of the exposure of the first substrate to the start of the exposure of the next substrate (the time t1 + t2 + t3 mentioned above) can be reduced. In the aforementioned example, the cycle time of 150 seconds can be set to 100 seconds or less (100 seconds is only the time for the exposure operation). Therefore, in the exposure apparatus 1 of this embodiment, the exposure waiting time generated on an exposure apparatus that is only on a substrate platform can be eliminated.
[0074] Furthermore, the data control unit requires: a memory for sending data for exposure to the spatial light modulation element 75, and a memory for pre-storing data for exposure with the second substrate 10B added. For example, a large-capacity memory may also include: an area for storing data for the first substrate platform 4A and an area for storing data for the second substrate platform 4B. Preferably, considering the delay caused by the simultaneous reading of data and processing of light, a switcher may also be used in the data control unit that includes separate memories and is used to switch the memory that is finally sent to the spatial light modulation element 75.
[0075] The above has described the operation flow of the exposure operation and the alignment operation for data correction in the first substrate platform 4A and the second substrate platform 4B, respectively. However, the operation flow of the modified example shown in FIG9 can also be used.
[0076] (Modification) In the exposure operation flow of the exposure apparatus 1 in the modified example shown in FIG9, the first substrate platform 4A is dedicated to the exposure operation, and the second substrate platform 4B is dedicated to the alignment operation and data correction operation. Therefore, the first alignment system 5A is only provided on the second substrate platform 4B. The configuration of the data control unit in the modified example is the same as in the above embodiment. The substrate platform 4 can also be configured such that the movable range of the first substrate platform 4A does not overlap with the movable range of the second substrate platform 4B. On the first substrate platform 4A, in a time sequence, the first exposure α is performed on the first substrate 10 in step S31, and after the first exposure α, the second exposure β is performed on the second substrate in step S32, and after the second exposure β, the third exposure γ is performed on the third substrate 10 in step S33.
[0077] As shown in FIG. 9, in step S41, during the first exposure α of the first substrate 10 on the first substrate 10 on the first substrate platform 4A performed on the second substrate platform 4B, the second substrate 10 for the second exposure β performed after the first exposure α is aligned using the first alignment system 5A, and correction data is generated by the data control unit. Specifically, the second substrate 10 is placed on the second substrate platform 4B using the first exchange arm 3A of the substrate exchange unit 3 (see FIG. 1). Then, the alignment mark 12 of the second substrate 10 is measured using the first alignment system 5A. In the data control unit, the correction value (correction data) for driving the spatial light modulation element 75 is calculated by using the measurement of the first alignment system 5A. Moreover, the data control unit stores the obtained correction data in memory.
[0078] Next, on the first substrate platform 4A, once exposure α is complete, the substrate exchange unit 3 shown in FIG. 1 is used to remove the exposed first substrate 10 from the first substrate platform 4A. Then, using the substrate exchange unit 3, the second substrate 10, for which correction data was created in step S41, is transferred from the second substrate platform 4B to the first substrate platform 4A. When the second substrate 10 is transferred from the second substrate platform 4B to the first substrate platform 4A, the first substrate platform 4A moves by the second alignment system 5B to detect the alignment mark 12, thereby determining the position of the second substrate 10 relative to the first substrate platform 4A. Alternatively, the first alignment system 5A measures the position of the second substrate 10 relative to the first substrate platform 4A to determine its position.
[0079] In a modified example, substrate 10 is replaced between the first substrate platform 4A and the second substrate platform 4B. Therefore, the correction data generated based on the positional relationship between the second substrate platform 4B and the second substrate 10 (before replacement) cannot be directly used. The reason is that the positional relationship between the second substrate platform 4B and the second substrate 10 (before replacement on the first substrate platform 4A) is different from the positional relationship between the first substrate platform 4A and the second substrate 10 (after replacement on the first substrate platform 4A). Therefore, if the positional relationship between the first platform 4A and the second platform 4B is measured in advance, and the position of the substrate 10 relative to each platform 4A and 4B before and after the transfer is known (the position is obtained by measuring the alignment mark 12), then the positional relationship between the second substrate platform 4B and the second substrate 10 (before being transferred onto the first substrate platform 4A) can be compared with the positional relationship between the first substrate platform 4A and the second substrate 10 (after being transferred onto the first substrate platform 4A). Here, as shown in FIG7, the second alignment system 5B (alignment system CE) provided between the projection modules 7B which are separated from each other about the first direction X1 measures only a predetermined number of points on the substrate 10, and measures the positional offset of the substrate 10, including the rotation caused by the transfer from the first substrate platform 4A to the second substrate platform 4B, and sets it to a state that is approximately the same as the state of the manufacturing data correction, and uses the substrate platform 4 or the platform holding the spatial light modulation element 75 to correct the projection position.
[0080] Then, on the first substrate platform 4A, in step S32, based on the correction data and formula information of the second substrate sent from the data control unit, the second substrate 10 on the first substrate platform 4A is subjected to a second exposure β (step S32). Furthermore, the correction data can be further corrected using the offset obtained through relative comparison. The position of the platform and / or the position of the spatial light modulation element 75 can also be adjusted while the correction data is being corrected.
[0081] Furthermore, in step S42, during the second exposure β of the second substrate 10 on the first substrate platform 4A performed on the second substrate platform 4B, the third substrate 10 for the third exposure γ performed after the second exposure β is aligned using the alignment system 5, and correction data is generated in the data control unit. Specifically, the third substrate 10 is placed on the second substrate platform 4B using the first exchange arm 3A of the substrate exchange unit 3 (see Figure 1). Then, the alignment mark 12 of the third substrate 10 is measured using the alignment system 5. In the data control unit, the correction value (correction data) for driving the spatial light modulation element 75 is calculated by using the measurement of the alignment system 5. Moreover, the obtained correction data is stored in the memory in the data control unit. Hereinafter, the same operation is repeated sequentially on the first substrate platform 4A and the second substrate platform 4B.
[0082] As described above, in the exposure operation of the modified example, during the exposure processing of the substrate 10 performed on one of the plurality of substrate platforms 4A and 4B, specifically on the first substrate platform 4A, a process step from alignment of the substrate 10 to data transmission is performed on the second substrate platform 4B, which is dedicated to alignment and data correction. Correction data can be transmitted in advance. This helps to suppress the occurrence of cycle delay.
[0083] In this modified example, the substrate 10 is transferred between the first substrate platform 4A dedicated to exposure and the second substrate platform 4B dedicated to alignment and data correction within the exposure apparatus 1. However, the second substrate platform 4B does not need to be located within the exposure apparatus 1; it can be located in a device different from the exposure apparatus 1. For example, in situations where the number of alignment marks 12 measured by alignment measurement is large, and the correction data prepared by the data control unit is not completed before the exposure of the next substrate 10 begins; or when the number of alignment marks is large due to the need to perform nonlinear corrections, the second substrate platform 4B can be located in a device different from the exposure apparatus 1. Such devices include, for example, a coating machine that coats photosensitive material (photoresist) onto the substrate 10, or a device located further forward than the coating machine that performs predetermined processing on the substrate 10. By using other devices to perform detailed alignment measurements, the processing of the actual measured data (preparation of correction data) and the time until exposure can be further delayed. Exposure apparatus 1 includes a receiving unit that receives results measured by other devices. A data control unit uses the received data to create correction data. In this case, the data control unit's memory requires three storage units: a storage unit for data of the substrate being exposed, a storage unit for data of the substrate 10 that has been processed and measured using other devices, and a storage unit for data about to be measured. The data control unit selectively reads data based on the substrate. That is, it uses a data measuring machine (a different device from exposure apparatus 1) used for overlap before exposure processing to perform measurements, and manages the measurement data by comparing it with the substrate. This allows it to store only the data processing different from that of the substrate about to be exposed in memory. At this time, by setting the data measuring machine and exposure apparatus to approximately the same environmental (holder or substrate temperature) changes, the magnification that cannot be corrected on the four sides of the substrate platform can be measured without significant change. Furthermore, the differences caused by substrate adsorption and other factors due to measurements performed using the data measuring machine and exposure machine can also be determined based on the final result of overlapping exposure and input into the data correction as process deviations.
[0084] Furthermore, the alignment system 5 has been described in one example where it is positioned separately from the projection module 7B in the first direction X1, i.e., off-axis alignment where the optical axis of the projection module 7B is offset from the alignment axis. It is not limited to this; it may also be configured to simultaneously perform on-axis alignment where the optical axis of the projection module 7B overlaps with the alignment axis, and TTL (Through the Lens) alignment measured via the projection module 7B.
[0085] The light modulator (spatial light modulation element 57) includes: a liquid crystal element, a digital mirror element (digital micromirror device, DMD), a magneto-optical spatial light modulator (MOSLM), etc. The light modulator can be a reflective type that reflects the illumination light from the illumination module 7A, which is an illumination optical system, a transmissive type that allows the illumination light to pass through, or a diffractive type that diffracts the illumination light. The light modulator can modulate the illumination light spatially and temporally.
[0086] The embodiments of the present invention have been described above, but here we will provide a supplementary explanation of the correspondence between the present invention and the above embodiments.
[0087] (1) In the above embodiment, the exposure apparatus for scanning and exposing the substrate 20 by means of a light modulator (spatial light modulator 75) that controls a plurality of elements according to an image pattern includes: a first substrate platform 4A that supports the first substrate 10; a second substrate platform 4B that supports a second substrate 10 that is different from the first substrate 10; a measurement unit that measures information of the second substrate 10; and a generation unit that, based on the information, generates control data for controlling the plurality of elements during the scanning exposure of the second substrate 10 in the exposure process of the first substrate 10.
[0088] In the exposure apparatus configured as described above, the efficiency of exposure operations can be improved by providing a plurality of substrate platforms 4A and 4B. That is, while the first substrate 10 on one of the substrate platforms 4A and 4B (e.g., the first substrate platform 4A) is being exposed, all operations such as removing the exposed substrate 10, inserting the second substrate 10, alignment by the measurement unit, generation of correction data by the generation unit, and data transmission are performed on the other platform (e.g., the second substrate platform 4B). This allows the exposure of the second substrate 10 to begin immediately after the exposure of the first substrate 10 is completed. As described above, when the exposure apparatus includes only one substrate platform 4, the time spent from the completion of the exposure of the first substrate to the start of the exposure of the next substrate 10 can be reduced. Therefore, in this embodiment, the exposure waiting time generated in the exposure apparatus 1 where there is only one substrate platform 4, as previously described, can be eliminated.
[0089] (2)In addition, in the above embodiment, the measuring unit measures the information of the second substrate 10 during the exposure process of the first substrate 10.
[0090] According to the configuration described above, during the exposure process of the first substrate 10 performed on the first substrate platform 4A, which is dedicated to exposure among the plurality of substrate platforms 4A and 4B, information of the substrate 10 can be measured on the second substrate platform 4B, which is dedicated to alignment (measurement) and data correction, thereby suppressing the occurrence of cycle delay.
[0091] (3)In addition, in the above embodiment, the measuring unit is provided separately from the exposure unit 20 (light modulator (spatial light modulator 75)) in such a way that the first substrate platform 4A, which is supported by the exposure unit 20 including the light modulator (spatial light modulator 75) and the second substrate platform 4B, which is supported by the second substrate 10 to be measured by the measuring unit, does not collide.
[0092] According to the configuration described above, since the movable range of the first substrate platform 4A and the movable range of the second substrate platform 4B do not overlap, information of the substrate 10 can be measured on the other substrate platform 4 using a measuring unit during the exposure operation of one substrate platform 4. Since both operations can be performed simultaneously, the occurrence of cycle delay can be suppressed, and the exposure waiting time can be eliminated.
[0093] (4)In addition, in the above embodiment, the measuring unit is provided on the second substrate platform 4B.
[0094] According to the configuration described above, during the exposure operation using the first substrate platform 4A, information about the second substrate 10 can be measured on the second substrate platform 4B using a measuring unit. After exposure is completed on the first substrate platform 4A, the second substrate 10 measured on the second substrate platform 4B can be transferred and placed on the first substrate platform 4A, and the second substrate 10 on the first substrate platform 4A can be exposed based on the measured information. That is, the exposure of the second substrate 10 is performed immediately after the exposure of the first substrate 10 with the waiting time set to a minimum. Since both operations can be performed simultaneously as described above, the occurrence of cycle delay can be suppressed, and the exposure waiting time can be eliminated.
[0095] (5)In addition, in the above embodiment, the first substrate platform 4A includes an acquisition unit that acquires light-related information of the exposure unit 20 including the light modulator (spatial light modulation element 75) during or before the exposure process of the first substrate 10, and the generation unit generates control data based on the information and the information acquired by the acquisition unit.
[0096] According to the configuration described above, during or before the exposure process of the first substrate 10 on the first substrate platform 4A, the acquisition unit can acquire light-related information, and the generation unit can generate control data based on the information acquired by the acquisition unit. Therefore, the second substrate 10 on the first substrate platform 4A can be exposed based on the control data generated in the generation unit.
[0097] (6)Furthermore, in the above embodiment, the exposure apparatus that scans and exposes the substrate 10 by means of the exposure unit 20 including an optical modulator that controls a plurality of elements according to an image pattern includes: a first substrate platform 4A that supports the first substrate 10; a second substrate platform 4B that supports a second substrate 10 that is different from the first substrate 10; and a generation unit that generates control data for controlling the exposure pattern of the plurality of elements during the scan exposure of the second substrate 10; and the first substrate platform 4A includes an acquisition unit that acquires light-related information from the exposure unit 20, and the generation unit generates control data based on the information acquired by the acquisition unit.
[0098] Based on the configuration described above, the efficiency of exposure operations can be improved by providing a plurality of substrate platforms 4A and 4B. That is, on the second substrate platform 4B, the acquisition unit can acquire light-related information of the exposure unit 20, and the generation unit generates control data for the exposure pattern based on the information acquired by the acquisition unit. Therefore, the second substrate 10 on the first substrate platform 4A can be exposed based on the exposure pattern generated in the generation unit.
[0099] (7)In addition, in the above embodiment, the generation unit generates control data during the exposure process of the first substrate 10.
[0100] According to the configuration described above, in the exposure process of the first substrate 10 performed on the first substrate platform 4A, which is dedicated to exposure among the plurality of substrate platforms 4A and 4B, in the generation section, control data of the exposure pattern is generated based on the light-related information of the second substrate 10 that is exposed after the first substrate 10, thereby suppressing the occurrence of time delay.
[0101] (8)In addition, in the above embodiment, the acquisition unit acquires light-related information during or before the exposure process of the first substrate 10.
[0102] According to the above configuration, during or before the exposure process of the first substrate 10 on the first substrate platform 4A, the acquisition unit can acquire light-related information of the exposure unit 20 in the second substrate platform 4B, and the generation unit can generate control data of the exposure pattern based on the information acquired by the acquisition unit.
[0103] (9)In addition, in the above embodiment, the acquisition unit acquires at least one of information related to the illuminance of light and information related to the first substrate platform 4A.
[0104] Based on the above configuration, control data for the exposure pattern can be generated in the generation unit based on the information obtained by the acquisition unit, thus enabling exposure with higher precision.
[0105] (10)In addition, in the above embodiment, the generation unit includes a memory that stores the generated control data during the exposure process of the first substrate 10.
[0106] According to the above configuration, since the control data generated in the generation unit is stored in the memory, the control data stored in the memory can be efficiently sent to the exposure unit 20 at an appropriate time, either when the first substrate 10 is exposed or before the exposure of the second substrate 10 begins.
[0107] (11)In addition, the above embodiment includes a transmission unit that transmits control data from memory to exposure unit 20. Before the exposure unit 20 is used to expose the second substrate 10, the transmission unit transmits the control data to the exposure unit 20.
[0108] Based on the configuration described above, the control data generated in the generation unit and stored in the memory can be efficiently transmitted to the exposure unit 20 before the exposure of the second substrate 10 begins.
[0109] (12)In addition, the above embodiment includes a drive unit that moves the second substrate platform 4B. During the scanning exposure of the second substrate 10, the drive unit moves the second substrate platform 4B that supports the second substrate 10 relative to the exposure unit 20 that receives control data.
[0110] According to the configuration described above, the second substrate platform 4B can be moved by the driving unit to a position where it can be exposed by the exposure unit 20, replacing the first substrate platform 4A. That is, the second substrate 10 on the second substrate platform 4B can be exposed using the exposure unit 20. As described above, the first substrate platform 4A and the second substrate platform 4B can be alternately switched at positions where they can be exposed by the exposure unit 20 for exposure.
[0111] (13) Furthermore, the above embodiment includes: a conveying unit that moves the first substrate 10 out of the first substrate platform 4A and moves the third substrate 10 into the first substrate platform 4A where the first substrate 10 has been moved out; a measuring device that measures information related to the third substrate 10 on the first substrate platform 4A; and a generation unit that generates control data for exposing the third substrate 10 based on the information.
[0112] According to the configuration described above, the first substrate 10 on the first substrate platform 4A can be removed by the conveying unit, and the third substrate 10 can be moved onto the first substrate platform 4A. Information related to the third substrate 10 on the first substrate platform 4A can be measured by the measuring device, and control data of the exposure pattern can be generated based on the information measured in the generation unit.
[0113] (14)In addition, in the above embodiment, the measuring device is set apart from the exposure unit 20 in such a way that the second substrate platform 4B, which supports the second substrate 10 exposed by the exposure unit 20, and the first substrate platform 4A, which supports the third substrate 10 to be measured by the measuring device, do not collide.
[0114] According to the configuration described above, during the exposure of the third substrate 10 on the second substrate platform 4B, information of the third substrate 10 can be measured on the first substrate platform 4A using a measuring device. Since both operations can be performed simultaneously as described above, the occurrence of cycle delay can be suppressed, and the exposure waiting time can be eliminated.
[0115] (15)In addition, in the above embodiment, the measuring device is disposed on the first substrate platform 4A.
[0116] According to the configuration described above, the information of the substrate 10 supported by both the first substrate platform 4A and the second substrate platform 4B can be measured using measuring devices respectively provided on the substrate platforms 4A and 4B. Therefore, during the exposure operation of the substrate 10 on one of the substrate platforms 4, the information of the substrate 10 can be measured on the other substrate platform 4 using the measuring device. Since both operations can be performed simultaneously as described above, the occurrence of cycle delay can be suppressed, and the exposure waiting time can be eliminated.
[0117] (16)In addition, in the above embodiments, the memory includes: a first memory that records information of the substrate 10 supported on the second substrate platform 4B as measured by a measuring device; and a second memory that records information of the substrate 10 supported on the first substrate platform 4A as measured by a measuring device.
[0118] According to the above configuration, the control data generated in the respective generation units of the first substrate platform 4A and the second substrate platform 4B are stored in the first memory and the second memory corresponding to each substrate platform 4A and 4B. Therefore, the control data stored in the memory can be efficiently sent to the exposure unit 20 at an appropriate time when the substrate 10 is exposed or before the exposure of the substrate 10 begins.
[0119] (17)In addition, the above embodiment includes: a transport unit for transporting the second substrate 10 from the second substrate platform 4B to the first substrate platform 4A, and a drive device for moving the first substrate platform 4A; and after the generation unit generates control data, the transport unit transports the second substrate 10 onto the first substrate platform 4A where the first substrate 10 has been moved out, and the drive device moves the first substrate platform 4A supporting the second substrate 10 relative to the exposure unit 20.
[0120] According to the configuration described above, the first substrate platform 4A can be moved by the driving device to a position where it can be exposed by the exposure unit 20. That is, the second substrate 10 on the second substrate platform 4B can be transported to the first substrate platform 4A by the transport unit, and the second substrate 10 on the first substrate platform 4A can be exposed by the exposure unit 20. As described above, the first substrate platform 4A can be positioned at a position where it can be exposed by the exposure unit 20 for exposure.
[0121] (18)In addition, in the above embodiment, the conveying unit moves the third substrate 10 onto the second substrate platform 4B where the second substrate 10 has been moved out, and a measuring unit is provided to measure information of the third substrate 10 on the second substrate platform 4B, and the generating unit generates control data related to the third substrate 10 during the exposure process of the second substrate 10.
[0122] According to the configuration described above, during the exposure process of the second substrate 10 on the first substrate platform 4A, the measurement unit can measure the information of the third substrate 10 that has been moved onto the second substrate platform 4B, and the generation unit can generate control data based on the information of the third substrate 10 measured by the measurement unit. Since both operations can be performed simultaneously as described above, the occurrence of cycle delay can be suppressed, and the exposure waiting time can be eliminated.
[0123] (19)In addition, in the above embodiment, the generation unit corrects the preset exposure data and generates control data.
[0124] Based on the above configuration, in the generation unit, the exposure data preset based on the information measured by the measurement unit can be used to make corrections by comparing the preset exposure data with the measurement information, thus enabling corrections with higher accuracy.
[0125] (20)In addition, in the above embodiment, the exposure unit 20 is provided with a plurality of spatial light modulation elements 75, and the light from the light source 61 and the light from the light source 61 are exposed in a segmented manner.
[0126] Based on the configuration described above, a plurality of exposure units 20 can be used to split and expose the light source 61 and the light from the light source 61 by using a plurality of spatial light modulation elements 75.
[0127] (21) Furthermore, in the above embodiment, the exposure apparatus for scanning and exposing the substrate 10 by means of an optical modulator that controls a plurality of elements according to an image pattern includes: a substrate platform 4 that supports the first substrate 10; a receiving unit that receives information of a second substrate 10 measured by means of a device different from the exposure apparatus, wherein the second substrate 10 is scanned and exposed by the exposure apparatus 1 after the first substrate 10 is scanned and exposed; a generating unit that generates control data for controlling a plurality of elements during the scanning and exposure of the second substrate 10 based on the information received by the receiving unit; and a memory that stores the control data during the exposure process of the first substrate 10.
[0128] (22) Furthermore, the above embodiment includes: a projection unit that projects an image of a pattern onto a first substrate or a second substrate; and a position changing unit that, during scanning exposure of the first substrate or the second substrate, changes the position of the image projected by the projection unit on the first substrate or the second substrate. The position changing unit controls at least one of the substrate platform 4, the substrate platform 4 holding the light modulator 75, and a part of the projection system, and changes the aforementioned position.
[0129] (23) Furthermore, in the above embodiment, it includes: a transfer unit that moves the first substrate 10 out of the substrate platform 4 and moves the second substrate 10 in; and a measurement unit that measures the information of the second substrate moved to the substrate platform 4. The measurement unit measures the marks that are measured in order to measure the information of the second substrate 10 in different devices, and obtains the information of the second substrate 10.
[0130] (24) Furthermore, in the above embodiment, a control unit is included, which associates identification information used to identify the substrate 10, information of the second substrate 10 measured by other devices, or control data.
[0131] (25)In addition, the above embodiments include: the step of exposing the substrate 10 using the exposure apparatus 1 described in any one of (1) to (20); and the step of developing the exposed substrate 10.
[0132] According to the configuration described above, the substrate 10 can be exposed by using the exposure apparatus 1 to eliminate the exposure waiting time, and the exposed substrate 10 can be developed, thereby efficiently manufacturing components.
[0133] (26) Furthermore, the above embodiments include: a step of exposing a substrate for a flat panel display using an exposure apparatus described in any one of (1) to (20); and a step of developing the exposed substrate.
[0134] According to the above configuration, by using the exposure apparatus 1, the exposure waiting time can be eliminated to expose the substrate 10, and the exposed substrate 10 can be developed, thereby efficiently manufacturing a flat panel display.
[0135] (27) Furthermore, in the above embodiment, the exposure method for scanning and exposing a substrate by means of an exposure unit including an optical modulator includes: a step of supporting a first substrate on a first platform; a step of supporting a second substrate different from the first substrate on a second platform; a step of measuring information of the second substrate; and a step of generating control data for exposing the second substrate in the exposure process of the first substrate based on the above information.
[0136] According to the configuration described above, the efficiency of exposure operations can be improved by providing a plurality of substrate platforms 4A and 4B. That is, during the exposure of the first substrate 10 on one of the substrate platforms 4A and 4B (e.g., the first substrate platform 4A), all operations such as removing the exposed substrate 10, inserting the second substrate 10, alignment using the measurement unit, generating correction data using the generation unit, and data transmission can be performed on the other platform (e.g., the second substrate platform 4B). This allows the exposure of the second substrate 10 to begin immediately after the exposure of the first substrate 10 is completed. As described above, when the exposure apparatus includes only one substrate platform 4, the time spent from the completion of the exposure of the first substrate to the start of the exposure of the next substrate 10 can be reduced. Therefore, in this embodiment, the exposure waiting time generated in the conventional exposure apparatus 1 with only one substrate platform 4 can be eliminated.
[0137] (28) Furthermore, in the above embodiment, the exposure apparatus 1 that scans and exposes the substrate 10 by means of the exposure unit 20 including the light modulator includes: a step of supporting the first substrate 10 on the first substrate platform 4A including the acquisition unit that acquires light-related information of the exposure unit 20; a step of supporting the second substrate 10, which is different from the first substrate 10, on the second substrate platform 4B; and a step of generating control data for exposing the second substrate 10 based on the information acquired by the acquisition unit.
[0138] Based on the configuration described above, the efficiency of exposure operations can be improved by providing a plurality of substrate platforms 4A and 4B. That is, on the second substrate platform 4B, the acquisition unit can acquire light-related information of the exposure unit 20, and in the generation unit, control data for the exposure pattern is generated based on the information acquired by the acquisition unit. Therefore, the second substrate 10 on the first substrate platform 4A can be exposed based on the exposure pattern generated in the generation unit.
[0139] (29) Furthermore, in the above embodiment, the exposure method for scanning and exposing a substrate by means of an optical modulator that controls a plurality of elements according to an image pattern includes: a step of supporting a first substrate on a platform; a step of receiving information of a second substrate measured by a receiving unit using an exposure device different from the exposure device used to scan and expose the substrate, wherein the second substrate is scanned and exposed using the exposure device after the first substrate is scanned and exposed; a step of generating control data for controlling the plurality of elements during the scanning and exposure of the second substrate based on the information received by the receiving unit; and a step of storing the control data in a memory during the exposure process of the first substrate.
[0140] (30) Furthermore, the above embodiments include: a step of exposing the substrate 10 using the exposure method described in any one of (27) to (29); and a step of developing the exposed substrate 10.
[0141] According to the configuration described above, by eliminating the exposure waiting time, the steps of exposing the substrate 10 and developing the exposed substrate 10 can form a step of manufacturing components with high efficiency.
[0142] (31) Furthermore, the above embodiments include: a step of exposing a substrate for a flat panel display using the exposure method described in any one of (27) to (29); and a step of developing the exposed substrate.
[0143] According to the configuration described above, by using the exposure apparatus 1, the exposure waiting time is eliminated and the substrate 10 is exposed, and the exposed substrate 10 is developed, so that a flat panel display can be manufactured efficiently.
[0144] The present invention has been described in detail above with reference to the drawings, but the specific configuration is not limited to the above, and various design changes can be made without departing from the spirit of the present invention. [Simplified Explanation of the Diagram]
[0015] [Fig. 1] is a perspective view showing the configuration of the exposure apparatus according to the embodiment. [Fig. 2] is a side view showing the schematic configuration of the exposure apparatus. [Fig. 3] is a side view showing the schematic configuration of the illumination and projection module of the exposure apparatus. [Fig. 4] is a perspective view showing the opening / closing operation of the spatial light modulation element. [Fig. 5A] is a diagram showing the operation of the spatial light modulation element, and is shown in the power-off state. [Fig. 5B] is a diagram showing the operation of the spatial light modulation element, and is shown in the open state. [Fig. 5C] is a diagram showing the operation of the spatial light modulation element, and is shown in the closed state. [Fig. 6] is a side view showing the schematic configuration of the first alignment system provided on the substrate platform. [Fig. 7] is a side view showing the schematic configuration of the second alignment system provided on the optical plate. [Fig. 8] is a diagram showing an example of the operation flow of the exposure processing of the exposure apparatus. [Figure 9] is a modified example of the exposure processing flow of an exposure device.
Claims
1. An exposure apparatus comprising: Platform 1, supporting substrate 1; The second platform supports a second substrate that is different from the first substrate mentioned above; The exposure unit includes a projection module and an optical modulation element that includes multiple elements that switch to multiple states based on image data; a measurement unit that measures information of the second substrate; and a generation unit that, based on the information, generates control data of the multiple elements controlled during the exposure process of the first substrate by the exposure apparatus during the exposure of the second substrate.
2. The exposure apparatus as described in claim 1, wherein, The aforementioned measurement unit measures information about the aforementioned second substrate during the exposure process of the aforementioned first substrate.
3. The exposure apparatus as requested in item 1 or 2, wherein, The aforementioned measuring unit is provided separately from the aforementioned light modulator in such a way that the first platform, which supports the first substrate exposed by the aforementioned exposure unit, and the second platform, which supports the second substrate, which is measured by the aforementioned measuring unit, do not collide.
4. The exposure apparatus as requested in item 1 or 2, wherein, The aforementioned measuring unit is located on the aforementioned second platform.
5. The exposure apparatus as described in claim 1, wherein, The first platform includes an acquisition unit that acquires light-related information of the exposure unit during or before the exposure process of the first substrate; and the generation unit generates the control data based on the information and the information acquired by the acquisition unit.
6. An exposure apparatus comprising: Platform 1, supporting substrate 1; The second platform supports a second substrate that is different from the first substrate mentioned above; The exposure unit includes a projection module and a light modulation element that includes a plurality of elements that switch to a plurality of states based on image data; and a generation unit that generates control data of the plurality of elements controlled during the exposure of the second substrate; and the first platform includes an acquisition unit that acquires light-related information of the exposure unit; the generation unit generates the control data during the exposure process of the first substrate based on the information acquired by the acquisition unit.
7. The exposure apparatus as described in claim 6, wherein, The aforementioned generation unit generates the aforementioned control data during the exposure process of the aforementioned first substrate.
8. The exposure apparatus as requested in item 6 or 7, wherein, The aforementioned acquisition unit acquires information related to the aforementioned light during or before the exposure process of the aforementioned first substrate.
9. The exposure apparatus as described in any of claims 5 to 7, wherein, The aforementioned acquisition department acquires at least one of the information related to the illuminance of the aforementioned light and the information related to the aforementioned first platform.
10. An exposure apparatus as described in any of the following requests: 1, 2, 5, 6, or 7, wherein... The aforementioned generation unit includes a memory that stores the generated control data during the exposure process of the first substrate.
11. The exposure apparatus of claim 10, comprising a transmitting unit that transmits the control data from the memory to the exposure unit; and the transmitting unit transmitting the control data to the exposure unit in the exposure unit before starting exposure of the second substrate using the exposure unit.
12. The exposure apparatus of claim 10, comprising a drive unit for moving the second platform; and the drive unit moving the second platform supporting the second substrate relative to the exposure unit receiving the control data during scanning exposure of the second substrate.
13. The exposure apparatus of claim 12, comprising: The transport unit moves the first substrate out of the first platform and moves the third substrate into the first platform where the first substrate has been moved out; the measuring device measures information related to the third substrate on the first platform; and the generation unit generates control data for exposing the third substrate based on the information.
14. The exposure apparatus as claimed in claim 13, wherein, The aforementioned measuring device is provided separately from the aforementioned exposure unit in such a way that the second platform, which supports the second substrate exposed by the aforementioned exposure unit, and the first platform, which supports the third substrate to be measured by the aforementioned measuring device, do not collide.
15. The exposure apparatus as claimed in claim 13, wherein, The aforementioned measuring device is installed on the aforementioned first platform.
16. The exposure apparatus as claimed in claim 13, wherein, The aforementioned memory includes: a first memory that records information about the substrate supported by the second platform as measured by the aforementioned measuring device; and a second memory that records information about the substrate supported by the first platform as measured by the aforementioned measuring device.
17. The exposure apparatus as claimed in claim 10 above, comprising: The transport unit transports the second substrate from the second platform to the first platform; and the drive device moves the first platform; and after the generation unit generates the control data, the transport unit transports the second substrate into the first platform where the first substrate has been moved out; and the drive device moves the first platform, which supports the second substrate, relative to the exposure unit.
18. The exposure apparatus as claimed in claim 17, wherein, The aforementioned transport unit moves the third substrate into the aforementioned second platform where the aforementioned second substrate has been moved out; a measurement unit is provided to measure information of the aforementioned third substrate on the aforementioned second platform; and the aforementioned generation unit generates the aforementioned control data related to the aforementioned third substrate during the exposure process of the aforementioned second substrate.
19. An exposure apparatus as described in any of the following requests: 1, 2, 5, 6, or 7, wherein... The aforementioned generation unit modifies the preset exposure data to generate the aforementioned control data.
20. An exposure apparatus as described in any of the following requests: 1, 2, 5, 6, or 7, wherein... The aforementioned exposure unit is provided in multiple units; and multiple spatial light modulation elements are used to separate the light source from the light source for exposure.
21. An exposure apparatus as described in any of the following requests: 1, 2, 5, 6, or 7, wherein... The aforementioned plurality of states include an open state and a closed state; and light from the element in the open state is incident on the projection module, while light from the element in the closed state is incident outside the projection module.
22. The exposure apparatus as requested in item 1 or 2, wherein, The above information includes information on the reduction or enlargement of the second substrate.
23. An exposure apparatus for scanning and exposing a substrate via a light modulator comprising a plurality of elements that switch to a plurality of states according to an image pattern, comprising: Platform, supporting the first substrate; The receiving unit receives information from a second substrate measured using a device different from the aforementioned exposure apparatus; the generating unit generates control data of the plurality of elements controlled during the scanning exposure of the second substrate during the exposure process of the first substrate based on the aforementioned information; and the memory stores the aforementioned control data during the exposure process of the first substrate; and the second substrate is a substrate scanned and exposed by the aforementioned exposure apparatus after the scanning exposure of the first substrate.
24. The exposure apparatus of claim 23, comprising: The projection module projects the image of the above-mentioned image pattern onto the first substrate or the second substrate. The position changing unit changes the position on the first substrate or the second substrate on which the image is projected by the projection module during the scanning exposure of the first substrate or the second substrate; and the position changing unit controls at least one of the platform, the platform holding the light modulator, and a part of the projection module to change the position.
25. The exposure apparatus as claimed in claim 23 or 24, comprising: The conveying unit moves the first substrate out of the platform and moves the second substrate in; and the measuring unit measures the information of the second substrate that has been conveyed to the platform; and the measuring unit measures the marks that are measured in order to measure the information of the second substrate using the different devices, thereby obtaining the information of the second substrate.
26. The exposure apparatus of claim 23 or 24, comprising a control unit that associates identification information used to identify the aforementioned substrate with information of the aforementioned second substrate measured using other means or the aforementioned control data.
27. An exposure method comprising exposing a substrate via a light modulator including a plurality of elements that switch to a plurality of states based on image data, comprising: The steps of supporting the first substrate through the first platform; The steps include: supporting a second substrate that is different from the first substrate via a second platform; measuring information of the second substrate; and generating control data of the plurality of elements controlled during the exposure of the second substrate during the exposure process of the first substrate based on the information.
28. An exposure method, comprising: In the step of supporting a first substrate on a first platform including an acquisition unit, the acquisition unit acquires light-related information including an exposure unit containing an optical modulator that switches to a plurality of states based on image data; in the step of supporting a second substrate on a second platform that is different from the first substrate; and in the step of generating control data for exposing the second substrate in the exposure process of the first substrate based on the information acquired by the acquisition unit.
29. An exposure method, comprising: The steps for supporting the first substrate on the platform; The steps include: receiving information from a receiving unit about a second substrate measured using an exposure apparatus different from the one used to scan and expose the first substrate; generating control data for the plurality of elements controlled during the exposure of the second substrate during the exposure process of the first substrate based on the information received by the receiving unit; storing the control data in a memory during the exposure process of the first substrate; and the second substrate being a substrate scanned and exposed by the exposure apparatus after the first substrate has been scanned and exposed.
30. A method for manufacturing a component, comprising: The step of exposing the substrate using an exposure apparatus of any one of claims 1, 2, 5, 6, 7, 23, 24, or an exposure method of any one of claims 27 to 29; and the step of developing the exposed substrate.